2SC0650P2Ax-17
IGBT-Driver.com Page 1
2SC0650P2Ax-17 Preliminary Data Sheet
Dual-Channel High-Power High-Frequency SCALE-2 Driver Core
Short De scription
The SCALE-2 dual driver core 2SC0650P2Ax-17 combines highest power density with broad applicability. The
driver is designed for both high-power and high-frequency applications requiring maximum reliability. It is
suitable for IGBTs with reverse voltages up to 1700V and also features a dedicated MOSFET mode. The
embedded paralleling capability allows easy inverter design covering higher power ratings. Multi-level
topologies are also supported.
CONCEPT’s patented planar-transfor mer tech nolog y ass ures ef ficie nt and hig h-voltage isolat ion with long-term
reliability and sets new milestones in compactness, interference immunity and performance. Its outstanding
EMC with a dv/dt strength of more than 100V/ns allows safe and reliable operation in even the toughest
industrial applications.
Thanks to its ultra-flat design with an insertion height of max. 6.5mm and a footprint of 61.7mm x 57.2, the
2SC0650P2Ax-17 can efficiently utilize even the most constrained insertion spaces. Compared with
convent ional driver s, the highly inte grated SCALE -2 chipset a llows about 85% of compone nts to be dispensed
with. This advantage is impressively reflected in increased reliability at simultaneously mi nimiz ed cost.
Equipped with the latest SCALE-2 technology, the driver core opens up the possibility of working with clock
frequencies of up to 150kHz – at best-in-class efficiency. The 2SC0650P2Ax-17 combines a complete two-
channel driver core with all components required for driving, such as an isolated DC/ DC converter, short-circuit
protection, advan ced active cla mping as well as s upply voltage monitor ing. Each o f the two output channels i s
electrically isolated from the primar y s ide and the other secondary channel.
Product Highlights Applications
Wind power converters
Industrial drives
Traction applications
Electro/hybrid drive commercial vehicles
Driving parallel-connected large IGBTs
High gate-current driving applications
Induction heating
Switched mode pow er suppl ies (SMPS)
Laser and medical (MR T, CT, X-Ray)
Laser technol ogy
Ultra-flat dual channel driver
Highly integrated SCALE-2 chipset
Planar transformer technology
Blocking voltages up to 1700V
Switching frequency up to 150kHz
Short delay and extremely small jitter
Gate current ±5 0A, 6W output power per channel
+15V/-10V gate driving
Safe isolation to EN 50178
UL compliant
2SC0650P2Ax-17
Prelim i nary Dat a Shee t
Page 2 INTELLIGENT POWER ELECTRONICS
Safety Notice!
The data contained in this data sheet is intended exclusively for technically trained staff. Handling all high-
voltage equipment involves risk to life. Strict complia nce with the respective safety regulations is mandatory!
Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive
devices according to inte rn ational sta ndard IE C 60747-1, Chapter IX or European standard EN 1000 15 (i .e. t he
workplace, tools, etc. must comply with these standards). Ot he r wise, this product may be damaged.
Impor tant Product Docum enta tion
This data sheet contains only product-specific data. For a detailed d escription, must-read application notes and
important informa tion that app ly to this product, plea se refer to “2SC0650P Descr iption & Application Man ual”
on www.IGBT-Driver.com/go/2SC0650P
Absolut e Maxi mum Rati ng s
Parameter Remarks Min Max Unit
Supply voltage VDC
VDC to GND 0 16 V
Supply voltage VCC
VCC to GND 0 16 V
Logic inp ut and out put voltages Primary side, to GND -0.5 VCC+0.5 V
SOx current Fa ilure condition, total current 20 mA
Gate peak current Iout Note 1 -50 +50 A
External gate resistance Turn-on and turn-off 0.5 Ω
Average supply current IDC Notes 2, 3 1300 mA
Output power Ambient temperature <70°C (Notes 4, 5) 6.5 W
Ambient temperature 85°C (Note 4) 6 W
Switching freq uency F 150 kHz
Test v ol tage (50Hz/1min.) Primary to secondary (Note 15) 5000 VAC(eff)
Secondary to secondary (Note 15) 4000 VAC(eff)
|dV/dt| R ate of change of input to output voltage (Note 11) 100 kV/μs
Operating voltage Primary/secondary, secondary/secondary 1700 Vpeak
Operating temperature Note 5 -40 +85 °C
Storage temperature -40 +90 °C
Recommended Operating Conditions
Power Supply Remarks Min Typ Max Unit
Supply voltage
VDC
VDC to GND 14.5 15 15.5 V
Supply voltage
VCC
VCC to GND 14.5 15 15.5 V
2SC0650P2Ax-17
Prelim i nary Dat a Shee t
IGBT-Driver.com Page 3
Electrical Characteristics (IGBT mode)
All data refer to +25°C and VCC = VDC
= 15V unless otherwise specified.
Power supply Remarks Min Typ Max Unit
Supply current IDC Without load 40 mA
Supply current ICC F = 0Hz 21 mA
Supply current ICC F = 150kHz 35 mA
Coupling capacitan c e Cio Primary to output, total 28 pF
Power Supply Monitoring Remarks Min Typ Max Unit
Supply threshold VCC P r imary side, clear fault 11.9 12.6 13.3 V
Primary side, set fault (Note 12) 11.3 12.0 12.7 V
Monitoring hysteresis Primary side, set/clea r fault 0.35 V
Supply threshold VISOx-VEx Seconda r y side , clear fault 12.1 12.6 13.1 V
Secondary side, set fault (Note 13) 11.5 12.0 12.5 V
Monitoring hysteresis Secon dary side, set/clear fault 0.35 V
Supply threshold VEx-VCOMx Secondary side, clear fault 5 5.15 5.3 V
Secondary side, set fault (Note 13) 4.7 4.85 5 V
Monitoring hysteresis Secon dary side, set/clear fault 0.15 V
Logic Inputs and Outputs Remarks Min Typ Max Unit
Input bias current V(INx) > 3V 190 µA
Turn-on threshold V(INx) 2.6 V
Turn-off threshold V(INx) 1.3 V
SOx output voltage Failure condition, I(SOx)<20mA 0.7 V
Short-Circuit Protection Remarks Min Typ Max Unit
Current through pin REFx R(REFx, VEx)<70kΩ 150 µA
Minimum response time Note 9 1.2 µs
Minimum blocking time Note 10 9 µs
Timing Charact eristics Remarks Min Typ Max Unit
Turn-on delay td(on) Note 6 80 ns
Turn-off delay td(off) Note 6 75 ns
Jitter of turn-on delay Note 17 ±2 ns
Jitter of turn-off delay Note 17 ±2 ns
Output rise time tr(out) Note 7 25 ns
Output fall time tf(out) Note 7 25 ns
Transmission delay of fault state Note 14 400 ns
2SC0650P2Ax-17
Prelim i nary Dat a Shee t
Page 4 INTELLIGENT POWER ELECTRONICS
Electrical Isolation Remarks Min Typ Max Unit
Test voltage (50Hz/1s) Primary to secondary side (Note 15) 5000 5050 5100 Veff
Partial discharge extinction volt. Prim ary to secondary side (N ote 16) 1768 Vpeak
Creepage distance Primary to secondary side 15 mm
Secon dary to seconda ry side 25 mm
Clearance distance Primary to secondary side 15 mm
Secon dary to seconda ry side 6.5 mm
Output Remarks Min Typ Max Unit
Blocking capacitance VISOx to VEx (Note 8) 9.4 µF
VEx to COMx ( Not e 8) 9.4 µF
Output voltage swing
The output voltage swing consists of two distinct se gments. First, there is the t urn-o n voltage VGHx between
pins GHx and VEx. VGHx is regulated and maintained at a constant level for all output power values and
frequencies.
The seco nd segm ent o f the output voltag e swing i s the turn-off volt age VGLx. VGLx is measured between pins
GLx and VEx. It is a negative voltage. It changes with the output power to accommodate the inevitable
voltage drop across the internal DC/DC converter.
Output Voltage Remarks Min Typ Max Unit
Turn-on voltage, VGHx Any load condition 15.0 V
Turn-off voltage, VGLx No load -11.4 V
Turn-off volta ge , VGLx 1W output p ower -9.3 V
Turn-off volta ge , VGLx 6W output p ower -8.1 V
Footnot es to the K ey D a ta
1) The maximum peak gate current refers to the highest current level occurring during the product
lifetime. It is an absolute value and does also apply for short pulses.
2) The average supply input current is limited for thermal reasons. Higher values than specified by the
absolute maximum rating are permissible (e.g. during power supply start up) if the average remains
below the given value, provided the average is taken over a time period which is shorter than the
thermal time constants of the driver in the application.
3) There is no means of actively controlling or limiting the input current in the driver. In the case of
start-up with very high blocking capacitor values, or in case of short circuit at the output, the supply
input current has to be limited externally.
4) The maximum output power must not be exceeded at any time during operation. The absolute
maximum rating must also be observed for time periods shorter than the thermal time constants of
the driver in the application.
5) An extended output power range is specified in the output power section for maximum ambient
temperatures of 70°C. In that case, the absolute maximum rating for the operating temperature
changes to (–40°C - 70°C) and the absolute maximum output p ower rating changes to 6.5W.
6) The delay time is measured between 50% of the input signal and 10% voltage swing of the
corresp onding output. The del ay time is i ndependent of the output loading.
2SC0650P2Ax-17
Prelim i nary Dat a Shee t
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7) Output rise and fall time s are measured between 10% and 90% of t he nominal outp ut swing with an
output load of 4.7Ω and 270nF. The values are given for the driver side of the gate resistors. The time
constant of the output load in conjuncti on wit h the pr esent g ate res istors le ads t o an additi onal delay
at the load side of the gate resistors.
8) External blocking capacitors are to be placed between VISOx and VEx as well as VEx and COMx for
gate charges exceeding 3µC. Ceramic capacitors are recommended. A minimum external blocking
capacitance of 3µF is recommended for every 1µC of gate charge beyond 3µC. Insufficient external
blocking can lead to r educed driver efficiency and thus to therm al overlo ad.
9) The minimum response time given is valid for the circuit given in the description and application
manual (Fig. 6) with the values of table 1 (Cax=0pF, Rthx=43kΩ).
10) The blocking time sets a minimum time span between the end of any fault state and the start of
normal operation (remove fault from pin SOx). The value of the blocking time can be adjusted at pin
TB. The specified bl ocking time is valid if TB is connected to GND.
11) This spe cification guara ntees that the drive in formation will be tra nsferred reliabl y even at a high DC-
link voltage and with ultra-fast switching operations.
12) Under voltage monitorin g of the primary-side supply voltage (VCC to GND). If the voltage drops below
this limit, a fault is transmitted to both SOx outputs and the power semiconductors are switched off.
13) Unde rvolta ge monitor ing of the seco ndary-side suppl y voltage (VI SOx to VEx and VEx to CO Mx which
correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding
voltage drops below this limit, t he IGBT is switched off and a fault is transmitted t o the corresponding
SOx output.
14) Transmission delay of fault state from the secondary side to the corresponding primary status output.
15) HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate
driver is suited for HiPot te sting. Nevert heless, it is str ongly recommended to limit the testing time to
1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 1200V AC(eff)
may lead to insulation degradation. No degradation has been observed over 1min. testing at
5000VAC(eff). E very pr oduct ion sampl e shipp ed to cust omers has underg one 100% testing at the give n
value for 1s.
16) Partial discharge measurement is performed in accordance with IEC 60270 and isolation coordination
specified in E N 50178. The par tial discharge extincti on voltage bet ween primary and either secondary
side is coordinated for safe isolation to EN 50178. The minimum value given is designed to include
appropriate sa fety margins for long-term a geing. Accelerat ed ageing tests show virt ually no insulation
deterioration. Minimum partial discharge extinction voltages remain >2100V even after 2600 slow
thermal cycles between –40°C and 1 25 °C a nd als o a ft e r 500 t her ma l s ho c k c ycle s be tw e en –55°C and
150°C.
17) Jitter measurements are performed with input signals INx switching between 0V and 5V referred to
GND, with a corresponding rise time and fall time of 15ns.
Legal Disclaimer
This data sheet specifies devices but cannot promise to deliver any specific characteristics. No warranty or
guarantee is given – either expressly or implicitly – regarding delivery, performance or suitability.
CT-Concept Technologie AG reserves the right to make modifications to its technical data and product
specifications at any time without prior notice. The general terms and conditions of delivery of CT-Concept
Technologie AG apply.
2SC0650P2Ax-17
Prelim i nary Dat a Shee t
Page 6 INTELLIGENT POWER ELECTRONICS
Ordering I nfo rmatio n
The general terms and conditions of delivery of CT-Concept Technologie AG apply.
Type Designation Description
2SC0650P2A0-17 Dual-channel SCALE-2 driver core
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Refer to www.IGBT-Driver.com/go/nomenclature for information on driver nomenclatur e
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Manufacturer
CT-Concept Technologie AG
Intelligent Power E lectronics
Renferstrasse 15
CH-2504 Biel-Bienne
Switzerland
Tel. +41 - 32 - 344 47 47
Fax +41 - 32 - 344 47 40
E-mail Info@IGBT-Driver.com
Internet www.IGBT-Driver.com
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We reserve the right to make any technical modifications without prior notice. Version from 2016-05-20
