Semiconductor Components Industries, LLC, 2002
June, 2002 – Rev. 2 1Publication Order Number:
MMSZ4678T1/D
MMSZ4678T1 Series
Zener Voltage Regulators
500 mW SOD–123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD–123 package. These devices provide a
convenient alternative to the leadless 34–package style.
Specification Features:
•500 mW Rating on FR–4 or FR–5 Board
•Wide Zener Reverse Voltage Range – 1.8 V to 43 V
•Package Designed for Optimal Automated Board Assembly
•Small Package Size for High Density Applications
•ESD Rating of Class 3 (>16 KV) per Human Body Model
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL94 V–0
MAXIMUM RATINGS
Rating Symbol Max Unit
Total Power Dissipation on FR–5 Board,
(Note 1.) @ TL = 75°C
Derated above 75°C
PD500
6.7 mW
mW/°C
Thermal Resistance –
Junction to Ambient (Note 2.) RJA 340 °C/W
Thermal Resistance –
Junction to Lead (Note 2.) RJL 150 °C/W
Junction and Storage
Temperature Range TJ, Tstg –55 to
+150 °C
1. FR–5 = 3.5 X 1.5 inches, using the On minimum recommended footprint as
shown in Figure 11
2. Thermal Resistance measurement obtained via infrared Scan Method
Device Package Shipping
ORDERING INFORMATION
SOD–123
CASE 425
STYLE 1
1
Cathode 2
Anode
MMSZ4xxxT1 SOD–123 3000/Tape & Reel
MARKING DIAGRAM
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
DEVICE MARKING INFORMATION
xx = Specific Device Code
M = Date Code
xx M
†The “T1” suffix refers to an 8 mm, 7 inch reel.
The “T3” suffix refers to an 8 mm, 13 inch reel.
1
2
Devices listed in
bold, italic
are ON Semiconductor
Preferred devices. Preferred devices are recommended
choices for future use and best overall value.
ÂÂ
ÂÂ
ÂÂ
MMSZ4xxxT3* SOD–123 10,000/Tape & Reel
http://onsemi.com
*MMSZ4703T1 and MMSZ4711T1 Not Available in
10,000/Tape & Reel
MMSZ4678T1 Series
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless
otherwise noted, VF = 0.95 V Max. @ IF = 10 mA)
Symbol Parameter
VZReverse Zener Voltage @ IZT
IZT Reverse Current
IRReverse Leakage Current @ VR
VRReverse Voltage
IFForward Current
VFForward Voltage @ IF
Zener Voltage Regulator
IF
V
I
IR
IZT
VR
VZVF
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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA)
Zener Voltage (Notes 1) Leakage Current
Device
VZ (Volts) @ IZT IR @ VR
Device
Device
Marking Min Nom Max AA Volts
MMSZ4678T1 CC 1.71 1.8 1.89 50 7.5 1
MMSZ4679T1 CD 1.90 2.0 2.10 50 5 1
MMSZ4680T1 CE 2.09 2.2 2.31 50 4 1
MMSZ4681T1 CF 2.28 2.4 2.52 50 2 1
MMSZ4682T1 CH 2.565 2.7 2.835 50 1 1
MMSZ4683T1 CJ 2.85 3.0 3.15 50 0.8 1
MMSZ4684T1 CK 3.13 3.3 3.47 50 7.5 1.5
MMSZ4685T1 CM 3.42 3.6 3.78 50 7.5 2
MMSZ4686T1 CN 3.70 3.9 4.10 50 5 2
MMSZ4687T1 CP 4.09 4.3 4.52 50 4 2
MMSZ4688T1 CT 4.47 4.7 4.94 50 10 3
MMSZ4689T1 CU 4.85 5.1 5.36 50 10 3
MMSZ4690T1 CV 5.32 5.6 5.88 50 10 4
MMSZ4691T1 CA 5.89 6.2 6.51 50 10 5
MMSZ4692T1 CX 6.46 6.8 7.14 50 10 5.1
MMSZ4693T1 CY 7.13 7.5 7.88 50 10 5.7
MMSZ4694T1 CZ 7.79 8.2 8.61 50 1 6.2
MMSZ4695T1 DC 8.27 8.7 9.14 50 1 6.6
MMSZ4696T1 DD 8.65 9.1 9.56 50 1 6.9
MMSZ4697T1 DE 9.50 10 10.50 50 1 7.6
MMSZ4698T1 DF 10.45 11 11.55 50 0.05 8.4
MMSZ4699T1 DH 11.40 12 12.60 50 0.05 9.1
MMSZ4700T1 DJ 12.35 13 13.65 50 0.05 9.8
MMSZ4701T1 DK 13.30 14 14.70 50 0.05 10.6
MMSZ4702T1 DM 14.25 15 15.75 50 0.05 11.4
MMSZ4703T1* DN 15.20 16 16.80 50 0.05 12.1
MMSZ4704T1 DP 16.15 17 17.85 50 0.05 12.9
MMSZ4705T1 DT 17.10 18 18.90 50 0.05 13.6
MMSZ4706T1 DU 18.05 19 19.95 50 0.05 14.4
MMSZ4707T1 DV 19.00 20 21.00 50 0.01 15.2
MMSZ4708T1 DA 20.90 22 23.10 50 0.01 16.7
MMSZ4709T1 DX 22.80 24 25.20 50 0.01 18.2
MMSZ4710T1 DY 23.75 25 26.25 50 0.01 19.0
MMSZ4711T1* EA 25.65 27 28.35 50 0.01 20.4
MMSZ4712T1 EC 26.60 28 29.40 50 0.01 21.2
MMSZ4713T1 ED 28.50 30 31.50 50 0.01 22.8
MMSZ4714T1 EE 31.35 33 34.65 50 0.01 25.0
MMSZ4715T1 EF 34.20 36 37.80 50 0.01 27.3
MMSZ4716T1 EH 37.05 39 40.95 50 0.01 29.6
MMSZ4717T1 EJ 40.85 43 45.15 50 0.01 32.6
1. Nominal Zener voltage is measured with the device junction in thermal equilibrium at TL = 30°C ±1°C
*Not Available in the 10,000/Tape & Reel.
MMSZ4678T1 Series
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4
TYPICAL CHARACTERISTICS
VZ, TEMPERATURE COEFFICIENT (mV/ C)°θ
VZ, NOMINAL ZENER VOLTAGE (V)
–3
–2
–1
0
1
2
3
4
5
6
7
8
12111098765432
Figure 1. Temperature Coefficients
(Temperature Range –55°C to +150°C)
TYPICAL TC VALUES
VZ @ IZT
VZ, TEMPERATURE COEFFICIENT (mV/ C)°θ
100
10
110 100
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 2. Temperature Coefficients
(Temperature Range –55°C to +150°C)
VZ @ IZT
1.2
1.0
0.8
0.6
0.4
0.2
01501251007550250
T, TEMPERATURE (C)
Figure 3. Steady State Power Derating
PD versus TA
PD versus TL
Ppk, PEAK SURGE POWER (WATTS)
0.1
PW, PULSE WIDTH (ms)
Figure 4. Maximum Nonrepetitive Surge Power
1 10 100 1000
1000
100
10
1
RECTANGULAR
WAVEFORM, TA = 25C
100
VZ, NOMINAL ZENER VOLTAGE
Figure 5. Effect of Zener Voltage on
Zener Impedance
101
ZZT, DYNAMIC IMPEDANCE ( )Ω
1000
100
10
1
TJ = 25C
IZ(AC) = 0.1 IZ(DC)
f = 1 kHz
IZ = 1 mA
5 mA
20 mA
VF, FORWARD VOLTAGE (V)
Figure 6. Typical Forward Voltage
1.21.11.00.90.80.70.60.50.4
IF, FORWARD CURRENT (mA)
1000
100
10
1
75 V (MMSZ5267BT1)
91 V (MMSZ5270BT1)
150C75°C 25°C 0°C
TYPICAL TC VALUES
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5
TYPICAL CHARACTERISTICS
C, CAPACITANCE (pF)
100
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 7. Typical Capacitance
1000
100
10
1101
BIAS AT
50% OF VZ NOM
TA = 25°C
0 V BIAS
1 V BIAS
12
VZ, ZENER VOLTAGE (V)
100
10
1
0.1
0.01 1086420
TA = 25°C
IZ, ZENER CURRENT (mA)
VZ, ZENER VOLTAGE (V)
100
10
1
0.1
0.01 10 30 50 70 90
TA = 25°C
IR, LEAKAGE CURRENT ( A)µ
90
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 8. Typical Leakage Current
1000
100
10
1
0.1
0.01
0.001
0.0001
0.00001 80706050403020100
+150C
+25C
–55C
IZ, ZENER CURRENT (mA)
Figure 9. Zener Voltage versus Zener Current
(VZ Up to 12 V) Figure 10. Zener Voltage versus Zener Current
(12 V to 91 V)
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INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNT APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to ensure proper solder connection
interface between the board and the package.
The minimum recommended footprint for the SOD-123
is shown at the right.
The SOD-123 package can be used on existing surface
mount boards which have been designed for the leadless 34
package style. The footprint compatibility makes
conversion from leadless 34 to SOD-123 straightforward.
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
mm
inches
0.91
0.036
1.22
0.048
2.36
0.093
4.19
0.165
Figure 11. Minimum Recommended Footprint
SOD-123 POWER DISSIPATION
The power dissipation of the SOD-123 is a function of
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RJA, the thermal resistance from
the device junction to ambient; and the operating
temperature, TA. Using the values provided on the data
sheet for the SOD-123 package, PD can be calculated as
follows:
PD = TJ(max) – TA
RJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 0.37 watts.
PD = 150C – 25C
340C/W = 0.37 watts
The 340°C/W for the SOD-123 package assumes using
recommended footprint shown on FR-4 glass epoxy printed
circuit board. Another alternative is to use a ceramic
substrate or an aluminum core board such as
Thermal Clad. By using an aluminum core board
material such as Thermal Clad, the power dissipation can
be doubled using the same footprint.
GENERAL SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•Always preheat the device.
•The delta temperature between the preheat and
soldering should be 100°C or less.*
•When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
•The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
•When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
•After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
•Mechanical stress or shock should not be applied
during cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
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7
PACKAGE DIMENSIONS
SOD–123
CASE 425–04
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 1:
PIN 1. CATHODE
2. ANODE
ÂÂÂÂ
ÂÂÂÂ
B
D
K
AC
E
J
1
2
H
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.055 0.071 1.40 1.80
B0.100 0.112 2.55 2.85
C0.037 0.053 0.95 1.35
D0.020 0.028 0.50 0.70
E0.01 --- 0.25 ---
H0.000 0.004 0.00 0.10
J--- 0.006 --- 0.15
K0.140 0.152 3.55 3.85
500 mW SOD–123
Zener Voltage Regulators – Surface Mounted
MMSZ4678T1 Series
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8
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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: r14525@onsemi.com
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
MMSZ4678T1/D
Thermal Clad is a registered trademark of the Bergquist Company
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