SN54AHC86, SN74AHC86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS249I – OCTOBER 1995 – REVISED JULY 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Operating Range 2-V to 5.5-V VCC
D
Latch-Up Performance Exceeds 250 mA Per
JESD 17
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN54AHC86 ...J OR W PACKAGE
SN74AHC86 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
1Y
2A
2B
2Y
GND
VCC
4B
4A
4Y
3B
3A
3Y
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4A
NC
4Y
NC
3B
1Y
NC
2A
NC
2B
1B
1A
NC
3Y
3A V
4B
2Y
GND
NC
SN54AHC86 . . . FK PACKAGE
(TOP VIEW)
CC
NC – No internal connection
SN74AHC86 . . . RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
4B
4A
4Y
3B
3A
1B
1Y
2A
2B
2Y
1A
3Y V
GND
CC
description/ordering information
The ’AHC86 devices are quadruple 2-input exclusive-OR gates. These devices perform the Boolean function
Y = A ⊕ B or Y = AB + AB in positive logic.
A common application is as a true/complement element. If one of the inputs is low, the other input is reproduced
in true form at the output. If one of the inputs is high, the signal on the other input is reproduced inverted at the
output.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
QFN – RGY Tape and reel SN74AHC86RGYR HA86
PDIP – N Tube SN74AHC86N SN74AHC86N
SOIC – D
Tube SN74AHC86D
AHC86
SOIC
–
D
Tape and reel SN74AHC86DR
AHC86
–40°C to 85°CSOP – NS Tape and reel SN74AHC86NSR AHC86
SSOP – DB Tape and reel SN74AHC86DBR HA86
TSSOP PW
Tube SN74AHC86PW
HA86
TSSOP
–
PW
Tape and reel SN74AHC86PWR
HA86
TVSOP – DGV Tape and reel SN74AHC86DGVR HA86
CDIP – J Tube SNJ54AHC86J SNJ54AHC86J
–55°C to 125°CCFP – W Tube SNJ54AHC86W SNJ54AHC86W
LCCC – FK Tube SNJ54AHC86FK SNJ54AHC86FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54AHC86, SN74AHC86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS249I – OCTOBER 1995 – REVISED JULY 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(each gate)
INPUTS OUTPUT
A B Y
L L L
LHH
HLH
H H L
exclusive-OR logic
An exclusive-OR gate has many applications, some of which can be represented better by alternative
logic symbols.
= 1
EXCLUSIVE OR
These are five equivalent exclusive-OR symbols valid for an SN74AHC86 gate in positive logic; negation may be shown at any two ports.
= 2k 2k + 1
LOGIC-IDENTITY ELEMENT EVEN-PARITY ELEMENT ODD-PARITY ELEMENT
The output is active (low) if
all inputs stand at the same
logic level (i.e., A = B).
The output is active (low) if
an even number of inputs
(i.e., 0 or 2) are active.
The output is active (high) if
an odd number of inputs
(i.e., only 1 of the 2) are
active.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA(see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package 127°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package 47°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
SN54AHC86, SN74AHC86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS249I – OCTOBER 1995 – REVISED JULY 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
SN54AHC86 SN74AHC86
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 2 5.5 2 5.5 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 3 V 2.1 2.1 V
VCC = 5.5 V 3.85 3.85
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 3 V 0.9 0.9 V
VCC = 5.5 V 1.65 1.65
VIInput voltage 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V –50 –50
m
A
IOH High-level output current VCC = 3.3 V ± 0.3 V –4–4
mA
VCC = 5 V ± 0.5 V –8–8
mA
VCC = 2 V 50 50
m
A
IOL Low-level output current VCC = 3.3 V ± 0.3 V 4 4
mA
VCC = 5 V ± 0.5 V 8 8
mA
∆t/∆v
In
p
ut transition rise or fall rate
VCC = 3.3 V ± 0.3 V 100 100
ns/V
∆t/∆v
Input
transition
rise
or
fall
rate
VCC = 5 V ± 0.5 V 20 20
ns/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54AHC86 SN74AHC86
UNIT
PARAMETER
TEST
CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.9 2 1.9 1.9
IOH = –50
m
A3 V 2.9 3 2.9 2.9
VOH 4.5 V 4.4 4.5 4.4 4.4 V
OH
IOH = –4 mA 3 V 2.58 2.48 2.48
IOH = –8 mA 4.5 V 3.94 3.8 3.8
2 V 0.1 0.1 0.1
IOL = 50
m
A3 V 0.1 0.1 0.1
VOL 4.5 V 0.1 0.1 0.1 V
OL
IOL = 4 mA 3 V 0.36 0.5 0.44
IOL = 8 mA 4.5 V 0.36 0.5 0.44
IIVI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1* ±1
m
A
ICC VI = VCC or GND, IO = 0 5.5 V 2 20 20
m
A
CiVI = VCC or GND 5 V 4 10 10 pF
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
SN54AHC86, SN74AHC86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS249I – OCTOBER 1995 – REVISED JULY 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ±0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO LOAD TA = 25°C SN54AHC86 SN74AHC86
UNIT
PARAMETER
(INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
tPLH
CL=15
p
F
7* 11* 1* 13* 1 13
ns
tPHL
C
L =
15
pF
7* 11* 1* 13* 1 13
ns
tPLH
CL=50
p
F
9.5 14.5 1 16.5 1 16.5
ns
tPHL
C
L =
50
pF
9.5 14.5 1 16.5 1 16.5
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ±0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO LOAD TA = 25°C SN54AHC86 SN74AHC86
UNIT
PARAMETER
(INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
tPLH
CL=15
p
F
4.8* 6.8* 1* 8* 1 8
ns
tPHL
C
L =
15
pF
4.8* 6.8* 1* 8* 1 8
ns
tPLH
CL=50
p
F
6.3 8.8 1 10 1 10
ns
tPHL
C
L =
50
pF
6.3 8.8 1 10 1 10
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5)
PARAMETER
SN74AHC86
UNIT
PARAMETER
MIN TYP MAX
UNIT
VOL(P) Quiet output, maximum dynamic VOL 0.3 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.3 –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.4 V
VIH(D) High-level dynamic input voltage 3.5 V
VIL(D) Low-level dynamic input voltage 1.5 V
NOTE 5: Characteristics are for surface-mount packages only.
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 18 pF
SN54AHC86, SN74AHC86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS249I – OCTOBER 1995 – REVISED JULY 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50% VCC
VCC
VCC
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
W aveform 1
S1 at VCC
(see Note B)
Output
W aveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈VCC
0 V
50% VCC VOL + 0.3 V
50% VCC ≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
VCC
0 V
50% VCC
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
From Output
Under Test CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1 VCC
RL = 1 kΩGND
From Output
Under Test CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
50% VCC
50% VCC 50% VCC
50% VCC
50% VCC 50% VCC
50% VCC 50% VCC
VOH – 0.3 V
Figure 1. Load Circuit and Voltage Waveforms
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-9681601Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-9681601QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
5962-9681601QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN74AHC86D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74AHC86DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74AHC86NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74AHC86NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74AHC86PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74AHC86PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AHC86RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74AHC86RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SNJ54AHC86FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54AHC86J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54AHC86W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AHC86DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74AHC86DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74AHC86DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AHC86NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AHC86PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74AHC86RGYR VQFN RGY 14 3000 180.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AHC86DBR SSOP DB 14 2000 346.0 346.0 33.0
SN74AHC86DGVR TVSOP DGV 14 2000 346.0 346.0 29.0
SN74AHC86DR SOIC D 14 2500 346.0 346.0 33.0
SN74AHC86NSR SO NS 14 2000 346.0 346.0 33.0
SN74AHC86PWR TSSOP PW 14 2000 346.0 346.0 29.0
SN74AHC86RGYR VQFN RGY 14 3000 190.5 212.7 31.8
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DLP® Products www.dlp.com Communications and www.ti.com/communications
Telecom
DSP dsp.ti.com Computers and www.ti.com/computers
Peripherals
Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps
Interface interface.ti.com Energy www.ti.com/energy
Logic logic.ti.com Industrial www.ti.com/industrial
Power Mgmt power.ti.com Medical www.ti.com/medical
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defense
Defense
RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video
Wireless www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated