TD62786,787APG/AFG TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62786APG, TD62786AFG TD62787APG, TD62787AFG 8CH HIGH-VOLTAGE SOURCE DRIVER The TD62786APG / AFG series are eight channel huyx non-inverting source current transistor array. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer and lamp drivers. This devices are a product for the Pb free(Sn-Ag). TD62786APG TD62787APG FEATURES High output voltage VCE (SUS) = 50 V (Min) Output current (single output) : IOUT = -500 mA / ch (Max) TD62786AFG TD62787AFG Output clamp diodes Single supply voltage Input compatible with TTL, 5 V CMOS Low level active input Package type-APG : DIP-18 pin Package type-AFG : SOP-18 pin PIN CONNECTION (TOP VIEW) Weight DIP18-P-300-2.54D : 1.47 g (Typ.) SOP18-P-375-1.27 : 0.41 g (Typ.) SCHEMATICS (EACH DRIVER) TD62786APG/ AFG Note: TD62787APG/ AFG The input and output parasitic diodes cannot be used as clamp diodes. 1 2005-04-12 TD62786,787APG/AFG MAXIMUM RATINGS (Ta = 25C) CHARACTERISTIC SYMBOL RATING UNIT Supply Voltage VCC-VGND 50 V Output Sustaining Voltage VOUT -50 V IOUT -500 mA / ch Input Voltage VIN (Note 1) -30~0.5 V Input Voltage VIN (Note 2) VGND~7 V VR 50 V 500 mA Output Current Clamp Diode Forward Current Clamp Diode Forward Current APG Power Dissipation AFG IF PD (Note 3) 1.47 W 0.96 Operating Temperature Topr -40~85 C Storage Temperature Tstg -55~150 C Note 1: Only TD62786APG / AFG Note 2: Only TD62787APG / AFG Note 3: Delated above 25C in the proportion of 11.7 mW / C (APG Type), 7.7 mW / C (AFG Type). RECOMMENDED OPERATING CONDITIONS (Ta = -40~85C, VCC = 0 V) CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT Supply Voltage VCC-VGND 50 V Output Voltage VOUT -50 V IOUT -350 mA / ch -30 0 VGND 7 VR 50 V IF 350 mA 0.52 0.35 Output Current Input Voltage TD62786 TD62787 Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation APG AFG VIN PD 2 V W 2005-04-12 TD62786,787APG/AFG ELECTRICAL CHARACTERISTICS (Ta = 25C, VCC = 0 V) CHARACTERISTIC Output Leakage Current Output Saturation Voltage Input Voltage "L" Level TEST CIR- CUIT ICEX 1 VCE (sat) DC Current transfer Ratio "H" Level SYMBOL hFE 2 2 TEST CONDITION MIN TYP. MAX UNIT VOUT = VGND = -50 V Ta = 85C -100 A VIN = VIL MAX. IOUT = -100 mA -1.8 VIN = VIL MAX. IOUT = -350 mA -2.0 1000 -1.2 0 -1.6 5.5 -30 -2.8 VGND -3.7 -0.4 mA 100 A 2.0 V 0.2 1.0 VCC = 0 V, VCE = 3 V IOUT = -350 mA TD62786 TD62787 TD62786 VIN 4 TD62787 Input Current IIL VCC = 5.5 V, VIN = 0.4 V Clamp Diode Reverse Current IR VR = VR Clamp Diode Forward Voltage VF Turn-On Delay tON Turn Off Delay tOFF 5 MAX., Ta = 85C VOUT = -50 V, RL = 163 CL = 15 pF 3 V V s 2005-04-12 TD62786,787APG/AFG TEST CIRCUIT 1. ICEX 2. VCE (sat), hFE 3. IIN (ON), IIN (OFF) 4. VIN (ON), VIN (OFF) 5. tON, tOFF Note 1: Pulse Width 50 s, Duty Cycle 10% Output Impedance 50 , tr 10 ns, tf 5 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 4 2005-04-12 TD62786,787APG/AFG 5 Type-APG Free Air Type-AFG Free Air 2005-04-12 TD62786,787APG/AFG PACKAGE DIMENSIONS DIP18-P-300-2.54D Unit: mm Weight: 1.47 g (Typ.) 6 2005-04-12 TD62786,787APG/AFG PACKAGE DIMENSIONS SOP18-P-375-1.27 Unit: mm Weight: 0.41 g (Typ.) 7 2005-04-12 TD62786,787APG/AFG About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE 030619EBA * The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 8 2005-04-12