SX1240 DATASHEET ADVANCED COMMUNICATIONS & SENSING SX1240 - Low Cost Integrated Transmitter IC 434 MHz and 868 MHz Band RF Transmitter GENERAL DESCRIPTION APPLICATIONS The SX1240 is an ultra-low-cost, fully integrated FSK or OOK compatible transmitter suitable for operation in the 418, 434 and 868 MHz licence free ISM bands. For applications where economy is paramount, the SX1240 may be used without the requirement for configuration via an MCU. The transmitter is configured for default operation at a frequency of 433.92 MHz or 868.3 MHz. However, in conjunction with a microcontroller the communication link parameters may be re-configured. Including, output power, modulation format and operating channel. The SX1240 offers integrated radio performance with cost efficiency and is suited for worldwide operations in particular Europe (ETSI EN 300-220-1), North America (FCC part 15.231). ORDERING INFORMATION Part Number Temperature Range Qty. per Reel Package SX1240ISTRT -40 C to +85 C 2500 SOIC8-EP Pb-Free, Halogen Free, RoHS/WEEE compliant product. SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Low-Cost Consumer Electronic Applications Remote Keyless Entry (RKE) Remote Control / Security Systems Audio Accessories Process and building / home control Active RFID KEY PRODUCT FEATURES +10 dBm or 0 dBm Configurable output power 1.8 to 3.7 V supply range Page 1 Bit rates up to 100 kbps FSK and OOK modulation 2 Preconfigured Modes for Operation without MCU 433.92 MHz OOK & 868.3 MHz FSK Low BOM Fully Integrated Tx 8 Selectable Centre Frequencies Programmable Frequency Tuning of low cost XTAL www.semtech.com SX1240 ADVANCED COMMUNICATIONS & SENSING DATASHEET Table of contents Section 1. 2. Page General Description ................................................................................................................................................. 3 1.1. Pin Diagram ..................................................................................................................................................... 3 1.2. Marking Diagram.............................................................................................................................................. 4 1.3. Pin Description................................................................................................................................................. 4 Electrical Characteristics ......................................................................................................................................... 5 2.1. ESD Notice ...................................................................................................................................................... 5 2.2. Absolute Maximum Ratings ............................................................................................................................. 5 2.3. Operating Range.............................................................................................................................................. 5 2.4. Electrical Specifications 6 2.5. 3. Timing Characteristics ..................................................................................................................................... 7 Application Modes ................................................................................................................................................... 8 3.1. Application Mode: Power & Go 9 3.1.1. `Power & Go' Mode: Configuration............................................................................................................ 9 3.1.2. Transmitter Operation in `Power & Go' Mode ........................................................................................... 9 3.2. Application Mode: Advanced ......................................................................................................................... 10 3.2.1. Advanced Mode: Configuration............................................................................................................... 10 3.2.2. Transmitter Operation in Advanced Mode .............................................................................................. 11 4. Configuration Register ........................................................................................................................................... 13 5. Application Information .......................................................................................................................................... 14 5.1. Crystal Specification ...................................................................................................................................... 14 5.2. Reference Design Schematics....................................................................................................................... 14 5.3. Reference Design PCB Layout 15 5.4. Reference Design BOM 16 6. 7. Packaging Information ........................................................................................................................................... 17 6.1. Package Outline Drawing .............................................................................................................................. 17 6.2. Land Pattern .................................................................................................................................................. 17 6.3. Tape & Reel Specification.............................................................................................................................. 18 Revision History..................................................................................................................................................... 19 SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 2 www.semtech.com SX1240 Integrated Transmitter IC ADVANCED COMMUNICATIONS & SENSING DATASHEET This product datasheet contains a detailed description of the SX1240 performance and functionality. 1. General Description The SX1240 is a fully-integrated frequency-agile, single chip transmitter IC capable of FSK and OOK modulation of an input data stream. The full application circuit is shown in Figure 9. The SX1240 is configured, by default, to operate without a microcontroller with its pre-configured RF settings (see Section 3 for precise details of the default settings). Selection is made between 434 MHz and 868 MHz band operation by setting the Control pin (6) either high or low at power-up. A full description of this functionality is given in Section 3.1. Where greater flexibility is required, many of the default communication parameters can be dynamically configured. This includes the operating frequency, frequency deviation and modulation format. Upon the application of a serial clock to the Control pin (6), the Data pin (2) can be used to load a single 13-bit control word. Accessing this functionality is subject to the connection of the control pin at start-up. For full details of this, the configuration bits and the precise timing operations of this functionality please consult Section 3.2. The SX1240 is designed for use with a variety of low-cost antenna technologies. A reference design with PCB-trace antenna is presented in Section 5. Another key feature of the SX1240 is its low current consumption in transmit and sleep modes and its wide voltage operating range from 1.8 V to 3.7 V. This makes the SX1240 suitable for low-cost battery chemistries or energy harvesting applications. The internal architecture of the SX1240 is shown in Figure 1. The SX1240 comprises a low-consumption PLL and power amplifier. For frequency modulation the modulation is performed digitally within the PLL bandwidth. OOK Modulation is performed via ramping of the PA reference DAC. 1.1. Pin Diagram Figure 1. Pinouts, Top View SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 3 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 1.2. Marking Diagram Figure 2. Marking Diagram Notes yyww refers to the date code xxxxx refers to the lot number 1.3. Pin Description Table 1 Description of the SX1240 Pinouts Number Name Type Function in `Power & Go' Mode Function in `Advanced' Mode 1 GND I 2 DATA I/O 3 GND I Ground 4 XTAL I/O Reference Crystal 5 VDD I Power Supply 1.8V to 3.7V 6 CTRL I 7 GND I Ground 8 RFOUT O Transmitter RF Output SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Ground Transmit Data Transmit or Configuration Data Config Selection Page 4 Configuration Data Clock www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 2. Electrical Characteristics 2.1. ESD Notice The SX1240 is a high performance radio frequency device, and satisfies Class 2 of the JEDEC standard JESD22-A114-B (human body model) on all pins. It should thus be handled with all necessary ESD precautions to avoid any permanent damage. 2.2. Absolute Maximum Ratings Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Table 2 Absolute Maximum Ratings Symbol Description Min Max Unit VDDmr Supply Voltage -0.5 3.9 V Tmr Temperature -55 +115 C Tjunc Junction Temperature -55 +125 C Tstor Storage Temperature -55 150 C 2.3. Operating Range Operating ranges define the limits for functional operation and the parametric characteristics of the device as described in this section. Functionality outside these limits is not implied. Table 3 Operating Range Symbol Description Min Max Unit VDDop Supply voltage 1.8 3.7 V Top Operational temperature range -40 85 C Clop Load capacitance on digital ports - 25 pF SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 5 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 2.4. Electrical Specifications The table below gives the electrical specifications of the transmitter under the following conditions: Supply voltage = 3.3 V, temperature = 25 C, fXOSC = 26 MHz, fRF = 433.93 MHz, 2-level FSK modulation Df = 20 kHz, bit rate = 10 kbit/s and output power = +10 dBm terminated in a matched 50 ohm impedance, unless otherwise specified. Table 4 Symbol Transmitter Specifications Description Conditions Min Typ Max Unit - 0.5 1 A RF Power o/p = +10 dBm RF Power o/p = 0 dBm - 16.5 9 - mA mA Number of programmable values - 8 - 10 - 100 kHz Current Consumption IDDSL Supply current in sleep mode IDDT Supply current in transmit mode with appropriate external matching. RF and Baseband Specifications FDA_D Frequency deviation, FSK FDA Frequency deviation, FSK* BRF Bit rate, FSK Permissible Range 0.5 - 100 kbps BRO Bit rate, OOK Permissible Range 0.5 - 10 kbps OOK_B OOK Modulation Depth - 50 - dB RFOP RF output power in 50 ohms High Power Setting Low Power Setting** 7 -3 10 0 - dBm dBm DRFOPV Variation in RF output power with supply voltage 2.5 V to 3.3 V 1.8 V to 3.7 V - - 3 7 dB dB PHN Transmitter phase noise at 868.3 MHz Offset from centre frequency: 100 kHz 350 kHz 550 kHz 1.15 MHz - - -76 -81 -91 -101 - 8 - 26 26 26 MHz - 3.174 1.587 - kHz kHz - - +/-25 ppm - - 2 ms Programmable - 2 20 - ms ms **** - 20 - us FR Number of selectable Frequencies FXOSC Crystal Oscillator Frequency STEP RF Frequency Step DFXOSC Frequency Variation of the Oscillator Circuit 868 MHz 434 MHz No crystal contribution dBc/Hz dBc/Hz dBc/Hz dBc/Hz Timing Specifications TS_TR Time from Sleep to Tx mode TOFFT Timer from Tx data activity to Sleep RAMP PA Ramp up and down time SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 6 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING Symbol Description Conditions T_START Time before CTRL pin mode selection. Time from power on to sampling of CTRL *** Min Typ Max - 200 us + TS_OSC - * Frequency deviation is positive (+FDA) with DATA = `1', negative (-FDA) with DATA = `0' ** With two different matching networks *** The oscillator startup time, TS_OSC, depends on the electrical characteristics of the crystal Unit ms **** Ramp-up time of the internal regulator turning the PA on. The typical 10% - 90% power ramp-up time is 10us 2.5. Timing Characteristics The following table gives the operating specifications for the TWI interface of the SX1240. Table 5 Serial Interface Timing Specifications Symbol Description fctrl Min Typ Max CTRL Clock Frequency - - 10 tch CTRL Clock High time 45 - - ns tcl CTRL Clock Low time 45 - - ns trise CTRL Clock rise time - - 5 ns tfall CTRL Clock Fall time - - 5 ns tsetup DATA Setup time From Data transition to CTRL rising edge 45 - - ns thold DATA hold time From CTRL rising edge to DATA transition 45 - - ns SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Conditions Page 7 Unit MHz www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 3. Application Modes The SX1240 has two application modes. These are selected depending upon the load presented to the Control pin (6) at power-on of the device, as shown on Figure 3. By connecting the Control pin to logical `0' or `1' the Power & Go mode is selected. A full description of operation in this mode is given in Section 3.1. By presenting a logical zero to the Control input, Advanced Mode can be accessed by subsequent clocking of the control pin, in conjunction with the Data pin (2) permits programming of the SX1240 configuration register and manual control of the transmitter. For more information on Advanced Mode operation please consult Section 3.2. The diagram below summarises the mode selection process. Figure 3. SX1240 Mode Selection Table 6 Control Pin Selection of the Application Mode CTRL Pin (6) Logic `1' or `0' Logic `0' then Clock on CTRL SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Application Mode Power & Go Mode (see Section 3.1) Advanced Mode (see Section 3.2) Page 8 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 3.1. Application Mode: Power & Go 3.1.1. `Power & Go' Mode: Configuration The default Power & Go application mode sees the SX1240 configured as detailed in the following table. By changing the logical state of the control pin (6) at power-up, one of a pair of default configuration modes can be selected. The Power & Go application mode hence permits microcontroller-less operation. By simply powering the transmitter application circuit, the SX1240 is pre-configured as either a 434 MHz OOK transmitter or an 868 MHz FSK transmitter. For appropriate matching circuits please see Section 5. Table 7 Configuration and Band Selection in Power & Go Application Mode CTRL (Pin 6) Configuration `High' OOK 433.92 MHz, 10 dBm `Low' FSK 868.3 MHz, Fdev = 20 kHz, 10 dBm 3.1.2. Transmitter Operation in `Power & Go' Mode The timing of a typical transmit operation in Power & Go mode is shown in Figure 4. Here we see that a rising edge on the DATA pin activates the transmitter start-up process. DATA must then be held high for the start-up time (TS_TR) of the SX1240. During this time the SX1240 undergoes an optimized, self-calibrating, trajectory from sleep mode to transmit mode. Once this time has elapsed, the SX1240 is ready to transmit. Any logical signal subsequently applied to the DATA pin is then transmitted. Figure 4. `Power & Go' Mode: Transmitter Timing Operation The transition back to sleep mode is managed automatically. In 868 MHz FSK modulation mode, after 2 ms of inactivity on the DATA line, the SX1240 returns to sleep mode. If in 434 MHz, OOK modulation mode, the SX1240 waits for 20 ms of inactivity before returning to sleep mode. SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 9 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 3.2. Application Mode: Advanced 3.2.1. Advanced Mode: Configuration Advanced mode can be accessed as described on Figure 3. Programming is performed via a two wire interface (TWI) formed by CTRL and DATA pins. Programming of the configuration register is triggered by a rising edge on the CTRL line. Upon detection of this rising edge, the data applied to the DATA pin is accepted as register configuration information, the data bits are clocked on subsequent rising edges of the clocking signal applied to the CTRL pin. The first bit of serial data selects register read or write operation (Read = `high' and Write = `low'). The timing for SX1240 configuration register `write' is shown in Figure 5. Note that, once triggered, all 13 data bits must be written to the SX1240. The contents of the configuration register and the role of each bit therein is described in Table 8 of Section 4. CTRL DATA R/W ACC `0' `0' D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 `0' Figure 5. TWI Configuration Register `Write'. Similarly, the configuration register may be read using the timing of Figure 6. CTRL DATA R/W ACC `0' `1' `0' `0' `0' `0' `0' D12 D11 D10 D1 D0 T42 T1 T41 T0 `0' DATA pin is an output Figure 6. TWI Configuration Register `Read'. Notes - Logic level `0' on DATA during the first rising edge on CTRL is required to start the TWI access - Reading only the 13 configuration bits D0 to D12 is not allowed on the SX1240. In Read access, 64 clock cycles on CTRL pin must be issued, shifting out on pin DATA the 13 configuration bits (D0 to D12), plus 43 internal test bits (T0 to T42). Read access should be used when developing the device firmware, but is not intended for use in the normal operation mode. - During the register `write' or `read' phases the SX1240 remains in sleep mode. SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 10 www.semtech.com SX1240 Integrated Transmitter IC ADVANCED COMMUNICATIONS & SENSING DATASHEET When powering up the circuit (microcontroller and SX1240), the logic level of the CTRL pin is sampled after T_START, as described on Figure 3. During T_START, the microcontroller IO driving the CTRL pin must be configured as an output, driving the CTRL pin to the desired state. Note whilst the logic level of CTRL pin during T_START (initialization phase of the microcontroller) does not have any effect on the device operation, the pin should not be connected to VDD through an impedance lower than 20 k ohms or higher than 1 M ohms. Figure 7. Power-up Timing 3.2.2. Transmitter Operation in Advanced Mode When operating in advanced mode two possibilities exist for operation of the transmitter, these are dependent upon the state of the Tx Mode bit (D12 of the register description in Table 8). Tx Mode = `0' When set to logical `0' operation is identical to that of the Power & Go mode, following completion of the programming phase, the SX1240 will be placed in transmit mode upon the next rising edge detected on the DATA pin. Transmit operation will then be in accordance with that of Figure 4 with the time TOFFT corresponding to that programmed. Note that prior to programming the default, logical `0', configuration is loaded. Note also that subsequent programming iterations can only be performed once the transmit cycle is finished - including the time required for switching off the PA (TOFFT). Tx Mode = `1' With Tx Mode (D12) set to `1' during the register programming cycle detailed in Figure 5, the SX1240 is placed directly in transmit mode. It will then remain in transmit mode until a second TWI register write operation where, if reset to logical `0', the SX1240 returns to sleep mode. An illustration of this operation is shown in the following timing diagram. Please also note that once in sleep mode, subsequent activity on the DATA pin (without clocking of the CTRL line) will trigger transmission in accordance with Figure 4. Care must hence be taken to avoid inadvertent transmission due to such activity. SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 11 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING D12 = '1' Data D12 = '0' TWI Config TWI Config Ctrl TS_TR RAMP RF Out Sleep State Tx Tx Enable Data Transmission Sleep Tx Off Figure 8. Manual Control of Transmitter Enable via the TWI SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 12 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 4. Configuration Register Table 8 SX1240 TWI Register Description Default Bit D12 D(11:9) D8 D(7:5) D4 D3 D(2:0) T(42:0) Name Nbits State Setting Tx Mode 1 0 1 Frequency 3 000 001 010 011 100 101 110 111 418.00 MHz 433.42 MHz 433.92 MHz 864.00 MHz 868.30 MHz 868.65 MHz 868.95 MHz 869.85 MHz 0 1 FSK OOK 000 001 010 011 100 101 110 111 10 kHz 12.5 kHz 20 kHz 25 kHz 40 kHz 50 kHz 80 kHz 100 kHz 1 0 1 0 dBm 10 dBm 1 0 1 2 ms 20 ms Modulation Freq. Deviation RF Power Tx Timer Fine Tuning Test SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. 1 3 3 43 Power & Go Forced Transmit Notes CTRL = `0' CTRL = `1' 0 0 When set to `1' SX1240 is in continuous Tx until reset to `0'. RF Operating centre frequency 010 100 0 Modulation format 1 FSK Frequency deviation (not used in OOK mode). 010 010 1 1 Programmed RF output power. 0 Transmit power-off timer. 1 011 010 001 000 111 110 101 100 fc + 6 * PLL Step fc + 4 * PLL Step fc + 2 * PLL Step fc + 0 * PLL Step fc - 2 * PLL Step fc - 4 * PLL Step fc - 6 * PLL Step fc - 8 * PLL Step - - Page 13 Fine tuning from programmed centre frequency. 000 000 - - Test registers www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 5. Application Information 5.1. Crystal Specification The SX1240 is designed to operate with a low-cost 26 MHz crystal. Table 9 SX1240 Quartz Crystal Reference Oscillator Specification Symbol Description Conditions Min Typ Max FXOSC Crystal Frequency LM Unit 26 26 26 MHz Crystal Motional Inductance - 12.655 - mH CM Crystal Motional Capacitance - 2.962 - fF RS Crystal Serial Resistance - 20 100 Ohms C0 Crystal Shunt Capacitance - 1.0 7.0 pF CL Load Capacitance - 15 - pF 5.2. Reference Design Schematics VCC R1 C6 GND C5 GND U1 P1 1 GND 10 9 8 7 6 5 4 3 2 1 Data R6 2 Ctrl 3 GND Q1 R_VBAT 4 VBAT GND 1 GND RFOUT DATA GND GND SCK XTAL VBAT GND Q2 GND SX1240 L2 8 7 GND C7 C2 C3 RFIO1 L3 C8 C4 LM C11 6 5 GND GND VCC GND GND GND 2 XTAL 26 MHz MHDR1X10 GND Antenna1 C1 L1 1 3 xtal 26 MHz 2 R2 R3 NC NC VCC R4 0R0 4 GND Figure 9. Application Module Schematics (See BoM for Optional Components) SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 14 www.semtech.com SX1240 Integrated Transmitter IC ADVANCED COMMUNICATIONS & SENSING DATASHEET 5.3. Reference Design PCB Layout With careful RF design practices, the SX1240 can be designed on a single-layer PCB, optimizing the cost of the application. The single layer design below also features a spiral antenna and optional on-board regulation. 1 1 2 2 4 3 2 1 2 1 2 1 1 1 1 2 1 1 4 2 3 5 1 6 2 7 2 8 2 2 1 2 1 1 1 2 2 2 1 2 3 1 2 1 2 1 2 2 1 2 1 1 1 1 1 2 2 2 2 1 2 1 4 3 5 2 6 1 2 2 2 1 1 1 2 3 4 5 6 7 8 9 1 10 Figure 10. Reference Design PCB Layout SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 15 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 5.4. Reference Design BOM The following tables summarize the module BoM for 434 MHz and 868 MHz band operation. Table 10 434 MHz Single Layer Reference Design BoM Designator Part Number U1 SX1240ISRT Q1 Package Value Qty Description Manufacturer SO8 SX1240 1 RF Transmitter IC - HC49 26 MHz 1 Crystal 26 MHz CL = 15 pF - C1 - 0402 NC 0 Capacitor NPO (+/-5%) - C2 - 0402 3.3 pF 1 Capacitor NPO (+/-0.25 pF) - C3 - 0402 S/C 0 C4 - 0402 8.2 pF 1 Capacitor NPO (+/-5%) - C5 - 0402 100 pF 1 Capacitor NPO (+/-5%) - C6 - 0402 100 nF 1 Capacitor X7R (+/-10%) - C7 - 0402 1 pF 1 Capacitor NPO (+/-0.25 pF) - C8 - 0402 8.2 pF 1 Capacitor NPO (+/-5%) - L1 LQG15 0402 120 nH 1 Multilayer chip inductor Murata or equivalent L2 LQG15 0402 22 nH 1 Multilayer chip inductor Murata or equivalent L3 LQG15 0402 15 nH 1 Multilayer chip inductor Murata or equivalent Q2 - 2.5 x 3.2 mm 26 MHz - Optional replacement of Q1 - C11 - 0402 TBC - Antenna Matching Component - LM - 0402 TBC - Antenna Matching Component - R1 - 0402 0R0 - Optional PA Supply Isolation - R2 - 0402 0R0 - Optional CTRL `hi' Connection - R3 - 0402 0R0 - Optional CTRL `lo' Connection - R4 - 0402 0R0 - Optional CTRL Isolation - R VBAT - 0402 0R0 - Optional Supply Isolation - R6 - 0402 0R0 - Optional Data Connection to header - Semtech - - Table 11 868 MHz Reference Design BoM To be Confirmed SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 16 www.semtech.com SX1240 Integrated Transmitter IC ADVANCED COMMUNICATIONS & SENSING DATASHEET 6. Packaging Information 6.1. Package Outline Drawing Figure 11. Package Outline Drawing 6.2. Land Pattern Figure 12. Land Pattern SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 17 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 6.3. Tape & Reel Specification Carrier Tape Tape Width (W) 12 +/-0.30 Pocket Pitch (P) 8 +/-0.10 Reel Ao / Bo Ko Reel Size Reel Width Min. Trailer Length Min. Leader Length QTY per Unit 6.5 / 5.4 +/-0.30 2.00 +/-0.15 330.2 12.4 400 400 2500 mm Figure 13. Tape & Reel Specification Note Single Sprocket Holes SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Page 18 www.semtech.com SX1240 Integrated Transmitter IC DATASHEET ADVANCED COMMUNICATIONS & SENSING 7. Revision History Revision History Revision Date 1 October 2010 First FINAL datasheet version SX1240, Rev 1, Oct 2010 (c)2010 Semtech Corp. Comment Page 19 www.semtech.com SX1240 ADVANCED COMMUNICATIONS & SENSING DATASHEET (c) Semtech 2010 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Semtech assumes no responsibility or liability whatsoever for any failure or unexpected operation resulting from misuse, neglect improper installation, repair or improper handling or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified range. 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