SX1240ISTRT - Semtech - Datasheet.Live

SX1240, Rev 1, Oct 2010

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SX1240 - Low Cost Integrated Transmitter IC

434 MHz and 868 MHz Band RF Transmitter

The SX1240 is an ultra-low-cost, fully integrated FSK or

OOK compatible transmitter suitable for operation in the

418, 434 and 868 MHz licence free ISM bands.

For applications where economy is paramount, the SX1240

may be used without the requirement for configuration via

an MCU. The transmitter is configured for default operation

at a frequency of 433.92 MHz or 868.3 MHz. However, in

conjunction with a microcontroller the communication link

parameters may be re-configured. Including, output power,

modulation format and operating channel.

The SX1240 offers integrated radio performance with cost

efficiency and is suited for worldwide operations in

particular Europe (ETSI EN 300-220-1), North America

(FCC part 15.231).

Pb-Free, Halogen Free, RoHS/WEEE compliant product.

Low-Cost Consumer Electronic Applications

Remote Keyless Entry (RKE)

Remote Control / Security Systems

Audio Accessories

Process and building / home control

Active RFID

+10 dBm or 0 dBm Configurable output power

Bit rates up to 100 kbps

FSK and OOK modulation

2 Preconfigured Modes for Operation without MCU

433.92 MHz OOK & 868.3 MHz FSK

1.8 to 3.7 V supply range

Low BOM Fully Integrated Tx

8 Selectable Centre Frequencies

Programmable Frequency Tuning of low cost XTAL

GENERAL DESCRIPTION

ORDERING INFORMATION

Part Number Temperature Range Qty. per Reel Package

SX1240ISTRT -40 °C to +85 °C 2500 SOIC8-EP

APPLICATIONS

KEY PRODUCT FEATURES

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Table of contents

1. General Description ................................................................................................................................................. 3

1.1. Pin Diagram ..................................................................................................................................................... 3

1.2. Marking Diagram.............................................................................................................................................. 4

1.3. Pin Description................................................................................................................................................. 4

2. Electrical Characteristics ......................................................................................................................................... 5

2.1. ESD Notice ...................................................................................................................................................... 5

2.2. Absolute Maximum Ratings ............................................................................................................................. 5

2.3. Operating Range.............................................................................................................................................. 5

2.4. Electrical Specifications 6

2.5. Timing Characteristics ..................................................................................................................................... 7

3. Application Modes ................................................................................................................................................... 8

3.1. Application Mode: Power & Go 9

3.1.1. ‘Power & Go’ Mode: Configuration............................................................................................................ 9

3.1.2. Transmitter Operation in ‘Power & Go’ Mode ........................................................................................... 9

3.2. Application Mode: Advanced ......................................................................................................................... 10

3.2.1. Advanced Mode: Configuration............................................................................................................... 10

3.2.2. Transmitter Operation in Advanced Mode .............................................................................................. 11

4. Configuration Register ........................................................................................................................................... 13

5. Application Information .......................................................................................................................................... 14

5.1. Crystal Specification ...................................................................................................................................... 14

5.2. Reference Design Schematics....................................................................................................................... 14

5.3. Reference Design PCB Layout 15

5.4. Reference Design BOM 16

6. Packaging Information ........................................................................................................................................... 17

6.1. Package Outline Drawing .............................................................................................................................. 17

6.2. Land Pattern .................................................................................................................................................. 17

6.3. Tape & Reel Specification.............................................................................................................................. 18

7. Revision History..................................................................................................................................................... 19

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This product datasheet contains a detailed description of the SX1240 performance and functionality.

1. General Description

The SX1240 is a fully-integrated frequency-agile, single chip transmitter IC capable of FSK and OOK modulation of an

input data stream. The full application circuit is shown in Figure 9. The SX1240 is configured, by default, to operate without

a microcontroller with its pre-configured RF settings (see Section 3 for precise details of the default settings). Selection is

made between 434 MHz and 868 MHz band operation by setting the Control pin (6) either high or low at power-up. A full

description of this functionality is given in Section 3.1.

Where greater flexibility is required, many of the default communication parameters can be dynamically configured. This

includes the operating frequency, frequency deviation and modulation format. Upon the application of a serial clock to the

Control pin (6), the Data pin (2) can be used to load a single 13-bit control word. Accessing this functionality is subject to

the connection of the control pin at start-up. For full details of this, the configuration bits and the precise timing operations

of this functionality please consult Section 3.2.

The SX1240 is designed for use with a variety of low-cost antenna technologies. A reference design with PCB-trace

antenna is presented in Section 5.

Another key feature of the SX1240 is its low current consumption in transmit and sleep modes and its wide voltage

operating range from 1.8 V to 3.7 V. This makes the SX1240 suitable for low-cost battery chemistries or energy harvesting

applications.

The internal architecture of the SX1240 is shown in Figure 1. The SX1240 comprises a low-consumption PLL and power

amplifier. For frequency modulation the modulation is performed digitally within the PLL bandwidth. OOK Modulation is

performed via ramping of the PA reference DAC.

1.1. Pin Diagram

Figure 1. Pinouts, Top View

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1.2. Marking Diagram

Figure 2. Marking Diagram

Notes yyww refers to the date code

xxxxx refers to the lot number

1.3. Pin Description

Table 1 Description of the SX1240 Pinouts

Number Name Type Function in ‘Power & Go’ Mode Function in ‘Advanced’ Mode

1GND I Ground

2 DATA I/O Transmit Data Transmit or Configuration Data

3GND I Ground

4 XTAL I/O Reference Crystal

5 VDD I Power Supply 1.8V to 3.7V

6 CTRL I Config Selection Configuration Data Clock

7GND I Ground

8 RFOUT O Transmitter RF Output

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2. Electrical Characteristics

2.1. ESD Notice

The SX1240 is a high performance radio frequency device, and satisfies Class 2 of the JEDEC

standard JESD22-A114-B (human body model) on all pins.

It should thus be handled with all necessary ESD precautions to avoid any permanent damage.

2.2. Absolute Maximum Ratings

Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for

extended periods may affect device reliability.

Table 2 Absolute Maximum Ratings

2.3. Operating Range

Operating ranges define the limits for functional operation and the parametric characteristics of the device as described in

this section. Functionality outside these limits is not implied.

Table 3 Operating Range

Symbol Description Min Max Unit

VDDmr Supply Voltage -0.5 3.9 V

Tmr Temperature -55 +115 ° C

Tjunc Junction Temperature -55 +125 ° C

Tstor Storage Temperature -55 150 ° C

Symbol Description Min Max Unit

VDDop Supply voltage 1.8 3.7 V

Top Operational temperature range -40 85 ° C

Clop Load capacitance on digital ports - 25 pF

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2.4. Electrical Specifications

The table below gives the electrical specifications of the transmitter under the following conditions: Supply voltage = 3.3 V,

temperature = 25 °C, fXOSC = 26 MHz, fRF = 433.93 MHz, 2-level FSK modulation Df = 20 kHz, bit rate = 10 kbit/s and

output power = +10 dBm terminated in a matched 50 ohm impedance, unless otherwise specified.

Table 4 Transmitter Specifications

Symbol Description Conditions Min Typ Max Unit

Current Consumption

IDDSL Supply current in sleep mode - 0.5 1 µA

IDDT Supply current in transmit mode

with appropriate external match-

ing.

RF Power o/p = +10 dBm

RF Power o/p = 0 dBm

16.5

RF and Baseband Specifications

FDA_D Frequency deviation, FSK Number of programmable values - 8 -

FDA Frequency deviation, FSK* 10 - 100 kHz

BRF Bit rate, FSK Permissible Range 0.5 - 100 kbps

BRO Bit rate, OOK Permissible Range 0.5 - 10 kbps

OOK_B OOK Modulation Depth - 50 - dB

RFOP RF output power in 50 ohms High Power Setting

Low Power Setting**

-3

dBm

DRFOPV Variation in RF output power with

supply voltage

2.5 V to 3.3 V

1.8 V to 3.7 V

PHN Transmitter phase noise at

868.3 MHz

Offset from centre frequency:

100 kHz

350 kHz

550 kHz

1.15 MHz

-76

-81

-91

-101

dBc/Hz

FR Number of selectable Frequencies - 8 -

FXOSC Crystal Oscillator Frequency 26 26 26 MHz

STEP RF Frequency Step 868 MHz

434 MHz

3.174

1.587

kHz

DFXOSC Frequency Variation of the Oscilla-

tor Circuit

No crystal contribution - - +/-25 ppm

Timing Specifications

TS_TR Time from Sleep to Tx mode - - 2 ms

TOFFT Timer from Tx data activity to

Sleep

Programmable -

RAMP PA Ramp up and down time **** - 20 - us

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* Frequency deviation is positive (+FDA) with DATA = ‘1’, negative (-FDA) with DATA = ‘0’

** With two different matching networks

*** The oscillator startup time, TS_OSC, depends on the electrical characteristics of the crystal

**** Ramp-up time of the internal regulator turning the PA on. The typical 10% - 90% power ramp-up time is 10us

2.5. Timing Characteristics

The following table gives the operating specifications for the TWI interface of the SX1240.

Table 5 Serial Interface Timing Specifications

T_START Time before CTRL pin mode

selection.

Time from power on to sampling of

CTRL ***

- 200 us

+ TS_OSC

-ms

Symbol Description Conditions Min Typ Max Unit

fctrl CTRL Clock Frequency - - 10 MHz

tch CTRL Clock High time 45 - - ns

tcl CTRL Clock Low time 45 - - ns

trise CTRL Clock rise time - - 5 ns

tfall CTRL Clock Fall time - - 5 ns

tsetup DATA Setup time From Data transition to CTRL rising

edge

45 - - ns

thold DATA hold time From CTRL rising edge to DATA

transition

45 - - ns

Symbol Description Conditions Min Typ Max Unit

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3. Application Modes

The SX1240 has two application modes. These are selected depending upon the load presented to the Control pin (6) at

power-on of the device, as shown on Figure 3. By connecting the Control pin to logical ‘0’ or ‘1’ the Power & Go mode is

selected. A full description of operation in this mode is given in Section 3.1. By presenting a logical zero to the Control

input, Advanced Mode can be accessed by subsequent clocking of the control pin, in conjunction with the Data pin (2)

permits programming of the SX1240 configuration register and manual control of the transmitter. For more information on

Advanced Mode operation please consult Section 3.2. The diagram below summarises the mode selection process.

Figure 3. SX1240 Mode Selection

Table 6 Control Pin Selection of the Application Mode

CTRL Pin (6) Application Mode

Logic ‘1’ or ‘0’ Power & Go Mode (see Section 3.1)

Logic ‘0’ then Clock on CTRL Advanced Mode (see Section 3.2)

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3.1. Application Mode: Power & Go

3.1.1. ‘Power & Go’ Mode: Configuration

The default Power & Go application mode sees the SX1240 configured as detailed in the following table. By changing the

logical state of the control pin (6) at power-up, one of a pair of default configuration modes can be selected. The Power &

Go application mode hence permits microcontroller-less operation. By simply powering the transmitter application circuit,

the SX1240 is pre-configured as either a 434 MHz OOK transmitter or an 868 MHz FSK transmitter. For appropriate

matching circuits please see Section 5.

Table 7 Configuration and Band Selection in Power & Go Application Mode

3.1.2. Transmitter Operation in ‘Power & Go’ Mode

The timing of a typical transmit operation in Power & Go mode is shown in Figure 4. Here we see that a rising edge on the

DATA pin activates the transmitter start-up process. DATA must then be held high for the start-up time (TS_TR) of the

SX1240. During this time the SX1240 undergoes an optimized, self-calibrating, trajectory from sleep mode to transmit

mode. Once this time has elapsed, the SX1240 is ready to transmit. Any logical signal subsequently applied to the DATA

pin is then transmitted.

Figure 4. ‘Power & Go’ Mode: Transmitter Timing Operation

The transition back to sleep mode is managed automatically. In 868 MHz FSK modulation mode, after 2 ms of inactivity on

the DATA line, the SX1240 returns to sleep mode. If in 434 MHz, OOK modulation mode, the SX1240 waits for 20 ms of

inactivity before returning to sleep mode.

CTRL (Pin 6) Configuration

‘High’ OOK 433.92 MHz, 10 dBm

‘Low’ FSK 868.3 MHz, Fdev = 20 kHz, 10 dBm

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3.2. Application Mode: Advanced

3.2.1. Advanced Mode: Configuration

Advanced mode can be accessed as described on Figure 3. Programming is performed via a two wire interface (TWI)

formed by CTRL and DATA pins.

Programming of the configuration register is triggered by a rising edge on the CTRL line. Upon detection of this rising edge,

the data applied to the DATA pin is accepted as register configuration information, the data bits are clocked on subsequent

rising edges of the clocking signal applied to the CTRL pin. The first bit of serial data selects register read or write operation

(Read = ‘high’ and Write = ‘low’). The timing for SX1240 configuration register ‘write’ is shown in Figure 5. Note that, once

triggered, all 13 data bits must be written to the SX1240.

The contents of the configuration register and the role of each bit therein is described in Table 8 of Section 4.

Figure 5. TWI Configuration Register ‘Write’.

Similarly, the configuration register may be read using the timing of Figure 6.

Figure 6. TWI Configuration Register ‘Read’.

Notes - Logic level ‘0’ on DATA during the first rising edge on CTRL is required to start the TWI access

- Reading only the 13 configuration bits D0 to D12 is not allowed on the SX1240. In Read access, 64 clock cycles

on CTRL pin must be issued, shifting out on pin DATA the 13 configuration bits (D0 to D12), plus 43 internal test

bits (T0 to T42). Read access should be used when developing the device firmware, but is not intended for use in

the normal operation mode.

- During the register ‘write’ or ‘read’ phases the SX1240 remains in sleep mode.

DATA D12 D11 D10 D9 D7D8 D6 D5 D4 D3 D1 D0D2

‘0’ ‘0’

ACCR/W

CTRL

‘0’

CTRL

DATA ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ D12 D11 D10 D1 D0

‘1’ ‘0’

ACCR/W T42 T41 T1 T0

‘0’

DATA pin is an output

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When powering up the circuit (microcontroller and SX1240), the logic level of the CTRL pin is sampled after T_START, as

described on Figure 3. During T_START, the microcontroller IO driving the CTRL pin must be configured as an output,

driving the CTRL pin to the desired state.

Note whilst the logic level of CTRL pin during T_START (initialization phase of the microcontroller) does not have any

effect on the device operation, the pin should not be connected to VDD through an impedance lower than 20 k

ohms or higher than 1 M ohms.

Figure 7. Power-up Timing

3.2.2. Transmitter Operation in Advanced Mode

When operating in advanced mode two possibilities exist for operation of the transmitter, these are dependent upon the

state of the Tx Mode bit (D12 of the register description in Table 8).

Tx Mode = ‘0’

When set to logical ‘0’ operation is identical to that of the Power & Go mode, following completion of the programming

phase, the SX1240 will be placed in transmit mode upon the next rising edge detected on the DATA pin. Transmit operation

will then be in accordance with that of Figure 4 with the time TOFFT corresponding to that programmed.

Note that prior to programming the default, logical ‘0’, configuration is loaded. Note also that subsequent programming

iterations can only be performed once the transmit cycle is finished - including the time required for switching off the PA

(TOFFT).

Tx Mode = ‘1’

With Tx Mode (D12) set to ‘1’ during the register programming cycle detailed in Figure 5, the SX1240 is placed directly in

transmit mode. It will then remain in transmit mode until a second TWI register write operation where, if reset to logical ‘0’,

the SX1240 returns to sleep mode. An illustration of this operation is shown in the following timing diagram.

Please also note that once in sleep mode, subsequent activity on the DATA pin (without clocking of the CTRL line) will

trigger transmission in accordance with Figure 4. Care must hence be taken to avoid inadvertent transmission due to such

activity.

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Figure 8. Manual Control of Transmitter Enable via the TWI

Data

State Tx Sleep

TWI Config

Ctrl

D12 = ’1'

TS_TR

RF Out

Sleep

D12 = ’0'

TWI Config

Tx Enable Data Transmission Tx Off

RAMP

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4. Configuration Register

Table 8 SX1240 TWI Register Description

Bit Name Nbits State Setting

Default

Notes

CTRL = ‘0’ CTRL = ‘1’

D12 Tx Mode 1 0

Power & Go

Forced Transmit

0 0 When set to ‘1’ SX1240 is in

continuous Tx until reset to ‘0’.

D(11:9) Frequency 3 000

001

010

011

100

101

110

111

418.00 MHz

433.42 MHz

433.92 MHz

864.00 MHz

868.30 MHz

868.65 MHz

868.95 MHz

869.85 MHz

100

010

RF Operating centre frequency

D8 Modulation 1 0

FSK

OOK

Modulation format

D(7:5) Freq. Devia-

tion

3000

001

010

011

100

101

110

111

10 kHz

12.5 kHz

20 kHz

25 kHz

40 kHz

50 kHz

80 kHz

100 kHz

010 010

FSK Frequency deviation (not

used in OOK mode).

D4 RF Power 10

0 dBm

10 dBm 1 1

Programmed RF output power.

D3 Tx Timer 1 0

2 ms

20 ms

Transmit power-off timer.

D(2:0) Fine Tuning 3 011

010

001

000

111

110

101

100

fc + 6 * PLL Step

fc + 4 * PLL Step

fc + 2 * PLL Step

fc + 0 * PLL Step

fc - 2 * PLL Step

fc - 4 * PLL Step

fc - 6 * PLL Step

fc - 8 * PLL Step

000 000

Fine tuning from programmed

centre frequency.

T(42:0) Test 43 - - - - Test registers

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5. Application Information

5.1. Crystal Specification

The SX1240 is designed to operate with a low-cost 26 MHz crystal.

Table 9 SX1240 Quartz Crystal Reference Oscillator Specification

5.2. Reference Design Schematics

Figure 9. Application Module Schematics (See BoM for Optional Components)

Symbol Description Conditions Min Typ Max Unit

FXOSC Crystal Frequency 26 26 26 MHz

LM Crystal Motional Inductance - 12.655 - mH

CM Crystal Motional Capacitance - 2.962 - fF

RS Crystal Serial Resistance - 20 100 Ohms

C0 Crystal Shunt Capacitance - 1.0 7.0 pF

CL Load Capacitance - 15 - pF

GND

DATA

GND

XTAL

RFOUT 8

GND 7

SCK 6

VBAT 5

U1 SX1240

MHDR1X10

GND

VBAT

Dat a

Ctrl

26 MHz

XTAL

26 MHz

2 4

xtal

GND

VCC

C8 C4

C6 C5

GND GND GND

GNDGND

VCC

0R0

VCC

GND

Antenna1

RFIO1

GND

C11

GND

R_VBAT

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5.3. Reference Design PCB Layout

With careful RF design practices, the SX1240 can be designed on a single-layer PCB, optimizing the cost of the

application. The single layer design below also features a spiral antenna and optional on-board regulation.

Figure 10. Reference Design PCB Layout

2 1

21 21

21 2

1 2 21

1 2 3 4 5 6 7 9 108

2 1

2 121

1 2

1234

8765

2 1

1 2

2 3

2 1

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5.4. Reference Design BOM

The following tables summarize the module BoM for 434 MHz and 868 MHz band operation.

Table 10 434 MHz Single Layer Reference Design BoM

Table 11 868 MHz Reference Design BoM

To be Confirmed

Designator Part

Number Package Value Qty Description Manufacturer

U1 SX1240ISRT SO8 SX1240 1 RF Transmitter IC Semtech

Q1 - HC49 26 MHz 1 Crystal 26 MHz CL = 15 pF -

C1 - 0402 NC 0 Capacitor NPO (+/-5%) -

C2 - 0402 3.3 pF 1 Capacitor NPO (+/-0.25 pF) -

C3 - 0402 S/C 0 - -

C4 - 0402 8.2 pF 1 Capacitor NPO (+/-5%) -

C5 - 0402 100 pF 1 Capacitor NPO (+/-5%) -

C6 - 0402 100 nF 1 Capacitor X7R (+/-10%) -

C7 - 0402 1 pF 1 Capacitor NPO (+/-0.25 pF) -

C8 - 0402 8.2 pF 1 Capacitor NPO (+/-5%) -

L1 LQG15 0402 120 nH 1 Multilayer chip inductor Murata or equivalent

L2 LQG15 0402 22 nH 1 Multilayer chip inductor Murata or equivalent

L3 LQG15 0402 15 nH 1 Multilayer chip inductor Murata or equivalent

Q2 -2.5 x 3.2 mm 26 MHz -Optional replacement of Q1 -

C11 -0402 TBC -Antenna Matching Component -

LM -0402 TBC -Antenna Matching Component -

R1 -0402 0R0 -Optional PA Supply Isolation -

R2 -0402 0R0 -Optional CTRL ‘hi’ Connection -

R3 -0402 0R0 -Optional CTRL ‘lo’ Connection -

R4 -0402 0R0 -Optional CTRL Isolation -

R VBAT -0402 0R0 -Optional Supply Isolation -

R6 -0402 0R0 -Optional Data Connection to header -

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6. Packaging Information

6.1. Package Outline Drawing

Figure 11. Package Outline Drawing

6.2. Land Pattern

Figure 12. Land Pattern

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6.3. Tape & Reel Specification

Figure 13. Tape & Reel Specification

Note Single Sprocket Holes

Carrier Tape Reel

Tape

Width

(W)

Pocket

Pitch

(P)

Ao / Bo Ko Reel

Size

Reel

Width

Min.

Trailer

Length

Min.

Leader

Length

QTY

per Unit

+/-0.30

+/-0.10

6.5 / 5.4

+/-0.30

2.00

+/-0.15 330.2 12.4 400 400 2500 mm

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7. Revision History

Revision History

Revision Date Comment

1 October 2010 First FINAL datasheet version

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