Product
Specification 108-11030
29May07 Rev E
Power Distribution Tap
©2007 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved.
* Trademark
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LOC B
1. SCOPE
1.1. Content
This specification covers per formance, tests and quality requirements for Ty co Electronics power
di stribution taps. These taps are available in .100 X .300 and .125 X .250 inch centerlines. The .125 X
.250 t aps are available in 6 and 10 position w hile the .100 X .300 tap is available in 10 position only.
1.2. Definitions
For t he purpose of this specification, the following defini tions shall apply.
!
Power Di stributi on Tap: A printed circuit board mounted device intended as an interface
between printed circuit board and power l eads.
!
ACTION PIN* Contacts: Pins used on power distribution tap for distributing current to printed
ci rcuit board.
1.3. Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
Al l i nspections shall be performed using applicable inspect ion plan and product draw ing.
1.4. Qual ification Test Resul ts
Successful qualification testing on the subject product line was completed in Jan93. The Qualif ication
Test Report number for this testing is 501-215. T his documentation is on file at and available from
Engi neering Pr actices and Standards (EPS).
2. APPLI CABLE DOCUMENTS
The follow ing documents constitute a part of this specification to the extent specified herein. Unless
other wise specified, the latest edition of the document applies. In the event of conflict between the
requirements of t his specification and the product drawing, the product drawing shall take precedence.
In t he event of conflict betw een the requirements of this specification and the referenced documents,
this specif ication shall take precedence.
2.1. Tyco Electronics Documents
!
109 Series: Test Specifications as indicated in Figure 1
!
114-11000: Application Specification (P ower Di stribution T aps)
!
501-215: Qualification Test Report (Pow er Distribution Tap)
3. REQUIREMENTS
3.1. Desi gn and Construction
Product shall be of the design, construction and physical dimensi ons specified on the applicable product
drawing.
108-11030
Rev E 2 of 9
3.2. Materials
!
Contact : Copper alloy 725
!
Housi ng: Thermopl astic, UL94V0
3.3. Ratings
!
Curr ent: See Figure 2 for applicable current carrying capability
!
Temperature: -55 to 85
/
C
3.4. Perf ormance and Test Description
Product is designed to meet the electrical, mechanical and envi ronmental performance requirements
speci fied in Figur e 1. Unless otherwi se specified, all tests shall be performed at ambient environmental
condi tions per Test Speci fication 109-1.
3.5. Test Requirements and Procedures Summary
Test Description Requi rement Procedur e
Examination of product. Meets requirements of product
drawing and Application
Speci fication 114-11000.
Vi sual, dimensi onal and functional
per applicable quality inspection
plan.
ELECTRICAL
Termination resistance, specified
current. Position Test Resistance
Current (milliohms)
(amperes) maximum)
6 15 .5
10 25 .4
AMP Spec 109-25.
Measure potential drop of mated
contact s assembled in housing.
Cal culate resistance.
See Fi gure 7.
Termination resistance, dry circuit. Posi tion Resistance
(milliohms maximum)
6 .5
10 .4
AMP Spec 109-3.
Subject connectors to 1 ampere t est
curr ent and millivolt test method.
Curr ent cycl ing. See Note. AMP Spec 109-51.
Subject mated contacts to 250
cycles at 31.25 amperes f or 15
minut es ON and 15 minutes OFF.
Temperature rise vs current . 30
/
C maximum temperat ure rise at
speci fied current. AMP Spec 109-45-1.
Measure temperature rise vs
current.
See Fi gures 2 and 5.
MECHANICAL
Random vibration. No di scontinuiti es greater than 10
microseconds.
See Note.
AMP Spec 109-21-5.
Subject mated connectors to 16. 91
G's rms for 20 minutes in each of 3
mutual ly per pendicular planes.
See Fi gure 6.
Board insertion force. 400 pounds maximum for 10
position.
240 pounds maximum for 6
position.
Measure force necessary to mount
tap ont o test board using proper
mounti ng fix ture per applicable
Inst ruction Sheet.
See Fi gures 4A and 4B.|Fi gure 1 (continued)
108-11030
Test Description Requi rement Procedur e
Rev E 3 of 9
Board extraction force. 70 pounds minimum for 10 positi on.
42 pounds minimum for 6 positi on. Measure force necessary to remove
tap f rom test board.
Torque. See Note. Apply 9 inch pounds torque to tap
screw terminal, hold 15 seconds
and release.
ENVIRONMENTAL
Thermal shock. See Note. AMP Spec 109-22.
Subject taps wit h wir e in pl ace to
500 cycles between -55 and 85
/
C.
Humidity-temperat ure cycl ing. See Note. AMP Spec 109-23-4,
Condi tion B.
Subject taps wit h wir e in pl ace to 10
humidity-temperat ure cycl es
between 25 and 65
/
C at 95% RH.
Temperature life. See Note. AMP Spec 109-43.
Subject taps wit h wir e in pl ace to
85
/
C for 168 hours.
Shal l meet visual requirements, show no physical damage and shall meet requirements of
NOTE additional tests specified in T est Sequence in Figure 3.
Fi gure 1 (end)
108-11030
Rev E 4 of 9
Fi gure 2A
Curr ent Carrying Capability
Connector Size Wire Size (AWG)
10 12
6 posi tion .91 .75
10 posi tion 1.00 .82
To deter mine acceptable current carrying capacity for connector size and w ire gage indicated, use
NOTE
the Mul tiplication Factor (F) from the above chart and multiply times the Base Rated Current for
single circuit at the maximum operating temperature shown i n Figure 2A.
Fi gure 2B
Curr ent Rating
108-11030
Rev E 5 of 9
3.6. Product Qualification And Requalification Test Sequence
Test or Examination Test Group (a)
1234
Test Sequence (b)
Examination of product 1111
Termination resistance, specified current (c) 4,7, 9,11 3,5, 7,9
Termination resistance, dry circuit 3,8
Curr ent cycl ing 6
Temperature rise vs current 5 10 2 4,9
Vibration 8
Board insertion force 2
Board extraction force 12
Torque 3,10 2,8 2
Thermal shock 4
Humidity-temperat ure cycl ing 6 5
Temperature life 6
(a) See paragraph 4.1.A.
NOTE
(b) Numbers indicate sequence in which tests ar e performed.
(c) 25 amperes for 10 pin, 15 amperes for 6 pin.
Fi gure 3
108-11030
Rev E 6 of 9
4. QUALI TY ASSURANCE PROVISIONS
4.1. Qual ification Testi ng
A. Sample Selection
Taps shall be prepared in accordance wi th applicable Instruction Sheets and shall be sel ected at
random fr om current production. Test groups 1 and 2 shall consi st of 30 samples of 10 position,
hi gh profile, insulat ed power tap mounted to double si ded printed circuit board. Test group 3 shall
consi st of 3 each of both 6 (.100 X .300) and 10 position (.125 X . 250) taps (uninsulated, insulated
l ow profile and insulated high profile) with and without anti-rotation embossments mounted to both
si ngle and doubl e sided printed circuit boards. Test group 4 shall consist of 30 each of 10 position
hi gh profile and 6 posi tion uninsulated taps mounted to double sided printed circuit boards. Test
groups 1, 2 and 3 shall be wired w ith 12 AWG wi re, test group 4 wi th 10 AWG wi re. Wires shall be
att ached to taps using appropriate size PIDG terminals. Wire lengths shall meet minimum
requirements of Test Specification 109-45. Printed circuit test boards shall be both single and
doubl e clad with .5 X .100 traces of 2 ounce copper.
B. Test sequence
Qual ification inspection shall be verified by testing samples as specified in Figure 3.
4.2. Requal ification Testi ng
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing consisting of all or part of the original testing
sequence as deter mined by development/product, quality and reliability engineering.
4.3. Acceptance
Acceptance is based upon verification that product meets the r equirements of Figure 1. Failures
att ributed to equipment, test setup or operator deficiencies shall not disqualify the product. When
product failure occurs, corrective acti on shall be taken and samples resubmitted for qualification. Testing
to conf irm corrective action is required prior to resubmittal.
4.4. Qual ity Conformance Inspection
The applicable quality inspection plan will specify acceptable qualit y sampl ing level to be used.
Di mensional and f unctional requirements shall be in accordance with the applicable product dr awing and
this specif ication.
108-11030
Rev E 7 of 9
Tap Size “B” Dimension “C” Dimension
.125 X .250 .125 .250
.100 X .300 .100 .300
Hole
Type Drill
Size Drilled Hole
Di ameter ± .001 Plating Thi ckness Hole Diameter Copper
Hardness
(Knoop)
Copper Tin-lead After Plating After Ref low
A 1.15 mm .0453 .001 t o .003 .0003 min .037 t o .043 .036 to .043 150 max
Fi gure 4A |Printed Circuit Test Board
Surf ace Finish
Thickness|Plating|.0002 - .0006| Hot Air Solder Level ing, T in-Lead|.00002 Minimum| I mmersion, Tin|.000008 - .00002| Organic Solderability Preservitive|.000004 Minimum| Immersi on, Silver|Fi gure 4B|Hol e Dimensions|
108-11030
Rev E 8 of 9
Fi gure 5
Thermocouple Mounti ng
Fi gure 6
Vibration
108-11030
Rev E 9 of 9
Fi gure 7
Termination Resistance Probe Locations
