2SC0650P2Ax-17 2SC0650P2Ax-17 Preliminary Data Sheet Dual-Channel High-Power High-Frequency SCALE-2 Driver Core Short Description The SCALE-2 dual driver core 2SC0650P2Ax-17 combines highest power density with broad applicability. The driver is designed for both high-power and high-frequency applications requiring maximum reliability. It is suitable for IGBTs with reverse voltages up to 1700V and also features a dedicated MOSFET mode. The embedded paralleling capability allows easy inverter design covering higher power ratings. Multi-level topologies are also supported. CONCEPT's patented planar-transformer technology assures efficient and high-voltage isolation with long-term reliability and sets new milestones in compactness, interference immunity and performance. Its outstanding EMC with a dv/dt strength of more than 100V/ns allows safe and reliable operation in even the toughest industrial applications. Thanks to its ultra-flat design with an insertion height of max. 6.5mm and a footprint of 61.7mm x 57.2, the 2SC0650P2Ax-17 can efficiently utilize even the most constrained insertion spaces. Compared with conventional drivers, the highly integrated SCALE-2 chipset allows about 85% of components to be dispensed with. This advantage is impressively reflected in increased reliability at simultaneously minimized cost. Equipped with the latest SCALE-2 technology, the driver core opens up the possibility of working with clock frequencies of up to 150kHz - at best-in-class efficiency. The 2SC0650P2Ax-17 combines a complete twochannel driver core with all components required for driving, such as an isolated DC/DC converter, short-circuit protection, advanced active clamping as well as supply voltage monitoring. Each of the two output channels is electrically isolated from the primary side and the other secondary channel. Product Highlights Ultra-flat dual channel driver Highly integrated SCALE-2 chipset Planar transformer technology Blocking voltages up to 1700V Switching frequency up to 150kHz Short delay and extremely small jitter Gate current 50A, 6W output power per channel +15V/-10V gate driving Safe isolation to EN 50178 UL compliant IGBT-Driver.com Applications Wind power converters Industrial drives Traction applications Electro/hybrid drive commercial vehicles Driving parallel-connected large IGBTs High gate-current driving applications Induction heating Switched mode power supplies (SMPS) Laser and medical (MRT, CT, X-Ray) Laser technology Page 1 2SC0650P2Ax-17 Preliminary Data Sheet Safety Notice! The data contained in this data sheet is intended exclusively for technically trained staff. Handling all highvoltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory! Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged. Important Product Documentation This data sheet contains only product-specific data. For a detailed description, must-read application notes and important information that apply to this product, please refer to "2SC0650P Description & Application Manual" on www.IGBT-Driver.com/go/2SC0650P Absolute Maximum Ratings Parameter Remarks Supply voltage V DC VDC to GND Supply voltage V CC Logic input and output voltages SOx current Gate peak current I out External gate resistance Average supply current I DC Output power VCC to GND Primary side, to GND Failure condition, total current Note 1 Turn-on and turn-off Notes 2, 3 Ambient temperature <70C (Notes 4, 5) Ambient temperature 85C (Note 4) Switching frequency F Test voltage (50Hz/1min.) Min Max Unit 0 16 V 0 16 V -0.5 VCC+0.5 V 20 mA -50 +50 A 0.5 1300 mA 6.5 W 6 W 150 kHz 5000 V AC(eff) Primary to secondary (Note 15) Secondary to secondary (Note 15) 4000 V AC(eff) |dV/dt| Rate of change of input to output voltage (Note 11) 100 kV/s Operating voltage Operating temperature Storage temperature Primary/secondary, secondary/secondary Note 5 -40 -40 1700 +85 +90 V peak C C Recommended Operating Conditions Power Supply Remarks Min Typ Max Unit Supply voltage V DC VDC to GND 14.5 15 15.5 V Supply voltage V CC VCC to GND 14.5 15 15.5 V Page 2 INTELLIGENT POWER ELECTRONICS 2SC0650P2Ax-17 Preliminary Data Sheet Electrical Characteristics (IGBT mode) All data refer to +25C and V CC = V DC = 15V unless otherwise specified. Power supply Remarks Supply current I DC Without load 40 mA Supply current I CC F = 0Hz 21 mA Supply current I CC F = 150kHz 35 mA Coupling capacitance C io Primary to output, total 28 pF Power Supply Monitoring Remarks Min Typ Max Unit Supply threshold V CC 11.9 11.3 0.35 12.1 11.5 0.35 5 4.7 0.15 12.6 12.0 13.3 12.7 12.6 12.0 13.1 12.5 5.15 4.85 5.3 5 Monitoring hysteresis Primary side, clear fault Primary side, set fault (Note 12) Primary side, set/clear fault Secondary side, clear fault Secondary side, set fault (Note 13) Secondary side, set/clear fault Secondary side, clear fault Secondary side, set fault (Note 13) Secondary side, set/clear fault V V V V V V V V V Logic Inputs and Outputs Remarks Min Typ Max Unit Input bias current Turn-on threshold Turn-off threshold SOx output voltage V(INx) > 3V V(INx) V(INx) Failure condition, I(SOx)<20mA 0.7 A V V V Short-Circuit Protection Remarks Max Unit Current through pin REFx R(REFx, VEx)<70k 150 A Minimum response time Note 9 1.2 s Minimum blocking time Note 10 9 s Timing Characteristics Remarks Turn-on delay t d(on) Note 6 80 ns Turn-off delay t d(off) Jitter of turn-on delay Jitter of turn-off delay Note 6 Note 17 Note 17 75 2 2 ns ns ns Output rise time t r(out) Note 7 25 ns Output fall time t f(out) Note 7 25 ns Transmission delay of fault state Note 14 400 ns Monitoring hysteresis Supply threshold V ISOx -V Ex Monitoring hysteresis Supply threshold V Ex -V COMx IGBT-Driver.com Min Typ Max 190 2.6 1.3 Min Min Typ Typ Max Unit Unit Page 3 2SC0650P2Ax-17 Preliminary Data Sheet Electrical Isolation Remarks Min Typ Max Test voltage (50Hz/1s) Primary to secondary side (Note 15) 5000 5050 5100 Partial discharge extinction volt. Primary to secondary side (Note 16) 1768 V peak Creepage distance Primary to secondary side 15 mm Secondary to secondary side 25 mm Primary to secondary side 15 mm Secondary to secondary side 6.5 mm Output Remarks Min Blocking capacitance VISOx to VEx (Note 8) 9.4 F VEx to COMx (Note 8) 9.4 F Clearance distance Typ Max Unit V eff Unit Output voltage swing The output voltage swing consists of two distinct segments. First, there is the turn-on voltage V GHx between pins GHx and VEx. V GHx is regulated and maintained at a constant level for all output power values and frequencies. The second segment of the output voltage swing is the turn-off voltage V GLx . V GLx is measured between pins GLx and VEx. It is a negative voltage. It changes with the output power to accommodate the inevitable voltage drop across the internal DC/DC converter. Output Voltage Remarks Min Typ Max Unit Turn-on voltage, V GHx Any load condition 15.0 V Turn-off voltage, V GLx No load -11.4 V Turn-off voltage, V GLx 1W output power -9.3 V Turn-off voltage, V GLx 6W output power -8.1 V Footnotes to the Key Data 1) 2) 3) 4) 5) 6) The maximum peak gate current refers to the highest current level occurring during the product lifetime. It is an absolute value and does also apply for short pulses. The average supply input current is limited for thermal reasons. Higher values than specified by the absolute maximum rating are permissible (e.g. during power supply start up) if the average remains below the given value, provided the average is taken over a time period which is shorter than the thermal time constants of the driver in the application. There is no means of actively controlling or limiting the input current in the driver. In the case of start-up with very high blocking capacitor values, or in case of short circuit at the output, the supply input current has to be limited externally. The maximum output power must not be exceeded at any time during operation. The absolute maximum rating must also be observed for time periods shorter than the thermal time constants of the driver in the application. An extended output power range is specified in the output power section for maximum ambient temperatures of 70C. In that case, the absolute maximum rating for the operating temperature changes to (-40C - 70C) and the absolute maximum output power rating changes to 6.5W. The delay time is measured between 50% of the input signal and 10% voltage swing of the corresponding output. The delay time is independent of the output loading. Page 4 INTELLIGENT POWER ELECTRONICS 2SC0650P2Ax-17 Preliminary Data Sheet 7) 8) 9) 10) 11) 12) 13) 14) 15) 16) 17) Output rise and fall times are measured between 10% and 90% of the nominal output swing with an output load of 4.7 and 270nF. The values are given for the driver side of the gate resistors. The time constant of the output load in conjunction with the present gate resistors leads to an additional delay at the load side of the gate resistors. External blocking capacitors are to be placed between VISOx and VEx as well as VEx and COMx for gate charges exceeding 3C. Ceramic capacitors are recommended. A minimum external blocking capacitance of 3F is recommended for every 1C of gate charge beyond 3C. Insufficient external blocking can lead to reduced driver efficiency and thus to thermal overload. The minimum response time given is valid for the circuit given in the description and application manual (Fig. 6) with the values of table 1 (C ax =0pF, R thx =43k). The blocking time sets a minimum time span between the end of any fault state and the start of normal operation (remove fault from pin SOx). The value of the blocking time can be adjusted at pin TB. The specified blocking time is valid if TB is connected to GND. This specification guarantees that the drive information will be transferred reliably even at a high DClink voltage and with ultra-fast switching operations. Undervoltage monitoring of the primary-side supply voltage (VCC to GND). If the voltage drops below this limit, a fault is transmitted to both SOx outputs and the power semiconductors are switched off. Undervoltage monitoring of the secondary-side supply voltage (VISOx to VEx and VEx to COMx which correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the corresponding SOx output. Transmission delay of fault state from the secondary side to the corresponding primary status output. HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate driver is suited for HiPot testing. Nevertheless, it is strongly recommended to limit the testing time to 1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 1200V AC(eff) may lead to insulation degradation. No degradation has been observed over 1min. testing at 5000V AC(eff) . Every production sample shipped to customers has undergone 100% testing at the given value for 1s. Partial discharge measurement is performed in accordance with IEC 60270 and isolation coordination specified in EN 50178. The partial discharge extinction voltage between primary and either secondary side is coordinated for safe isolation to EN 50178. The minimum value given is designed to include appropriate safety margins for long-term ageing. Accelerated ageing tests show virtually no insulation deterioration. Minimum partial discharge extinction voltages remain >2100V even after 2600 slow thermal cycles between -40C and 125C and also after 500 thermal shock cycles between -55C and 150C. Jitter measurements are performed with input signals INx switching between 0V and 5V referred to GND, with a corresponding rise time and fall time of 15ns. Legal Disclaimer This data sheet specifies devices but cannot promise to deliver any specific characteristics. No warranty or guarantee is given - either expressly or implicitly - regarding delivery, performance or suitability. CT-Concept Technologie AG reserves the right to make modifications to its technical data and product specifications at any time without prior notice. The general terms and conditions of delivery of CT-Concept Technologie AG apply. IGBT-Driver.com Page 5 2SC0650P2Ax-17 Preliminary Data Sheet Ordering Information The general terms and conditions of delivery of CT-Concept Technologie AG apply. Type Designation Description 2SC0650P2A0-17 Dual-channel SCALE-2 driver core Product home page: www.IGBT-Driver.com/go/2SC0650P Refer to www.IGBT-Driver.com/go/nomenclature for information on driver nomenclature Information about Other Products For other drivers, product documentation, and application support Please click: www.IGBT-Driver.com Manufacturer CT-Concept Technologie AG Intelligent Power Electronics Renferstrasse 15 CH-2504 Biel-Bienne Switzerland Tel. Fax +41 - 32 - 344 47 47 +41 - 32 - 344 47 40 E-mail Internet Info@IGBT-Driver.com www.IGBT-Driver.com (c) 2009...2011 CT-Concept Technologie AG - Switzerland. We reserve the right to make any technical modifications without prior notice. Page 6 All rights reserved. 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