Sample & Buy Product Folder Technical Documents Support & Community Tools & Software LM119, LM219, LM319 SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 LMx19 High Speed Dual Comparator 1 Features 2 Description * * * * * The LM119 series are precision high-speed dual comparators fabricated on a single monolithic chip. They are designed to operate over a wide range of supply voltages down to a single 5-V logic supply and ground. They have higher gain and lower input currents than devices such as the LM710. The uncommitted collector of the output stage makes the LM119 compatible with RTL, DTL, and TTL, as well as capable of driving lamps and relays at currents of up to 25 mA. 1 * * Two Independent Comparators Operates from a Single 5-V Supply Typically 80-ns Response Time at 15 V Minimum Fan-out of 2 Each Side Maximum Input Current of 1 A Over Temperature Inputs and Outputs can be Isolated from System Ground High Common-Mode Slew Rate Connection Diagram The LM319A offers improved precision over the standard LM319, with tighter tolerances on offset voltage, offset current, and voltage gain. Although designed primarily for applications requiring operation from digital logic supplies, the LM119 series are fully specified for power supplies up to 15 V. The series features faster response than the LM111, at the expense of higher power dissipation. However, the high-speed, wide operating voltage range and low package count make the LM119 more versatile than older devices such as the LM711. The LM119 is specified from -55C to +125C, the LM219 is specified from -25C to +85C, and the LM319A and LM319 are specified from 0C to +70C. Device Information(1) PART NUMBER Typical Application - Relay Driver LM119, LM219, LM319 PACKAGE BODY SIZE (NOM) TO-100 (10) 8.96 mm x 8.96 mm CDIP (14) 6.67 mm x 19.56 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM119, LM219, LM319 SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 2 3 4 5.1 5.2 5.3 5.4 5.5 5.6 4 4 4 5 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Thermal Information .................................................. Electrical Characteristics LM119, LM219.................. Electrical Characteristics LM319, LM319A ............... Typical Characteristics .............................................. 6 Detailed Description ............................................ 10 7 Application and Implementation ........................ 11 8 Device and Documentation Support.................. 12 6.1 Functional Block Diagram ....................................... 10 7.1 Typical Applications ................................................ 11 8.1 8.2 8.3 8.4 8.5 9 Related Links .......................................................... Community Resources............................................ Trademarks ............................................................. Electrostatic Discharge Caution .............................. Glossary .................................................................. 12 12 12 12 12 Mechanical, Packaging, and Orderable Information ........................................................... 12 3 Revision History Changes from Revision A (May 2004) to Revision B Page * Changed datasheet to new TI format from National. ............................................................................................................. 1 * Added Pin Functions and Thermal Information tables, the Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 2 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 LM119, LM219, LM319 www.ti.com SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 4 Pin Configuration and Functions D, J, or NFF Package 14-Pins CDIP and PDIP Top View LME Package 10-Pins TO-100 (Metal Can Package) Top View NAD Package 10-Pins CFP Top View Pin Functions PIN NAME I/O DESCRIPTION NO. (D, J, NFF 14) NO. (LME 10) NO. (NAD 10) OUTPUT 1 1 12 1 O Comparator 1 output GND 1 2 3 2 G Comparator 1 ground connection INPUT 1+ 3 4 3 I Comparator 1 input INPUT 1- 4 5 4 I Comparator 1 input V- 5 6 5 P Negative supply voltage OUTPUT 2 6 7 6 O Comparator 2 output GND 2 7 8 7 G Comparator 2 ground connection INPUT 2+ 8 9 8 I Comparator 2 input INPUT 2- 9 10 9 I Comparator 2 input V+ 10 11 10 P Positive supply voltage NC 1,2,13,14 No connect. Do not connect to ground. Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 Submit Documentation Feedback 3 LM119, LM219, LM319 SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MAX UNIT Total supply voltage MIN 36 V Output to negative supply voltage 36 V Ground to negative supply voltage 25 V Ground to positive supply voltage 18 V V Differential input voltage -5 +5 Input voltage (4) -15 +15 V 500 mW Output short circuit duration 10 sec Lead temperature (soldering, 10 sec.) 260 C Power dissipation (5) Soldering information (6) Dual-In-Line Package Soldering (10 seconds) 260 Small Outline Package Vapor Phase (60 seconds) 215 Small Outline Package Infrared (15 seconds) Operating temperature 220 LM119 -55 125 LM219 -25 85 0 70 -65 150 LM319A, LM319 Storage temperature, Tstg (1) (2) (3) (4) (5) (6) C C C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Refer to RETS119X for LM119H/883 and LM119J/883 specifications. For supply voltages less than 15 V the absolute maximum input voltage is equal to the supply voltage. The maximum junction temperature of the LM119 is 150C, while that of the LM219 is 110C. For operating at elevated temperatures, devices in the H10 package must be derated based on a thermal resistance of 160C/W, junction to ambient, or 19C/W, junction to case. The thermal resistance of the J14 and N14 packages is 100C/W, junction to ambient. See AN-450 "Surface Mounting Methods and Their Effect on Product Reliability" for other methods of soldering surface mount devices. 5.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT 800 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 5.3 Thermal Information LM119, LM219, LM319 THERMAL METRIC (1) TO-100 (LME) PDIP (NFF) CDIP (J) 10 PINS 14 PINS 14 PINS UNIT RJA Junction-to-ambient thermal resistance 160 100 100 C/W RJC(top) Junction-to-case (top) thermal resistance 19 NA NA C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 LM119, LM219, LM319 www.ti.com SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 5.4 Electrical Characteristics LM119, LM219 These specifications apply for VS = 15 V, and the Ground pin at ground, and -55C TA +125C, unless otherwise stated. With the LM219, all temperature specifications are limited to -25C TA +85C. The offset voltage, offset current and bias current specifications apply for any supply voltage from a single 5-V supply up to 15-V supplies. Do not operate the device with more than 16 V from ground to VS. PARAMETER TEST CONDITIONS (1) MIN TYP MAX UNIT TA = 25C, RS 5k 0.7 4 mV Input Offset Current (1) TA = 25C 30 75 nA Input Bias Current TA = 25C 150 500 nA Input Offset Voltage (2) Voltage Gain TA = 25C Response Time (3) TA = 25C, VS = 15 V Saturation Voltage VIN -5 mV, IOUT = 25 mA TA = 25C Output Leakage Current VIN 5 mV, VOUT = 35 V TA = 25C Input Offset Voltage (1) RS 5k Input Offset Current 10 40 V/mV 80 ns 0.75 1.5 V 0.2 2 A 7 mV 100 nA 1000 nA (1) Input Bias Current VS = 15 V Input Voltage Range V+ = 5 V, V- = 0 -12 13 1 +12 3 V V+ 4.5 V, V- = 0 VIN -6 mV, ISINK 3.2 mA Saturation Voltage TA 0C 0.23 TA 0C VIN 5 mV, VOUT = 35 V, V- = VGND =0V Output Leakage Current 0.4 V 0.6 1 Differential Input Voltage 10 5 A V Positive Supply Current TA = 25C, V+ = 5 V, V- = 0 Positive Supply Current TA = 25C, VS = 15 V 8 11.5 mA Negative Supply Current TA = 25C, VS = 15 V 3 4.5 mA (1) (2) (3) 4.3 mA The offset voltages and offset currents given are the maximum values required to drive the output within a volt of either supply with a 1mA load. Thus, these parameters define an error band and take into account the worst case effects of voltage gain and input impedance. Output is pulled up to 15 V through a 1.4-kW resistor. The response time specified is for a 100-mV input step with 5-mV overdrive. Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 Submit Documentation Feedback 5 LM119, LM219, LM319 SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 www.ti.com 5.5 Electrical Characteristics LM319, LM319A These specifications apply for VS = 15 V, and 0C TA 70C, unless otherwise stated. The offset voltage, offset current, and bias current specifications apply for any supply voltage from a single 5-V supply up to 15-V supplies. Do not operate the device with more than 16 V from ground to VS. PARAMETER Input Offset Voltage (1) Input Offset Current (1) TEST CONDITIONS LM319A MIN TA = 25C, RS 5k LM319 TYP MAX 0.5 1 MIN UNIT TYP MAX 2 8 mV nA TA = 25C 20 40 80 200 Input Bias Current TA = 25C 150 500 250 1000 Voltage Gain TA = 25C (2) Response Time (3) TA = 25C, VS = 15 V Saturation Voltage VIN -10 mV, IOUT = 25 mA TA = 25C 0.75 1.5 0.75 1.5 V Output Leakage Current VIN 10 mV, VOUT = 35 V V- = VGND = 0 V, TA = 25C 0.2 10 0.2 10 A Input Offset Voltage (1) RS 5k 10 10 mV 300 300 nA 1200 nA 20 40 80 Input Offset Current (1) Input Bias Current Input Voltage Range 8 V/mV 80 ns 1000 VS = 15 V 13 V+ = 5 V, V- = 0 1 13 3 nA 40 1 3 V V+ 4.5 V, V- = 0 VIN -10 mV, ISINK 3.2 mA 0.3 Positive Supply Current TA = 25C, V+ = 5 V, V- = 0 4.3 Positive Supply Current TA = 25C, VS = 15 V 8 12.5 8 12.5 mA Negative Supply Current TA = 25C, VS = 15 V 3 5 3 5 mA Saturation Voltage Differential Input Voltage (1) (2) (3) 6 0.4 0.3 5 0.4 5 4.3 V V mA The offset voltages and offset currents given are the maximum values required to drive the output within a volt of either supply with a 1mA load. Thus, these parameters define an error band and take into account the worst case effects of voltage gain and input impedance. Output is pulled up to 15 V through a 1.4-kW resistor. The response time specified is for a 100-mV input step with 5-mV overdrive. Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 LM119, LM219, LM319 www.ti.com SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 5.6 Typical Characteristics 5.6.1 Typical Characteristics - LM119, LM119A, LM219 Figure 1. Input Currents Figure 2. Common-Mode Limits Figure 3. Transfer Function Figure 4. Response Time for Various Input Overdrives Figure 5. Response Time for Various Input Overdrives Figure 6. Input Characteristics Figure 7. Response Time for Various Input Overdrives Figure 8. Response Time for Various Input Overdrives Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 Submit Documentation Feedback 7 LM119, LM219, LM319 SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 www.ti.com Typical Characteristics - LM119, LM119A, LM219 (continued) Figure 9. Output Saturation Voltage Figure 10. Supply Current Figure 11. Supply Current Figure 12. Output Limiting Characteristics 5.6.2 Typical Characteristics - LM319, LM319A 8 Figure 13. Input Currents Figure 14. Supply Currents Figure 15. Transfer Function Figure 16. Response Time for Various Input Overdrives Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 LM119, LM219, LM319 www.ti.com SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 Typical Characteristics - LM319, LM319A (continued) Figure 17. Response Time for Various Input Overdrives Figure 18. Input Characteristics Figure 19. Response Time for Various Input Overdrives Figure 20. Response Time for Various Input Overdrives Figure 21. Output Saturation Voltage Figure 22. Supply Current Figure 23. Common-Mode Limits Figure 24. Output Limiting Characteristics Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 Submit Documentation Feedback 9 LM119, LM219, LM319 SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 www.ti.com 6 Detailed Description 6.1 Functional Block Diagram DS005705-1 Do not operate the LM119 with more than 16V between GND and V+ 10 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 LM119, LM219, LM319 www.ti.com SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 7 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 7.1 Typical Applications 7.1.1 Relay Driver Figure 25. Relay Driver 7.1.2 Window Detector Figure 26. Window Detector Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 Submit Documentation Feedback 11 LM119, LM219, LM319 SNOSBJ2B - AUGUST 2000 - REVISED JANUARY 2016 www.ti.com 8 Device and Documentation Support 8.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM119 Click here Click here Click here Click here Click here LM219 Click here Click here Click here Click here Click here LM319 Click here Click here Click here Click here Click here 8.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 8.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 8.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 8.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 9 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM119 LM219 LM319 PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM119H ACTIVE TO-100 LME 10 500 TBD Call TI Call TI -55 to 125 ( LM119H ~ LM119H) LM119H/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM119H ~ LM119H) LM119J ACTIVE CDIP J 14 25 TBD Call TI Call TI -55 to 125 LM119J LM319AM NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM319AM LM319AM/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM319AM LM319AMX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM319AM LM319M NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM319M LM319M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM319M LM319MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM319M LM319N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM319N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 17-Mar-2017 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 7-Jan-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM319AMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LM319MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Jan-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM319AMX/NOPB SOIC D 14 2500 367.0 367.0 35.0 LM319MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE LME0010A TO-CAN - 5.72 mm max height SCALE 0.800 METAL CYLINDRICAL PACKAGE 8.51 7.75 4.70 4.19 1.02 MAX 5.72 MAX C 1.02 STAND-OFF 0.25 SEATING PLANE 10X 12.7 MIN 10X 0.53 0.41 0.25 C A ( 3.56) STAND-OFF 5 4 6 2.92 3 7 A 2 8 9.40 8.51 5.84 9 1 10 36 TYP 0.86 0.71 1.14 0.74 4220604/A 05/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration MO-006/TO-100. www.ti.com EXAMPLE BOARD LAYOUT LME0010A TO-CAN - 5.72 mm max height METAL CYLINDRICAL PACKAGE SOLDER MASK OPENING 10 ( 1.4) 1 9 0.07 MAX ALL AROUND 9X ( 1.4) METAL METAL 10X ( 0.8) VIA (R0.05) TYP 2 8 9X SOLDER MASK OPENING 7 3 9X 0.07 MAX ALL AROUND 4 6 (36 ) TYP 5 ( 5.84) LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 12X 4220604/A 05/2017 www.ti.com PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID (OPTIONAL) A 4X .005 MIN [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 [0.36-0.66] 14X .045-.065 [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 8 7 B .245-.283 [6.22-7.19] .2 MAX TYP [5.08] C .13 MIN TYP [3.3] SEATING PLANE .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 TYP 14X .008-.014 [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL A SEE DETAIL B 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 8 7 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX [0.05] ALL AROUND (.063) [1.6] METAL ( .063) [1.6] SOLDER MASK OPENING METAL (R.002 ) TYP [0.05] .002 MAX [0.05] ALL AROUND SOLDER MASK OPENING DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com MECHANICAL DATA NFF0014A N0014A N14A (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2017, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM319AM LM319AM/NOPB LM319AMX LM319AMX/NOPB LM319M LM319M/NOPB LM319MX LM319MX/NOPB LM319N LM319N/NOPB