Pb
RoHS
EMDS13E2J-176.83816M TR
EMDS13 E 2 J -176.83816M TR
Series
RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm
Plastic SMD LVDS MEMS Oscillator
Frequency Tolerance/Stability
±25ppm Maximum over 0°C to +70°C
Duty Cycle
50 ±5(%)
Packaging Options
Tape & Reel
Nominal Frequency
176.83816MHz
Logic Control / Additional Output
Standby (ST) and Complementary Output
ELECTRICAL SPECIFICATIONS
Nominal Frequency 176.83816MHz
Frequency Tolerance/Stability ±25ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency
Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year
Aging at 25°C, Reflow, Shock, and Vibration)
Aging at 25°C ±1ppm First Year Maximum
Supply Voltage +3.3Vdc ±0.3Vdc
Input Current 80mA Maximum (Excluding Load Termination Current)
Output Voltage Logic High (Voh) 1.425Vdc Typical
Output Voltage Logic Low (Vol) 1.075Vdc Typical
Differential Output Voltage (Vod) 247mVdc Minimum, 350mVdc Typical, 454mVdc Maximum
Offset Voltage (Vos) 1.125V Minimum, 1.250V Typical, 1.375V Maximum
Rise/Fall Time 225pSec Typical, 325pSec Maximum (Measured over 20% to 80% of waveform)
Differential Output Error (dVod) 50mVdc Maximum
Duty Cycle 50 ±5(%) (Measured at 50% of waveform)
Offset Error (dVos) 50mVdc Maximum
Load Drive Capability 100 Ohms Between Output and Complementary Output
Output Logic Type LVDS
Logic Control / Additional Output Standby (ST) and Complementary Output
Output Control Input Voltage Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc
Maximum to Disable Output and Complementary Output (High Impedance)
Standby Current 30µA Maximum (ST) Without Load
Period Jitter (Deterministic) 0.2pSec Typical
Period Jitter (Random) 2.0pSec Typical
Period Jitter (RMS) 1.8pSec Typical, 2.5pSec Maximum
Period Jitter (pk-pk) 25pSec Typical, 30pSec Maximum
RMS Phase Jitter (Fj = 637kHz to
10MHz; Random) 1.6pSec Typical
RMS Phase Jitter (Fj = 1MHz to
20MHz; Random) 0.7pSec Typical
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random) 0.6pSec Typical
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V
Flammability UL94-V0
Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity Level J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)
Temperature Cycling MIL-STD-883, Method 1010, Condition B
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 6
EMDS13E2J-176.83816M TR
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Thermal Shock MIL-STD-883, Method 1011, Condition B
Vibration MIL-STD-883, Method 2007, Condition A, 20G
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3
2
1
A
4
5
6
7.00
±0.15 2.30
1.47
1.20 ±0.10 (x4)
5.00
±0.15
0.85
±0.15
0.08
MAX
1.40
±0.10 (x4)
Note A: Center paddle is connected
internally to oscillator ground (Pad 3).
5.08
±0.10
2.60
±0.15
2.54 TYP
PIN CONNECTION
1 Standby (ST)
2 No Connect
3 Case Ground
4 Output
5 Complementary Output
6 Supply Voltage
LINE MARKING
1XXXX or XXXXX
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X6)
All Dimensions in Millimeters
0.54 (X4)
2.39 (X3)
1.80 (X6)
2.00 (X6)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 6
EMDS13E2J-176.83816M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
VOS
VIH
VIL
Q & Q OUTPUTS TRI-STATE INPUT
HIGH IMPEDANCE
STATE
80%
0V
20%
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
tPLZ tPZL
Q MINUS Q OUTPUT
Q
Q
HIGH IMPEDANCE
STATE
VOD
VOp-p
Output
Supply
Voltage
(VDD)
Ground
Power
Supply Voltage
Meter
Current
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Power
Supply No
Connect
Switch
Complementary
Output
Tri-State
Oscilloscope Frequency
Counter
Probe 2
(Note 2) Probe 1
(Note 2)
Test Circuit for Tri-State and Complementary Output
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
100 Ohms
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 6
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
EMDS13E2J-176.83816M TR
16.0 ±0.3
7.5 ±0.2
6.75 ±0.20
4.0 ±0.2
2.0 ±0.2
8.0 ±0.2 B0*
DIA 1.5 ±0.1
A0*
0.30 ±0.05
K0*
22.4 MAX
180 MAX
Quantity Per Reel: 1,000 units
16.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EMDS13E2J-176.83816M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EMDS13E2J-176.83816M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 6 of 6
