DATA SH EET
Product specification
Supersedes data of 1999 Mar 30 2001 Oct 31
DISCRETE SEMICONDUCTORS
BGE885
860 MHz, 17 dB gain push-pull
amplifier
dbook, halfpage
M3D248
2001 Oct 31 2
NXP Semiconductors Product specification
860 MHz, 17 dB gain push-pull amplifier BGE885
FEATURES
Excellent linearity
Extremely low nois e
Rugged construction
TiPtAu metallized crystals ensure
optimal reliability.
DESCRIPTION
Hybrid amplifier module for use in
CATV systems operating over a
frequency range of 40 to 860 MHz
with a voltage supply of 24 V (DC).
PINNING - SOT115D
Note
1. Pins 1 and 9 carry DC voltag es.
PIN DESCRIPTION
1 input; note 1
2 common
3 common
4 12 V, 60 mA supply terminal
5 common
6 common
7 common
8+V
B
9 output; note 1
Fig.1 Simplified outline.
lfpage
789
246
351
Side view MBK049
QUICK REFERENCE DATA
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Gppower gain f = 50 MHz 16.5 17.5 dB
Itot total current consumption (DC) VB=24V 240 mA
SYMBOL PARAMETER MIN. MAX. UNIT
VBDC supply voltage 28 V
ViRF input voltage 65 dBmV
Tstg storage temperature 40 +100 C
Tmb operating mounting base temperature 20 +100 C
2001 Oct 31 3
NXP Semiconductors Product specification
860 MHz, 17 dB gain push-pull amplifier BGE885
CHARACTERISTICS
Bandwidth 40 to 860 MHz; VB=24V; T
mb =30C; ZS=Z
L=75
Notes
1. fp=349.25MHz; V
p= 59 dBmV;
fq=403.25MHz; V
q= 59 dBmV;
measured at fp+f
q= 752.5 MHz.
2. Measur ed according to DI N45004B:
fp=851.25MHz; V
p=V
o=59dBmV;
fq=858.25MHz; V
q=V
o6dB;
fr= 860.25 MHz; Vr=V
o6dB;
measured at fp+f
qfr=849.25MHz.
3. The module nor m ally operates at VB= 2 4 V, but is able to withstand supply transi ents up to 30 V.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Gppower gain f = 50 MHz 16.5 17.5 dB
SL slope cable equ i va le nt f = 40 to 860 MHz 0.2 1.2 dB
FL flatness of frequency response f = 40 to 860 MHz 0.5 dB
s11 input return losses f = 40 to 450 MHz 14 dB
f=450to860MHz 10 dB
s22 output return losses f = 40 to 450 MHz 14 dB
f=450to860MHz 10 dB
d2second order distortion note 1 53 dB
Vooutput voltage dim =60 dB; note 2 59 dBmV
F noi se fig ur e f = 350 MHz 7.5 dB
f=860MHz 8dB
Itot total current consumption (D C) note 3 240 mA
2001 Oct 31 4
NXP Semiconductors Product specification
860 MHz, 17 dB gain push-pull amplifier BGE885
List of components (see Fig.2)
COMPONENT DESCRIPTION VALUE
C1, C3, C4 ceramic multilayer capacitor 1 nF
C2 ceramic multilayer capacitor 1 nF (max.)
R resistor 200 ,1 W
Pins 1 and 9 ca rry DC voltages.
Fig.2 Test circuit.
MGD013
RC2
C3
C1
input
12 V
BGE885
C4
output
987654321
VB= 24 V
2001 Oct 31 5
NXP Semiconductors Product specification
860 MHz, 17 dB gain push-pull amplifier BGE885
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
DIMENSIONS (mm are the original dimensions)
SOT115D
0 5 10 mm
scale
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads SOT115D
D
U1q
q1
b
F
S
A
Z
E
A2
L
c
d
Q
U2
M
w
78923
We
e1
564
pyMB
xMB
1
B
04-02-04
10-06-18
q2yMB
UNIT A2
max. cee
1q
Q
max. q1q2U2
U1W
mm 20.8 9.5 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 4.15
3.85 2.4 38.1 25.4 10.2 4.2 44.75
44.25 8.2
7.8 0.25 0.1 3.8
bF
p
6-32
UNC
yw
0.7
x
S
A
max. D
max. L
min.
E
max. Z
max.
d
max.
2001 Oct 31 6
NXP Semiconductors Product specification
860 MHz, 17 dB gain push-pull amplifier BGE885
DATA SHEET STATUS
Notes
1. Please cons ult the most recently issued do cument before initiating or completin g a design.
2. The product status of dev i ce(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the pr oduct specification.
DEFINITIONS
Product specification The information and da ta
provided in a Product data she et shall define the
specification of the product as agre ed between NXP
Semiconductors and its custo m er, unless NXP
Semiconductors and cus to mer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which th e NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sh eet.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconduc tors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, busin es s inte rru ption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditio ns of comme rcial
sale of NXP Semiconductors.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and prod uct descriptions, at any time and
without notice. This document supersedes and replaces all
information su pplied prior to the publicat ion hereof.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critic al systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to res ult in personal injur y, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductor s pr od ucts in such equipment or
application s and therefor e suc h inclusion and/o r use is at
the customer’s own risk.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors pro du ct is su itable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of custom er’s third
party customer(s). Customers should provide appropriate
design and opera ting safeguards to minimi ze the risks
associated with their ap plications and products.
2001 Oct 31 7
NXP Semiconductors Product specification
860 MHz, 17 dB gain push-pull amplifier BGE885
NXP Semiconductors does not accept any liability related
to any default, damage, cost s or problem which is based
on any weakness or default in the customer’s applications
or products, or the applic ation or use by customer’s th ird
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semic on ductors produc ts in or de r to
avoid a default of the app lications and th e products or of
the application or use by cust omer’s third party
customer(s). NXP does not accept any liability in this
respect.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operat ion of the device at these or any othe r
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the qual ity and
reliability of the device.
Terms and conditions of commercial sale NXP
Semiconductors products are sold subject to the general
terms and conditio ns of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agre eme n t. In case an
individual agreeme nt is co nc luded only the terms and
conditions of the resp ective agreement shall apply. NXP
Semiconductors hereby expressly objects to apply i ng the
customer’s general terms and conditions with regard to the
purchase of NXP Semicon ductors produc ts by customer.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for accepta nc e or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual proper ty rights.
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick refer ence data The Quick reference data is an
extract of th e product data given in the Li miting values and
Characteristics sections of this document, and as such is
not complete, exhaus tive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is au tomotive qualified, the
product is not suitable fo r automotive use. It is neither
qualified nor te sted in accorda nce with automot ive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified prod ucts in automotive equip m en t or
applications.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for suc h aut omo tive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyo nd NXP
Semiconductors’ specifications such use shall be solely at
customer’s own ris k, an d (c) customer fully inde m nifies
NXP Semiconductors for an y liability, damages or failed
product clai ms r esult ing fr om cus to mer d esi gn an d us e of
the product for automotive ap plic ations beyond NXP
Semiconductors ’ st andard warranty and NXP
Semiconductors’ product specifications.
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Contact information
For additional information p lease visit: http://www.nxp.com
For sales offices addr esses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in th is do cumen t d oes not form par t o f an y q uot ation or co nt ra ct, is b elieve d to be accurate and reliable and may be chan ged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimer s. No cha ng es were made to the technic al content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands R77/04/pp8 Date of release: 2001 Oct 31
