NEW
:
Ultra High Precision Z-Foil Surface Mount Current Sensing Chip Resistor
with Power Rating to 1 W and Temperature Coefficient of Resistance of
± 0.05 ppm/°C and Power Coefficient of 5 ppm at Rated Power
VCS1625ZP (Z-Foil)
Vishay Foil Resistors
Document Number: 63155 For any questions, contact: foil@vishaypg.com www.vishayfoilresistors.com
Revision: 24-Jan-13 1
INTRODUCTION
The Z-foil technology provides a significant increase of
stability of resistance value’s sensitivity to ambient
temperature variations (TCR) and applied power changes
(PCR). Designers can now guarantee a high degree of
stability and accuracy in fixed-resistor applications using
solutions based on VPG’s revolutionary Z-foil technology.
Model VCS1625ZP is a surface mount chip resistor designed
with 4 pads for Kelvin connection. Utilizing VPG’s Bulk
Metal® Z-foil as the resistance element, it provides
performance capabilities far greater than other resistor
technologies can supply in a product of comparable size.
0.05 ppm/°C typical TCR removes errors due to temperature
gradients.
This small device dissipates heat almost entirely through the
pads so surface mount users are encouraged to be generous
with the board’s pads and traces.
The four terminal device separates the current leads from the
voltage sensing leads. This configuration eliminates the
effect of the lead wire resistance from points A to B and C to
D, allowing low TCR current sensing.
FIGURE 1 - POWER DERATING CURVE
100
75
50
25
0
- 75 - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Percent of Rated Power
+ 70 °C
- 55 °C
FEATURES
Temperature coefficient of resistance (TCR):
± 0.05 ppm/°C typical (0 °C to + 60 °C)
± 0.2 ppm/°C typical (- 55 °C to + 125 °C,
+ 25 °C ref.) (see table 1)
Resistance range: 0.3 to 10 (for higher or
lower values please contact us)
Vishay Foil Resistors are not restricted to standard values,
we can supply specific “as required” values at no extra cost
or delivery (e.g. 1.234 vs. 1 )
Resistance Tolerance: to ± 0.2% (0.05% and 0.1% are
also available)
Power coefficient “R due to self heating”: 5 ppm at rated
power
Load life stability: 0.015 % at 70 °C, 2000 h at rated power
Electrostatic discharge (ESD) at least to 25 000 V
Short time overload < 0.005 %
Thermal stabilization time < 1 s (nominal value achieved
within 10 ppm of steady state value)
Power rating: 1 W at + 70 °C (figure 1)
Non inductive, non capacitive design
Rise time: 1 ns effectively no ringing
Current rating: 1.8 A maximum
Current noise: 0.010 µVRMS/V of applied voltage(< - 40 dB)
Voltage coefficient: < 0.1 ppm/V
Non inductive: < 0.08 µH
Non hot spot design
Prototype quantities available in just 5 working days or
sooner.
For higher temperature application above +150 °C and for
better performances please contact us.
TERMINATIONS
Two lead (Pb)-free options are available:
gold plated or tin plated
Tin/lead plated
I
A
R
Zin
I
D
V
=
~
∞
BC
TABLE 1 - SPECIFICATIONS (1)
MODEL
NUMBER
RESISTANCE
RANGE
RESISTANCE
TOLERANCE(4)
TYPICAL TCR and MAX. SPREAD
(- 55 °C to + 125 °C, + 25 °C Ref)
POWER RATING
at + 70 °C (2)
MAXIMUM
CURRENT (2)
VCS1625ZP > 2.0 to 10
0.3 to 2.0
± 0.2 %, ± 0.5 %; ± 1.0 %
± 0.5 %; ± 1.0 % ± 0.2 ± 2.8 ppm/°C 1 W on FR4 PCB(3) 1.8 A
Notes
(1) Tighter performances are available. Please contact application engineering foil@vishaypg.com
(2) Whichever is lower
(3) See solder pad layout at figure 2
(4) 0.05% and 0.1% are also available per special request
* Pb containing materials are not RoHS compliant, exemptions may apply
FIGURE 2 - DIMENSIONS in Inches (Millimeters)
L
H
WA
B
I2
I1E1
E2
Top View Bottom View
Mounting
Pads (4)
I1E1
I2E2
Electrical
Schematic
R
Solder Pad Layout
0.806 (20.47)
0.806 (20.47)
0.070 (1.78)
0.200 (5.08)
0.020 (0.51)
0.020 (0.51)
0.070 (1.78)
0.260 (6.60)
2 oz. Copper (70 Microns)
Coated by Solder mask
Solder Coated Pads
(Windows in Solder Mask)
INCHES MILLIMETERS
L0.250 ± 0.010 6.35 ± 0.25
H0.160 ± 0.010 4.06 ± 0.25
W0.040 maximum 1.02 maximum
A0.080 ± 0.005 2.03 ± 0.13
B0.040 ± 0.010 1.02 ± 0.25
VCS1625ZP (Z-Foil)
Vishay Foil Resistors
www.vishayfoilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63155
2Revision: 24-Jan-13
FIGURE 3 - TRIMMING TO VALUES
(Conceptual Illustration)*
Mutual Inductance
Reduction due
to Opposing
Current in
Adjacent Lines
Current Path
Before Trimming
Note: Foil shown in black, etched spaces in white
Interloop Capacitance
Reduction in Series
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Current Path
After Trimming
* To acquire a precision resistance value, the Bulk Metal Foil chip is trimmed by
selectively removing built-in “shorting bars.” To increase the resistance in known
increments, marked areas are cut, producing progressively smaller increases in
resistance. This method eliminates the effect of “hot spot” and improves the long term
stability of the hybrid chips.
FIGURE 4 - TYPICAL TCR CURVE Z-FOIL
+ 500
+ 200
+ 100
0
- 100
- 200
- 300
- 500
- 55 - 25 + 25 + 60 + 75 + 100 + 125
Ambient Temperature (°C)
ΔR
R
(ppm)
0
0.05 ppm/°C
- 0.1 ppm/°C 0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C- 0.16 ppm/°C
- 400
+ 300
+ 400
TABLE 2 - PERFORMANCE SPECIFICATIONS
TEST MIL-PRF-55342
R LIMITS
TYPICAL
R LIMITS
MAXIMUM
R LIMITS (1)
Thermal shock 5 x (- 65 °C to + 150 °C) ± 0.10 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
Low temperature operation, - 65 °C, 45 min at Pnom ± 0.10 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
Short time overload, 6.25 x rated power, 5 s ± 0.10 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
High temperature exposure, + 150 °C, 100 h ± 0.10 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm)
Resistance to soldering heat ± 0.2 % ± 0.01 % (100 ppm) ± 0.03 % (300 ppm)
Moisture resistance ± 0.2 % ± 0.01 % (100 ppm) ± 0.03 % (300 ppm)
Load life stability 2000 h at 70 °C at 1 W ± 0.5 % ± 0.015 % (150 ppm) ± 0.025 % (250 ppm)
Note
(1) Measurement error 0.001R
FIGURE 5 - LOAD LIFE TEST
–200
–150
–100
–50
0
50
100
150
200
0 200 400 600 800 1000 1200 1400 1600 1800 2000
ΔR (ppm)
Time (hrs)
Load Life Test for 2000 Hr @ 1W, +70°C
Average of n=14 resistors per each value
2R
VCS1625ZP (Z-Foil)
Vishay Foil Resistors
Document Number: 63155 For any questions, contact: foil@vishaypg.com www.vishayfoilresistors.com
Revision: 24-Jan-13 3
POST MANUFACTURING OPERATIONS (PMO)
Military applications can include requirements for
performance under conditions of stress beyond the normal
and over extended periods of time. This calls for more than
just selecting a standard device and applying it to a circuit.
The standard device may turn out to be all that is needed but
an analysis of the projected service conditions should be
made and it may well dictate a routine of stabilization known
as post manufacturing operations (PMO). The PMO
operations that will be discussed are only applicable to Foil
resistors. They stabilize Foil resistors while they are harmful
to other types. Short time overload, accelerated load life, and
temperature cycling are the three PMO exercises that do the
most to remove the anomalies down the road. Foil resistors
are inherently stable as manufactured. These PMO
exercises are only of value on foil resistors and they improve
the performance by small but significant amounts. Users are
encouraged to contact VPG's Foil applications engineering
for assistance in choosing the PMO operations that are right
for their application.
FIGURE 6 - COMPARISON OF CURRENT SENSE RESISTORS IN SOLAR PANEL
(PRODUCT DEMO)
This video compares the variations in output current of a
scaled-down model of a solar panel being monitored by three
different current sense resistor technologies as the resistors are
heated. All three output signals are displayed together for direct
comparison. The next-generation VFR foil resistor is compared
to thick film and metal band current sense resistors, all in
4-terminal Kelvin configurations. Each technology has distinctly
different patterns of response to the heat source, with the foil
having virtually no change and continuing a precise reading of
the output current regardless of the heat applied.
TABLE 3 - GLOBAL PART NUMBER INFORMATION
NEW GLOBAL PART NUMBER: Y16061R50000D9W (preferred part number format)
DENOTES PRECISION VALUE CHARACTERISTICS (1)
Y R = 0 = standard part, tin/lead termination
9 = standard part, lead (Pb)-free termination
129 = standard part, gold plated
Other = custom
PRODUCT CODE RESISTANCE TOLERANCE PACKAGING
1606 = VCS1625ZPA= ± 0.05 %
B= ± 0.1 %
E= ± 0.2 %
D= ± 0.5 %
F= ± 1.0 %
G= ± 2.0 %
J= ± 5.0 %
R= tape and reel
W= waffle pack
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1606 1R50000 D 9 W:
TYPE: VCS1625ZP
VALUE: 1.5
ABSOLUTE TOLERANCE: ± 0.5 %
TERMINATION: lead (Pb)-free
PACKAGING: waffle pack
HISTORICAL PART NUMBER: VCS1625ZP 1R5000 TCR0.2 D S W (will continue to be used)
VCS1625ZP 1R5000 TCR0.2 D S W
MODEL OHMIC VALUE TCR RESISTANCE
TOLERANCE TERMINATION PACKAGING
VCS1625ZP 1.5 Characteristic A= ± 0.05 %
B= ± 0.1 %
E= ± 0.2 %
D= ± 0.5 %
F= ± 1.0 %
G= ± 2.0 %
J= ± 5.0 %
S= lead (Pb)-free
B= tin/lead
G= gold plated
T= tape and reel
W= waffle pack
VCS1625ZP (Z-Foil)
Vishay Foil Resistors
www.vishayfoilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63155
4Revision: 24-Jan-13
Note
(1) Application engineering release: for non-standard requests, please contact application engineering.
6061 500RY1 D90 W0
Vishay Precision Group, Inc.
www.vpgsensors.com
1
Legal Disclaimer Notice
Document No.: 63999
Revision: 15-Jul-2014
Disclaimer
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Vishay Precision Group, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “VPG”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in
any other disclosure relating to any product.
The product specifications do not expand or otherwise modify VPG’s terms and conditions of purchase, including but
not limited to, the warranty expressed therein.
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Information provided in datasheets and/or specifications may vary from actual results in different applications and
performance may vary over time. Statements regarding the suitability of products for certain types of applications
are based on VPG’s knowledge of typical requirements that are often placed on VPG products. It is the customer’s
responsibility to validate that a particular product with the properties described in the product specification is suitable for
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