TN80C186EA16 - Intel - Datasheet.Live

*Other brands and names are the property of their respective owners.

Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or

copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make

changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.

October 1995

Order Number: 272432-003

80C186EA/80C188EA AND 80L186EA/80L188EA

16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS

Y80C186 Upgrade for Power Critical Applications

YFully Static Operation

YTrue CMOS Inputs and Outputs

YIntegrated Feature Set

Ð Static 186 CPU Core

Ð Power Save, Idle and Powerdown

Modes

Ð Clock Generator

Ð 2 Independent DMA Channels

Ð 3 Programmable 16-Bit Timers

Ð Dynamic RAM Refresh Control Unit

Ð Programmable Memory and

Peripheral Chip Select Logic

Ð Programmable Wait State Generator

Ð Local Bus Controller

Ð System-Level Testing Support

(High Impedance Test Mode)

YSpeed Versions Available (5V):

Ð 25 MHz (80C186EA25/80C188EA25)

Ð 20 MHz (80C186EA20/80C188EA20)

Ð 13 MHz (80C186EA13/80C188EA13)

YSpeed Versions Available (3V):

Ð 13 MHz (80L186EA13/80L188EA13)

Ð 8 MHz (80L186EA8/80L188EA8)

YDirect Addressing Capability to

1 Mbyte Memory and 64 Kbyte I/O

YSupports 80C187 Numeric Coprocessor

Interface (80C186EA only)

YAvailable in the Following Packages:

Ð 68-Pin Plastic Leaded Chip Carrier

(PLCC)

Ð 80-Pin EIAJ Quad Flat Pack (QFP)

Ð 80-Pin Shrink Quad Flat Pack (SQFP)

YAvailable in Extended Temperature

Range (b40§Ctoa

85§C)

The 80C186EA is a CHMOS high integration embedded microprocessor. The 80C186EA includes all of the

features of an ‘‘Enhanced Mode’’ 80C186 while adding the additional capabilities of Idle and Powerdown

Modes. In Numerics Mode, the 80C186EA interfaces directly with an 80C187 Numerics Coprocessor.

272432–1

80C186EA/80C188EA, 80L186EA/80L188EA

80C186EA/80C188EA AND 80L186EA/80L188EA

16-Bit High Integration Embedded Processor

CONTENTS PAGE

INTRODUCTION ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4

80C186EA CORE ARCHITECTURE ÀÀÀÀÀÀÀ 4

Bus Interface Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4

Clock Generator ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 4

80C186EA PERIPHERAL

ARCHITECTURE ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5

Interrupt Control Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5

Timer/Counter Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 5

DMA Control Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

Chip-Select Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

Refresh Control Unit ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

Power Management ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 7

80C187 Interface (80C186EA Only) ÀÀÀÀÀÀÀÀÀ 8

ONCE Test Mode ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

DIFFERENCES BETWEEN THE

80C186XL AND THE 80C186EA ÀÀÀÀÀÀÀÀ 8

Pinout Compatibility ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

Operating Modes ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

TTL vs CMOS Inputs ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

Timing Specifications ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 8

PACKAGE INFORMATION ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 9

Prefix Identification ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 9

Pin Descriptions ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 9

80C186EA Pinout ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 15

CONTENTS PAGE

PACKAGE THERMAL

SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 20

ELECTRICAL SPECIFICATIONS ÀÀÀÀÀÀÀÀÀ 21

Absolute Maximum Ratings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 21

Recommended Connections ÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 21

DC SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 22

ICC versus Frequency and Voltage ÀÀÀÀÀÀÀÀÀ 24

PDTMR Pin Delay Calculation ÀÀÀÀÀÀÀÀÀÀÀÀÀ 24

AC SPECIFICATIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 25

AC CharacteristicsÐ80C186EA20/13 ÀÀÀÀÀ 25

AC CharacteristicsÐ80L186EA13/8 ÀÀÀÀÀÀÀ 27

Relative Timings ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 29

AC TEST CONDITIONS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 30

AC TIMING WAVEFORMS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 30

DERATING CURVES ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 33

RESET ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 33

BUS CYCLE WAVEFORMS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 36

EXECUTION TIMINGS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 43

INSTRUCTION SET SUMMARY ÀÀÀÀÀÀÀÀÀÀ 44

REVISION HISTORY ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 50

ERRATA ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 50

80C186EA/80C188EA, 80L186EA/80L188EA

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA

Figure 1. 80C186EA/80C188EA Block Diagram

272432–2

80C186EA/80C188EA, 80L186EA/80L188EA

INTRODUCTION

Unless specifically noted, all references to the

80C186EA apply to the 80C188EA, 80L186EA, and

80L188EA. References to pins that differ between

the 80C186EA/80L186EA and the 80C188EA/

80L188EA are given in parentheses. The ‘‘L’’ in the

part number denotes low voltage operation. Physi-

cally and functionally, the ‘‘C’’ and ‘‘L’’ devices are

identical.

The 80C186EA is the second product in a new gen-

eration of low-power, high-integration microproces-

sors. It enhances the existing 80C186XL family by

offering new features and operating modes. The

80C186EA is object code compatible with the

80C186XL embedded processor.

The 80L186EA is the 3V version of the 80C186EA.

The 80L186EA is functionally identical to the

80C186EA embedded processor. Current

80C186EA customers can easily upgrade their de-

signs to use the 80L186EA and benefit from the re-

duced power consumption inherent in 3V operation.

The feature set of the 80C186EA/80L186EA meets

the needs of low-power, space-critical applications.

Low-power applications benefit from the static de-

sign of the CPU core and the integrated peripherals

as well as low voltage operation. Minimum current

consumption is achieved by providing a Powerdown

Mode that halts operation of the device, and freezes

the clock circuits. Peripheral design enhancements

ensure that non-initialized peripherals consume little

current.

Space-critical applications benefit from the inte-

gration of commonly used system peripherals. Two

flexible DMA channels perform CPU-independent

data transfers. A flexible chip select unit simplifies

memory and peripheral interfacing. The interrupt unit

provides sources for up to 128 external interrupts

and will prioritize these interrupts with those generat-

ed from the on-chip peripherals. Three general pur-

pose timer/counters round out the feature set of the

80C186EA.

Figure 1 shows a block diagram of the 80C186EA/

80C188EA. The Execution Unit (EU) is an enhanced

8086 CPU core that includes: dedicated hardware to

speed up effective address calculations, enhance

execution speed for multiple-bit shift and rotate in-

structions and for multiply and divide instructions,

string move instructions that operate at full bus

bandwidth, ten new instructions, and static opera-

tion. The Bus Interface Unit (BIU) is the same as that

found on the original 80C186 family products. An

independent internal bus is used to allow communi-

cation between the BIU and internal peripherals.

80C186EA CORE ARCHITECTURE

Bus Interface Unit

The 80C186EA core incorporates a bus controller

that generates local bus control signals. In addition,

it employs a HOLD/HLDA protocol to share the local

bus with other bus masters.

The bus controller is responsible for generating 20

bits of address, read and write strobes, bus cycle

status information and data (for write operations) in-

formation. It is also responsible for reading data off

the local bus during a read operation. SRDY and

ARDY input pins are provided to extend a bus cycle

beyond the minimum four states (clocks).

The local bus controller also generates two control

signals (DEN and DT/R) when interfacing to exter-

nal transceiver chips. This capability allows the addi-

tion of transceivers for simple buffering of the mulit-

plexed address/data bus.

Clock Generator

The processor provides an on-chip clock generator

for both internal and external clock generation. The

clock generator features a crystal oscillator, a divide-

by-two counter, and two low-power operating

modes.

The oscillator circuit is designed to be used with ei-

ther a parallel resonant fundamental or third-over-

tone mode crystal network. Alternatively, the oscilla-

tor circuit may be driven from an external clock

source. Figure 2 shows the various operating modes

of the oscillator circuit.

The crystal or clock frequency chosen must be twice

the required processor operating frequency due to

the internal divide-by-two counter. This counter is

used to drive all internal phase clocks and the exter-

nal CLKOUT signal. CLKOUT is a 50% duty cycle

processor clock and can be used to drive other sys-

tem components. All AC timings are referenced to

CLKOUT.

The following parameters are recommended when

choosing a crystal:

Temperature Range: Application Specific

ESR (Equivalent Series Resistance): 60Xmax

C0 (Shunt Capacitance of Crystal): 7.0 pF max

CL(Load Capacitance): 20 pF g2pF

Drive Level: 2 mW max

80C186EA/80C188EA, 80L186EA/80L188EA

272432–3

(A) Crystal Connection

NOTE:

The L1C1network is only required when using a third-overtone crystal.

272432–4

(B) Clock Connection

Figure 2. Clock Configurations

80C186EA PERIPHERAL

ARCHITECTURE

The 80C186EA has integrated several common sys-

tem peripherals with a CPU core to create a com-

pact, yet powerful system. The integrated peripher-

als are designed to be flexible and provide logical

interconnections between supporting units (e.g., the

interrupt control unit supports interrupt requests

from the timer/counters or DMA channels).

The list of integrated peripherals include:

#4-Input Interrupt Control Unit

#3-Channel Timer/Counter Unit

#2-Channel DMA Unit

#13-Output Chip-Select Unit

#Refresh Control Unit

#Power Management logic

The registers associated with each integrated peri-

heral are contained within a 128 x 16 register file

called the Peripheral Control Block (PCB). The PCB

can be located in either memory or I/O space on

any 256 byte address boundary.

Figure 3 provides a list of the registers associated

with the PCB when the processor’s Interrupt Control

Unit is in Master Mode. In Slave Mode, the defini-

tions of some registers change. Figure 4 provides

Interrupt Control Unit

The 80C186EA can receive interrupts from a num-

ber of sources, both internal and external. The Inter-

rupt Control Unit (ICU) serves to merge these re-

quests on a priority basis, for individual service by

the CPU. Each interrupt source can be independent-

ly masked by the Interrupt Control Unit or all inter-

rupts can be globally masked by the CPU.

Internal interrupt sources include the Timers and

DMA channels. External interrupt sources come

from the four input pins INT3:0. The NMI interrupt

pin is not controlled by the ICU and is passed direct-

ly to the CPU. Although the timers only have one

request input to the ICU, separate vector types are

generated to service individual interrupts within the

Timer Unit.

Timer/Counter Unit

The 80C186EA Timer/Counter Unit (TCU) provides

three 16-bit programmable timers. Two of these are

highly flexible and are connected to external pins for

control or clocking. A third timer is not connected to

any external pins and can only be clocked internally.

However, it can be used to clock the other two timer

channels. The TCU can be used to count external

events, time external events, generate non-repeti-

tive waveforms, generate timed interrupts, etc.

80C186EA/80C188EA, 80L186EA/80L188EA

PCB Function

Offset

00H Reserved

02H Reserved

04H Reserved

06H Reserved

08H Reserved

0AH Reserved

0CH Reserved

0EH Reserved

10H Reserved

12H Reserved

14H Reserved

16H Reserved

18H Reserved

1AH Reserved

1CH Reserved

1EH Reserved

20H Reserved

22H End of Interrupt

24H Poll

26H Poll Status

28H Interrupt Mask

2AH Priority Mask

2CH In-Service

2EH Interrupt Request

30H Interrupt Status

32H Timer Control

34H DMA0 Int. Control

36H DMA1 Int. Control

38H INT0 Control

3AH INT1 Control

3CH INT2 Control

3EH INT3 Control

PCB Function

Offset

40H Reserved

42H Reserved

44H Reserved

46H Reserved

48H Reserved

4AH Reserved

4CH Reserved

4EH Reserved

50H Timer 0 Count

52H Timer 0 Compare A

54H Timer 0 Compare B

56H Timer 0 Control

58H Timer 1 Count

5AH Timer 1 Compare A

5CH Timer 1 Compare B

5EH Timer 1 Control

60H Timer 2 Count

62H Timer 2 Compare

64H Reserved

66H Timer 2 Control

68H Reserved

6AH Reserved

6CH Reserved

6EH Reserved

70H Reserved

72H Reserved

74H Reserved

76H Reserved

78H Reserved

7AH Reserved

7CH Reserved

7EH Reserved

PCB Function

Offset

80H Reserved

82H Reserved

84H Reserved

86H Reserved

88H Reserved

8AH Reserved

8CH Reserved

8EH Reserved

90H Reserved

92H Reserved

94H Reserved

96H Reserved

98H Reserved

9AH Reserved

9CH Reserved

9EH Reserved

A0H UMCS

A2H LMCS

A4H PACS

A6H MMCS

A8H MPCS

AAH Reserved

ACH Reserved

AEH Reserved

B0H Reserved

B2H Reserved

B4H Reserved

B6H Reserved

B8H Reserved

BAH Reserved

BCH Reserved

BEH Reserved

PCB Function

Offset

C0H DMA0 Src. Lo

C2H DMA0 Src. Hi

C4H DMA0 Dest. Lo

C6H DMA0 Dest. Hi

C8H DMA0 Count

CAH DMA0 Control

CCH Reserved

CEH Reserved

D0H DMA1 Src. Lo

D2H DMA1 Src. Hi

D4H DMA1 Dest. Lo

D6H DMA1 Dest. Hi

D8H DMA1 Count

DAH DMA1 Control

DCH Reserved

DEH Reserved

E0H Refresh Base

E2H Refresh Time

E4H Refresh Control

E6H Reserved

E8H Reserved

EAH Reserved

ECH Reserved

EEH Reserved

F0H Power-Save

F2H Power Control

F4H Reserved

F6H Step ID

F8H Reserved

FAH Reserved

FCH Reserved

FEH Relocation

Figure 3. Peripheral Control Block Registers

80C186EA/80C188EA, 80L186EA/80L188EA

PCB Function

Offset

20H Interrupt Vector

22H Specific EOI

24H Reserved

26H Reserved

28H Interrupt Mask

2AH Priority Mask

2C In-Service

2E Interrupt Request

30 Interrupt Status

32 TMR0 Interrupt Control

34 DMA0 Interrupt Control

36 DMA1 Interrupt Control

38 TMR1 Interrupt Control

3A TMR2 Interrupt Control

3C Reserved

3E Reserved

Figure 4. 80C186EA Slave Mode Peripheral

Control Block Registers

DMA Control Unit

The 80C186EA DMA Contol Unit provides two inde-

pendent high-speed DMA channels. Data transfers

can occur between memory and I/O space in any

combination: memory to memory, memory to I/O,

I/O to I/O or I/O to memory. Data can be trans-

ferred either in bytes or words. Transfers may pro-

ceed to or from either even or odd addresses, but

even-aligned word transfers proceed at a faster rate.

Each data transfer consumes two bus cycles (a mini-

mum of eight clocks), one cycle to fetch data and

the other to store data. The chip-select/ready logic

may be programmed to point to the memory or I/O

space subject to DMA transfers in order to provide

hardware chip select lines. DMA cycles run at higher

priority than general processor execution cycles.

Chip-Select Unit

The 80C186EA Chip-Select Unit integrates logic

which provides up to 13 programmable chip-selects

to access both memories and peripherals. In addi-

tion, each chip-select can be programmed to auto-

matically terminate a bus cycle independent of the

condition of the SRDY and ARDY input pins. The

chip-select lines are available for all memory and

I/O bus cycles, whether they are generated by the

CPU, the DMA unit, or the Refresh Control Unit.

Refresh Control Unit

The Refresh Control Unit (RCU) automatically gen-

erates a periodic memory read bus cycle to keep

dynamic or pseudo-static memory refreshed. A 9-bit

counter controls the number of clocks between re-

fresh requests.

A 9-bit address generator is maintained by the RCU

with the address presented on the A9:1 address

lines during the refresh bus cycle. Address bits

A19:13 are programmable to allow the refresh ad-

dress block to be located on any 8 Kbyte boundary.

Power Management

The 80C186EA has three operational modes to con-

trol the power consumption of the device. They are

Power Save Mode, Idle Mode, and Powerdown

Mode.

Power Save Mode divides the processor clock by a

programmable value to take advantage of the fact

that current is linearly proportional to frequency. An

unmasked interrupt, NMI, or reset will cause the

80C186EA to exit Power Save Mode.

Idle Mode freezes the clocks of the Execution Unit

and the Bus Interface Unit at a logic zero state while

all peripherals operate normally.

Powerdown Mode freezes all internal clocks at a

logic zero level and disables the crystal oscillator. All

internal registers hold their values provided VCC is

maintained. Current consumption is reduced to tran-

sistor leakage only.

80C186EA/80C188EA, 80L186EA/80L188EA

80C187 Interface (80C186EA Only)

The 80C187 Numerics Coprocessor may be used to

extend the 80C186EA instruction set to include

floating point and advanced integer instructions.

Connecting the 80C186EA RESOUT and TEST/

BUSY pins to the 80C187 enables Numerics Mode

operation. In Numerics Mode, three of the four Mid-

Range Chip Select (MCS) pins become handshaking

pins for the interface. The exchange of data and

control information proceeds through four dedicated

I/O ports.

If an 80C187 is not present, the 80C186EA config-

ures itself for regular operation at reset.

NOTE:

The 80C187 is not specified for 3V operation and

therefore does not interface directly to the

80L186EA.

ONCE Test Mode

To facilitate testing and inspection of devices when

fixed into a target system, the 80C186EA has a test

mode available which forces all output and input/

output pins to be placed in the high-impedance

state. ONCE stands for ‘‘ON Circuit Emulation’’. The

ONCE mode is selected by forcing the UCS and LCS

pins LOW (0) during a processor reset (these pins

are weakly held to a HIGH (1) level) while RESIN is

active.

DIFFERENCES BETWEEN THE

80C186XL AND THE 80C186EA

The 80C186EA is intended as a direct functional up-

grade for 80C186XL designs. In many cases, it will

be possible to replace an existing 80C186XL with

little or no hardware redesign. The following sections

describe differences in pinout, operating modes, and

AC and DC specifications to keep in mind.

Pinout Compatibility

The 80C186EA requires a PDTMR pin to time the

processor’s exit from Powerdown Mode. The original

pin arrangement for the 80C186XL in the PLCC

package did not have any spare leads to use for

PDTMR, so the DT/R pin was sacrificed. The ar-

rangement of all the other leads in the 68-lead PLCC

is identical between the 80C186XL and the

80C186EA. DT/R may be synthesized by latching

the S1 status output. Therefore, upgrading a PLCC

80C186XL to PLCC 80C186EA is straightforward.

The 80-lead QFP (EIAJ) pinouts are different be-

tween the 80C186XL and the 80C186EA. In addition

to the PDTMR pin, the 80C186EA has more power

and ground pins and the overall arrangement of pins

was shifted. A new circuit board layout for the

80C186EA is required.

Operating Modes

The 80C186XL has two operating modes, Compati-

ble and Enhanced. Compatible Mode is a pin-to-pin

replacement for the NMOS 80186, except for nu-

merics coprocessing. In Enhanced Mode, the proc-

essor has a Refresh Control Unit, the Power-Save

feature and an interface to the 80C187 Numerics

Coprocessor. The MCS0, MCS1, and MCS3 pins

change their functions to constitute handshaking

pins for the 80C187.

The 80C186EA allows all non-80C187 users to use

all the MCS pins for chip-selects. In regular opera-

tion, all 80C186EA features (including those of the

Enhanced Mode 80C186) are present except for the

interface to the 80C187. Numerics Mode disables

the three chip-select pins and reconfigures them for

connection to the 80C187.

TTL vs CMOS Inputs

The inputs of the 80C186EA are rated for CMOS

switching levels for improved noise immunity, but the

80C186XL inputs are rated for TTL switching levels.

In particular, the 80C186EA requires a minimum VIH

of 3.5V to recognize a logic one while the 80C186XL

requires a minimum VIH of only 1.9V (assuming 5.0V

operation). The solution is to drive the 80C186EA

with true CMOS devices, such as those from the HC

and AC logic families, or to use pullup resistors

where the added current draw is not a problem.

Timing Specifications

80C186EA timing relationships are expressed in a

simplified format over the 80C186XL. The AC per-

formance of an 80C186EA at a specified frequency

will be very close to that of an 80C186XL at the

same frequency. Check the timings applicable to

your design prior to replacing the 80C186XL.

80C186EA/80C188EA, 80L186EA/80L188EA

PACKAGE INFORMATION

This section describes the pins, pinouts, and thermal

characteristics for the 80C186EA in the Plastic

Leaded Chip Carrier (PLCC) package, Shrink Quad

Flat Pack (SQFP), and Quad Flat Pack (QFP) pack-

age. For complete package specifications and infor-

mation, see the Intel Packaging Outlines and Dimen-

sions Guide (Order Number: 231369).

With the extended temperature range operational

characteristics are guaranteed over a temperature

range corresponding to b40§Ctoa

85§C ambient.

Package types are identified by a two-letter prefix to

the part number. The prefixes are listed in Table 1.

Table 1. Prefix Identification

Prefix Note Package Temperature

Type Range

TN PLCC Extended

TS QFP (EIAJ) Extended

SB 1 SQFP Extended/Commercial

N 1 PLCC Commercial

S 1 QFP (EIAJ) Commercial

NOTE:

1. The 25 MHz version is only available in commercial tem-

perature range corresponding to 0§Ctoa

70§C ambient.

Pin Descriptions

Each pin or logical set of pins is described in Table

3. There are three columns for each entry in the Pin

Description Table.

The Pin Name column contains a mnemonic that

describes the pin function. Negation of the signal

name (for example, RESIN) denotes a signal that is

active low.

The Pin Type column contains two kinds of informa-

tion. The first symbol indicates whether a pin is pow-

er (P), ground (G), input only (I), output only (O) or

input/output (I/O). Some pins have multiplexed

functions (for example, A19/S6). Additional symbols

indicate additional characteristics for each pin. Table

3 lists all the possible symbols for this column.

The Input Type column indicates the type of input

(asynchronous or synchronous).

Asynchronous pins require that setup and hold times

be met only in order to guarantee

recognition

at a

particular clock edge. Synchronous pins require that

setup and hold times be met to guarantee proper

operation.

For example, missing the setup or hold

time for the SRDY pin (a synchronous input) will re-

sult in a system failure or lockup. Input pins may also

be edge- or level-sensitive. The possible character-

istics for input pins are S(E), S(L), A(E) and A(L).

The Output States column indicates the output

state as a function of the device operating mode.

Output states are dependent upon the current activi-

ty of the processor. There are four operational

states that are different from regular operation: bus

hold, reset, Idle Mode and Powerdown Mode. Ap-

propriate characteristics for these states are also in-

dicated in this column, with the legend for all possi-

ble characteristics in Table 2.

The Pin Description column contains a text de-

scription of each pin.

As an example, consider AD15:0. I/O signifies the

pins are bidirectional. S(L) signifies that the input

function is synchronous and level-sensitive. H(Z)

signifies that, as outputs, the pins are high-imped-

ance upon acknowledgement of bus hold. R(Z) sig-

nifies that the pins float during reset. P(X) signifies

that the pins retain their states during Powerdown

Mode.

80C186EA/80C188EA, 80L186EA/80L188EA

Table 2. Pin Description Nomenclature

Symbol Description

P Power Pin (Apply aVCC Voltage)

G Ground (Connect to VSS)

I Input Only Pin

O Output Only Pin

I/O Input/Output Pin

S(E) Synchronous, Edge Sensitive

S(L) Synchronous, Level Sensitive

A(E) Asynchronous, Edge Sensitive

A(L) Asynchronous, Level Sensitive

H(1) Output Driven to VCC during Bus Hold

H(0) Output Driven to VSS during Bus Hold

H(Z) Output Floats during Bus Hold

H(Q) Output Remains Active during Bus Hold

H(X) Output Retains Current State during Bus Hold

R(WH) Output Weakly Held at VCC during Reset

R(1) Output Driven to VCC during Reset

R(0) Output Driven to VSS during Reset

R(Z) Output Floats during Reset

R(Q) Output Remains Active during Reset

R(X) Output Retains Current State during Reset

I(1) Output Driven to VCC during Idle Mode

I(0) Output Driven to VSS during Idle Mode

I(Z) Output Floats during Idle Mode

I(Q) Output Remains Active during Idle Mode

I(X) Output Retains Current State during Idle Mode

P(1) Output Driven to VCC during Powerdown Mode

P(0) Output Driven to VSS during Powerdown Mode

P(Z) Output Floats during Powerdown Mode

P(Q) Output Remains Active during Powerdown Mode

P(X) Output Retains Current State during Powerdown Mode

80C186EA/80C188EA, 80L186EA/80L188EA

Table 3. Pin Descriptions

Pin Pin Input Output Description

Name Type Type States

VCC PPOWER connections consist of six pins which must be shorted

externally to a VCC board plane.

VSS GGROUND connections consist of five pins which must be shorted

externally to a VSS board plane.

CLKIN I A(E) CLocK INput is an input for an external clock. An external

oscillator operating at two times the required processor operating

frequency can be connected to CLKIN. For crystal operation,

CLKIN (along with OSCOUT) are the crystal connections to an

internal Pierce oscillator.

OSCOUT O H(Q) OSCillator OUTput is only used when using a crystal to generate

the external clock. OSCOUT (along with CLKIN) are the crystal

R(Q)

connections to an internal Pierce oscillator. This pin is not to be

P(Q)

used as 2X clock output for non-crystal applications (i.e., this pin is

N.C. for non-crystal applications). OSCOUT does not float in

ONCE mode.

CLKOUT O H(Q) CLocK OUTput provides a timing reference for inputs and outputs

of the processor, and is one-half the input clock (CLKIN)

R(Q)

frequency. CLKOUT has a 50% duty cycle and transistions every

P(Q)

falling edge of CLKIN.

RESIN I A(L) RESet IN causes the processor to immediately terminate any bus

cycle in progress and assume an initialized state. All pins will be

driven to a known state, and RESOUT will also be driven active.

The rising edge (low-to-high) transition synchronizes CLKOUT with

CLKIN before the processor begins fetching opcodes at memory

location 0FFFF0H.

RESOUT O H(0) RESet OUTput that indicates the processor is currently in the

reset state. RESOUT will remain active as long as RESIN remains

R(1)

active. When tied to the TEST/BUSY pin, RESOUT forces the

P(0)

80C186EA into Numerics Mode.

PDTMR I/O A(L) H(WH) Power-Down TiMeR pin (normally connected to an external

capacitor) that determines the amount of time the processor waits

R(Z)

after an exit from power down before resuming normal operation.

P(1)

The duration of time required will depend on the startup

characteristics of the crystal oscillator.

NMI I A(E) Non-Maskable Interrupt input causes a Type 2 interrupt to be

serviced by the CPU. NMI is latched internally.

TEST/BUSY I A(E) TEST/BUSY is sampled upon reset to determine whether the

80C186EA is to enter Numerics Mode. In regular operation, the pin

(TEST)

is TEST.TEST is used during the execution of the WAIT

instruction to suspend CPU operation until the pin is sampled

active (low). In Numerics Mode, the pin is BUSY. BUSY notifies the

80C186EA of 80C187 Numerics Coprocessor activity.

AD15:0 I/O S(L) H(Z) These pins provide a multiplexed Address and Data bus. During

the address phase of the bus cycle, address bits 0 through 15 (0

(AD7:0) R(Z)

through 7 on the 8-bit bus versions) are presented on the bus and

P(X)

can be latched using ALE. 8- or 16-bit data information is

transferred during the data phase of the bus cycle.

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

Table 3. Pin Descriptions (Continued)

Pin Pin Input Output Description

Name Type Type States

A18:16 O H(Z) These pins provide multiplexed Address during the address

phase of the bus cycle. Address bits 16 through 19 are

A19/S6– A16 R(Z)

presented on these pins and can be latched using ALE.

(A19– A8) P(X) A18:16 are driven to a logic 0 during the data phase of the bus

cycle. On the 8-bit bus versions, A15– A8 provide valid address

information for the entire bus cycle. Also during the data

phase, S6 is driven to a logic 0 to indicate a CPU-initiated bus

cycle or logic 1 to indicate a DMA-initiated bus cycle or a

refresh cycle.

S2:0 O H(Z) Bus cycle Status are encoded on these pins to provide bus

transaction information. S2:0 are encoded as follows:

R(Z)

P(1) S2 S1 S0 Bus Cycle Initiated

0 0 0 Interrupt Acknowledge

0 0 1 Read I/O

0 1 0 Write I/O

0 1 1 Processor HALT

1 0 0 Queue Instruction Fetch

1 0 1 Read Memory

1 1 0 Write Memory

1 1 1 Passive (no bus activity)

ALE/QS0 O H(0) Address Latch Enable output is used to strobe address

information into a transparent type latch during the address

R(0)

phase of the bus cycle. In Queue Status Mode, QS0 provides

P(0) queue status information along with QS1.

BHE O H(Z) Byte High Enable output to indicate that the bus cycle in

progress is transferring data over the upper half of the data

(RFSH) R(Z)

bus. BHE and A0 have the following logical encoding:

P(X)

A0 BHE Encoding (For 80C186EA/80L186EA Only)

0 0 Word Transfer

0 1 Even Byte Transfer

1 0 Odd Byte Transfer

1 1 Refresh Operation

On the 80C188EA/80L188EA, RFSH is asserted low to

indicate a Refresh bus cycle.

RD/QSMD O H(Z) ReaD output signals that the accessed memory or I/O device

must drive data information onto the data bus. Upon reset, this

R(WH)

pin has an alternate function. As QSMD, it enables Queue

P(1) Status Mode when grounded. In Queue Status Mode, the

ALE/QS0 and WR/QS1 pins provide the following information

about processor/instruction queue interaction:

QS1 QS0 Queue Operation

0 0 No Queue Operation

0 1 First Opcode Byte Fetched from the Queue

1 1 Subsequent Byte Fetched from the Queue

1 0 Empty the Queue

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

Table 3. Pin Descriptions (Continued)

Pin Pin Input Output Description

Name Type Type States

WR/QS1 O H(Z) WRite output signals that data available on the data bus are to be

written into the accessed memory or I/O device. In Queue Status

R(Z)

Mode, QS1 provides queue status information along with QS0.

P(1)

ARDY I A(L) Asychronous ReaDY is an input to signal for the end of a bus cycle.

ARDY is asynchronous on rising CLKOUT and synchronous on falling

S(L)

CLKOUT. ARDY or SRDY must be active to terminate any processor

bus cycle, unless they are ignored due to correct programming of the

Chip Select Unit.

SRDY I S(L) Synchronous ReaDY is an input to signal for the end of a bus cycle.

ARDY or SRDY must be active to terminate any processor bus cycle,

unless they are ignored due to correct programming of the Chip Select

Unit.

DEN O H(Z) Data ENable output to control the enable of bidirectional transceivers

when buffering a system. DEN is active only when data is to be

R(Z)

transferred on the bus.

P(1)

DT/R O H(Z) Data Transmit/Receive output controls the direction of a bi-

directional buffer in a buffered system. DT/R is only available on the

R(Z)

QFP (EIAJ) package and the SQFP package.

P(X)

LOCK O H(Z) LOCK output indicates that the bus cycle in progress is not to be

interrupted. The processor will not service other bus requests (such

R(WH)

as HOLD) while LOCK is active. This pin is configured as a weakly

P(1)

held high input while RESIN is active and must not be driven low.

HOLD I A(L) HOLD request input to signal that an external bus master wishes to

gain control of the local bus. The processor will relinquish control of

the local bus between instruction boundaries not conditioned by a

LOCK prefix.

HLDA O H(1) HoLD Acknowledge output to indicate that the processor has

relinquished control of the local bus. When HLDA is asserted, the

R(0)

processor will (or has) floated its data bus and control signals allowing

P(0)

another bus master to drive the signals directly.

UCS O H(1) Upper Chip Select will go active whenever the address of a memory

or I/O bus cycle is within the address limitations programmed by the

R(1)

user. After reset, UCS is configured to be active for memory accesses

P(1)

between 0FFC00H and 0FFFFFH. During a processor reset, UCS and

LCS are used to enable ONCE Mode.

LCS O H(1) Lower Chip Select will go active whenever the address of a memory

bus cycle is within the address limitations programmed by the user.

R(1)

LCS is inactive after a reset. During a processor reset, UCS and LCS

P(1)

are used to enable ONCE Mode.

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

Table 3. Pin Descriptions (Continued)

Pin Pin Input Output Description

Name Type Type States

MCS0/PEREQ I/O A(L) H(1) These pins provide a multiplexed function. If enabled,

these pins normally comprise a block of Mid-Range Chip

MCS1/ERROR R(1)

Select outputs which will go active whenever the address

MCS2 P(1) of a memory bus cycle is within the address limitations

MCS3/NCS programmed by the user. In Numerics Mode (80C186EA

only), three of the pins become handshaking pins for the

80C187. The CoProcessor REQuest input signals that a

data transfer is pending. ERROR is an input which

indicates that the previous numerics coprocessor

operation resulted in an exception condition. An interrupt

Type 16 is generated when ERROR is sampled active at

the beginning of a numerics operation. Numerics

Coprocessor Select is an output signal generated when

the processor accesses the 80C187.

PCS4:0 O H(1) Peripheral Chip Selects go active whenever the address

of a memory or I/O bus cycle is within the address

R(1)

limitations programmed by the user.

P(1)

PCS5/A1 O H(1)/H(X) These pins provide a multiplexed function. As additional

Peripheral Chip Selects, they go active whenever the

PCS6/A2 R(1)

address of a memory or I/O bus cycle is within the

P(1) address limitations by the user. They may also be

programmed to provide latched Address A2:1 signals.

T0OUT O H(Q) Timer OUTput pins can be programmed to provide a

single clock or continuous waveform generation,

T1OUT R(1)

depending on the timer mode selected.

P(Q)

T0IN I A(L) Timer INput is used either as clock or control signals,

depending on the timer mode selected.

T1IN A(E)

DRQ0 I A(L) DMA ReQuest is asserted by an external request when it

is prepared for a DMA transfer.

DRQ1

INT0 I A(E,L) Maskable INTerrupt input will cause a vector to a specific

Type interrupt routine. To allow interrupt expansion, INT0

INT1/SELECT

and/or INT1 can be used with INTA0 and INTA1 to

interface with an external slave controller. INT1 becomes

SELECT when the ICU is configured for Slave Mode.

INT2/INTA0 I/O A(E,L) H(1) These pins provide multiplexed functions. As inputs, they

provide a maskable INTerrupt that will cause the CPU to

INT3/INTA1/IRQ R(Z)

vector to a specific Type interrupt routine. As outputs,

P(1) each is programmatically controlled to provide an

INTerrupt Acknowledge handshake signal to allow

interrupt expansion. INT3/INTA1 becomes IRQ when the

ICU is configured for Slave Mode.

N.C. No Connect. For compatibility with future products, do not

connect to these pins.

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

80C186EA PINOUT

Tables 4 and 5 list the 80C186EA pin names with

package location for the 68-pin Plastic Leaded Chip

Carrier (PLCC) component. Figure 9 depicts the

complete 80C186EA/80L186EA pinout (PLCC pack-

age) as viewed from the top side of the component

(i.e., contacts facing down).

Tables 6 and 7 list the 80C186EA pin names with

package location for the 80-pin Quad Flat Pack

(EIAJ) component. Figure 6 depicts the complete

80C186EA/80C188EA (EIAJ QFP package) as

viewed from the top side of the component (i.e., con-

tacts facing down).

Tables 8 and 9 list the 80C186EA/80C188EA pin

names with package location for the 80-pin Shrink

Quad Flat Pack (SQFP) component. Figure 7 depicts

the complete 80C186EA/80C188EA (SQFP) as

viewed from the top side of the component (i.e., con-

tacts facing down).

Table 4. PLCC Pin Names with Package Location

Address/Data Bus

Name Location

AD0 17

AD1 15

AD2 13

AD3 11

AD4 8

AD5 6

AD6 4

AD7 2

AD8 (A8) 16

AD9 (A9) 14

AD10 (A10) 12

AD11 (A11) 10

AD12 (A12) 7

AD13 (A13) 5

AD14 (A14) 3

AD15 (A15) 1

A16 68

A17 67

A18 66

A19/S6 65

Bus Control

Name Location

ALE/QS0 61

BHE (RFSH)64

S0 52

S1 53

S2 54

RD/QSMD 62

WR/QS1 63

ARDY 55

SRDY 49

DEN 39

LOCK 48

HOLD 50

HLDA 51

Power

Name Location

VSS 26, 60

VCC 9, 43

Processor Control

Name Location

RESIN 24

RESOUT 57

CLKIN 59

OSCOUT 58

CLKOUT 56

TEST/BUSY 47

PDTMR 40

NMI 46

INT0 45

INT1/SELECT 44

INT2/INTA0 42

INT3/INTA1/41

IRQ

I/O

Name Location

UCS 34

LCS 33

MCS0/PEREQ 38

MCS1/ERROR 37

MCS2 36

MCS3/NCS 35

PCS0 25

PCS1 27

PCS2 28

PCS3 29

PCS4 30

PCS5/A1 31

PCS6/A2 32

T0OUT 22

T0IN 20

T1OUT 23

T1IN 21

DRQ0 18

DRQ1 19

NOTE:

Pin names in parentheses apply to the 80C188EA/80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

Table 5. PLCC Package Location with Pin Names

Location Name

1 AD15 (A15)

2 AD7

3 AD14 (A14)

4 AD6

5 AD13 (A13)

6 AD5

7 AD12 (A12)

8 AD4

10 AD11 (A11)

11 AD3

12 AD10 (A10)

13 AD2

14 AD9 (A9)

15 AD1

16 AD8 (A8)

17 AD0

Location Name

18 DRQ0

19 DRQ1

20 T0IN

21 T1IN

22 T0OUT

23 T1OUT

24 RESIN

25 PCS0

26 VSS

27 PCS1

28 PCS2

29 PCS3

30 PCS4

31 PCS5/A1

32 PCS6/A2

33 LCS

34 UCS

Location Name

35 MCS3/NCS

36 MCS2

37 MCS1/ERROR

38 MCS0/PEREQ

39 DEN

40 PDTMR

41 INT3/INTA1/

IRQ

42 INT2/INTA0

43 VCC

44 INT1/SELECT

45 INT0

46 NMI

47 TEST/BUSY

48 LOCK

49 SRDY

50 HOLD

51 HLDA

Location Name

52 S0

53 S1

54 S2

55 ARDY

56 CLKOUT

57 RESOUT

58 OSCOUT

59 CLKIN

60 VSS

61 ALE/QS0

62 RD/QSMD

63 WR/QS1

64 BHE (RFSH)

65 A19/S6

66 A18

67 A17

68 A16

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

NOTES: 272432–5

1. The nine-character alphanumeric code (XXXXXXXXD) underneath the product number is the Intel FPO number.

2. Pin names in parentheses apply to the 80C186EA/80L188EA.

Figure 5. 68-Lead PLCC Pinout Diagram

80C186EA/80C188EA, 80L186EA/80L188EA

Table 6. QFP (EIAJ) Pin Names with Package Location

Address/Data Bus Bus Control Processor Control I/O

Name Location Name Location Name Location Name Location

AD0 64 ALE/QS0 10 RESIN 55 UCS 45

AD1 66 BHE (RFSH) 7 RESOUT 18 LCS 46

AD2 68 S0 23 CLKIN 16 MCS0/PEREQ 40

AD3 70 S1 22 OSCOUT 17 MCS1/ERROR 41

AD4 74 S2 21 CLKOUT 19 MCS2 42

AD5 76 RD/QSMD 9 TEST/BUSY 29 MCS3/NCS 43

AD6 78 WR/QS1 8 PDTMR 38 PCS0 54

AD7 80 ARDY 20 NMI 30 PCS1 52

AD8 (A8) 65 SRDY 27 INT0 31 PCS2 51

AD9 (A9) 67 DT/R 37 INT1/SELECT 32 PCS3 50

AD10 (A10) 69 DEN 39 INT2/INTA0 35 PCS4 49

AD11 (A11) 71 LOCK 28 INT3/INTA1/ 36 PCS5/A1 48

AD12 (A12) 75 HOLD 26 IRQ PCS6/A2 47

AD13 (A13) 77 HLDA 25 N.C. 11, 14, T0OUT 57

AD14 (A14) 79 15, 63 T0IN 59

AD15 (A15) 1 T1OUT 56

A16 3

Power

T1IN 58

A17 4

Name Location

DRQ0 61

A18 5

VSS 12, 13, 24,

DRQ1 60

A19/S6 6

53,62

VCC 2, 33, 34,

44, 72, 73

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

Table 7. QFP (EIAJ) Package Location with Pin Names

Location Name Location Name Location Name Location Name

1 AD15 (A15) 21 S2 41 MCS1/ERROR 61 DRQ0

CC 22 S1 42 MCS2 62 VSS

3 A16 23 S0 43 MCS3/NCS 63 N.C.

4 A17 24 VSS 44 VCC 64 AD0

5 A18 25 HLDA 45 UCS 65 AD8 (A8)

6 A19/S6 26 HOLD 46 LCS 66 AD1

7 BHE (RFSH) 27 SRDY 47 PCS6/A2 67 AD9 (A9)

8WR

/QS1 28 LOCK 48 PCS5/A1 68 AD2

9RD

/QSMD 29 TEST/BUSY 49 PCS4 69 AD10 (A10)

10 ALE/QS0 30 NMI 50 PCS3 70 AD3

11 N.C. 31 INT0 51 PCS2 71 AD11 (A11)

12 VSS 32 INT1/SELECT 52 PCS1 72 VCC

13 VSS 33 VCC 53 VSS 73 VCC

14 N.C. 34 VCC 54 PCS0 74 AD4

15 N.C. 35 INT2/INTA0 55 RESIN 75 AD12 (A12)

16 CLKIN 36 INT3/INTA1/ 56 T1OUT 76 AD5

17 OSCOUT IRQ 57 T0OUT 77 AD13 (A13)

18 RESOUT 37 DT/R 58 T1IN 78 AD6

19 CLKOUT 38 PDTMR 59 T0IN 79 AD14 (A14)

20 ARDY 39 DEN 60 DRQ1 80 AD7

40 MCS0/PEREQ

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

NOTES: 272432–6

1. The nine-character alphanumeric code (XXXXXXXXD) underneath the product number is the Intel FPO number.

2. Pin names in parentheses apply to the 80C186EA/80L188EA.

Figure 6. Quad Flat Pack (EIAJ) Pinout Diagram

80C186EA/80C188EA, 80L186EA/80L188EA

Table 8. SQFP Pin Functions with Package Location

AD Bus

AD0 1

AD1 3

AD2 6

AD3 8

AD4 12

AD5 14

AD6 16

AD7 18

AD8 (A8) 2

AD9 (A9) 5

AD10 (A10) 7

AD11 (A11) 9

AD12 (A12) 13

AD13 (A13) 15

AD14 (A14) 17

AD15 (A15) 19

A16/S3 21

A17/S4 22

A18/S5 23

A19/S6 24

Bus Control

ALE/QS0 29

BHE/(RFSH)26

S0 40

S1 39

S2 38

RD/QSMD 28

WR/QS1 27

ARDY 37

SRDY 44

DEN 56

DT/R 54

LOCK 45

HOLD 43

HLDA 42

No Connection

N.C. 4

N.C. 25

N.C. 35

N.C. 72

Processor Control

RESIN 73

RESOUT 34

CLKIN 32

OSCOUT 33

CLKOUT 36

TEST/BUSY 46

NMI 47

INT0 48

INT1/SELECT 49

INT2/INTA0 52

INT3/INTA1 53

PDTMR 55

Power and Ground

VCC 10

VCC 11

VCC 20

VCC 50

VCC 51

VCC 61

VSS 30

VSS 31

VSS 41

VSS 70

VSS 80

I/O

UCS 62

LCS 63

MCS0/PEREQ 57

MCS1/ERROR 58

MCS2 59

MCS3/NPS 60

PCS0 71

PCS1 69

PCS2 68

PCS3 67

PCS4 66

PCS5/A1 65

PCS6/A2 64

TMR IN 0 77

TMR IN 1 76

TMR OUT 0 75

TMR OUT 1 74

DRQ0 79

DRQ1 78

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

Table 9. SQFP Pin Locations with Pin Names

1 AD0

2 AD8 (A8)

3 AD1

4 N.C.

5 AD9 (A9)

6 AD2

7 AD10 (A10)

8 AD3

9 AD11 (A11)

10 VCC

11 VCC

12 AD4

13 AD12 (A12)

14 AD5

15 AD13 (A13)

16 AD6

17 AD14 (A14)

18 AD7

19 AD15 (A15)

20 VCC

21 A16/S3

22 A17/S4

23 A18/S5

24 A19/S6

25 N.C.

26 BHE/(RFSH)

27 WR/QS1

28 RD/QSMD

29 ALE/QS0

30 VSS

31 VSS

32 X1

33 X2

34 RESET

35 N.C.

36 CLKOUT

37 ARDY

38 S2

39 S1

40 S0

41 VSS

42 HLDA

43 HOLD

44 SRDY

45 LOCK

46 TEST/BUSY

47 NMI

48 INT0

49 INT1/SELECT

50 VCC

51 VCC

52 INT2/INTA0

53 INT3/INTA1

54 DT/R

55 PDTMR

56 DEN

57 MCS0/PEREQ

58 MCS1/ERROR

59 MCS2

60 MCS3/NPS

61 VCC

62 UCS

63 LCS

64 PCS6/A2

65 PCS5/A1

66 PCS4

67 PCS3

68 PCS2

69 PCS1

70 VSS

71 PCS0

72 N.C.

73 RES

74 TMR OUT 1

75 TMR OUT 0

76 TMR IN 1

77 TMR IN 0

78 DRQ1

79 DRQ0

80 VSS

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

272432–7

Figure 7. Shrink Quad Flat Pack (SQFP) Pinout Diagram

NOTES:

1. XXXXXXXXD indicates the Intel FPO number.

2. Pin names in parentheses apply to the 80C188EA.

PACKAGE THERMAL

SPECIFICATIONS

The 80C186EA/80L186EA is specified for operation

when TC(the case temperature) is within the range

of 0§Cto85

C (PLCC package) or 0§Cto106

(QFP-EIAJ) package. TCmay be measured in any

environment to determine whether the processor is

within the specified operating range. The case tem-

perature must be measured at the center of the top

surface.

TA(the ambient temperature) can be calculated

from iCA (thermal resistance from the case to ambi-

ent) with the following equation:

TAeTC-Pci

Typical values for iCA at various airflows are given

in Table 10.

P (the maximum power consumption, specified in

watts) is calculated by using the maximum ICC as

tabulated in the DC specifications and VCC of 5.5V.

Table 10. Thermal Resistance (iCA) at Various Airflows (in §C/Watt)

Airflow Linear ft/min (m/sec)

0 200 400 600 800 1000

(0) (1.01) (2.03) (3.04) (4.06) (5.07)

iCA (PLCC) 29 25 21 19 17 16.5

iCA (QFP) 66 63 60.5 59 58 57

iCA (SQFP) 70

80C186EA/80C188EA, 80L186EA/80L188EA

ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings*

Storage Temperature ÀÀÀÀÀÀÀÀÀÀb65§Ctoa

150§C

Case Temperature under Bias ÀÀÀb65§Ctoa

150§C

Supply Voltage with Respect

to VSS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀb0.5V to a6.5V

Voltage on Other Pins with Respect

to VSS ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀb0.5V to VCC a0.5V

NOTICE: This data sheet contains preliminary infor-

mation on new products in production. It is valid for

the devices indicated in the revision history. The

specifications are subject to change without notice.

WARNING: Stressing the device beyond the ‘‘Absolute

Maximum Ratings’’ may cause permanent damage.

These are stress ratings only. Operation beyond the

‘‘Operating Conditions’’ is not recommended and ex-

tended exposure beyond the ‘‘Operating Conditions’’

may affect device reliability.

Recommended Connections

Power and ground connections must be made to

multiple VCC and VSS pins. Every 80C186EA based

circuit board should contain separate power (VCC)

and ground (VSS) planes. All VCC and VSS pins must

be connected to the appropriate plane. Pins identi-

fied as ‘‘N.C.’’ must not be connected in the system.

Decoupling capacitors should be placed near the

processor. The value and type of decoupling capac-

itors is application and board layout dependent. The

processor can cause transient power surges when

its output buffers transition, particularly when con-

nected to large capacitive loads.

Always connect any unused input pins to an appro-

priate signal level. In particular, unused interrupt pins

(NMI, INT3:0) should be connected to VSS to avoid

unwanted interrupts. Leave any unused output pin

or any ‘‘N.C.’’ pin unconnected.

80C186EA/80C188EA, 80L186EA/80L188EA

DC SPECIFICATIONS (80C186EA/80C188EA)

Symbol Parameter Min Max Units Conditions

VCC Supply Voltage 4.5 5.5 V

VIL Input Low Voltage for All Pins b0.5 0.3 VCC V

VIH Input High Voltage for All Pins 0.7 VCC VCC a0.5 V

VOL Output Low Voltage 0.45 V IOL e3 mA (min)

VOH Output High Voltage VCC b0.5 V IOH eb

2 mA (min)

VHYR Input Hysterisis on RESIN 0.30 V

IIL1 Input Leakage Current (except g10 mA0V

IN sVCC

RD/QSMD, UCS, LCS, MCS0/PEREQ,

MCS1/ERROR, LOCK and TEST/BUSY)

IIL2 Input Leakage Current b275 mAV

IN e0.7 VCC

(RD/QSMD, UCS, LCS, MCS0/PEREQ, (Note 1)

MCS1, ERROR, LOCK and TEST/BUSY

IOL Output Leakage Current g10 mA0.45 sVOUT sVCC

(Note 2)

ICC Supply Current Cold (RESET)

80C186EA25/80C188EA25 105 mA (Notes 3, 5)

80C186EA20/80C188EA20 90 mA

80C186EA13/80C188EA13 65 mA

IID Supply Current In Idle Mode

80C186EA25/80C188EA25 90 mA (Note 5)

80C186EA20/80C188EA20 70 mA

80C186EA13/80C188EA13 46 mA

IPD Supply Current In Powerdown Mode

80C186EA25/80C188EA25 100 mA (Note 5)

80C186EA20/80C188EA20 100 mA

80C186EA13/80C188EA13 100 mA

COUT Output Pin Capacitance 0 15 pF TFe1 MHz (Note 4)

CIN Input Pin Capacitance 0 15 pF TFe1 MHz

NOTES:

1. RD/QSMD, UCS, LCS, MCS0/PEREQ, MCS1/ERROR, LOCK and TEST/BUSY have internal pullups that are only acti-

vated during RESET. Loading these pins above IOL eb

275 mA will cause the processor to enter alternate modes of

operation.

2. Output pins are floated using HOLD or ONCE Mode.

3. Measured at worst case temperature and VCC with all outputs loaded as specified in the AC Test Conditions, and with the

device in RESET (RESIN held low). RESET is worst case for ICC.

4. Output capacitance is the capacitive load of a floating output pin.

5. Operating conditions for 25 MHz are 0§Ctoa

70§C, VCC e5.0V g10%.

80C186EA/80C188EA, 80L186EA/80L188EA

DC SPECIFICATIONS (80L186EA/80L188EA)

Symbol Parameter Min Max Units Conditions

VCC Supply Voltage 2.7 5.5 V

VIL Input Low Voltage for All Pins b0.5 0.3 VCC V

VIH Input High Voltage for All Pins 0.7 VCC VCC a0.5 V

VOL Output Low Voltage 0.45 V IOL e1.6 mA (min)

VOH Output High Voltage VCC b0.5 V IOH eb

1 mA (min)

VHYR Input Hysterisis on RESIN 0.30 V

IIL1 Input Leakage Current (except g10 mA0V

IN sVCC

RD/QSMD, UCS, LCS, MCS0/PEREQ,

MCS1, LOCK and TEST)

IIL2 Input Leakage Current b275 mAV

IN e0.7 VCC

(RD/QSMD, UCS, LCS, MCS0, (Note 1)

MCS1, LOCK and TEST)

IOL Output Leakage Current g10 mA0.45 sVOUT sVCC

(Note 2)

ICC5 Supply Current (RESET, 5.5V)

80L186EA-13 65 mA (Note 3)

80L186EA-8 40 mA (Note 3)

ICC3 Supply Current (RESET, 2.7V)

80L186EA-13 34 mA (Note 3)

80L186EA-8 20 mA (Note 3)

IID5 Supply Current Idle (5.5V)

80L186EA-13 46 mA

80L186EA-8 28 mA

IID5 Supply Current Idle (2.7V)

80L186EA-13 24 mA

80L186EA-8 14 mA

IPD5 Supply Current Powerdown (5.5V)

80L186EA-13 100 mA

80L186EA-8 100 mA

IPD3 Supply Current Powerdown (2.7V)

80L186EA-13 50 mA

80L186EA-8 50 mA

COUT Output Pin Capacitance 0 15 pF TFe1 MHz (Note 4)

CIN Input Pin Capacitance 0 15 pF TFe1 MHz

NOTES:

1. RD/QSMD, UCS, LCS, MCS0, MCS1, LOCK and TEST have internal pullups that are only activated during RESET.

Loading these pins above IOL eb

275 mA will cause the processor to enter alternate modes of operation.

2. Output pins are floated using HOLD or ONCE Mode.

3. Measured at worst case temperature and VCC with all outputs loaded as specified in the AC Test Conditions, and with the

device in RESET (RESIN held low).

4. Output capacitance is the capacitive load of a floating output pin.

80C186EA/80C188EA, 80L186EA/80L188EA

ICC VERSUS FREQUENCY AND VOLTAGE

The current (ICC) consumption of the processor is

essentially composed of two components; IPD and

ICCS.

IPD is the quiescent current that represents internal

device leakage, and is measured with all inputs or

floating outputs at GND or VCC (no clock applied to

the device). IPD is equal to the Powerdown current

and is typically less than 50 mA.

ICCS is the switching current used to charge and

discharge parasitic device capacitance when chang-

ing logic levels. Since ICCS is typically much greater

than IPD,I

PD can often be ignored when calculating

ICC.

ICCS is related to the voltage and frequency at which

the device is operating. It is given by the formula:

Power eVcIeV2cCDEV cf

...IeICC eICCS eVcCDEV cf

Where: V eDevice operating voltage (VCC)

CDEV eDevice capacitance

feDevice operating frequency

ICCS eICC eDevice current

Measuring CDEV on a device like the 80C186EA

would be difficult. Instead, CDEV is calculated using

the above formula by measuring ICC at a known VCC

and frequency (see Table 11). Using this CDEV val-

ue, ICC can be calculated at any voltage and fre-

quency within the specified operating range.

EXAMPLE: Calculate the typical ICC when operating

at 20 MHz, 4.8V.

ICC eICCS e4.8 c0.515 c20 &49 mA

PDTMR PIN DELAY CALCULATION

The PDTMR pin provides a delay between the as-

sertion of NMI and the enabling of the internal

clocks when exiting Powerdown. A delay is required

only when using the on-chip oscillator to allow the

crystal or resonator circuit time to stabilize.

NOTE:

The PDTMR pin function does not apply when

RESIN is asserted (i.e., a device reset during Pow-

erdown is similar to a cold reset and RESIN must

remain active until after the oscillator has stabi-

lized).

To calculate the value of capacitor required to pro-

vide a desired delay, use the equation:

440 cteCPD (5V, 25§C)

Where: t edesired delay in seconds

CPD ecapacitive load on PDTMR in mi-

crofarads

EXAMPLE: To get a delay of 300 ms, a capacitor

value of CPD e440 c(300 c10b6)e0.132 mFis

required. Round up to standard (available) capaci-

tive values.

NOTE:

The above equation applies to delay times greater

than 10 ms and will compute the TYPICAL capaci-

tance needed to achieve the desired delay. A delay

variance of a50% or b25% can occur due to

temperature, voltage, and device process ex-

tremes. In general, higher VCC and/or lower tem-

perature will decrease delay time, while lower VCC

and/or higher temperature will increase delay time.

Table 11. CDEV Values

Parameter Typ Max Units Notes

CDEV (Device in Reset) 0.515 0.905 mA/V*MHz 1, 2

CDEV (Device in Idle) 0.391 0.635 mA/V*MHz 1, 2

1. Max CDEV is calculated at b40§C, all floating outputs driven to VCC or GND, and all

outputs loaded to 50 pF (including CLKOUT and OSCOUT).

2. Typical CDEV is calculated at 25§C with all outputs loaded to 50 pF except CLKOUT and

OSCOUT, which are not loaded.

80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS

AC CharacteristicsÐ80C186EA25/80C186EA20/80C186EA13

Symbol Parameter Min Max Min Max Min Max Units Notes

INPUT CLOCK 25 MHz(12) 20 MHz 13 MHz

TFCLKIN Frequency 0 50 0 40 0 26 MHz 1

TCCLKIN Period 20 %25 %38.5 %ns 1

TCH CLKIN High Time 10 %10 %12 %ns 1, 2

TCL CLKIN Low Time 10 %10 %12 %ns 1, 2

TCR CLKIN Rise Time 1 8 1 8 1 8 ns 1, 3

TCF CLKIN Fall Time 1 8 1 8 1 8 ns 1, 3

OUTPUT CLOCK

TCD CLKIN to CLKOUT Delay 0 15 0 17 0 23 ns 1, 4

T CLKOUT Period 2TC2*TC2*TCns 1

TPH CLKOUT High Time (T/2) b5 (T/2) b5 (T/2) b5ns1

PL CLKOUT Low Time (T/2) b5 (T/2) b5 (T/2) b5ns1

PR CLKOUT Rise Time 1 6 1 6 1 6 ns 1, 5

TPF CLKOUT Fall Time 1 6 1 6 1 6 ns 1, 5

OUTPUT DELAYS

TCHOV1 ALE, S2:0, DEN, DT/R, 3 20 3 22 3 25 ns 1, 4, 6, 7

BHE, (RFSH), LOCK, A19:16

TCHOV2 MCS3:0, LCS, UCS, PCS6:0, 3 25 3 27 3 30 ns 1, 4, 6, 8

NCS,RD,WR

CLOV1 BHE (RFSH), DEN, LOCK, 3 20 3 22 3 25 ns 1, 4, 6

RESOUT, HLDA,

T0OUT, T1OUT, A19:16

TCLOV2 RD,WR, MCS3:0, LCS, 3 25 3 27 3 30 ns 1, 4, 6

UCS, PCS6:0, AD15:0

(A15:8, AD7:0),

NCS, INTA1:0, S2:0

TCHOF RD,WR, BHE (RFSH), DT/R, 0 25 0 25 0 25 ns 1

LOCK, S2:0, A19:16

TCLOF DEN, AD15:0 (A15:8, AD7:0) 0 25 0 25 0 25 ns 1

80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS (Continued)

AC CharacteristicsÐ80C186EA25/80C186EA20/80C186EA13

Symbol Parameter Min Max Min Max Min Max Units Notes

SYNCHRONOUS INPUTS 25 MHz(12) 20 MHz 13 MHz

TCHIS TEST, NMI, INT3:0, 8 10 10 ns 1, 9

T1:0IN, ARDY

TCHIH TEST, NMI, INT3:0, 3 3 3 ns 1, 9

T1:0IN, ARDY

TCLIS AD15:0 (AD7:0), ARDY, 10 10 10 ns 1, 10

SRDY, DRQ1:0

TCLIH AD15:0 (AD7:0), ARDY, 3 3 3 ns 1, 10

SRDY, DRQ1:0

TCLIS HOLD, PEREQ, ERROR 10 10 10 ns 1, 9

(80C186EA Only)

TCLIH HOLD, PEREQ, ERROR 333 ns1,9

(80C186EA Only)

TCLIS RESIN (to CLKIN) 10 10 10 ns 1, 9

TCLIH RESIN (from CLKIN) 3 3 3 ns 1, 9

NOTES:

1. See AC Timing Waveforms, for waveforms and definition.

2. Measured at VIH for high time, VIL for low time.

3. Only required to guarantee ICC. Maximum limits are bounded by TC,T

CH and TCL.

4. Specified for a 50 pF load, see Figure 13 for capacitive derating information.

5. Specified for a 50 pF load, see Figure 14 for rise and fall times outside 50 pF.

6. See Figure 14 for rise and fall times.

7. TCHOV1 applies to BHE (RFSH), LOCK and A19:16 only after a HOLD release.

8. TCHOV2 applies to RD and WR only after a HOLD release.

9. Setup and Hold are required to guarantee recognition.

10. Setup and Hold are required for proper operation.

11. TCHOVS applies to BHE (RFSH) and A19:16 only after a HOLD release.

12. Operating conditions for 25 MHz are 0§Ctoa

70§C, VCC e5.0V g10%.

Pin names in parentheses apply to the 80C188EA/80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS

AC CharacteristicsÐ80L186EA13/80L186EA8

Symbol Parameter Min Max Min Max Units Notes

INPUT CLOCK 13 MHz 8 MHz

TFCLKIN Frequency 0 26 0 16 MHz 1

TCCLKIN Period 38.5 %62.5 %ns 1

TCH CLKIN High Time 12 %12 %ns 1, 2

TCL CLKIN Low Time 12 %12 %ns 1, 2

TCR CLKIN Rise Time 1 8 1 8 ns 1, 3

TCF CLKIN Fall Time 1 8 1 8 ns 1, 3

OUTPUT CLOCK

TCD CLKIN to CLKOUT Delay 0 45 0 95 ns 1, 4

T CLKOUT Period 2*TC2*TCns 1

TPH CLKOUT High Time (T/2) b5 (T/2) b5ns1

PL CLKOUT Low Time (T/2) b5 (T/2) b5ns1

PR CLKOUT Rise Time 1 12 1 12 ns 1, 5

TPF CLKOUT Fall Time 1 12 1 12 ns 1, 5

OUTPUT DELAYS

TCHOV1 ALE, LOCK 3 27 3 27 ns 1,4,6,7

CHOV2 MCS3:0, LCS, UCS, 332332ns1,4,

PCS6:0,RD,WR 6, 8

TCHOV3 S2:0 (DEN), DT/R, 330330ns1

BHE (RFSH), A19:16

TCLOV1 LOCK, RESOUT, HLDA, 3 27 3 27 ns 1, 4, 6

T0OUT, T1OUT

TCLOV2 RD,WR, MCS3:0, LCS, 3 32 3 35 ns 1,4,6

UCS, PCS6:0, INTA1:0

TCLOV3 BHE (RFSH), DEN, A19:16 3 30 3 30 ns 1, 4, 6

TCLOV4 AD15:0 (A15:8, AD7:0) 3 34 3 35 ns 1, 4, 6

TCLOV5 S2:0 3 38 3 40 ns 1,4,6

CHOF RD,WR, BHE (RFSH), 027027ns1

DT/R, LOCK,

S2:0, A19:16

TCLOF DEN, AD15:0

(A15:8, AD7:0) 0 27 0 27 ns 1

NOTES:

1. See AC Timing Waveforms, for waveforms and definition.

2. Measured at VIH for high time, VIL for low time.

3. Only required to guarantee ICC. Maximum limits are bounded by TC,T

CH and TCL.

4. Specified for a 50 pF load, see Figure 13 for capacitive derating information.

5. Specified for a 50 pF load, see Figure 14 for rise and fall times outside 50 pF.

6. See Figure 14 for rise and fall times.

7. TCHOV1 applies to BHE (RFSH), LOCK and A19:16 only after a HOLD release.

8. TCHOV2 applies to RD and WR only after a HOLD release.

9. Setup and Hold are required to guarantee recognition.

10. Setup and Hold are required for proper operation.

11. TCHOVS applies to BHE (RFSH) and A19:16 only after a HOLD release.

12. Pin names in parentheses apply to the 80C188EA/80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS

AC CharacteristicsÐ80L186EA13/80L186EA8

Symbol Parameter Min Max Min Max Units Notes

SYNCHRONOUS INPUTS 13 MHz 8 MHz

TCHIS TEST, NMI, INT3:0, T1:0IN, ARDY 22 22 ns 1, 9

TCHIH TEST, NMI, INT3:0, T1:0IN, ARDY 3 3 ns 1, 9

TCLIS AD15:0 (AD7:0), ARDY, SRDY, DRQ1:0 22 22 ns 1, 10

TCLIH AD15:0 (AD7:0), ARDY, SRDY, DRQ1:0 3 3 ns 1, 10

TCLIS HOLD 22 22 ns 1, 9

TCLIH HOLD 3 3 ns 1, 9

TCLIS RESIN (to CLKIN) 22 22 ns 1, 9

TCLIH RESIN (from CLKIN) 3 3 ns 1, 9

NOTES:

1. See AC Timing Waveforms, for waveforms and definition.

2. Measured at VIH for high time, VIL for low time.

3. Only required to guarantee ICC. Maximum limits are bounded by TC,T

CH and TCL.

4. Specified for a 50 pF load, see Figure 13 for capacitive derating information.

5. Specified for a 50 pF load, see Figure 14 for rise and fall times outside 50 pF.

6. See Figure 14 for rise and fall times.

7. TCHOV1 applies to BHE (RFSH), LOCK and A19:16 only after a HOLD release.

8. TCHOV2 applies to RD and WR only after a HOLD release.

9. Setup and Hold are required to guarantee recognition.

10. Setup and Hold are required for proper operation.

11. TCHOVS applies to BHE (RFSH) and A19:16 only after a HOLD release.

12. Pin names in parentheses apply to the 80C188EA/80L188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS (Continued)

Relative Timings (80C186EA25/20/13, 80L186EA13/8)

Symbol Parameter Min Max Unit Notes

RELATIVE TIMINGS

TLHLL ALE Rising to ALE Falling T b15 ns

TAVLL Address Valid to ALE Falling (/2Tb10 ns

TPLLL Chip Selects Valid to ALE Falling (/2Tb10 ns 1

TLLAX Address Hold from ALE Falling (/2Tb10 ns

TLLWL ALE Falling to WR Falling (/2Tb15 ns 1

TLLRL ALE Falling to RD Falling (/2Tb15 ns 1

TRHLH RD Rising to ALE Rising (/2Tb10 ns 1

TWHLH WR Rising to ALE Rising (/2Tb10 ns 1

TAFRL Address Float to RD Falling 0 ns

TRLRH RD Falling to RD Rising (2*T) b5ns2

WLWH WR Falling to WR Rising (2*T) b5ns2

RHAV RD Rising to Address Active T b15 ns

TWHDX Output Data Hold after WR Rising T b15 ns

TWHDEX WR Rising to DEN Rising (/2Tb10 ns 1

TWHPH WR Rising to Chip Select Rising (/2Tb10 ns 1, 4

TRHPH RD Rising to Chip Select Rising (/2Tb10 ns 1, 4

TPHPL CS Inactive to CS Active (/2Tb10 ns 1

TDXDL DEN Inactive to DT/R Low 0 ns 5

TOVRH ONCE (UCS, LCS) Active to RESIN Rising T ns 3

TRHOX ONCE (UCS, LCS) to RESIN Rising T ns 3

NOTES:

1. Assumes equal loading on both pins.

2. Can be extended using wait states.

3. Not tested.

4. Not applicable to latched A2:1. These signals change only on falling T1.

5. For write cycle followed by read cycle.

6. Operating conditions for 25 MHz are 0§Ctoa

70§C, VCC e5.0V g10%.

80C186EA/80C188EA, 80L186EA/80L188EA

AC TEST CONDITIONS

The AC specifications are tested with the 50 pF load

shown in Figure 8. See the Derating Curves section

to see how timings vary with load capacitance.

Specifications are measured at the VCC/2 crossing

point, unless otherwise specified. See AC Timing

Waveforms, for AC specification definitions, test

pins, and illustrations.

272432–8

CLe50 pF for all signals.

Figure 8. AC Test Load

AC TIMING WAVEFORMS

272432–9

Figure 9. Input and Output Clock Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

272432–10

NOTE:

20% VCC kFloat k80% VCC

Figure 10. Output Delay and Float Waveform

272432–11

NOTE:

RESIN measured to CLKIN, not CLKOUT

Figure 11. Input Setup and Hold

80C186EA/80C188EA, 80L186EA/80L188EA

272432–12

NOTES:

1. TDXDL for write cycle followed by read cycle.

2. Pin names in parentheses apply to tthe 80C188EA.

Figure 12. Relative Signal Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

DERATING CURVES

272432–13

Figure 13. Typical Output Delay Variations

Versus Load Capacitance

272432–14

Figure 14. Typical Rise and Fall Variations

Versus Load Capacitance

RESET

The processor performs a reset operation any time

the RESIN pin is active. The RESIN pin is actually

synchronized before it is presented internally, which

means that the clock must be operating before a

reset can take effect. From a power-on state, RESIN

must be held active (low) in order to guarantee cor-

rect initialization of the processor. Failure to pro-

vide RESIN while the device is powering up will

result in unspecified operation of the device.

Figure 15 shows the correct reset sequence when

first applying power to the processor. An external

clock connected to CLKIN must not exceed the VCC

threshold being applied to the processor. This is nor-

mally not a problem if the clock driver is supplied

with the same VCC that supplies the processor.

When attaching a crystal to the device, RESIN must

remain active until both VCC and CLKOUT are stable

(the length of time is application specific and de-

pends on the startup characteristics of the crystal

circuit). The RESIN pin is designed to operate cor-

rectly using an RC reset circuit, but the designer

must ensure that the ramp time for VCC is not so

long that RESIN is never really sampled at a logic

low level when VCC reaches minimum operating

conditions.

Figure 16 shows the timing sequence when RESIN

is applied after VCC is stable and the device has

been operating. Note that a reset will terminate all

activity and return the processor to a known operat-

ing state. Any bus operation that is in progress at the

time RESIN is asserted will terminate immediately

(note that most control signals will be driven to their

inactive state first before floating).

While RESIN is active, signals RD/QSMD, UCS,

LCS, MCS0/PEREQ, MCS1/ERROR, LOCK, and

TEST/BUSY are configured as inputs and weakly

held high by internal pullup transistors. Forcing UCS

and LCS low selects ONCE Mode. Forcing QSMD

low selects Queue Status Mode. Forcing TEST/

BUSY high at reset and low four clocks later enables

Numerics Mode. Forcing LOCK low is prohibited and

results in unspecified operation.

80C186EA/80C188EA, 80L186EA/80L188EA

Figure 15. Powerup Reset Waveforms

272432–15

NOTES:

1. CLKOUT synchronization occurs approximately 1(/2 CLKIN periods after RESIN is sampled low.

2. Pin names in parentheses apply to the 80C188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

Figure 16. Warm Reset Waveforms

272432–16

NOTES:

1. CLKOUT resynchronization occurs approximately 1(/2 CLKIN periods after RESIN is sampled low. If RESIN is sampled low while CLKOUT is transitioning high,

then CLKOUT will remain high for two CLKIN periods. If RESIN is sampled low while CLKOUT is transitioning high, then CLKOUT will not be affected.

2. Pin names in parentheses apply to the 80C188EA.

80C186EA/80C188EA, 80L186EA/80L188EA

BUS CYCLE WAVEFORMS

Figures 17 through 23 present the various bus cycles that are generated by the processor. What is shown in

the figure is the relationship of the various bus signals to CLKOUT. These figures along with the information

present in AC Specifications allow the user to determine all the critical timing analysis needed for a given

application.

272432-17

NOTES:

1. During the data phase of the bus cycle, A19/S6 is driven high for a DMA or refresh cycle.

2. Pin names in parentheses apply to the 80C188EA.

Figure 17. Read, Fetch and Refresh Cycle Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

272432-18

NOTES:

1. During the data phase of the bus cycle, A19/S6 is driven high for a DMA cycle.

2. Pin names in parentheses apply to the 80C188EA.

Figure 18. Write Cycle Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

272432–19

NOTES:

1. The processor drives these pins to 0 during Idle and Powerdown Modes.

2. Pin names in parentheses apply to the 80C188EA.

Figure 19. Halt Cycle Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

NOTES: 272432–20

1. INTA occurs one clock later in Slave Mode.

2. Pin names in parentheses apply to the 80C188EA.

Figure 20. INTA Cycle Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

272432–21

NOTE:

1. Pin names in parentheses apply to the 80C188EA.

Figure 21. HOLD/HLDA Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

272432–22

NOTE:

1. Pin names in parentheses apply to the 80C188EA.

Figure 22. DRAM Refresh Cycle During Hold Acknowledge

80C186EA/80C188EA, 80L186EA/80L188EA

272432–23

NOTES:

1. Generalized diagram for READ or WRITE.

2. ARDY low by either edge causes a wait state. Only rising ARDY is fully synchronized.

3. SRDY low causes a wait state. SRDY must meet setup and hold times to ensure correct device operation.

4. Either ARDY or SRDY active high will terminate a bus cycle.

5. Pin names in parentheses apply to the 80C188EA.

Figure 23. Ready Waveform

80C186EA/80C188EA, 80L186EA/80L188EA

80C186EA/80C188EA EXECUTION

TIMINGS

A determination of program exeuction timing must

consider the bus cycles necessary to prefetch in-

structions as well as the number of execution unit

cycles necessary to execute instructions. The fol-

lowing instruction timings represent the minimum

execution time in clock cycle for each instruction.

The timings given are based on the following as-

sumptions:

#The opcode, along with any data or displacement

required for execution of a particular instruction,

has been prefetched and resides in the queue at

the time it is needed.

#No wait states or bus HOLDs occur.

#All word-data is located on even-address bound-

aries. (80C186EA only)

All jumps and calls include the time required to fetch

the opcode of the next instruction at the destination

address.

All instructions which involve memory accesses can

require one or two additional clocks above the mini-

mum timings shown due to the asynchronous hand-

shake between the bus interface unit (BIU) and exe-

cution unit.

With a 16-bit BIU, the 80C186EA has sufficient bus

performance to endure that an adequate number of

prefetched bytes will reside in the queue (6 bytes)

most of the time. Therefore, actual program exeuc-

tion time will not be substanially greater than that

derived from adding the instruction timings shown.

The 80C188EA 8-bit BIU is limited in its performance

relative to the execution unit. A sufficient number of

prefetched bytes may not reside in the prefetch

queue (4 bytes) much of the time. Therefore, actual

program execution time will be substantially greater

than that derived from adding the instruction timings

shown.

80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY

Function Format

80C186EA 80C188EA

Comments

Clock Clock

Cycles Cycles

DATA TRANSFER

MOV eMove:

Immediate to register/memory 1100011w mod000 r/m data data if we1 12–13 12–13 8/16-bit

Immediate to register 1011w reg data data if we1 3–4 3–4 8/16-bit

Memory to accumulator 1010000w addr-low addr-high 8 8*

Accumulator to memory 1010001w addr-low addr-high 9 9*

Segment register to register/memory 10001100 mod0reg r/m 2/11 2/15

PUSH ePush:

Memory 11111111 mod110 r/m 16 20

Segment register 000reg110 9 13

Immediate 011010s0 data data if se01014

PUSHA ePush All 01100000 36 68

POP ePop:

Memory 10001111 mod000 r/m 20 24

Segment register 000reg111 (reg i01) 8 12

POPA ePopAll 01100001 51 83

XCHG eExchange:

IN eInput from:

Fixed port 1110010w port 10 10*

Variable port 1110110w 8 7*

OUT eOutput to:

Fixed port 1110011w port 9 9*

Variable port 1110111w 7 7*

XLAT eTranslate byte to AL 11010111 11 15

LEA eLoad EA to register 10001101 modreg r/m 6 6

LDS eLoad pointer to DS 11000101 modreg r/m (modi11) 18 26

LES eLoad pointer to ES 11000100 modreg r/m (modi11) 18 26

LAHF eLoad AH with flags 10011111 2 2

SAHF eStore AH into flags 10011110 3 3

PUSHF ePush flags 10011100 9 13

POPF ePop flags 10011101 8 12

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

Function Format

80C186EA 80C188EA

Comments

Clock Clock

Cycles Cycles

DATA TRANSFER (Continued)

SEGMENT eSegment Override:

CS 00101110 2 2

SS 00110110 2 2

DS 00111110 2 2

ES 00100110 2 2

ARITHMETIC

ADD eAdd:

Reg/memory with register to either 000000dw modreg r/m 3/10 3/10*

Immediate to register/memory 100000sw mod000 r/m data data if s we01 4/16 4/16*

Immediate to accumulator 0000010w data data if we1 3/4 3/4 8/16-bit

ADC eAdd with carry:

Reg/memory with register to either 000100dw modreg r/m 3/10 3/10*

Immediate to register/memory 100000sw mod010 r/m data data if s we01 4/16 4/16*

Immediate to accumulator 0001010w data data if we1 3/4 3/4 8/16-bit

INC eIncrement:

SUB eSubtract:

Reg/memory and register to either 001010dw modreg r/m 3/10 3/10*

Immediate from register/memory 100000sw mod101 r/m data data if s we01 4/16 4/16*

Immediate from accumulator 0010110w data data if we1 3/4 3/4 8/16-bit

SBB eSubtract with borrow:

Reg/memory and register to either 000110dw modreg r/m 3/10 3/10*

Immediate from register/memory 100000sw mod011 r/m data data if s we01 4/16 4/16*

Immediate from accumulator 0001110w data data if we1 3/4 3/4*8/16-bit

DEC eDecrement

CMP eCompare:

Immediate with register/memory 100000sw mod111 r/m data data if s we01 3/10 3/10*

Immediate with accumulator 0011110w data data if we1 3/4 3/4 8/16-bit

NEG eChange sign register/memory 1111011w mod011 r/m 3/10*3/10*

AAA eASCII adjust for add 00110111 8 8

DAA eDecimal adjust for add 00100111 4 4

AAS eASCII adjust for subtract 00111111 7 7

DAS eDecimal adjust for subtract 00101111 4 4

MUL eMultiply (unsigned): 1111011w mod100 r/m

Memory-Byte 32–34 32–34

Memory-Word 41–43 41–48*

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

Function Format

80C186EA 80C188EA

Comments

Clock Clock

Cycles Cycles

ARITHMETIC (Continued)

IMUL eInteger multiply (signed): 1111011w mod101 r/m

Memory-Byte 31–34 32–34

Memory-Word 40–43 40–43*

IMUL eInteger Immediate multiply 011010s1 modreg r/m data data if se0 22– 25 22-25

(signed) 29–32 29–32

DIV eDivide (unsigned): 1111011w mod110 r/m

Memory-Byte 35 35

Memory-Word 44 44*

IDIV eInteger divide (signed): 1111011w mod111 r/m

Memory-Byte 50–58 50–58

Memory-Word 59–67 59–67*

AAM eASCII adjust for multiply 11010100 00001010 19 19

AAD eASCII adjust for divide 11010101 00001010 15 15

CBW eConvert byte to word 10011000 2 2

CWD eConvert word to double word 10011001 4 4

LOGIC

Shift/Rotate Instructions:

n/17an5

n/17an

TTT Instruction

000 ROL

001 ROR

010 RCL

011 RCR

1 0 0 SHL/SAL

101 SHR

111 SAR

AND eAnd:

Reg/memory and register to either 001000dw modreg r/m 3/10 3/10*

Immediate to register/memory 1000000w mod100 r/m data data if we1 4/16 4/16*

Immediate to accumulator 0010010w data data if we1 3/4 3/4*8/16-bit

TESTeAnd function to flags, no result:

Immediate data and register/memory 1111011w mod000 r/m data data if we1 4/10 4/10*

Immediate data and accumulator 1010100w data data if we1 3/4 3/4 8/16-bit

OReOr:

Reg/memory and register to either 000010dw modreg r/m 3/10 3/10*

Immediate to register/memory 1000000w mod001 r/m data data if we1 4/16 4/16*

Immediate to accumulator 0000110w data data if we1 3/4 3/4*8/16-bit

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

Function Format

80C186EA 80C188EA

Comments

Clock Clock

Cycles Cycles

LOGIC (Continued)

XOR eExclusive or:

Reg/memory and register to either 001100dw modreg r/m 3/10 3/10*

Immediate to register/memory 1000000w mod110 r/m data data if we1 4/16 4/16*

Immediate to accumulator 0011010w data data if we1 3/4 3/4 8/16-bit

NOT eInvert register/memory 1111011w mod010 r/m 3/10 3/10*

STRING MANIPULATION

MOVS eMove byte/word 1010010w 14 14*

CMPS eCompare byte/word 1010011w 22 22*

SCAS eScan byte/word 1010111w 15 15*

LODS eLoad byte/wd to AL/AX 1010110w 12 12*

STOS eStore byte/wd from AL/AX 1010101w 10 10*

INS eInput byte/wd from DX port 0110110w 14 14

OUTS eOutput byte/wd to DX port 0110111w 14 14

Repeated by count in CX (REP/REPE/REPZ/REPNE/REPNZ)

MOVS eMove string 11110010 1010010w 8

8n 8a8n*

CMPS eCompare string 1111001z 1010011w 5

22n 5a22n

SCAS eScan string 1111001z 1010111w 5

15n 5a15n*

LODS eLoad string 11110010 1010110w 6

11n 6a11n*

STOS eStore string 11110010 1010101w 6

9n 6a9n*

INS eInput string 11110010 0110110w 8

8n 8a8n*

OUTS eOutput string 11110010 0110111w 8

8n 8a8n*

CONTROL TRANSFER

CALL eCall:

Direct within segment 11101000 disp-low disp-high 15 19

indirect within segment

Direct intersegment 10011010 segment offset 23 31

segment selector

Indirect intersegment 11111111 mod011 r/m (mod i11) 38 54

JMP eUnconditional jump:

Short/long 11101011 disp-low 14 14

Direct within segment 11101001 disp-low disp-high 14 14

indirect within segment

Direct intersegment 11101010 segment offset 14 14

segment selector

Indirect intersegment 11111111 mod101 r/m (mod i11) 26 34

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

Function Format

80C186EA 80C188EA

Comments

Clock Clock

Cycles Cycles

CONTROL TRANSFER (Continued)

RET eReturn from CALL:

Within segment 11000011 16 20

Within seg adding immed to SP 11000010 data-low data-high 18 22

Intersegment 11001011 22 30

Intersegment adding immediate to SP 11001010 data-low data-high 25 33

JE/JZ eJump on equal/zero 01110100 disp 4/13 4/13 JMP not

JL/JNGE eJump on less/not greater or equal 01111100 disp 4/13 4/13 taken/JMP

JLE/JNG eJump on less or equal/not greater 01111110 disp 4/13 4/13

taken

JB/JNAE eJump on below/not above or equal 01110010 disp 4/13 4/13

JBE/JNA eJump on below or equal/not above 01110110 disp 4/13 4/13

JP/JPE eJump on parity/parity even 01111010 disp 4/13 4/13

JO eJump on overflow 01110 000 disp 4/13 4/13

JS eJump on sign 01111000 disp 4/13 4/13

JNE/JNZ eJump on not equal/not zero 01110101 disp 4/13 4/13

JNL/JGE eJump on not less/greater or equal 01111101 disp 4/13 4/13

JNLE/JG eJump on not less or equal/greater 01111111 disp 4/13 4/13

JNB/JAE eJump on not below/above or equal 01110011 disp 4/13 4/13

JNBE/JA eJump on not below or equal/above 01110111 disp 4/13 4/13

JNP/JPO eJump on not par/par odd 01111011 disp 4/13 4/13

JNO eJump on not overflow 01110001 disp 4/13 4/13

JNS eJump on not sign 01111001 disp 4/13 4/13

JCXZ eJump on CX zero 11100011 disp 5/15 5/15

LOOP eLoop CX times 11100010 disp 6/16 6/16 LOOP not

LOOPZ/LOOPE eLoop while zero/equal 11100001 disp 6/16 6/16 taken/LOOP

LOOPNZ/LOOPNE eLoop while not zero/equal 11100000 disp 6/16 6/16

taken

ENTER eEnter Procedure 11001000 data-low data-high L

Le0 15 19

Le1 25 29

Ll1

16(n

1) 26

20(n

LEAVE eLeave Procedure 11001001 8 8

INT eInterrupt:

Type specified 11001101 type 47 47

Type 3 11001100 45 45 ifINT. taken/

INTO eInterrupt on overflow 11001110 48/4 48/4 if INT. not

taken

IRET eInterrupt return 11001111 28 28

BOUND eDetect value out of range 01100010 modreg r/m 33–35 33–35

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

Function Format

80C186EA 80C188EA

Comments

Clock Clock

Cycles Cycles

PROCESSOR CONTROL

CLC eClear carry 11111000 2 2

CMC eComplement carry 11110101 2 2

STC eSet carry 11111001 2 2

CLD eClear direction 11111100 2 2

STD eSet direction 11111101 2 2

CLI eClear interrupt 11111010 2 2

STI eSet interrupt 11111011 2 2

HLT eHalt 11110100 2 2

WAIT eWait 10011011 6 6 ifTEST e0

LOCK eBus lock prefix 11110000 2 2

NOP eNo Operation 10010000 3 3

(TTT LLL are opcode to processor extension)

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

The Effective Address (EA) of the memory operand

is computed according to the mod and r/m fields:

if mod e11 then r/m is treated as a REG field

if mod e00 then DISP e0*, disp-low and disp-

high are absent

if mod e01 then DISP edisp-low sign-ex-

tended to 16-bits, disp-high is absent

if mod e10 then DISP edisp-high: disp-low

if r/m e000 then EA e(BX) a(SI) aDISP

if r/m e001 then EA e(BX) a(DI) aDISP

if r/m e010 then EA e(BP) a(SI) aDISP

if r/m e011 then EA e(BP) a(DI) aDISP

if r/m e100 then EA e(SI) aDISP

if r/m e101 then EA e(DI) aDISP

if r/m e110 then EA e(BP) aDISP*

if r/m e111 then EA e(BX) aDISP

DISP follows 2nd byte of instruction (before data if

required)

*except if mod e00 and r/m e110 then EA e

disp-high: disp-low.

EA calculation time is 4 clock cycles for all modes,

and is included in the execution times given whenev-

er appropriate.

Segment Override Prefix

0 0 1 reg 1 1 0

reg is assigned according to the following:

Segment

reg Register

00 ES

01 CS

10 SS

11 DS

REG is assigned according to the following table:

16-Bit (w e1) 8-Bit (w e0)

000 AX 000 AL

001 CX 001 CL

010 DX 010 DL

011 BX 011 BL

100 SP 100 AH

101 BP 101 CH

110 SI 110 DH

111 DI 111 BH

The physical addresses of all operands addressed

by the BP register are computed using the SS seg-

ment register. The physical addresses of the desti-

nation operands of the string primitive operations

(those addressed by the DI register) are computed

using the ES segment, which may not be overridden.

80C186EA/80C188EA, 80L186EA/80L188EA

REVISION HISTORY

Intel 80C186EA/80L186EA devices are marked with

a 9-character alphanumeric Intel FPO number un-

derneath the product number. This data sheet up-

date is valid for devices with an ‘‘A’’, ‘‘B’’, ‘‘C’’, ‘‘D’’,

or ‘‘E’’ as the ninth character in the FPO number, as

illustrated in Figure 5 for the 68-lead PLCC package,

Figure 6 for the 84-lead QFP (EIAJ) package, and

Figure 7 for the 80-lead SQFP device. Such devices

may also be identified by reading a value of 01H,

02H, 03H from the STEPID register.

This data sheet replaces the following data sheets:

272019-002Ð80C186EA

272020-002Ð80C188EA

272021-002Ð80L186EA

272022-002Ð80L188EA

272307-001ÐSB80C186EA/SB80L186EA

272308-001ÐSB80C188EA/SB80L188EA

ERRATA

An 80C186EA/80L186EA with a STEPID value of

01H or 02H has the following known errata. A device

with a STEPID of 01H or 02H can be visually identi-

fied by noting the presence of an ‘‘A’’, ‘‘B’’, or ‘‘C’’

alpha character, next to the FPO number. The FPO

number location is shown in Figures 5, 6, and 7.

1. An internal condition with the interrupt controller

can cause no acknowledge cycle on the INTA1

line in response to INT1. This errata only occurs

when Interrupt 1 is configured in cascade mode

and a higher priority interrupt exists. This errata

will not occur consistantly, it is dependent on in-

terrupt timing.

An 80C186EA/80L186EA with a STEPID value of

03H has no known errata. A device with a STEPID of

03H can be visually identified by noting the presence

of a ‘‘D’’ or ‘‘E’’ alpha character next to the FPO

number. The FPO number location is shown in Fig-

ures 5, 6, and 7.