MMSZ4678T1 Series Zener Voltage Regulators 500 mW SOD-123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD-123 package. These devices provide a convenient alternative to the leadless 34-package style. http://onsemi.com Specification Features: * * * * * 500 mW Rating on FR-4 or FR-5 Board Wide Zener Reverse Voltage Range - 1.8 V to 43 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications ESD Rating of Class 3 (>16 KV) per Human Body Model 1 Cathode Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 2 1 SOD-123 CASE 425 STYLE 1 260C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL94 V-0 MAXIMUM RATINGS Rating Total Power Dissipation on FR-5 Board, (Note 1.) @ TL = 75C Derated above 75C MARKING DIAGRAM Symbol Max Unit 500 6.7 mW mW/C AA AA AA PD Thermal Resistance - Junction to Ambient (Note 2.) RJA 340 C/W Thermal Resistance - Junction to Lead (Note 2.) RJL 150 C/W TJ, Tstg -55 to +150 C Junction and Storage Temperature Range 2 Anode xx M = Specific Device Code = Date Code ORDERING INFORMATION Device 1. FR-5 = 3.5 X 1.5 inches, using the On minimum recommended footprint as shown in Figure 11 2. Thermal Resistance measurement obtained via infrared Scan Method xx M Package Shipping MMSZ4xxxT1 SOD-123 3000/Tape & Reel MMSZ4xxxT3* SOD-123 10,000/Tape & Reel *MMSZ4703T1 and MMSZ4711T1 Not Available in 10,000/Tape & Reel DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value. The "T1" suffix refers to an 8 mm, 7 inch reel. The "T3" suffix refers to an 8 mm, 13 inch reel. Semiconductor Components Industries, LLC, 2002 June, 2002 - Rev. 2 1 Publication Order Number: MMSZ4678T1/D MMSZ4678T1 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless I otherwise noted, VF = 0.95 V Max. @ IF = 10 mA) Symbol IF Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF VZ VR IR VF IZT Zener Voltage Regulator http://onsemi.com 2 V MMSZ4678T1 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA) Zener Voltage (Notes 1) VZ (Volts) Leakage Current @ IZT IR @ VR Device Device Marking Min Nom Max A A Volts MMSZ4678T1 MMSZ4679T1 MMSZ4680T1 MMSZ4681T1 MMSZ4682T1 CC CD CE CF CH 1.71 1.90 2.09 2.28 2.565 1.8 2.0 2.2 2.4 2.7 1.89 2.10 2.31 2.52 2.835 50 50 50 50 50 7.5 5 4 2 1 1 1 1 1 1 MMSZ4683T1 MMSZ4684T1 MMSZ4685T1 MMSZ4686T1 MMSZ4687T1 CJ CK CM CN CP 2.85 3.13 3.42 3.70 4.09 3.0 3.3 3.6 3.9 4.3 3.15 3.47 3.78 4.10 4.52 50 50 50 50 50 0.8 7.5 7.5 5 4 1 1.5 2 2 2 MMSZ4688T1 MMSZ4689T1 MMSZ4690T1 MMSZ4691T1 MMSZ4692T1 CT CU CV CA CX 4.47 4.85 5.32 5.89 6.46 4.7 5.1 5.6 6.2 6.8 4.94 5.36 5.88 6.51 7.14 50 50 50 50 50 10 10 10 10 10 3 3 4 5 5.1 MMSZ4693T1 MMSZ4694T1 MMSZ4695T1 MMSZ4696T1 MMSZ4697T1 CY CZ DC DD DE 7.13 7.79 8.27 8.65 9.50 7.5 8.2 8.7 9.1 10 7.88 8.61 9.14 9.56 10.50 50 50 50 50 50 10 1 1 1 1 5.7 6.2 6.6 6.9 7.6 MMSZ4698T1 MMSZ4699T1 MMSZ4700T1 MMSZ4701T1 MMSZ4702T1 DF DH DJ DK DM 10.45 11.40 12.35 13.30 14.25 11 12 13 14 15 11.55 12.60 13.65 14.70 15.75 50 50 50 50 50 0.05 0.05 0.05 0.05 0.05 8.4 9.1 9.8 10.6 11.4 MMSZ4703T1* MMSZ4704T1 MMSZ4705T1 MMSZ4706T1 MMSZ4707T1 DN DP DT DU DV 15.20 16.15 17.10 18.05 19.00 16 17 18 19 20 16.80 17.85 18.90 19.95 21.00 50 50 50 50 50 0.05 0.05 0.05 0.05 0.01 12.1 12.9 13.6 14.4 15.2 MMSZ4708T1 MMSZ4709T1 MMSZ4710T1 MMSZ4711T1* MMSZ4712T1 DA DX DY EA EC 20.90 22.80 23.75 25.65 26.60 22 24 25 27 28 23.10 25.20 26.25 28.35 29.40 50 50 50 50 50 0.01 0.01 0.01 0.01 0.01 16.7 18.2 19.0 20.4 21.2 MMSZ4713T1 MMSZ4714T1 MMSZ4715T1 MMSZ4716T1 MMSZ4717T1 ED EE EF EH EJ 28.50 31.35 34.20 37.05 40.85 30 33 36 39 43 31.50 34.65 37.80 40.95 45.15 50 50 50 50 50 0.01 0.01 0.01 0.01 0.01 22.8 25.0 27.3 29.6 32.6 1. Nominal Zener voltage is measured with the device junction in thermal equilibrium at TL = 30C 1C *Not Available in the 10,000/Tape & Reel. http://onsemi.com 3 MMSZ4678T1 Series 8 7 VZ, TEMPERATURE COEFFICIENT (mV/C) VZ, TEMPERATURE COEFFICIENT (mV/C) TYPICAL CHARACTERISTICS TYPICAL TC VALUES 6 5 4 VZ @ IZT 3 2 1 0 -1 -2 TYPICAL TC VALUES VZ @ IZT 10 1 -3 2 3 4 5 6 7 8 9 10 11 10 12 100 VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V) Figure 1. Temperature Coefficients (Temperature Range -55C to +150C) Figure 2. Temperature Coefficients (Temperature Range -55C to +150C) 1000 Ppk , PEAK SURGE POWER (WATTS) 1.2 1.0 PD versus TL 0.8 0.6 PD versus TA 0.4 0.2 RECTANGULAR WAVEFORM, TA = 25C 100 10 1 0 0 25 50 75 100 125 0.1 150 1 10 100 1000 T, TEMPERATURE (C) PW, PULSE WIDTH (ms) Figure 3. Steady State Power Derating Figure 4. Maximum Nonrepetitive Surge Power 1000 1000 TJ = 25C IZ(AC) = 0.1 IZ(DC) f = 1 kHz 75 V (MMSZ5267BT1) 91 V (MMSZ5270BT1) IF, FORWARD CURRENT (mA) Z ZT, DYNAMIC IMPEDANCE ( ) 100 IZ = 1 mA 100 5 mA 20 mA 10 100 10 150C 1 1 10 100 1 0.4 0.5 75C 25C 0.6 0.7 0C 0.8 0.9 1.0 VZ, NOMINAL ZENER VOLTAGE VF, FORWARD VOLTAGE (V) Figure 5. Effect of Zener Voltage on Zener Impedance Figure 6. Typical Forward Voltage http://onsemi.com 4 1.1 1.2 MMSZ4678T1 Series TYPICAL CHARACTERISTICS 1000 1000 C, CAPACITANCE (pF) I R , LEAKAGE CURRENT ( A) TA = 25C 0 V BIAS 1 V BIAS 100 BIAS AT 50% OF VZ NOM 10 100 10 1 +150C 0.1 0.01 +25C 0.001 -55C 0.0001 1 0.00001 1 100 10 0 10 20 30 40 50 60 VZ, NOMINAL ZENER VOLTAGE (V) Figure 7. Typical Capacitance Figure 8. Typical Leakage Current 80 100 100 TA = 25C I Z , ZENER CURRENT (mA) TA = 25C I Z , ZENER CURRENT (mA) 70 VZ, NOMINAL ZENER VOLTAGE (V) 10 1 0.1 10 1 0.1 0.01 0.01 0 2 4 6 8 10 12 10 30 50 70 90 VZ, ZENER VOLTAGE (V) VZ, ZENER VOLTAGE (V) Figure 10. Zener Voltage versus Zener Current (12 V to 91 V) Figure 9. Zener Voltage versus Zener Current (VZ Up to 12 V) http://onsemi.com 5 90 MMSZ4678T1 Series INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNT APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. The minimum recommended footprint for the SOD-123 is shown at the right. The SOD-123 package can be used on existing surface mount boards which have been designed for the leadless 34 package style. The footprint compatibility makes conversion from leadless 34 to SOD-123 straightforward. 0.91 0.036 2.36 0.093 EEEE EEEE EEEE EEEE 4.19 0.165 1.22 0.048 mm inches Figure 11. Minimum Recommended Footprint SOD-123 POWER DISSIPATION into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 0.37 watts. The power dissipation of the SOD-123 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SOD-123 package, PD can be calculated as follows: PD = PD = 150C - 25C 340C/W = 0.37 watts The 340C/W for the SOD-123 package assumes using recommended footprint shown on FR-4 glass epoxy printed circuit board. Another alternative is to use a ceramic substrate or an aluminum core board such as Thermal Clad. By using an aluminum core board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values GENERAL SOLDERING PRECAUTIONS * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 6 MMSZ4678T1 Series PACKAGE DIMENSIONS Zener Voltage Regulators - Surface Mounted 500 mW SOD-123 SOD-123 CASE 425-04 ISSUE C A AAAA AAAA C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. H 1 K DIM A B C D E H J K B E 2 D J http://onsemi.com 7 INCHES MIN MAX 0.055 0.071 0.100 0.112 0.037 0.053 0.020 0.028 0.01 --0.000 0.004 --0.006 0.140 0.152 STYLE 1: PIN 1. CATHODE 2. ANODE MILLIMETERS MIN MAX 1.40 1.80 2.55 2.85 0.95 1.35 0.50 0.70 0.25 --0.00 0.10 --0.15 3.55 3.85 MMSZ4678T1 Series Thermal Clad is a registered trademark of the Bergquist Company ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800-282-9855 Toll Free USA/Canada http://onsemi.com 8 MMSZ4678T1/D