MTC-20278/9 150200 [1]
MTC-20278/9 ILT
Key Features
Quad ISDN LT ‘U’ interface
functions in a single monolithic
integrated circuit
Pin compatible 2B1Q and 4B3T
line code versions
* MTC-20278 ILTQ for 2B1Q
* MTC-20279 ILTT for 4B3T
Full compliance with the
applicable ETSI, FTZ and ITU
requirements
DECT Synchronization Support
(2BTQ)
Digital interface bus using
industry-standard GCI
Minimal external components
3.3V operating voltage
80 pin Plastic Quad Flat Pack
package
Key Applications
ISDN Exchange Line Cards
Remote Access Multiplex
Systems
FTTx Systems
General Description
The MTC-20278/9 chip contains all
the functions necessary to make 4 ‘U’
interfaces in an ISDN Line Termination
card. It comprises 4, fully integrated
echo-canceling ‘U’ interfaces, plus the
necessary support and test functions.
The general block diagram is shown
in Figure 1. By integrating 4 complete
U Interfaces in a single high density
package, the MTC-20278/9 makes it
possible to integrate more lines on one
card, this reducing the cost per line.
Two versions of the device are available
- the MTC-20278 offering the 2B1Q line
code, and the MTC-20279 which has
4B3T line coding. Both devices are pin
compatible, and are fully compliant with
the relevant parts of ETSI, FTZ and ITU
requirements for ISDN connection.
The MTC-20278/9 device offers a user
transport rate of 144kbit/s full duplex
(2B + D) per channel, as well as fully
automatic control of activate/deactivate
protocols, and full support of the main-
tenance channel. Digital I/O for Power-
feed Control, and DECT Synchronization
(MTC-20278 only) are provided for 4
identical channels.
Quad ISDN U-Interface
ISDN Standard Products
Data Sheet
Rev. 2.0 - February 2000
TSP NRESET
Channel Support
Channel ‘U’
Interface
Power
Feed Control
JTAG
Test Interface
TRST
TCK
TMS
TDI
TDO
GCI Port
DOUT
DIN
DCLK
DFR
POS
AVDD
AVSS
AREF
LOUT2
LOUT1
LIN2
LIN1
RD2
RD1
FD2
FD1
RD3
4 Identical
Channels
VDD
VSS
Fig.1: General Block Diagram
Ordering Information
Part number Package Temp.
MTC-20278PQ-I 80PQFP -40 to + 85°C
MTC-20278PQ-C 80PQFP 0 to + 70°C
MTC-20279PQ-I 80PQFP -40 to + 85°C
MTC-20279PQ-C 80PQFP 0 to + 70°C
The digital interface on the ‘exchange’
side uses the industry-standard GCI
interface in 2 Mbit burst mode. This
mode allows for 8 channels to be multi-
plexed onto the same interface. The
MTC-20278/9 can be set to respond to
either the first 4 or the last 4 timeslots in
the GCI frame. This allows two devices,
totalling 8 ISDN lines, to be multiplexed
onto the same GCI interface.
The MTC-20278/9 takes all timing
information from the GCI clocks, and
so does not require a separate clock
oscillator.
MTC-20278/9 150200 [2]
2
MTC-20278/9 ILTQ/ILTT
12
12
1:2
LOUT2
LOUT1
ILTQ 135 VI
Fig.2: Test Circuit for Single Pulse VI
Relevant Standards
- ETSI TS 102 080, 1998
- ETS 300 012
- ETS 300 297
- CCITT / ITU Recommendation
G.961
- ANSI T1.601, BA ISDN
specifications 1992
Functional Characteristics
The U-Interface
NOTE: Some of the specifications in
this section refer to the U0 Inter-
face and not to the line ports
(LOUT1, LOUT2, LIN1, LIN2).
The characteristics at the line
port are affected by the design
of the transformer and the other
external components.
MTC-20278
Physical Characteristics
The quaternary symbol stream on the
U-interface complies to the following
physical characteristics:
1) Symbol Rate
The symbol rate is 80 kbaud ±
1 ppm and applies to synchronous
symbol transmission. The symbol
rate is controlled by the external
clock.
2) Input Jitter
The ILTQ tolerates a sinusoidal input
jitter of the quaternary symbols as
shown in Figure 5.
3) Output Jitter
The peak-to–peak jitter produced
by the ILTQ doesn’t exceed 0.02 UI
when measured via a high pass filter
with a cut-off frequency of 30Hz.
Without this filter, the same measure-
ment doesn’t read more than 0.1 UI.
To obtain this performance, the jitter
on the GCI input clock should not
exceed 15ns peak-to-peak
4) Transmit Signal Amplitude
The absolute peak value VImax of
a single pulse VI at U0 interface
terminated with a 135resistance
is 2.5V ± 5%. See Figure 2 and 8.
5) Stability
The transmit signal amplitude mea-
sured over a periode of one minute
doesn’t vary by more than 1%
beginning 5ms after the ILTQ is
switched into power-up state.
6) Transmit Spectrum
The spectrum of the quaternary
transmit signal at U0 interface
doesn’t exceed the limits given
in Figure 7.
7) Pulse Shape
A single pulse measured across a
135resistance at U0 interface
complies to the spectral require-
ments presented in Figure 7 and
the pulse mask requirements given
in Figure 8.
8) Maximum Voltage
The maximum peak-to-peak value
VUmax of the voltage VU as shown
in Figure 3 with full receive signal
(short line) is 2.5V. Due to the ana-
log echo subtraction the maximum
peak-to-peak value Vinmax of the
voltage Vin between LIN1 and LIN2
is 1.7V.
9) Input/Output Impedance
The line terminating impedance is
135in power-up and in power-
down state. The return loss at U0
measured against 135(real)
exceeds; 20 dB between 10kHz
and 25kHz.
- slope below 10kHz: 20 dB /
decade
- slope above 25kHz: -20 dB /
decade
10) Load
The load is given by the line trans-
former and the subscriber line.
The loops are standardized by
the ANSI and ETSI documents.
Turns ratio of line transformer 1:2
Transformer coil inductance (from
line side): 15 mH ± 10%
3
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [3]
VU
Analog Echo Subtraction
12
12
1:2
LIN1
LIN2
LOUT2
LOUT1
ILT
U0, short line
Fig.3: Test Circuit for Voltages VU and Vin at UO Interface
MTC-20278/9 150200 [4]
4
MTC-20278/9 ILTQ/ILTT
MTC-20279
Requirements for the
U- Line Ports
NOTE: Some of the specifications in
this section refer to the UK0
Interface and not to the line
ports (LOUT1, LOUT2, LIN1,
LIN2). The characteristics at the
line port are affected by the
design of the transformer and
the other external components.
Physical Characteristics
The ternary symbol stream on the U-
interface must comply to the following
physical characteristics:
1) Symbol Rate
The symbol rate is 120 kbaud ±
1 ppm and applies to synchronous
symbol transmission. The symbol
rate is controlled by an external
clock.
2) Input Jitter
The ILTT tolerates a sinusoidal input
jitter of the ternary symbols as indi-
cated in Figure 4.
3) Output Jitter
The peak-to-peak jitter produced by
the ILTT doesn’t exceed 0.02 UI
(166ns), when measured via a high
pass filter with a cut-off frequency of
30Hz. Without this filter the same
measurement doesn’t read more
than 0.1 UI. This performance is
only guaranteed when the input jitter
at the GCI clock is less than 15ns
peak-to-peak.
4) Transmit Signal Amplitude
The absolute peak value VImax of
a single pulse VI at UK0 interface
terminated with a 150resistance
is 2V ± 0.2V. See the following
Figure. The absolute peak value of
the coded ternary signal measured
at UK0 interface terminated with
150doesn’t exceed 4V.
See Figure 4.
Jitter Amplitude
(peak-to-peak)
Jitter Amplitude
(peak-to-peak)
UI = Unit
Interval
UI = Unit
Interval
0,25 UIpp
0,025 UIpp
20 db/Decade
3 Hz 30 Hz 10 KHz
Jitter Frequency
Fig.4: Range of Admissable Sinusoidal Input Jitter, MTC-20278 and MTC-20279
MTC-20278/9 150200 [5]
5
MTC-20278/9 ILTQ/ILTT
5) Stability
The transmit signal amplitude mea-
sured over a period of one minute
doesn’t vary by more than 1%
beginning 5ms after the ILTT is
switched into power-up state.
6) Transmit Spectrum
The spectrum of the ternary transmit
signal at UK0 interface doesn’t
exceed the limits given in Figure 6.
7) Pulse Shape
A single pulse measured across a
150resistance at the UK0 interface
comply to the spectral requirements
presented in Figure 7 and the pulse
mask requirements given in Figure 8.
8) Maximum Voltage
The maximum peak-to-peak value
VUmax of the voltage VU as shown
in Figure 5 with full receive signal
(short line), that must be accepted,
is 4V. Due to the analog echo sub-
traction the maximum peak-to-peak
value Vinmax of the voltage Vin
between LIN1 and LIN2 is 2.7V.
For ILTT, the value of n must be 1.6.
VU
Analog Echo Subtraction
25
25
1:1.6
LIN1
LIN2
LOUT2
LOUT1
ILTT
UK0, short line
Fig.5: Test Circuit for Voltages VU and Vin at UK0 Interface
MTC-20278/9 150200 [6]
6
MTC-20278/9 ILTQ/ILTT
9) Input/Output Impedance
The line terminating impedance must
be 150in power-up and in power-
down state. The return loss at UK0
measured against 150real must
exceed 16 dB between 12kHz and
50kHz.
- slope below 12kHz: 20 dB/decade
- slope above 50kHz: -10 dB/decade
10) Load
The load is given by the line trans-
former and the subscriber line.
Turns ratio of line transformer: 1.6
Transformer coil inductance (from line
side): 6.8mH ± 10%.
Measurement bandwith = 1 Khz
500 kHz
50 kHz
-90 dB
-30 dB
-80 dB
-20 dB
-70 dB
-60 dB
-50 dB
-40 dB
Frequency
Fig.6: Spectrum of Signal at UK0 Interface, MTC-20278
0.1 0.15 0.5 1 10 30 MHz
Frequency
5 dB/Decode
Band Width above 150 KHz = 9 KHz
1 V
100 mV
10 mV-40
-32
-26
-20
-23.4
0 dB
Fig.7: Single Pulse Mask
MTC-20278/9 150200 [7]
7
MTC-20278/9 ILTQ/ILTT
-U
+U
-T 0
2.625 V
2.5 V
2.375 V
T= = 12.5 µs
1
80 KHz
25 mV
-25 mV T 14T2T
Time t
0.075 V
-0.125 V
0.4T-0.4T
SS
SS SSSS
SSSS
SSSS
SS
Fig.8: Single Pulse Mask, MTC-20278
MTC-20278/9 150200 [8]
8
MTC-20278/9 ILTQ/ILTT
SSSS
+U
2.2 V
2 V
1.8 V
T = 1
120 KHz = 8.33 µs
10 mV
-10 mV 0 T 2T 8T 30T
-U
12
8
9
8
5
8
3
8
T
T
T
T
-T
-0.2 V
0.2 V
Time t
Fig.9: Single Pulse Mask, MTC-20279
MTC-20278/9 150200 [9]
9
MTC-20278/9 ILTQ/ILTT
LOUT11
AVDD1
AVSS1
RD11
TRST
TCK
TMS
VDD
TDO
VSS
TDI
AREF2
LIN21
LIN22
RD23
NRESET
TSP
DOUT
VDD
DCLK
VSS
RD21
RD22
FD21
FD22
VSS
VDD
RD13
FD12
FD11
RD12
LIN12
RD31
RD32
RD33
FD31
VDD
FD42
FD41
RD42
AVSS4
MTC-20278 PQ-I
MTC-20279 PQ-I
ILTQ/ILTT
(80PQFP)
11
12
13
14
34
35
36
32
28
29
30
31
33
60
53
52
51
54
58
57
56
55
2
1
67
7
6
5
3
9
27
50
37
59
8
10
4
LIN11
AREF1
LOUT12
DIN
DFR
POS
AVSS3
AVDD3
RD43
RD41
LIN42
LINE41
AREF4
15
17
18
19
20
16
21
22
23
24
25
26
64
63
62
61
65
66
47
46
45
48
49
44
40
41
42
38
39
43
AVDD4
LOUT41
LOUT42
VSS
FD32
LOUT22
LOUT21
AVDD2
AVSS2
LOUT32
LIN32
LIN31
AREF3
71
70
69
73
77
76
75
74
72
78
68
80
79
LOUT31
Fig.10: ILT Pinout - 80 PQFP
MTC-20278/9 150200 [10]
10
MTC-20278/9 ILTQ/ILTT
Pin Description
Nr. Function Name Dir. Description
80 LOUT11 O U-Interface analog outputs. The pins LOUT11 and LOUT12
connect the U-driver outputs via termination resistors and the line
coupling transformer to the U0 reference point.
4 LOUT12 O
6 LIN11 I U-Interface analog inputs from the analog hybrid
7 LIN12 I
5 U1 AREF1 O Analog ground. Used as reference voltage for A/D and D/A.
79 Interface AVDD1 P +3.3V power supply for analog U-Interface functions
78 AVSS1 P 0V ground for analog U-Interface functions
77 RD11 / SPICS O Relay drivers 1
8 RD12 / SPICK O
11 RD13 IO Bidirectional I/O. Put in Input mode after HW reset, not affected by
SW reset
9 FD11 / SPIDI I Power feed status and control 1
10 FD12 / SPIDO O
20 LOUT21 O U-Interface analog outputs. The pins LOUT21 and LOUT22
connect the U-driver outputs via termination resistors and the line
coupling transformer to the U0 reference point.
24 LOUT22 O
26 LIN21 I U-Interface analog inputs from the analog hybrid
27 LIN22 I
25 U2 AREF2 O Analog ground. Used as reference voltage for A/D and D/A
19 Interface AVDD2 P +3.3V power supply for analog U-Interface functions
18 AVSS2 P 0V ground for analog U-Interface functions
17 RD21 O Relay drivers 2
16 RD22 O
28 RD23 IO Bidirectional I/O. Put in Input mode after HW reset, not affected by
SWreset
15 FD21 / SEL0 I Power feed status and control 2
14 FD22 O
40 LOUT31 O U-Interface analog outputs. The pins LOUT31 and LOUT32
connect the U-driver outputs via termination resistors and the line
coupling transformer to the U0 reference point.
44 LOUT32 O
46 LIN31 I U-Interface analog inputs from the analog hybrid
47 LIN32 I
45 AREF3 O Analog ground. Used as reference voltage for A/D and D/A.
39 U3 AVDD3 P +3.3V power supply for analog U-Interface functions
38 Interface AVSS3 P 0V ground for analog U-Interface functions
48 RD31 O Relay drivers 3
49 RD32 O
50 RD33 IO Bidirectional I/O. Put in Input mode after HW reset, not affected by
SW reset
51 FD31 / SEL1 I Power feed status and control 3
52 FD32 O
MTC-20278/9 150200 [11]
11
MTC-20278/9 ILTQ/ILTT
60 LOUT41 O U-Interface analog outputs. The pins LOUT41 and LOUT42
connect the U-driver outputs via termination resistors and the line
coupling transformers to the U0 reference point.
64 LOUT42 O
66 LIN41 I U-Interface analog inputs from the analog hybrid
67 U4 LIN42 I
65 Interface AREF4 O Analog ground. Used as reference voltage for A/D and D/A.
59 AVDD4 P +3.3V power supply for analog U-Interface functions
58 AVSS4 P 0V ground for analog U-Interface functions
68 RD41 O Relay drivers 4
57 RD42 O
69 RD43 IO Bidirectional I/O. Put in Input mode after HW reset, not affected by
SW reset
56 FD41 I Power feed status and control 4
55 FD42 O
31 DOUT O GCI data output at 2048 Kbits/s. Open drain output.
35 GCI DIN I GCI data input at 2048 Kbit/s
33 Interface DCLK I 4096kHz GCI clock
36 DFR I 8kHz GCI frame clock which identifies the beginning of the frame of
DIN and DOUT Normal use
76 TRST I TAP controller reset, active low 0
75 JTAG TCK I TAP controller clock, maximum 10MHz 0
74 Test TMS I TAP controller mode selection 0
70 Interface TDI I TAP controller input 0
72 TDO O TAP controller output open
29 NRESET I Hardware reset, active low. Schmit trigger input with treshold at 1.65V
(CMOS level).
30 TSP/DECT I 1. Transmit Single Pulses. ILT transmits single pulses of alternating
General maximum positive and negative polarity. Pulse repetition rate is 666Hz.
Applications: test purposes and search tone on the line.
2. DECT synchronization of the U-superframes (2B1Q only)
The distinction between the 2 modes is made based on the duty cycle of
the applied input signal: if logic ’1’ is present for more then 200ms,
TSP is assumed ; otherwise, a DECT sync is executed.
37 POS I ILT works in burst mode and consists of 4 line drivers, 1 line per burst.
POS = ’0’ means the 4 fisrt GCI bursts are taken
POS = ’1’ means the 4 last GCI bursts are taken
12 VDD P +3.3V power supply for digital functions
32 VDD P
54 Power VDD P
73 VDD P
13 VSS P 0V Ground for digital functions
34 VSS P
53 VSS P
71 VSS P
MTC-20278/9 150200 [12]
12
MTC-20278/9 ILTQ/ILTT
1:2
15 mH
(2B1Q)
VDD
VSS
LOUTn1
LOUTn2
LINn2
LINn1
AVDDn
AVSSn
AREFn
C4
C3
RDn1
FDn1
FDn2
RDn2
LINE
TEST RELAY
Test Bus
C1
VDD
100 k
NRESET
100 nF C1
VDD
VSS
VDD
VSS
TSP (0 for normal operation)
POS VDD
(strap to 0 or 1)
One of 4 indentical channels
Common for all channels
GCI bus
Passive Hybrid
R ,C
H H
1:1.3
6 mH
(4B3T)
RDn3
Line Feed
Power Supply
Z
CL
R1
Fig.11: MTC-20278/9 ILT - Typical Component Configuration
MTC-20278/9 150200 [13]
13
MTC-20278/9 ILTQ/ILTT
Line 0
GCI bus 2k22k2
DIN
DOUT
DLCK
DFR
DIN
DOUT
DLCK
DFR
POS
DIN
DOUT
DLCK
DFR
POS
VDD
VDD
VSS
Line 1
Line 2
Line 3
Line 4
Line 5
Line 6
Line 7
2x
MTC-20278/9
Fig.12: Connection of two, MTC-20278/9 for an 8-line access on one GCI bus
MTC-20278/9 150200 [14]
14
MTC-20278/9 ILTQ/ILTT
Component Function Value Comment
Rh U feed bridge and hybrid ±1%
resistors see Fig. 13/14
R1 reset delay 100k±5%
C1 reset delay 100 nF ±5%
C2 Digital supply decoupling 100 nF
C3 Analog reference decoupling 100 nF
C4 Analog supply decoupling 100 nF
CL Line-feed coupling 2.2 µF 250V
Ch Hybrid capacitance see Fig. 13/14 2%
Z overvoltage protection
Recommended Component Values
Table 2
Min/Typ Max Min/Typ Max
Turns Ratio 2:1 1.6:1
Prelimary Inductance (mH) 14.25 15.75 5.25 6.75
Leakage Inducatance (uH) 60 60
Interwinding Capacitance (pF max.) 90 90
PRI DCR (Ohms) 6 7 6 7
SEC DCR (Ohms) 2.8 3.3 3.5 4.2
(Alcatel Part Code TMP 00087 0003) (Alcatel Part Code TMP 00087 0002)
Transformer-Recommended Specifications
Table 1a (MTC-20278) Table 1b (MTC-20279)
MTC-20278/9 150200 [15]
15
MTC-20278/9 ILTQ/ILTT
Common Hybrid Shematics for 4B3T (MTC-20279) and 2B1Q (MTC-20278)
12,3
12,3
T1
4n7
4n7
4k32
4k32
6k81
6k81
1k
1k
470p
39n
39n
100
100
2n7
576
LIN 2
LOUT 2
LOUT 1
LIN 1
Fig.13: MTC-20278 - Recommended Hybrid component Configuration
Fig.14: MTC-20279 - Recommended Hybrid component Configuration
25
25
T1
++
++
3k3
3k3
7k *
7k *
470p
LIN 2
LOUT 2
LOUT 1
LIN 1
+
++
++
++
+
+
+ short
++ open
* for FTZ loops, 470p -> 680p and 7 k -> 6k8
*
+
MTC-20278
Logical Characteristics
of the U Interface
The quaternary symbol stream crossing
the U-interface complies with the follow-
ing logical characteristics:
Frame Structure
The information flow across the sub-
scriber line uses frames as shown in
Figure 15. The length of such a frame
corresponds to 120 quaternary symbols
being transmitted within 1.5ms. The
frame structure is detailed as follows.
B+B+D - Data
108 quaternary symbols represent 216
bits of scrambled and encoded B+B+D
data. The 108 quaternary symbols are
transmitted in succession. These blocks
are assembled as follows:
Synchronizing Word
9 quaternary symbols in each direction
represent a non-scrambled synchroniz-
ing word. They are used to generate
frame clocks. If they are out of position
for 60 . . . 200 consecutive frames,
the line resynchronization procedure
is started. The quaternary values and
the frame positions are as follows:
From LT to NT or analog loop in LT
(loop 1) and from NT to LT.
16
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [16]
Quad
Position
Bit
Position
1-9
1-18
10-117
19-234
118-120
235-240
Frame 1 ISW 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
Frame 2 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
Frame 3 SW 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
Frame 4 SW 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
Frame 5 SW 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
Frame 6 SW 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
Frame 7 SW 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
Frame 8 SW 2B+D 2B+D ... 2B+D 2B+D M1 ... M6
SW
Fig.15: Frame and Superframe Structure
Data of: B1 + B2 + D + B1 + B2 + D
Number of bits: 8 8 2 8 8 2
SW Polarity: +3 +3 -3 -3 -3 +3 -3 +3 +3
ISW Polarity: -3 -3 +3 +3 +3 -3 +3 -3 -3
Maintenance and Service Channel
3 quaternary symbols per frame are
transmitted to convey maintenance and
embedded operations channel info-
rmation. This information is contained
in a superframe consisting of 8 frames
(duration: 12ms). The start of a super-
frame in the up and downstream direc-
tions is marked by a single inversion of
the synchronisation word. The quater-
nary symbol sequences represent data
that can be transmitted at a rate of 4
kbit/s. They are transmitted immediately
before the sync word.
The M symbol is used for various
purposes:
1) Maintenance Channel (control test
loops and report frame errors)
2) Service Channel (carry transparent
user data in both directions)
In detail the following convention
applies (LT to NT):
17
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [17]
M1 M2 M3 M4 M5 M6
Frame 1 EOC a1 EOC a2 EOC a3 ACT 1 1
Frame 2 EOC dm EOC i1 EOC i2 DEA 1 FEBE
Frame 3 EOC i3 EOC i4 EOC i5 1 CRC 1 CRC 2
Frame 4 EOC i6 EOC i7 EOC i8 1 CRC 3 CRC 4
Frame 5 EOC a1 EOC a2 EOC a3 1 CRC 5 CRC 6
Frame 6 EOC dm EOC i1 EOC i2 1 CRC 7 CRC 8
Frame 7 EOC i3 EOC i4 EOC i5 UOA CRC 9 CRC 10
Frame 8 EOC i6 EOC i7 EOC i8 AIB CRC 11 CRC 12
ACT: Activation bit (set to ONE during activation)
AIB: Alarm indication bit (set = 0 to indicate interruption)
CRC: Cyclic Redundancy Check: covers 2B+D & M4:
1 = most significant bit;
2 = next most significant bit, etc.
DEA: turn-off bit (set = 0 to announce turn-off)
EOC: Embedded operations channel:
a = address bit;
dm = data/message indicator;
i = information (data/message).
FEBE: Far end block error bit (ZERO for errored multiframes)
UOA: U-only-activation bit
Encoding
The encoding of a binary bit stream is
made such that 2 binary bits correspond
to 1quaternary symbol. The first symbol
of a frame will always contain the
information of the first 2 bits of a B1
channel (although these bits are of
course scrambled.
In the receive direction, the first symbol
of the quaternary frame is always
converted (after descrambling) into
the first two bits of a B1 channel.
The exact convertion is done according
to the following rules (ANSI specifica-
tion):
Quaternary Symbol First bit (sign) Second bit (Magnitude)
+3 1 0
+1 1 1
-1 0 1
-3 0 0
Ds
Do
-1
X -1
X
-1
X
-1
X
-1
X
-p
Ds.X -23
Ds.X
: XOR function
Do = Di Ds.X Ds.X
-p -23
Scrambling
The received binary data stream is
divided by generating polynomials.
The scrambler contains supervision cir-
cuitry which flags if a continuous series
of ones or zeros have been detected at
the output for a complete 1ms frame.
18
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [18]
-1
X -1
X
-1
X
-1
X
-1
X
Ds
Di
-5
Ds.X -23
Ds.X
: XOR function
Fig.16: LT Transmit Scrambler
Fig.17: LT Receive Descrambler
Descrambling
The quaternary signals received on each
side of the subscriber line are converted
back into a binary bit stream and multi-
plied by the generating polynomials in
order to recover the original data.
19
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [19]
Activation and Deactivation
In order to reduce the power con-
sumption of circuits connected to the
subscriber line, ILTQ can be switched
to stand-by or powered down during
the idle period. The components are
powered up again during the line
activation procedure. Two states are
defined:
- Power-down state
Power consumption of the majority of
the functions is reduced by stopping
the clocks; maximum power
reduction;
- Power-up state
All functions powered up; GCI inter-
face is activated; exchange of C/I
messages possible.
The activation procedure consists of
three phases: awake (see the following
sections), synchronize, and connect
through.
The phases of activation are shown in
the following table.
Conditions for ACT and CT (see table 3
on page 22).
Maximum activation time (from com-
mand ACT to indication CT) without
repeater for LT +NT:
- < 300ms under normal conditions
(starting with stored coefficients:
See note on DECT synchronisation).
- 15s after reset of the coefficients
With repeater, the activation may take
twice as long.
Maximum activation time (from com-
mand ACT to indication CT) without
repeater for LT:
- < 150ms under normal conditions
(starting with stored coefficients)
- 10s after reset of the coefficients
The deactivation procedure consists
of two phases: line deactivation and
power-down (see table 3).
The deactivation can be initiated only
by the command DEAC in the LT. The
deactivation of the LT can be initiated
only by INFO U0. The phases of deacti-
vation are indicated in the following
table.
Conditions for DC and DEAC (see table 3
on page 22).
Deactivation time (from Command
DEAC to Indication DC) is of the order
of 4ms.
With repeater the deactivation may take
twice as long.
Reset
The ILTQ can be reset via an external
pin (NRESET = LOW) or via the com-
mand RES in the C/I channel. Normally
the ILTQ is reset via the pin NRESET
(hardware reset).
The ILTQ is initialized such that a ”cold
start” (resetting of the coefficients) is
performed.
Resetting the component affects the
status of the driver pins; after HW reset
the drivers are switched off (low output
level) but not changed after SW reset.
(See also the Monitor channel).
Loops
For maintenance purposes a loop
can be closed by applying the correct
command via the M channel or the
GCI C/I channel.
Phase Indication
LT
power-down DC
awake ACT
synchronize
connect through CT
Phase Indication
LT
power-up CT
(connected through)
Line deactivation DEAC
power-down DC
20
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [20]
XXX
TSP/Dect
U line frame0 frame1
Fig.18b: Dect Synchronisation
DECT Synchronisation
The 4 U frames and superframes are
aligned with the DECT synchronisation
signal with a precision of 1 symbol, in
the activation procedure.
At the rising edge of the DECT signal,
bit and frame counters are set to zero.
DECT synchronisation needs soft or
hard reset, precludes total power-down
(that is replaced by partial power-
down), and warm-start may require 2.4
additional seconds. The DECT signal
has a periodicity of 2.4 seconds and
the width of the pulse can be between
13 and 375 microseconds.
Activation signals
Table 3: LT Activation Signals
Information
Station Description
TL A 10 kHz tone consisting of alternating four + 3 quats followed by four - 3 quats for a time period of two
frames.
SL0 No signal transmitted.
SL1 Synchronization word present, no superframe synchronization word (ISW), and 2B+D+M = 1.
SL2 Synchronization word present, superframe synchronization word (ISW) present, 2B+D = 0, and M =
Normal.
SL3 Synchronization word present, superframe synchronization word (ISW) present. M channel bits active.
Transmitted 2B+D data operational when M4 act bit = 1. When M4 act = 0, transmitted 2B+D data = 0.
The MTC-20278 can transmit any of the
signals shown in Table 3.
SL1 (optional)
SN2 SN3
2 frames SL2
TL SL3
T0 T1 T5T0 T0 T0 T0
T0
T2 T4 T6 T7
T3
6 frames
(optional)
6 frames
(optional)
6 frames
(optional)
A + C 5s for cold start
A + C 150ms for warm start
B + D 10s for cold start
B + D 150ms for warm start
AB C D
4 ms 480 ms
NT1 --> Network
Network --> NT1
Time: Description of event or state:
T0 RESET state.
T1 Network and NT1 are awake.
T2 NT1 discontinues transmission, indicating that the NT1 is ready to receive signal.
T3 Network responds to termination of signal and begins transmitting signal towards to NT1.
T4 Network begins transmitting SL2 towards the network, indicating that the network is ready to receive SN2.
T5 NT1 begins transmitting SN2 towards the network, indicating that NT1 has acquired FW frame and detected SL2.
T6 NT1 has acquired multiframe marker and is fully operational.
T7 Network has acquired multiframe marker and is fully operational.
NOTE 1: If the TL is repeated due to the persistence of FE 1, the repetition interval shall be > 25ms. At a repetition
interval larger than 480ms, the state machine will cause a TL tone if FE 1 remains.
NOTE 2: The maximum time between TL tone is defined to be 4ms. This requirement is unnecessarily strict.
To allow transceivers which cannot meet this the LT should wait for, and accept the TN tone, for a
period of 10ms from the beginning of issuing the TL tone.
Fig.18a: State sequence for transceiver start-up
MTC-20278/9 150200 [21]
21
MTC-20278/9 ILTQ/ILTT
Logical Characteristics
of the GCI Interface
MTC-20279
The ternary symbol stream crossing the
U-interface comply with the following
logical characteristics:
Frame Structure
The information flow across the sub-
scriber line utilizes frames as shown in
Figure 9. The length of such a frame
corresponds to 120 ternary symbols
being transmitted within 1ms. The
frame structure is detailed as follows.
B+B+D - Data
108 ternary symbols (T1 . . . T8) re-
present 144 bits of scrambled and
encoded B+B+D data. The 108 ternary
symbols are divided into four equally
structured groups in which each group
of 27 ternary symbols corresponds to
a block of 36 binary bits (consult also
Figure 9 and Figure 10). These blocks
are assembled as follows:
Data of: B1 + B2 + D + B1 + B2 + D
Number of bits: 8 8 2 8 8 2
Synchronizing Word
11 ternary symbols in each direction
(SW1, SW2) represent a non-scram-
bled synchronizing word. They are
used to generate frame clocks. If they
are out of position for 60 . . . 200
consecutive frames, the line resyn-
chronization procedure is started.
The ternary values and the frame
positions are as follows:
From LT to NT or analog loop in LT (loop 1) (LT Transmit):
Frame position: 110 111 112 113 114 115 116 117 118 119 120
SW1 Polarity: + + + - - - + - - + -
From NT to LT (LT Receive):
Frame position: 50 51 52 53 54 55 56 57 58 59 60
SW1 Polarity: - + - - + - - - + + +
MTC-20278/9 150200 [22]
22
MTC-20278/9 ILTQ/ILTT
Table 4: Ternary Frame Structure
T1 T1 T1 T1 T1 T1 T1 T1 T1 T1 T1 T1
T1 T1 T1 T1 T1 T1 T1 T1 T1 T1 T1 T1
T1 T1 T1 T2 T2 T2 T2 T2 T2 T2 T2 T2
T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2 T2
T2 T2 T2 T2 T2 T2 T3 T3 T3 T3 T3 T3
T3 T3 T3 T3 T3 T3 T3 T3 T3 T3 T3 T3
T3 T3 T3 T3 T3 T3 T3 T3 T3 T4 T4 T4
M1 T4 T4 T4 T4 T4 T4 T4 T4 T4 T4 T4
T4 T4 T4 T4 T4 T4 T4 T4 T4 T4 T4 T4
T4
LT -› NT or analog loop in LT (loop 1)
123456789101112
12
24
36
48
60
72
84
96
108
120
123456789101112
T5 T5 T5 T5 T5 T5 T5 T5 T5 T5 T5 T5
T5 T5 T5 T5 T5 T5 T5 T5 T5 T5 T5 T5
M2 T5 T5 T5 T6 T6 T6 T6 T6 T6 T6 T6
T6 T6 T6 T6 T6 T6 T6 T6 T6 T6 T6 T6
T6
T6 T6 T6 T6 T6 T6 T7 T7 T7 T7 T7 T7
T7 T7 T7 T7 T7 T7 T7 T7 T7 T7 T7 T7
T7 T7 T7 T7 T7 T7 T7 T7 T7 T8 T8 T8
T8 T8 T8 T8 T8 T8 T8 T8 T8 T8 T8 T8
T8 T8 T8 T8 T8 T8 T8 T8 T8 T8 T8 T8
12
24
36
48
60
72
84
96
108
120
NT -› LT
Legend:
T1 . . . T8: B + B + D - Data (ternary)
M1, M2: Maintenance and Service
Data (ternary)
SW1, SW2: Synchronizing Word
MTC-20278/9 150200 [23]
Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti Ti
B1 B1 B2 B2 B1 B1 B1 B2 B2 DDDD
1 3 6 9 12 15 18 25 27
. . .
14 8 1216182024 323436
. . .
i = 1 . . . 8
23
MTC-20278/9 ILTQ/ILTT
Fig.19: Binary to Ternary Unit Correspondence of B + B + D - Data
Maintenance and Service
Channel
The ternary symbols (M1, M2) re-
present non-scrambled data that can
be transmitted at a rate of 1 kBaud.
The frame position for M1 is 85 and
for M2 it is 25 (see Figure 9).
The M symbol is used for various
purposes:
1) Maintenance Channel (control test
loops and report frame errors)
2) Service Channel (carry transparent
user data in both directions); this is not
supported by the MTC-20279.
In detail the following convention
applies:
Meaning Encoding Direction
Idle 0 Both
Maintenance
Channel Loop 2 in NT (1) ++++........ from LT to NT
(M + Channel) Loop 4 in RPTR +0+0+...... from LT to RPTR
Frame Error (2) + (single symbol) from NT to LT
Table 5: Service and Maintenance Data Convention
MTC-20278/9 150200 [24]
24
MTC-20278/9 ILTQ/ILTT
NOTE 1:
A loop function is performed, if on
eight consecutive frames the ternary
encoding is recognized.
A loop function is finished if eight con-
secutive ternary zeros are recognized,
or on line deactivation.
Encoding
The encoding of a binary bit stream is
made such that 4 binary bits correspond
to 3 symbols of the ternary symbol
stream (4B/3T encoding scheme). The
encoding follows the rules of modified
monitoring state 43 (MMS 43) which
contains four alphabets. The left most
bit of the binary value in column 1 of
Figure 12 represents the first received
bit of the binary bit stream.
Corresponding to this, the left most
indicated symbol of the ternary word
is transmitted first.
The alphabet used for encoding of
a given binary block depends on the
digital sum of previous three ternary
symbols transmitted. Therefore, the
alphabet to be used for encoding of
the next binary block is indicated by
a suffix number beside each ternary
word.
After reset any alphabet can be used.
The running digital sum (RDS) is com-
puted in the RDS monitor (RDSM) from
the received ternary symbols.
NOTE 2:
One or more code violations detected
by RDS (Running Digital Sum) checks or
non-permissible series of 8 0_polarity
symbols within one frame lead to one
frame error.
When at the end of a ternary block the
running digital sum equals zero or five
a code violation has occured.
The RDS monitor is reset to one at the
beginning of each frame. RDS errors
which are reported back from the NT
to the LT are also accumulated in the
RDS monitor.
One or more RDS errors or one or
more series of five or more zeros within
one frame lead to one frame error.
Binary Ternary Alphabets (left symbol is transmitted first)
Information S1 S2 S3 S4
0001 0-+1 0-+2 0-+3 0-+4
0111 -0+1 -0+2 -0+3 -0+4
0100 -+01 -+02 -+03 -+04
0010 +-01 +-02 +-03 +-04
1011 +0-1 +0-2 +03 +0-4
1110 0+-1 0+-2 0+-3 0+-4
1001 +-+2 +-+3 +-+4 - - -1
0011 00+2 00+3 00+4 - - 02
1101 0+02 0+03 0+04 -0-2
1000 +002 +003 +004 0- -2
0110 -++2 -++3 -- --+2 - -+3
1010 ++-2 ++-3 +-- --2 +- -3
1111 ++03 00-1 00-2 00-3
0000 +0+3 0-01 0-02 0-03
0101 0++3 -001 -002 -003
1100 +++4 -+-1 -+-2 -+-3
Table 6: MMS 43 - Code
Note that the received 3T-word 000 is
transformed into a 4B-word of 0000.
This pattern occurs only during de-
activation.
MTC-20278/9 150200 [25]
Descrambling
The ternary signals received on each
side of the subscriber line are converted
back into a binary bit stream and multi-
plied by the generating polynomials in
order to recover the original data.
25
MTC-20278/9 ILTQ/ILTT
Scrambling
The received binary data stream is
divided by generating polynomials.
The scrambler contains supervision cir-
cuitry which flags if a continuous series
of ones or zeros have been detected at
the output for a complete 1ms frame.
Fig.20: LT transmit scrambler
-1
X -1
X
-1
X
-1
X
-1
X
Ds
Di
-5
Ds.X -23
Ds.X
: XOR function
Ds = Di Ds.X Ds.X
-5 -23
Fig.21: LT receive descrambler
Ds
Do
-1
X -1
X
-1
X
-1
X
-1
X
-p
Ds.X -23
Ds.X
: XOR function
Do = Ds Ds.X Ds.X
-p -23
p = 18 in Normal mode, p = 5 in Analog Loop (Loop1) mode
MTC-20278/9 150200 [26]
26
MTC-20278/9 ILTQ/ILTT
Activation and Deactivation
In order to reduce the power consump-
tion of circuits connected to the sub-
scriber line,the ILTT is powered down
during idle period. The components are
powered up again during the line acti-
vation procedure. Two states are
defined:
- Power-down state
Power consumption of the majority of
the functions is reduced by stopping
the clocks; maximum power reduction;
- Power-up state
All functions powered up.
The activation procedure consists of
three phases: awake (see the following
sections), synchronize, and connect
through.
The phases of activation are indicated
according to the following table.
Conditions for RDS, ACT and CT
see 8.2.
Maximum activation time (from com-
mand ACT to indication CT) without
RPTR:
-210ms under normal conditions
(starting with stored coefficients)
- 1.5s after reset of the coefficients
The deactivation procedure consists of
two phases: line deactivation and
power-down (see 8.2).
The deactivation can be initiated
only by the command DEAC in the
LT. The deactivation of the LT can be
initiated only by INFO U0. The phases
of deactivation are indicated in the
following table.
Phase Indication
LT
power-down DC
awake ACT
synchronize RDS
connect through CT
Phase Indication
LT
power-up CT
(connected through)
Line deactivation DEAC
power-down DC
Conditions for DC and DEAC see 8.2.
Deactivation time (from Command
DEAC to Indication DC) is in the order
of 4ms.
With RPTR the deactivation may take
twice as long.
Loop2 (Loop in NT)
For maintenance purposes a loop
can be closed by applying the correct
command into the M channel or into
the GCI C/I channel.
Reset
The ILTT can be reset via an external
pin (NRESET = LOW) or via the
command RES in the C/I channel.
Normally the ILTT is reset via the pin
NRESET (hardware reset).
Both reset requests cause via the activa-
tion/deactivation control (ACDECO)
and the reset logic a reset for various
functional blocks. The ILTT is initialized
such that after reset a “cold start”
(resetting of the coefficients) is forced.
Resetting the component affects the
status of the Relay drivers; after HW
reset the Relay drivers are switched
off (low output level), but after a SW
reset the status of the Relay drivers is
not modified. See also 8.4.
Note:
When powered down, execution of
commands via the M-Channel is not
possible. To allow M-Channel com-
mands to be used, issue the DGAC
command on the CII bits.
MTC-20278/9 150200 [27]
27
MTC-20278/9 ILTQ/ILTT
Logical Characteristics of the GCI Interface
Data Format and Timing
at the GCI Interface (DIN,
DOUT, DCLK, DFR)
Continuous Modes
- Nominal bitrate of data (DIN and
DOUT): 2048 kbit/s
- Nominal frequency of clock (DCLK):
4096kHz
- Nominal frequency of frame clock
(DFR): 8kHz
The frame is marked by the rising
edge of the frame clock DFR and the
data/frames are sampled on falling
edge of DCLK. Note that the position of
the falling edge of DFR is not important.
One frame contains 8 bursts 4 bytes.
The data streams at DIN and DOUT
consist of 32 bytes per frame. See
Figure 13. The input data DIN and the
output data DOUT are synchronous
and in phase.
Depending on the level of the pin POS.
The quad-LT takes the 4 first or the 4
last time-slots.
The following Figure shows the timing
of data and clocks at the digital inter-
face 2048 kbit/s (continuous modes).
See the AC characteristics section for
details. Transitions of the data occur
after even-numbered rising edges of
the clock DCLK. The data is valid on
the odd-numbered rising edges of the
clock DCLK.
Even-numbered rising edges of the
clock are defined as the second rising
edge following the rising edge of the
frame clock and every second rising
edge thereafter.
12345678
1234
1234
1234
1234
DIN
DOUT
POS = 0
POS = 1
POS = 0
POS = 1
DFR
1
Valid ILT channel
Ignored
Hi-Z output
KEY
Fig.22: GCI Bus Multiplexing Timing Diagram
28
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [28]
DCLK
4096 kHz
Port
Signal
DFR
8 kHz
DIN
2048 kbit/s
(burstId-bitId)
DOUT
2048 kbit/s
(burstId-bitId)
Rising
edge no.
7-28 7-29 7-30 7-31 0-0 0-1 0-2 0-3 0-4 0-5 0-6 0-7 0-8
7-28 7-29 7-30 7-31 0-0 0-1 0-2 0-3 0-4 0-5 0-6 0-7 0-8
0 246 810121416
Fig.23: Timing of Data and Clocks at the 2048 kbit/s Interface
Frame Format
Within each time-slot, 4 bytes are transmitted:
1st byte B1: B channel (64 kbit/s data), transparent
2nd byte B2: B channel (64 kbit/s data), transparent
3rd byte B2*: Monitor channel
4th byte B1*: 2 bit D channel (16 kbit/s data)
4 bit C/I channel A1, A2, A3, A4
A, E bit used to control the transfer of information on the Monitor channel
Deactivate DEACR 0000 Request to deactivate U0. The transmitter outputs INFO U0.
After detecting the disappearance of an incoming signal at U0 the
indication DC is transmitted at module interface.
Reset RESI 0001 Reset of ILTQ to initial state.
Reset receiver RESR 0100 Reset of the ILTQ receiver only
Send Single Pulses TXSSP 0101 The ILTQ transmits single pulses at 1.5ms time intervals with alternate
polarity +3/-3.
Test TEST 0110 The ILTQ will be connected through from module interface to line
interface (transparent) without wake-up procedure.
U activation request ARUO 0111 Activation request of the U0 interface only.
Activate ACT 1000 Request to activate. ACT is indicated. The ILTQ is set in power-up state,
executing the complete activation of layer 1: the wake-up procedure is
executed by transmission of INFO U2W.
After successful wake-up process, the synchronization procedure is
started by transmission of INFO U2 (in case of LT).
Activation request 2 ACTX 1001 Activation request without 15 sec limit.
Analog Loop AL 1010 ACT is indicated.The analog transmitter output is looped back to the
receiver input (channels B+B+D), which is disconnected from the U0
interface.
Activation request 3 ACT0 1101 Activation request with ACT bit = 0.
DeactivateConfirmation DCON 1111 No signal is transmitted at U0 and the ILTQ is powerd down.
The wake-up detect circuitry remains enabled: thus a detected wake-up
signal INFO U1W is able to power-up the UIC and to initiate the
activation procedure, as in case of control ACT applied.
29
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [29]
EAA4A3A2A1D2D1
B2* B1*B2B1
Time_slot
Fig.24: GCI Frame Format
Command and Indicate (C/I) Channel (A bits), MTC-20278
Command (DIN)
Note that RES or RES1 do not change the driver pins status while a hard reset configures RDi3 as input.
Note that at power-up, a DC command has to be given prior to any other command or DIN has to be one.
Deactivate DEACA 0001 The ILTQ is deactivating. Data transmission is impossible.
Loss of synchronization RSYN 0100 Loss of synchronization.
Error indication 2 EIST 0101 Error indication on the S/T interface.
U activation indication UAIN 0111 U activation indication.
Activate ACT 1000 The signal INFO U1W has been recognized by the wake-up detect
circuitry. The ILTQ is powered up and the activation procedure will be
executed.
Activation request info. ARMB 1001 Activation request maintenance bits
Error indication 3 EIRTI 1011 Error indication for timeout T1 (15s) or error on the U0 interface.
ConnectionThrough CT 1100 The transparent channels are connected through from module to line
interface (transparent). The activation of Layer 1 up to the terminals is
completed.
Loss of signal level on U LSLU 1101 Loss of signal level on U.
Deactivate indication DIN 1111 After deactivation of U0 (by the command DEAC) the disappearance of
incoming signal (INFO U0) has been detected.
30
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [30]
Indication (DOUT)
Summary of C/I Codes:
Evaluation of any command is done
according to a double last look criterion:
any command is executed only after the
same command has been detected in
two successive frames. Until then, the
preceding command is considered
valid.
In case commands are received that
are not included in the list, the last
recognized command is considered
valid. Commands which are logically
impossible in the current state are
ignored (cfr ETR 80).
The indications are transmitted con-
tinuously in each frame.
Under no circumstances can an indica-
tion that is not included in the list be
transmitted.
Code A-bits
1 2 3 4 HEX DIN DOUT
0 0 0 0 0 DEACR
0 0 0 1 1 RESI DEACA
0010 2
0011 3
0 1 0 0 4 RESR RSYN
0 1 0 1 5 TXSSP EIST
0 1 1 0 6 TEST
0 1 1 1 7 ARUO UAIN
1 0 0 0 8 ACT ACT
1 0 0 1 9 ACTX ARMB
1010 A AL
1 0 1 1 B EIT1
1100 C CT
1 1 0 1 D ACT0 LSLU
1110 E
1 1 1 1 F DCON DIN
Table 8: C/I Codes Summary
A and E Bits
The A and E bits provide a handshake
procedure for the transfer of monitor
channel messages.
The transmitted E bit is put low for one
frame when a new information has
been written in the monitor channel. The
transmitter then waits for confirmation
indicted by the receiver puting low the
A bit for one frame.
Thus to send a monitor message from
the Exchange to the ILTQ, the E bit on
DIN and the A bit on DOUT are used.
In the opposite direction, the E bit on
DOUT and the A bit on DIN are used.
31
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [31]
Code (hex) Down stream Up stream
00 Hold Hold Hold
50 CCLB Complete loop
51 CLB1 Close Loop B1
52 CLB2 Close Loop B2
53 RCCRC Request corrupt
CRC
54 NCCRC Notify corrupt CRC
AA NAC Not able to comply
FF Return Return to normal
XX ACKN Acknowledge*
MON-0 messages
Format:
0000 AAA1 FFFF FFFF
0000 = MON-0 command
AAA = Address
0 = NT
1..6 = Repeater
7 = Broadcast
FF...FF: EOC code (see table)
* ACKN: Acknowledge. The NT will acknowledge a valid MON command by
echoing it in the upstream direction.
Monitor Channel
Monitor messages sent to the ILTQ are
2 bytes long and monitor messages
returned by the ILTQ are also 2 bytes
long.
The monitor messages are split into
3 categories:
- MON-0: EOC programming
- MON-2: Overhead bits
- MON-8: Local functions
MTC-20278/9 150200 [32]
32
MTC-20278/9 ILTQ/ILTT
After hard reset:
RDx1: output
RDx2: output
RDx3: input
FDx1: input
FDx2: output
MON-command 817x will set the value
of the driving pins
The MON-command 816x will change
the direction of the RDx3 pin:
8160: input direction
8168: output direction
Note: so, for applications requiring
3 driver pins and 2 sens pins, the
MON-command and Hard-reset can
affect them.
The status of the drivers is not affected
by a soft-reset, only MON-command
and HARD-reset can affect them.
The MON-commands are executed in
“soft-reset” mode.
Up stream
D11 ACT Activation bit
D10 1
D9 1
D8 PS1 Power supply 1bit
D7 1
D6 FEBE Far-end block error occured
D5 PS2 Power supply 2 bit
D4 NTM
D3 CSO Nt-activation with cold start only
D2 1
D1 SAI S activity indicator
D0 1
MON-2 messages
Format:
0010 D11..8 D7..4 D3..0
Only the Up stream EOC messages
are supported. Down stream EOC
commands are controlled by the ILTQ.
MON-8 messages
Format: 1000 000A D7..4 D3..0
33
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [33]
AD
7..0 Down stream Up stream
0 1111 0000 SCCRC Corrupt CRC
0 1111 1111 RTN Return to Normal
0 1111 1011 RBECN Read Near-end block error counter
0 1111 1010 RBECF Read Far-end block error counter
0 aaaa aaaa ABEC* Answer block error counter
1 0111 dcba SETDD Set state of driver pins
a: RDi1
b: Di2
c: FDi2
d: not used (RDi3 is INPUT)
1 0110 dcba SETDO Set status of driver pins
a: RDi1
b: RDi2
c: FDi2
d: RDi3 (pin is OUTPUT)
1 0000 0000 RSP Read status pins
1 xxxx xxxba ASP Answer status pins
a: read the pin FDi1
b: read the pin RDi3 (used as sens pin)
1 1000 0000 RPDUI Read propagation delay U-interface
e aaaa aaaa APDUI Answer propagation delay on U-interface
0 1111 1001 ZFEBE Set FEBE-Bit to zero
0 0000 0000 RCID Read chip identification
0 0000 1000 ACID Answer chip identification
e is 3 bits in length.
Total delay (inns) is given by the approximate formula:
D = N * 12,500 + S * M * 65ns
Where: N is the value represented by bits 10..8 of PDu
S is +1 when bit 7 of APDU is 0, or -1 if it is 1
M is the value represented by bits 6..0 of PDu
PDu is the 11-bit propagation-delay (U interface) word.
A more precise description can be found in application note ”DECT delay calibration for ILTQ”.
Format: 1000 100A D7..4 D3..0
AD
7..0 Down stream Up stream
0 cccc cccc RCF Read coefficients at address cccc cccc
0 0000 0000 DCF Data coefficients, 1 byte, put to zero
MTC-20278/9 150200 [34]
34
MTC-20278/9 ILTQ/ILTT
Reset
CI = DEAC Deactivated
CI = DI
PowerDown
CI = DI
WaitTN
CI = DI
PendActivation
CI = ACT
Awake
CI = ARM TimeOut
CI =EI3
ResetReceiver
CI = LSL
Uactivated
CI = UAI
Act = 0, Deact = 1
Sactivated
CI = ACT
Act = 0, Deact = 1 Sdeactivated
CI = UAI
Act = 0, Deact = 1 ErrorOnS
CI =EI2
Act = 1, Deact = 1
LossOfSignal
CI = LSL
Act = 0, Deact = 1 LossOfSync
CI = RSY
Act = 0, Deact = 1 PendDeactivation
CI =DEAC
Act = 0, Deact = 0
Connection True
CI = CT
Act =1, Deact = 1
From Any State
CI = RES CI = DEAC
CI = RES1
15 sec.
Hardware Reset
CI = DC
CI = activationRequest
CI = activationRequest
SN2received
15 sec.
15 sec.
toneNT
(CI = RES1) and LossOfSignal
[ (EOC_ACT = 1) and (CI I = ACT0) ] or (CI = AL)
CI = ACT0
LossOfSignal
LossOfSignal LossOfSignal CI = DEAC
CI = RES1 (CI = RES1) and
LossOfSignal
CI = UAR (EOC_SAI = 0) &
(EOC_ACT = 0) (EOC_SAI = 1) &
(EOC_ACT = 0)
SN3received and
fully converged
toneNT or (CI = AL)
MTC-20278 State Machine
activationRequest
CI = ACT
CI = ACTX
CI = ACT0
CI = UAR
CI = AL
CI CMD. IND.
0 DEAC
1 RES DEAC
2
3
4 RES1 RSY
5 SSP EI2
6 TEST
7 UAR UAI
8 ACT ACT
9 ACTX ARM
AAL
B EI3
CCT
D ACT0 LSL
E
FDCDI
Fig.25: MTC-20278 State Machine
MTC-20278/9 150200 [35]
35
MTC-20278/9 ILTQ/ILTT
MTC-20279 State Machine
Deactivated
CI = DI PendDeactivation
CI = DEAC
PowerDown
CI = DI
WaitTN
CI = ACT TestState
CI = DEAC
Usynchronizing
CI = ACT
Ssynchronizing
CI = RDS
U & S synchronizing
CI = RDS
ConnectionTrue
CI = CT Uresynchronizing
CI = RSYN
From Any State
CI = TEST
From Any State
CI = RES
CI = LTD
CI = SSP
From Any State
CI = DEAC
SIG3received
LossOfSync or
LossOfSignal
SIG3received
SIG1received
SIG3received or (CI = AL)
toneNT or (CI = AL)
LossOfSignal
CI = activationRequest
toneNT Hardware Reset
CI = DC
CI = activationRequest
CI = AL
1 ms
activationRequest
CI = ACT
CI = AL
CI = L2
CI = L4
CI CMD. IND.
0 DEAC
1 DEAC
2
3 LTD
4 RSYN
5 SSP
6 TEST
7 RDS
8 ACT ACT
9AL
AL2
BL4
CCT
D RES
E
FDCDC
Fig.26: MTC-20279 State Machine
Activate ACT 1000 ACT is indicated. The ILTT is set in power-up state, executing the complete activation of
layer 1: the wake-up procedure is executed by transmission of INFO U2W.
After successful wake-up process, the synchronization procedure is started by trans-
mission of INFO U2 (in case of LT).
When the receiver has been synchronized RDS is indicated.
When INFO U3 is recognized, INFO U4H is transmitted. Then the transparent channels
are connected through from module to line interface (transparent).
Analog Loop AL 1001 ACT is indicated. The analog transmitter output is looped back to the receiver input
(channels B+B+D), which is disconnected from UK0 interface.
The ILTT is set in power-up state, executing the activation of layer 1: A pseudo wake-up
procedure is executed. After successful wake-up procedure the transmitter generates
INFO U2. When synchronization is completed successfully, RDS is indicated. INFO
U4H is transmitted. The UIC is connected through from module interface to line interface
transparent).
Loop 2 L2 1010 ACT is indicated.Command to close loop 2 in the NT.As ACT, with the difference that
continuous positive polarity is transmitted in the M symbol at UK0.
NOTE: An L2 command can be applied in the deactivated state as well as in the
activated state.
Loop 4 L4 1011 ACT is indicated.Command to close loop 4 in the RPTR. As ACT with the difference that
continuous +/0 code is transmitted in the M symbol at UK0.
Deactivate DEAC 0000 Request to deactivate UK0. The transmitter outputs INFO U0. After detecting the dis-
appearance of an incoming signal at UK0 the indication DC is transmitted at module
interface. A wake-up signal will be disregarded.
Deactivate DC 1111 No signal is transmitted at UK0 and the ILTT is powered down. The wake-up detect
Confirmation circuitry remains enabled: thus a detected wake-up signal INFO U1W is able to power-
up the UIC and to initiate the activation procedure, as in case of control ACT applied.
NOTE: This command can be used to deactivate UK0 in case that after the command
DEAC the disappearance of an incoming signal is not detected and there is no indica
tion DC.
Reset RES 1101 Reset of ILTT to initial state.
Send SinglePulses SSP 0101 The ILTT transmits single pulses at 1ms time intervals with alternate polarity.
Test TEST 0110 The ILTT will be connected through from module interface to line interface (transparent)
without wake-up procedure.
Line Termination LTD 0011 The ILTT stops transmitting signals on the corresponding channel, ignoring awake
Disable signals. The channel stays in this state until a command RES, DEAC or DC is issued.
It then goes in power-down. Note that if RES or DEAC are used, they have to be
followed by DC.
36
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [36]
Command and Indicate (C/I) Channel (A bits), MTC-20279
Command (DIN)
Activate ACT 1000 (1) The signal INFO U1W has been recognized by the wake-up detect circuitry.The
ILTT is powered up and the activation procedure will be executed.
(2) The control ACT is acknowledged by ACT. The controls L2, L4, AL are also ackn.
by ACT (not included in FTZ 1 R 210).
Running RDS 0111 During activation procedure, the receiver has synchronized (on INFO U1/U3/U5).
Digital Sum Evaluation of transmission quality is enabled.
Connection CT 1100 The transparent channels are connected through from module to line interface
Through (transparent). The activation of Layer 1 up to the terminals is completed. In case of a
loop 4 the activation up to the loop is completed.
In case of loop 2 the activation up to the NT is completed.
Deactivate DEAC 0001 The ILTT is deactivating. Data transmission is impossible.A wake-up signal at UK0
will be disregarded.The ILTT transmits either INFO U0 or single pulses (when the
command SSP or TSP is applied).
Deactivate DC 1111 After deactivation of UK0 (by the command DEAC) the disappear
Confirmation ance of in incoming signal (INFO U0) has been detected.
Resynchronization RSYN 0100 The receiver has lost framing and is attempting to resynchronize. The ILTT remains
connected through from module to line interface (transparent).
37
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [37]
Indication (DOUT)
List of codes:
Evaluation of any command is done
according to a double last look criterion:
any command is followed only after the
same command has been detected in
two successive frames. Until then the
preceding command is considered
valid.
In case commands are received that
are not included in the list the last
recognized command is considered
valid. Commands which are logically
impossible to receive in the correct
state are ignored (cfr ETR 80).
The indications are transmitted con-
tinuously in each frame.
Under no circumstances an indication
that is not included in the list is
transmitted.
Code A-bits
1 2 3 4 HEX DIN DOUT
0 0 0 0 0 DEAC
0 0 0 1 1 DEAC
0010 2
0 0 1 1 3 LTD
0 1 0 0 4 RSYN
0 1 0 1 5 SSP
0 1 1 0 6 TEST
0 1 1 1 7 RDS
1 0 0 0 8 ACT ACT
1 0 0 1 9 AL ARMB
1010 A L2
1011 B L4
1100 C CT
1 1 0 1 D RES
1110 E
1111 F DC DC
DEAC = Deactivate
LTD = Line Termination
Deactivate
RSYN = Resynchronization
SSP = Send Single Pulses
TEST = Test
ACT = Activate
AL = Analog Loop
L2 = Loop 2
L4 = Loop 4
Deactivate
CT = Connection Through
DC = Deactivate Confirmation
Master clock
The master clock of 15.36 MHz is
derived by PLL from the 4096 MHz GCI
clock. It is only available to the internal
circuits.
Boundry Scan
The JTAG State Machine
Production test of the device IO pins
is performed using the JTAG state
machine implemented in the on-chip
ARM. The test controller state transitions
are shown in the following Figure 27.
38
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [38]
Fig.27: JTAG State Machine
Test-Logic reset
0xF
Run-Test/Idle
0xC
tms=0
tms=1
Select-DR-Scan
0x7
Capture-DR
0x6
Shift-DR
0x2
Exit-DR
0x1
Pause-DR
0x3
Exit2-DR
0x0
Update-DR
0x5
tms=1 tms=0
Select-IR-Scan
0x4
Capture-IR
0xE
Shift-IR
0xA
Exit-IR
0x9
Pause-IR
0xB
Update-IR
0xD
tms=1 tms=0
Exit2-IR
0x8
tms=0
tms=0
tms=1
tms=0
tms=1
tms=1 tms=1
tms=1
tms=0
tms=1
tms=0
tms=0
Reset
The boundary scan interface includes a
state-machine controller (TAP controller)
according to the IEEE standard. In order
to force the TAP controller into the cor-
rect state after power-up of the device, a
reset pulse must be applied to the TRST
signal. If the boundary scan interface is
to be used, TRST must be driven LOW,
and then HIGH again. If the boundary
scan is not to be used, the TRST input
pin should be tied permanently low. A
clock on TCK is not necessary to reset
the device.
Instruction Register
The instruction register is 4 bits in
length.
There is no parity bit. The fixed value
loaded into the instruction register
during the CAPTURE-IR controller state
is 0001.
Public Instructions
The following public instructions are
supported
Codes not listed in the table should be
considered reserved and must not be
used during boundary scan testing.
In the descriptions that follow, TDI and
TMS are sampled on the rising edge of
TCK and all output transitions on TDO
occur as a result of the falling edge of
TCK
EXTEST (0000)
The scan chain is placed in test mode
by the EXTEST instruction. The EXTEST
instruction connects the scan chain
between TDI and TDO.
In the CAPTURE-DR state, inputs from
the system logic and outputs from the
output scan cells to the system are cap-
tured by the scan cells. In the SHIFT-DR
state, the previously captured test data
is shifted out of the scan chain via the
TDO pin, while new test data is shifted
in via the TDI input. This data is applied
immediately to the system logic and
system pins.
SAMPLE/PRELOAD (0011)
The scan chain is placed in test mode
by the SAMPLE/PRELOAD instruction.
This instruction connects the scan chain
between TDI and TDO.
In the CAPTURE-DR state, inputs from the
system logic and outputs from the output
scan cells to the system are captured by
the scan cells. In the SHIFT-DR state, the
previously captured test data is shifted
out of the scan chain via the TDO pin.
The capture of the pins levels can be
done in normal operation.
INTEST (1100)
The scan chain is placed in test mode by
the INTEST instruction. This instruction
connects the scan chain between TDI
and TDO.
In the CAPTURE-DR state, the value of
the data applied from the core logic to
the output scan cells is captured. At the
same time, the value of the data applied
from the system logic to the input scan
cell is also captured by the scan cells.
In the SHIFT-DR state, the previously
captured test data is shifted out of the
scan chain via the TDO pin, while new
test data is shifted in via the TDI input.
BYPASS (1110)
The BYPASS instruction connects a 1 bit
shift register (the BYPASS register)
between the TDI pin and the TDO pin.
When the BYPASS instruction is loaded
into the instruction register, all the scan
cells are placed in their normal mode of
operation. The instruction has no effect
on the system pins.
In the CAPTURE-DR state, a logic 0 is
captured by the bypass register. In the
SHIFT-DR state, test data is shifted into
the bypass register via the TDI pin and
out via the TDO pin after a delay of one
TCK cycle. Note that the first bit out will
be a zero. The bypass register is not
affected in the update-DR state.
SCAN_N (0010)
This instruction connects the Scan Path
Select Register between TDI and TDO.
During the CAPTURE-DR state, the fixed
value 1000 is loaded into the register.
During the SHIFT-DR state, the ID num-
ber of the desired scan path is shifted
into the scan path select register. In the
UPDATE-DR state, the scan register of
the selected scan chain is connected
between TDI and TDO, and remains
connected until a subsequent SCAN_N
instruction is issued. On reset, scan
chain 3 is selected by default. The scan
path select register is 4 bits long.
39
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [39]
Instruction Binary code
EXTEST 0000
SCAN_N 0010
SAMPLE/PRELOAD 0011
INTEST 1100
BYPASS 1111
Test Data Registers
There are a number of data registers
which may be connected between TDI
and TDO. They are: Bypass register,
Instruction register, Scan chain select
register, Scan chain 3 (all others scan
chains are reserved). Only the bypass
register, instruction register, scan chain
select register and scan chain 3 are
discussed.
Bypass Register
Purpose: Bypasses the device during
scan test by providing a path between
TDI and TDO.
Length: 1 bit
Operating mode: when the BYPASS
instruction is the current instruction in the
instruction register, serial data is trans-
ferred from TDI to TDO in shift-DR state
with a delay of one TCK clock cycle.
There is no parallel output from the
bypass register. A logic 0 is loaded
from the parallel input of the bypass
register in the CAPTURE-DR state.
Instruction Register
Purpose:Changes the current TAP
instruction.
Length: 4 bits
Operating mode: when in SHIFT-IR
state, the instruction register is selected
as the serial path between TDI and TDO.
During the CAPTURE-IR state, the values
0001 binary is loaded into this register.
This is shifted out during shift-IR (LSB
first), while a new instruction is shifted
in (LSB first). During the UPDATE-IR state,
the value in the instruction register
becomes the current instruction. On
reset, IDCODE (reserved) becomes the
current instruction.
Scan Chain Select Register
Purpose: changes the currently active
scan chain.
Length: 4 bits
Operating mode: The external bound-
ary scan is selected by default at reset.
It is not allowed to select other registers
for boundary scan testing. The external
boundary scan corresponds to the scan
chain number 3.
External Boundary Scan Register
Purpose: boundary scan testing
Length: 25 bits
Operation: following digital component
pins are scanned and tested in bound-
ary scan mode
The relation betweeen the scanned pins
and the scan register sequence is de-
scribed in the following table (all digital
pins are included in the boundary scan
except for TDI, TDO,TMS, TCK, FD21,
FD31)
40
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [40]
Pin Direction INTEST EXTEST
TDI TDO TDI TDO
RD11 out x x
RD43 inout x x x x
RD41 out x x
RD42 out x x
FD41 in x x
FD42 inout x x x x
FD32 inout x x x x
RD33 inout x x x x
RD32 out x x
RD31 out x x
POS in x x
DFR in x x
DIN in x x
MTC-20278/9 150200 [41]
41
MTC-20278/9 ILTQ/ILTT
Pin Direction INTEST EXTEST
TDI TDO TDI TDO
DCLK in x x
DOUT out x x
TSP in x x
NRESET in x x
RD23 inout x x x x
RD21 out x x
RD22 out x x
FD22 out x x
RD13 inout x x x x
FD12 inout x x x x
FD11 in x x
RD12 out x x
Data entered at TDI will shift from position RD11 to RD12. Total delay between TDI and TDO is 26 clocks of TCK.
The positions marked ’x’ in the table should be interpreted as follows:
INTEST: data shifted in through TDI will be presented to the internal chip inputs
data from the internal chip outputs will be shifted to TDO
EXTEST: data shifted in through TDI will be presented to the external chip pins
data from the external chip pins will be shifted to TDO
MTC-20278/9 150200 [42]
Electrical Characteristics and Ratings
The NRESET input is a Schmitt Trigger input.
Absolute Maximum
Ratings
Stresses above those listed in this clause
can cause permanent device failure.
Exposure to absolute maximum ratings
for extended periods can effect device
reliability.
42
MTC-20278/9 ILTQ/ILTT
Symbol Description Min Max Unit
DVDD, AVDD power supply voltage VSS - 0.3 3.63 V
VIN input voltage on any pin VSS - 0.3 VDD + 0.3 AND < 3.63 V
Absolute Maximum Ratings,
Operating Ranges and Storage Conditions
Symbol Parameter Conditions Min Max Unit
VIH High Level Input Voltage 80% of VDD V
VIL Low Level Input Voltage 20% of VDD V
VIH NRESET Rising NRESET 1.7 1.9 V
VIL NRESET Falling NRESET 0.9 1.1 V
VOH High Level Output Voltage 85% of VDD V
VOL Low Level Output Voltage 0.4 V
CIN Input Capacitance, all inputs 1 pF
COUT Load Capacitance, all outputs 100 pF
MTC-20278/9 150200 [43]
43
MTC-20278/9 ILTQ/ILTT
Operating Ranges
Operating ranges define the limits for
functional operation and schematic
characteristics of the device as
described above, and for the reliability
specifications as listed. Functionality
outside these limits is not implied.
(1) U nominally loaded (U: 135line
equivalent) for random signal.
(2) Transition from power-up to power-
down automatically follows when trans-
mission on U is terminated. Transition to
power-up state occurs when a wakeup
signal is received from U or when
activity is detected on the data input
of the GCI interface.
Total cumulative dwell time outside the
normal power supplyVoltage range or
the ambient temperature under bias
must be less than 0.1% of the useful life
as defined in the reliability section.
Symbol Description Min Max Unit
DVDD, AVDD power supply 3.135 3.465 V
PTOT total power consumption 250 (1) mW/line
PPD power down power consumption 16 (2) mW/line
Tamb ambient temperature - I version -40 85 °C
Tamb ambient temperature - C version 0 70 °C
SNAVDD analog supply noise 30 mVPP
SNDVDD digital supply noise 100 mVPP
AC Characteristics
GCI Pins
Timing for: DCLK, DFR, DIN, DOUT
bit 0 bit1 bit2
Detail A
DCLK
DFR
DOUT/DIN
Fig.28: Timing for: DCLK, DFR, DIN, DOUT
Timing ReferenceVoltages
44
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [44]
tr tf
twH
DCLK
DFR
tDCL twL
tsF thF
twFH
tdDC
tdDF
tsD thD
DIN
DOUT
Voltage High Low
Output 2.4V 0.4V
Input 2.0V 0.8V
Parameter Signal Mnem. Units Min Max
Clock Period DCLK tDCL ns 239 249
Pulse width DCLK twL, twH ns 90 -
(2048 kbps)
Frame DFR tsF ns 70 tDCL-50
Frame Rise/Fall DFR tr, tf ns 60
Frame Width H DFR twFH ns 130 -
Frame Width L DFR twFL ns tDCL -
Frame Hold DFR thF ns 50 -
Data delay, Clock DOUT tdDC ns - 100 (1)
Data delay, Frame DOUT tdDF ns - 150 (1)
Data setup DIN tsD ns twH + 20 -
Data Hold DIN thD ns 50 -
Note 1: Cload = 150pF.
Fig.29: Timing for: DCLK, DFR, DIN, DOUT
Timing for JTAG, PINS: TCK, TMS, TDI, TDO (TRST asynchronous).
45
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [45]
T bscl T bsch
T bsis T bsih
T bsod
T bsoh
T bsss T bssh
T bsdd
T bsdh T bsdh T bsdd
Symbol Parameter (Time inns) Min Typ Max Notes
Tbscl TCK low period 15.1
Tbsch TCK high period 15.1
Tbsis TDI, TMS setup to [TCr] 3.6
Tbsih TDI, TMS hold from [TCr] 7.6
Tbsoh TDO hold time 2.4
Tbsod TCr to TDOValid 16.4
Tbsss I/O signal setup to [TCr] 3.6
Tbssh I/O signal hold from [TCr] 7.6
Tbsdh data output hold time 2.4
Tbsdd TCf to data outputValid 17.1
Tbsr Reset period 25
Fig.30: Timing for JTAG, PINS: TCK, TMS, TDI, TDO (TRST asynchronous)
MTC-20278/9 150200 [46]
46
MTC-20278/9 ILTQ/ILTT
Operating Environment
The components are intended for
application in equipment for indoor
operation without forced cooling air
flow, only convection.
Storage Conditions
Temperature should be in the range -55
to 110°C.
In case of IC deliveries in dry bag,
the conditions of time and humidity
during storage are specified in Alcatel
specification16650.
In case of IC deliveries not in dry bag,
the conditions for a maximum storage
period of 2 years are as follows:
Ambient Temperature (°C) Relative Humidity (%)
20 80
30 70
40 60
50 50
MTC-20278/9 150200 [47]
47
MTC-20278/9 ILTQ/ILTT
Quality
Product Accaptance
Tests
All products are tested 100%, at ambient
temperature with full temperature range
guardband, by means of production
test programs that guarantee optimal
coverage of the product specification.
Lot-by-lot Acceptance
Test
Lot conformance to specification of pro-
ducts delivered in Volume production is
guaranteed by means of following tests:
Delivery lot certification
Each delivery lot is accompanied by a
Certificate of Conformance.
Quality system
A quality system with certification
against ISO9001 is maintained.
Test Conditions AQL Level Inspection Level
Electrical, functional and parametric To product specification at Tamb = 25°C 0.04 II
with full temperature range performance
guardband.
ExternalVisual Physical damage to body or leads. 0.04 II
Dimensions affecting PCB manufacturability
such as bent leads, coplanarity, ...
ExternalVisual Correctness of marking 0.65 II
Reliability Specification
In order to guarantee the specified
reliability, a product qualification
for each product is performed. This
qualification is described in the Alcatel
Microelectronics specification document
15503.
In order to minimize reliability testing,
structural similarity is applied. Methods
and criteria are defined in the
documents 15501 (assembly) and
15502 (wafer fabrication).
Monitoring of assembly and wafer
fabrication is performed according to
the specifications 15910 and 15205.
These monitoring tests include the
solderability tests.
48
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [48]
Tjunction (°C) Early failure period (Hrs) Long term failure rate (FIT)
55 8760 100
65 4000 200
75 2000 400
85 1000 800
90 800 1000
The Intrinsic Failure
Rate
When operating the component under
benign conditions, the intrinsic failure
rate will not exceed:
- 5000 ppm during the early failure peri
od defined below
- the long term failure rate as specified
below after the early failure period
Failures due to external overstresses
such as ESD,Voltage and current over-
stress (e.g. due to EMI), excessive
mechanical and thermal shocks, ... are
not included in these Figures (see next
paragraph).
External Stress Immunity
Electrostatic discharges:
The device withstands 1000Volts
Standardized Human Body Modle
ESD pulses when tested according
to MIL883C method 3015.5 (pin com-
bination 2).
Latch-up:
Static latch-up protection level is 100
mA at 25°C when tested according to
JEDEC no. 17.
The Useful Life
The useful life, when used under
moderate conditions, is at least 25
years. The term useful life is specified
as the point in the lifetime where the
intrinsic failure rate exceeds the long
term failure rate specified above.
MTC-20278/9 150200 [49]
49
MTC-20278/9 ILTQ/ILTT
Fig.31: 80 PQFP Package Drawing
0.791(20.10)
0.783(19.90)
0.923(23.45)
0.903(22.95)
.113(2.87)
.101(2.57)
.018(0.45)
.008(0.20)
TYP .063(1.60)
Pin 1
TYP .031(0.80)
MAX .134(3.40)
MIN .002(0.05)
0°C - 10°C
.041(1.03)
.025(0.65)
0.555(14.10)
0.547(13.90)
0.687(17.45)
0.667(16.95)
0°C - 10°C
TYP.006(0.15)
All dimensions are in inches and
parenthetically in millimeters.
Inches dimensions are approximated.
Notes
MTC-20278/9 150200 [50]
50
MTC-20278/9 ILTQ/ILTT
MTC-20278/9 150200 [51]
51
MTC-20278/9 ILTQ/ILTT
Notes
MTC-20278/9 150200 [52]
03/00-0278b
Alcatel Microelectronics acknowledges the trademarks of all companies referred to in this document.
This document contains information on a new product.
Alcatel Microelectronics
reserves the right to make
changes in specifications at any time and without notice.
The information furnished by
Alcatel Microelectronics
in
this document is believed to be accurate and reliable.
However, no responsibility is assumed by
Alcatel
Microelectronics
for its use, nor for any infringements of
patents or other rights of third parties resulting from its use.
No licence is granted under any patents or patent rights
of
Alcatel Microelectronics
.
HEADQUARTERS
MANUFACTURING &
CUSTOMER SERVICE
Westerring 15
9700 Oudenaarde
Belgium
Tel. +32 55 33 24 70
Fax +32 55 33 27 68
MARKETING &
DESIGN CENTRE &
WESTERN EUROPE
(SALES)
Excelsiorlaan 44-46
1930 Zaventem
Belgium
Tel. +32 2 718 18 11
Fax +32 2 725 37 49
SALES OFFICES
Central Europe
Arabellastraße 4
81925 Munich
Germany
Tel. +49 89 920 07 70
Fax +49 89 910 15 59
Stuttgart Office
Schwieberdingertraße 9
70435 Stuttgart
Germany
Tel. +49 711 821 45 304
Fax +49 711 821 44 619
W. Europe/UK
Guildgate House
Shute End
Wokingham RG40 7BH/UK
Tel. +44 118 979 7102
Fax +44 118 979 7103
Northern Europe
Box 4121
SE-17104 Solna
Sweden
Tel. +46 8598 49853
Fax +46 8598 49795
SALES &
DESIGN CENTRES
Southern Europe
10, rue Latécoère, B.P.57
78140 Vélizy Cedex
France
Tel. +33 1 46 32 53 86
Fax +33 1 46 32 55 68
Mediterranean Area
Via Trento 30
20059 Vimercate MI
Italy
Tel. +39 039 686 4520
Fax +39 039 686 6899
USA
M/S 412-115
1225 N. Alma Road
Richardson
TX 75081-2206
Tel. +1 972 996 2489
Fax +1 972 996 2503
China
20/F Times Square
500 Zhangyang Road
Shangai 200122
P.R. China
Tel. +86 215 836 8800
Fax +86 137 01810370
SALES &
LOGISTICS OFFICE
Taiwan R.O.C.
Alcatel Microelectronics
Tower A, 17F, N°116, Sect 1
Hsin-Tai 5th Rd, Hsi-Chih,
Taipei County
Taiwan, R.O.C.
Tel. +886 2 2696-2618
Fax +886 2 2696-2562
DESIGN OFFICES
Germany
Königsbrücker Straße 61
D-01099 Dresden
Germany
Tel. +49 351 898 11 11
Fax +49 351 898 11 25
Czech Republic
Videnska 125
61900 Brno
Czech Republic
Tel. +420 5 47 125 400
Fax + 420 5 47 212 751
Turkey
Alcatel Teletas
1 Esensehir Y. Dudullu
81260 Istanbul, Turkey
Tel. +90 216 420 7500
Fax +90 216 420 7584
USA
3101 Industrial Drive
Suite 206, Raleigh
North Carolina 27609,
Tel. +1 919 850 67 31
Fax +1 919 850 66 89
USA
P.O. Box 750699
Petaluma, CA 94975
0699
Tel. +1 707 665 8013
Fax +1 707 792 6310
REPRESENTATIVES / DISTRIBUTION
Europe
Northern Germany, TRIAS, Moerser Landstraße 408, 47802 Krefeld, Germany, Tel. +49 2151 95 30 111, Fax +49 2151 95 30 115
UK,
Alpha Micro Comp., Springfield House, Cranes Road, Sherborne St. John, Basingstoke, Hampshire RG24 9LJ, Tel. +44 1256 851770, Fax +44 1256 851771
Spain, Newtek Electronica SA, Centro Empresarial El Plantio, c/Ochandiano 8, 2 Izq., 28023 Madrid, Spain, Tel. +34 91 3076893, Fax +34 91 3729453
Portugal, Comdist, Rua Entreposto Industrial, 3-20 Sala E Edificio Turia, 2720 Alfragide, Portugal, Tel. +35 1 147 251 90, Fax +35 1 147 25 1 99
Israel, Newtek, nr5 Yoni Nethanyahu St., Or-Yehuda 60200, Israel, Tel. +972 3 6344 564, Fax +972 3 6344 568
Asia
China, Shangai Belling Corp., 810 YiShan Rd., Shangai, China, Tel. +86 21 64850700, Fax +86 21 64854424
Hong Kong, Pr. Microelectr. Sales, Room 2101/2, 21/F, Westlands Centre, 20 Westlands Rd, Quarry Bay, Tel. +852 29604611, Fax +852 29600185
Taiwan, Pr. Microelectr. Sales, 3F, No.68, Chou-Tze St., Nei Hu Dist., Taipei 114, Taiwan, R.O.C., Tel. +886 2 8797 6826, Fax +886 2 8797 6827
USA (Premier Technical Sales)
East Canada, 43 Pretty Street, Stittsville, Ontario, K2S1N5 Canada, Tel. +1 613 836 1779, Fax +1 613 836 4459
N. California, 3235 Kiffer Road, Suite 110, Santa Clara, CA 95051, Tel. +1 408 736 2260 (105), Fax +1 408 736 2826
Arizona, 84 West Cypress St, Phoenix, AZ 85003, Tel. +1 602 254 8952, Fax +1 602 229 1100
Boston, 33 Boston Post West, Suite 270, Marlboro, MA 01752, Tel. +1 508 460 1730, Fax +1 508 460 1731
Chicago, 7628 W. Fullerton Avenue, Elorwood Park, IL 60707, Tel. +1 708 583 2372, Fax +1 708 583 2364
Oregan, 5319 S.W. Westgate Dr. Suite 136, Portland, OR 97221, Tel. +1 503 297 3956, Fax +1 503 297 4956
Texas, 800 East Campbell Road, Suite 199, Richardson, TX 75081, Tel. +1 972 680 5233, Fax +1 972 680 5234
Colorado, 1010 Broadview Place, Colorado Springs, CO 80904, Tel. +1 719 632 8340, Fax +1 719 632 1951
Georgia, 11140 Quailbrook Chase, Duluth, GA 30097, Tel. +1 770 476 1235, Fax +1 770 476 3989
New Jersey, 1015 Horseshoe Trail, Volley Forge, PA 194820342, Tel. +1 610 783 1919, Fax +1 610 783 6492
Alcatel Microelectronics
info@mie.alcatel.be
http://www.alcatel.com/telecom/micro