2SD300C17Ax
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2SD300C17Ax Preliminary Datasheet
Dual-Channel High-quality and Low-cost SCALE-2 Driver Core
Abstract
The SCALE-2 dual-driver core 2SD300C17Ax is a second source to Infineon's 2ED300C17-S and 2ED300C17-
ST. The driver is fully pin and function-compatible to the 2ED300C17-S/2ED300C17-ST and was designed for
applications in which high reliability is expected.
The use of CONCEPT's highly integrated SCALE-2 chipset allows 63% of the components to be dispensed with
compared to the 2ED300C17-S/2ED300C17-ST. This advantage is impressively reflected in increased reliability
(function and MTBF) with simultaneously lower costs.
The 2SD300C17Ax combines a complete two-channel driver core with all components required for driving,
such as an isolated DC/DC converter, short-circuit protection, failure soft shut down, short pulse suppression
as well as supply voltage monitoring. Each of the two output channels is electrically isolated from the primary
side and the other secondary channel.
The driver provides a gate voltage swing of ±15V. An output current of 30A and 4W drive power is available
per channel.
Its outstanding EMC with a dv/dt strength of more than 50V/ns allows safe and reliable operation in even the
demanding industrial applications
Product Highlights Applications
[ Dual channel driver [ 1:1 replacement of 2ED300C17-S
[ Highly integrated SCALE-2 chipset [ 1:1 replacement of 2ED300C17-ST
[ Switching frequency up to 60kHz [ IGBTs up to 1700V
[ Gate current ±30A
[ 4W output power per channel
[ Direct and half-bridge mode
[ IGBT short-circuit protection
[ Failure soft shut down
[ Isolated DC/DC converter
[ Safe isolation to EN 50178
[ UL compliant
[ Reliable, long service life
2SD300C17Ax
Preliminary Data Sheet
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Safety Notice!
The data contained in this data sheet is intended exclusively for technically trained staff. Handling all high-
voltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory!
Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive
devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the
workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged.
Important Product Documentation
This data sheet contains only product-specific data. For a detailed description, must-read application notes and
important information that apply to this product, please refer to “2SD300C17 Description & Application
Manual” on www.igbt-driver.com/go/2SD300C17
Absolute Maximum Ratings
Parameter Remarks Min Max Unit
Supply voltage VDC
VDC to GND 0 16 V
Supply voltage VDD
VDD to GND 0 16 V
Logic input voltages INA, INB and Mod to GND -0.5 20 V
Logic output voltages SOA and SOB to GND -0.5 VDD+0.5 V
SOx current Failure condition, total current 20 mA
Gate peak current Iout Note 1 -30 +30 A
Gate resistance Turn-on and turn-off 1 Ω
IGBT gate charge 50 µC
Average supply current IDC Notes 2, 3 540 mA
Output power Ambient temperature <70°C (Notes 4, 5) 4 W
Ambient temperature 85°C (Note 4) 3 W
Switching frequency F 60 kHz
Test voltage (50Hz/1min.) Primary to secondary (Note 13) 5000 VAC(eff)
Secondary to secondary (Note 13) 4000 VAC(eff)
|dV/dt| Rate of change of input to output voltage (Note 6) 50 kV/μs
Operating voltage Primary and secondary to secondary side 1700 Vpeak
Operating temperature Note 5 -40 +85 °C
Storage temperature -40 +90 °C
2SD300C17Ax
Preliminary Data Sheet
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Recommended Operating Conditions
Power Supply Remarks Min Typ Max Unit
Supply voltage
VDC
VDC to GND 14 15 16 V
Supply voltage
VDD
VDD to GND 14 15 16 V
Input logic level INx and Mod to GND, high level VDD V
Input logic level INx and Mod to GND, low level 0 V
Electrical Characteristics
All data refer to +25°C and VDC = VDD
= 15V unless otherwise specified.
Power supply Remarks Min Typ Max Unit
Supply current IDC Without load 65 mA
Supply current IDD Direct mode, F = 0Hz 14 mA
Supply current IDD Direct mode, F = 60kHz 21 mA
Coupling capacitance Cio Primary to secondary, per channel 31 pF
Secondary to secondary 29 pF
Power Supply Monitoring Remarks Min Typ Max Unit
Supply threshold VDD Primary side, clear fault 11.9 12.6 13.3 V
Primary side, set fault (Note 7) 11.3 12.0 12.7 V
Monitoring hysteresis Primary side, set/clear fault 0.35 V
Supply threshold Vx+-VCOMx Secondary side, clear fault 12.1 12.6 13.1 V
Secondary side, set fault (Note 8) 11.5 12.0 12.5 V
Monitoring hysteresis Secondary side, set/clear fault 0.35 V
Supply threshold VCOMx-Vx- Secondary side, clear fault 5 5.15 5.3 V
Secondary side, set fault (Note 8) 4.7 4.85 5 V
Monitoring hysteresis Secondary side, set/clear fault 0.15 V
Logic Inputs and Outputs Remarks Min Typ Max Unit
Input impedance INx and Mod 3.9 kΩ
Turn-on threshold V(INx) 8.1 V
Turn-off threshold V(INx) 4.8 V
SOx output voltage Failure condition, I(SOx)<20mA 0.7 V
Short-Circuit Protection Remarks Min Typ Max Unit
Rth value Between RCx and COM x 2 70 kΩ
Blocking time Note 12 27 ms
2SD300C17Ax
Preliminary Data Sheet
www.IGBT-Driver.com Page 4
External Fault input Remarks Min Typ Max Unit
Threshold level Between E.x and COM x 5 V
Timing Characteristics Remarks Min Typ Max Unit
Turn-on delay td(on) Direct mode (Note 9) 630 ns
Turn-off delay td(off) Direct mode (Note 9) 490 ns
Short pulse suppression Turn-on command pulse width 470 ns
Turn-off command pulse width 300 ns
Dead time between channels Half-bridge mode, with CA=CB=0pF (Note 15) 1.3 µs
Transmission delay of fault state Note 10 450 ns
Output Voltage Remarks Min Typ Max Unit
Turn-on voltage Gate x to COM x 15 V
Turn-off voltage Gate x to COM x -15 V
Electrical Isolation Remarks Min Typ Max Unit
Test voltage (50Hz/1s) Primary to secondary side (Note 13) 5000 5050 5100 Veff
Secondary to secondary side (Note 13) 4000 4050 4100 Veff
Partial discharge extinction volt. Primary to secondary side (Note 14) 1768 Vpeak
Secondary to secondary side (Note 14) 1700 Vpeak
Creepage distance Primary to secondary side 16.2 mm
Secondary to secondary side 14.2 mm
Clearance distance Primary to secondary side 16.2 mm
Secondary to secondary side 6.5 mm
Output Remarks Min Typ Max Unit
Blocking capacitance Vx+ to COMx 9.4 µF
COMx to Vx- 9.4 µF
Footnotes to the Key Data
1) The maximum peak gate current refers to the highest current level occurring during the product
lifetime. It is an absolute value and does also apply for short pulses.
2) The average supply input current is limited for thermal reasons. Higher values than specified by the
absolute maximum rating are permissible (e.g. during power supply start up) if the average remains
below the given value, provided the average is taken over a time period which is shorter than the
thermal time constants of the driver in the application.
3) There is no means of actively controlling or limiting the input current in the driver. In the case of
start-up with very high blocking capacitor values, or in case of short circuit at the output, the supply
input current has to be limited externally.
4) The maximum output power must not be exceeded at any time during operation. The absolute
maximum rating must also be observed for time periods shorter than the thermal time constants of
the driver in the application.
5) An extended output power range is specified for maximum ambient temperatures of 70°C.
2SD300C17Ax
Preliminary Data Sheet
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6) This specification guarantees that the drive information will be transferred reliably even at a high DC-
link voltage and with ultra-fast switching operations.
7) Undervoltage monitoring of the primary-side supply voltage (VDD to GND). If the voltage drops below
this limit, a fault is transmitted to both outputs SOA and SOB and the IGBTs are switched off.
8) Undervoltage monitoring of the secondary-side supply voltage (Vx+ to COMx and COMx to Vx- which
correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding
voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the corresponding
SOx output on the primary side.
9) The delay time is measured between 50% of the input signal and 10% (turn-on) or 90% (turn-off) of
the corresponding output.
10) Transmission delay of fault state from the secondary side to the primary status output.
11) The test voltage of 4000VAC(eff)/50Hz may be applied only once during one minute. It should be noted
that with this (strictly speaking obsolete) test method, some (minor) damage occurs to the insulation
layers due to the partial discharge. Consequently, this test is not performed at CONCEPT as a series
test. In the case of repeated isolation tests (e.g. module test, equipment test, system test), the
subsequent tests should be performed with a lower test voltage: the test voltage is reduced by 400V
for each additional test. The more modern if more elaborate partial-discharge measurement is
preferable to such test methods as it is almost entirely non-destructive.
12) The blocking time sets a minimum time span between the end of any fault state and the start of
normal operation (remove fault from pin SOx). The value of the blocking time is programmed on the
driver and cannot be modified externally.
13) HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate
driver is suited for HiPot testing. Nevertheless, it is strongly recommended to limit the testing time to
1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 1200VAC(eff)
may lead to insulation degradation. No degradation has been observed over 1min. testing at
5000VAC(eff). Every production sample shipped to customers has undergone 100% testing at the given
value for 1s.
14) Partial discharge measurement is performed in accordance with IEC 60270 and isolation coordination
specified in EN 50178. The partial discharge extinction voltage between primary and either secondary
side is coordinated for safe isolation to EN 50178.
15) The dead time is measured between 50% voltage swing of the gate-emitter voltage which is turned
off and 50% voltage swing of the gate-emitter voltage which is turned-on.
Legal Disclaimer
This data sheet specifies devices but cannot promise to deliver any specific characteristics. No warranty or
guarantee is given – either expressly or implicitly – regarding delivery, performance or suitability.
CT-Concept Technologie AG reserves the right to make modifications to its technical data and product
specifications at any time without prior notice. The general terms and conditions of delivery of CT-Concept
Technologie AG apply.
2SD300C17Ax
Preliminary Data Sheet
www.IGBT-Driver.com Page 6
Ordering Information
The general terms and conditions of delivery of CT-Concept Technologie AG apply.
Type Designation Description
2SD300C17A1 Dual-channel SCALE-2 driver core (PCB thickness: 1.55mm)
Product home page: www.IGBT-Driver.com/go/2SD300C17
Refer to www.IGBT-Driver.com/go/nomenclature for information on driver nomenclature
Information about Other Products
For other drivers, product documentation, and application support
Please click: www.IGBT-Driver.com
Manufacturer
CT-Concept Technologie AG
A Power Integrations Company
Johann-Renfer-Strasse 15
2504 Biel-Bienne
Switzerland
Phone +41 - 32 - 344 47 47
Fax +41 - 32 - 344 47 40
E-mail Info@IGBT-Driver.com
Internet www.IGBT-Driver.com
© 2009…2013 CT-Concept Technologie AG - Switzerland. All rights reserved.
We reserve the right to make any technical modifications without prior notice. Version 2.0 from 2013-04-11
