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D/CRCW-P e3

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Revision: 07-Apr-14 1Document Number: 20036

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Lead (Pb)-Free Thick Film, Rectangular,

Semi-Precision Chip Resistors

FEATURES

• Low temperature coefficient (50 ppm/K) and

tight tolerances (± 0.25 %)

• Pure tin plating provides compatibility with

lead (Pb)-free and lead containing soldering

processing

• Metal glaze on high quality ceramic

• AEC-Q200 qualified

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

Notes

• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage and

permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time generally

known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.

• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020).

• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.

STANDARD ELECTRICAL SPECIFICATIONS

MODEL

CASE

SIZE

INCH

CASE

SIZE

METRIC

POWER

RATING

P70

LIMITING

ELEMENT

VOLTAGE

Umax.

ACRMS/DC

TEMPERATURE

COEFFICIENT

ppm/K

TOLERANCE

RESISTANCE

RANGE



SERIES

D10/CRCW0402-P 0402 1005 0.063 50 ± 100 ± 0.5 1R to 1M1 E24; E96

± 50 ± 0.25, ± 0.5, ± 1 100R to 1M

D11/CRCW0603-P 0603 1608 0.1 75

± 100 ± 0.5, ± 0.25 1R to 10M

E24; E96

± 50 ± 0.25 100R to 1M

± 0.5, ± 1 100R to 10M

D12/CRCW0805-P 0805 2012 0.125 150

± 100 ± 0.5 10R to 10M

E24; E96

± 50 ± 0.25 100R to 1M

± 0.5, ± 1 100R to 10M

D25/CRCW1206-P 1206 3216 0.25 200

± 100 ± 0.5 10R to 10M

E24; E96

± 50 ± 0.25 100R to 1M

± 0.5, ± 1 100R to 10M

CRCW1210-P 1210 3225 0.5 200 ± 100 ± 0.5 100R to 1M E24; E96

± 50 ± 0.5, ± 1 100R to 1M

CRCW1218-P 1218 3246 1.0 200 ± 100 ± 0.5 100R to 2M2 E24; E96

± 50 ± 0.5, ± 1 100R to 2M2

CRCW2010-P 2010 5025 0.75 400 ± 100 ± 0.5 10R to 10M E24; E96

± 50 ± 0.5, ± 1 100R to 10M

CRCW2512-P 2512 6332 1.0 500 ± 100 ± 0.5 10R to 10M E24; E96

± 50 ± 0.5, ± 1 100R to 10M

D/CRCW-P e3

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Revision: 07-Apr-14 2Document Number: 20036

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Note

(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the

printed-ciruit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.

TECHNICAL SPECIFICATIONS

PARAMETER UNIT

D10/

CRCW0402-P

D11/

CRCW0603-P

D12/

CRCW0805-P

D25/

CRCW1206-P CRCW1210-P CRCW1218-P CRCW2010-P CRCW2512-P

Rated Dissipation at P70 (1) W 0.063 0.1 0.125 0.25 0.5 1.0 0.75 1.0

Operating Voltage

Umax. ACRMS/DC V 50 75 150 200 200 200 400 500

Insulation Voltage Uins (1 min) V 75 100 200 300 300 300 300 300

Insulation Resistance > 109

Operating Temperature Range °C - 55 to + 155

Failure Rate h-1 < 0.1 x 10-9

Weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5

PART NUMBER AND PRODUCT DESCRIPTION

PART NUMBER: CRCW040275R0DKEDP

MODEL RESISTANCE TOLERANCE TCR PACKAGING SPECIAL

CRCW0402

CRCW0603

CRCW0805

CRCW1206

CRCW1210

CRCW1218

CRCW2010

CRCW2512

R = Decimal

K = Thousand

M = Million

C = ± 0.25 %

D = ± 0.5 %

F = ± 1.0 %

H = ± 50 ppm/K

K = ± 100 ppm/K

EA, EB,

EC, ED,

EE, EF,

EG, EH,

EI, EL

P =

Semi-Precision

PRODUCT DESCRIPTION: D10/CRCW0402-P 100 75R 0.5 % ET7 e3

D10/CRCW0402-P 100 75R 0.5 % ET7 e3

MODEL TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE

D10/CRCW0402-P

D11/CRCW0603-P

D12/CRCW0805-P

D25/CRCW1206-P

CRCW1210-P

CRCW1218-P

CRCW2010-P

CRCW2512-P

± 50 ppm/K

± 100 ppm/K

49K9 = 49.9 k

5R1 = 5.1 

± 0.25 %

± 0.5 %

± 1 %

ET1, ET2,

ET3, ET4,

ET5, ET6,

ET7, ET8,

ET9, EF4,

E02, E67,

E82

e3 = Pure tin

termination

finish

C R C W 0 4 0 2 7 5 R 0 K D PED

D/CRCW-P e3

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Revision: 07-Apr-14 3Document Number: 20036

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PACKAGING

MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER

D10/CRCW0402-P ED = ET7 10 000

Paper tape acc. to

IEC 60068-3

Type I

8 mm 2 mm 180 mm/7"

EE = EF4 50 000 330 mm/13"

D11/CRCW0603-P

EI = ET2 5000

8 mm 2 mm

180 mm/7"

ED = ET3 10 000 180 mm/7"

EL = ET4 20 000 285 mm/11.25"

EE = ET8 50 000 330 mm/13"

EA = ET1 5000

8 mm 4 mm

180 mm/7"

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

D12/CRCW0805-P

EA = ET1 5000

8 mm 4 mm

180 mm/7"

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

D25/CRCW1206-P

EA = ET1 5000

8 mm 4 mm

180 mm/7"

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

CRCW1210-P

EA = ET1 5000

12 mm 4 mm

180 mm/7"

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

CRCW1218-P EK = ET9 4000

Blister tape acc. to

IEC 60068-3

Type II

12 mm 4 mm 180 mm/7"

CRCW2010-P EF = E02 4000 12 mm 4 mm 180 mm/7"

CRCW2512-P EG = E67 2000 12 mm 8 mm 180 mm/7"

EH = E82 4000 4 mm

DIMENSIONS in millimeters

SIZE DIMENSIONS SOLDER PAD DIMENSIONS

REFLOW SOLDERING WAVE SOLDERING

INCH METRIC L W H T1 T2 a b l a b l

0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5

0603 1608 1.55 + 0.10

- 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0

0805 2012 2.0 + 0.20

- 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20

- 0.10 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3

1206 3216 3.2 + 0.10

- 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3

1210 3225 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2

1218 3246 3.2 + 0.10

- 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9

2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9

2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2

D/CRCW-P e3

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Revision: 07-Apr-14 4Document Number: 20036

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FUNCTIONAL PERFORMANCE

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE REQUIREMENTS

PERMISSIBLE CHANGE (R)

Stability for product types: STABILITY CLASS 1 OR BETTER

D/CRCW-P e3 1 to 10 M

4.5 - Resistance - ± 0.25 %; ± 0.5 %; ± 1 %

4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown

4.13 - Short time overload U = 2.5 x  2 x Umax.;

duration acc. to style ± (0.25 % R + 0.05 )

4.17.2 58 (Td) Solderability

Solder bath method;

Sn60Pb40

non-activated flux;

(235 ± 5) °C

(2 ± 0.2) s

Good tinning ( 95 % covered)

no visible damage

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

(245 ± 5) °C

(3 ± 0.3) s

Good tinning ( 95 % covered)

no visible damage

4.8.4.2 - Temperature

coefficient

(20/- 55/20) °C and

(20/125/20) °C ± 50 ppm/K; ± 100 ppm/K

4.32 21 (Uu3)Shear

(adhesion)

RR 1608 and smaller: 9 N

RR 2012 and larger: 45 N No visible damage

4.33 21 (Uu1) Substrate bending Depth 2 mm;

3 times

No visible damage, no open circuit in bent position

± (0.25 % R + 0.05 )

4.19 14 (Na) Rapid change of

temperature

30 min at - 55 °C;

30 min at 125 °C

5 cycles ± (0.25 % R + 0.05 )

1000 cycles ± (1 % R + 0.05 )

Ambient Temperature in amb

Fraction of Rated Dissipation P70

- 50 0 50 100 150

100

70 °C

P70 x R

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Revision: 07-Apr-14 5Document Number: 20036

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All tests are carried out in accordance with the following specifications:

• EN 60115-1, generic specification

• EN 140400, sectional specification

• EN 140401-802, detail specification

• IEC 60068-2-x, variety of environmental test procedures

Packaging of components is done in paper or blister tapes according to IEC 60286-3.

4.23 - Climatic sequence: -

± (1 % R + 0.05 )

4.23.2 2 (Ba) Dry heat 125 °C; 16 h

4.23.3 30 (Db) Damp heat, cyclic 55 °C;  90 % RH;

24 h; 1 cycle

4.23.4 1 (Aa) Cold - 55 °C; 2 h

4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h

4.23.6 30 (Db) Damp heat, cyclic 55 °C;  90 % RH;

24 h; 5 cycles

4.23.7 - DC load U =

4.25.1 - Endurance at 70 °C

U =  Umax.;

1.5 h on; 0.5 h off;

70 °C; 1000 h ± (1 % R + 0.05 )

70 °C; 8000 h ± (2 % R + 0.05 )

4.18.2 58 (Td) Resistance to

soldering heat

Solder bath method

(260 ± 5) °C;

(10 ± 1) s

± (0.25 % R + 0.05 )

4.35 - Flamability,

needle flame test

IEC 60695-11-5;

10 s No burning after 30 s

4.24 78 (Cab) Damp heat,

steady state

(40 ± 2) °C;

(93 ± 3) % RH;

56 days

± (1 % R + 0.05 )

4.25.3 -

Endurance at

upper category

temperature

155 °C, 1000 h ± (1 % R + 0.05 )

4.40 -

Electrostatic

discharge

(human body model)

IEC 61340-3-1;

3 pos. + 3 neg. discharges;

ESD voltage acc. to size

± (1 % R + 0.05 )

4.29 45 (XA) Component solvent

resistance

Isopropyl alcohol;

50 °C; method 2 No visible damage

4.30 45 (XA) Solvent resistance

of marking

Isopropyl alcohol;

50 °C; method 1,

toothbrush

Marking legible,

no visible damage

4.22 6 (Fc) Vibration, endurance

by sweeping

f = 10 Hz to 2000 Hz;

x, y, z  1.5 mm;

A  200 m/s2;

10 sweeps per axis

± (0.25 % R + 0.05 )

4.37 - Periodic electric

overload

U =

 2 x Umax.;

0.1 s on; 2.5 s off;

1000 cycles

± (1 % R + 0.05 )

4.27 -

Single pulse high

voltage overload,

10 μs/700 μs

Û = 10 x

 2 x Umax.;

10 pulses

± (1 % R + 0.05 )

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST PROCEDURE REQUIREMENTS

PERMISSIBLE CHANGE (R)

Stability for product types: STABILITY CLASS 1 OR BETTER

D/CRCW-P e3 1 to 10 M

P70 x R

15 x P70 x R

P70 x R

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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over

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including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

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