MOTOROU Order this document by P~2222AT1/D SEMICONDUCTOR TECHNICAL DATA NPN Siiicon Planar Epitmia[ Transistor PzT222aTl Motorola PrsferredDevlcs This NPN Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications. PNP Complement is PZT2907AT1 The SOT-223 package can be soldered using wave or reflow. SOT-223 package ensures level mounting, resulting in improved thermal conduction, and-allows visual inspection of soldered join~. The formed leads absorb thermal str-s during soldering, eliminating the possibility of damage to the die. . , \*:P ,. ~ Available in 12 mm tape and reel Use PZT2222AT1 to order the 7 inch/1000 unit reel. Use PZT2222AT3 to order the 13 inch/4000 unit reel. COLLECT@"~':: 2,4,'5?.<:"':,$> .,,;. +(.)<:+,. ,. ,:+ .,,, ."~J\> ~.l~;l~.~ ,!a. BASE .. : .*t, , , .>.:: ,,.,.. 1 ,. ~2kw*tq ",.l~t,c, .3! @ ,,$: `<. `+ .,.,,,,.,>.!.,, 3 .>:,:$~' ...\ ~":., EMIHER .~,.~,:y, ,\,,y "~hi. MAXIMUM *;*' $.~.$,., `.`<:* ..tLy\\.., ,'* ~ ... :~$i ~>~: *3:,x,$:?, ,,~~. RATINGS Rating Coliector-EmitierVohage >:$,. Collector-Base Voltage Emitier-Base Voltage (Open Collector) Collector Current Symbol .,,.,.,. *J* ~S.,*3 .,.,} \?~. .:p~,.~ ..., >*. .. ,.t./>"+?i\..$ ,;. `i.,. .~~i L) ~,:$,:~h$$, ,<,:.J $,., ~$. \,,]\ . ,,~.,\., Total Power Dissipation up to TA = 25"C(1 ),~,$l:~$.? ~... ,... `?::~:i;~,\.\ ,\:$t\\x. ,~,t\, Storage Temperature Range \;tw.\.i8L THERMAL Unit VCEO 40 Vdc VCBO 75 Vdc VEBO 6.0 Vdc Ic 600 mAdc pD 1.5 WaW - 65to+150 Tstg Junction Temperature Value `c TJ 150 `c R~A 83.3 "cm TL 260 CHARACTERI Thermal Resistance from Lead Temperature fofi$~~ng, Time in Solder ~th `~t:l$: 0.0625ti from case "c Sec 10 DEVICE MAR@k$\$d I P1 F , J$!.. `~?~it 1 ELECWl&@CHARACTERISTICS rA = 25C unless othem.se noted) .,,,. .,>+ \,: Characteristic I Symbol Min Max Unit V(BR)CEO 40 -- Vdc V(BR)CBO 75 -- Vdc V(BR)EBO 6.0 -- Vdc - 20 nAdc I +*,BHARACTERISTICS .,.+, `~:;: *&ollector-Emitter Breakdown Voltage (Ic = 10 mAdc, IB = O) "(' Collactor-BseeBreakdownVoltage(Ic = 10 @de, IE = O) Emitter-Base Breakdown Voltage (IE = 10 @de, IC = O) Bas&Emitter Cutoff Current (VCE = 60 Vdc, VBE= -3.0 Vdc) IBEX Collector-EmitterCutoffCurrent~cE = 60 Vdc, VBE = -3.0 Vdc) iCEX -- 10 nAdc lEBO -- 100 nAdc Emitier-Base Cutoff Current WEB= 3.0 Vdc, Ic = O) 1. Devicemountedon an SPCWw.ntadcircuitboard 1.575inchesx 1.575inch= x 0.059 inch= mountingpad for the collectorlead min. 0.93 inch*2. Thermal Clad is atrsdemark of the Bergquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 @ Motorola, Inc. 1994 @ MOTOROLA ELECTRICAL CHARACTERISTICS -- continued UA = 25C unless othewise noted) Characteristic Symbol I Min Max Unit -- -- 10 10 nAdc @dc OFF CHARACTERISTICS (continued) iCBO Collector-Base Cutoff Currant (VCB = 60 Vdc, IE = O) (VCB = 60 Vdc, IE = O,TA = 125"C) IN CHARACTERISTICS hFE DC Current Gdn (IC = 0.1 mAdc, VCE = 10 Vdc) (IC = 1.0 mAdc, VCE = 10 Vdc) (ic = 10 mAdc, VCE = 10 Vdc) (1c = 10 mAdc, VCE = 10 Vdc, TA = - 55C) (Ic = 150 mAdc, VCE = 10 Vdc) (lc = 150 mAdc, VCE = 1.0 Vdc) (1c = 500 mAdc, VCE = 10 Vdc) 35 50 70 35 100 50 40 Collector-Emitter Saturation Voltages (Ic = 150 mAdc, IB = 15 mAdc) (Ic = 500 mAdc, IB = 50 mAdc) vCE(sat) BaseEmitter Saturation Voltages (Ic = 150 mAdc, IB = 15 mAdc) (Ic = 500 mAdc, IB = 50 mAdc) VBE(sat) 1.0 kfi Input Impedance (VCE = 10 Vdc, IC = 1.0 mAdc,f = 1.0 kHz) (VCE = 10 Vdc, Ic = 10 mAdc, f = 1.0 kHz) 2.0 0.25 Voltage Feedback Ratio (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) (VCE = 10 Vdc, IC = 10 mAdc, f = 1.0 kHz) O@ut Admittance (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) (VCE = 10 Vdc, Ic = 10 mAdc, f = 1.0 kHz) .+',. b+<,`%' , .$:s*\?,>?\,,,?\$ ,,,>,,, Noise Figure NCE = 10 Vdc, IC = 100 @de, f = 1.0=.,+'" ,,:~.,> $........$DYNAMIC CHARACTERISTICS ,:,,:i:; .1:,?.$ Current-Gain -- BanMdth Product ,k::$~~$ (Ic = 20 mAdc, VCE = 20 Vdc, f = 100 ~z~ Output Capacitance (VCB = 10 Vdc,#~$~~= `" 1.0 MHz) Input Capacitance (VEB = 0.5 ~@~Y&:*ti, f = 1.0 MHz) . , .,! SWITCHING TIMES WA= ~Q) ">1{$ ~&'~~@~dc, Rise Time Storage Ti~~ Fall ~~~~~~:' ~@~&$e 15 ~dc, ,, ~:ime 1 Ic = 150 mAdc, vEB(@ = 0.5 Vdc) = 30 Vdc, Ic = 150 mAdc, J ~$cc * lB(on) = lB(ofi = 15 mAdc) Figure 2 8.0 1.25 -- ed,$ ,,,~$;,. ,$ ,,!,.$:,! ,.*,i,:,N\... ,s`- ~t~.: ~: .""J>$:j:,,. -\ ~!. .'?:>!., >.> ~4~.. *\>#?? \\f,y+h $~i. .~:, $ Small-Signal Current Gain (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) (VCE = 10 Vdc, Ic = 10 mAdc, f = 1.0 kHz) Delay Time Vdc 1.2 2.0 -- -- 8.OXI0~ =4.OX1o~ 50 75 300 375 5.0 25 35 200 F -- 4.0 fT 300 -- MHz cc -- 8.0 pF Ce -- 25 pF b - 10 ns tr -- 25 ts -- 225 tf -- 60 -- ~hos hOe I dB ns ,,S.. ., ,,,t~., , ,'1.~~ ] ,,.??$l>:,+{,t, .,&.., .*$: ~ 2 Motorola Smal14ignaI Transistors, FHs and Diodes Device Data PZT2222AT1 Vcc ---- ---------- -- 4 N R1 -------- ---- o t~ e Motorola Small-Signal * b Transistors, y F=s and Diodes Device Data v~ D.U.T. 3 PzT222mTl INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. ,,,-$s.?:, ,t, .$, The power dissipation of the SOT-223 is a function of the ~~ough one can almost double the power dissipation with collector pad size. This can vary from the minimum pad siz~ ~' this method, one will be giving up area on the printed circuit for soldering to a pad size given for maximum PO:8X:, board which can defeat the purpose of using surface mount dissipation. Power dissipation for a surface mount de~$~~s "" technology. A graph of RgJA versus collecfor pad area is determined by TJ(m=), the maximum rated juncfio~~m~rashown in Figure 3. ture of the die, ReJA, the thermal resistance froql~~~ce 160 c junction to ambient, and the operating te@}@'~e, TA. I -s Board Material =0,0625" Using the values provided on the data sheef~~~~SOT-223 TA = 25C E .~+i G-1OFR4, 2 oz Gopper ~- 140 package, PD can be calculated as follg~s.'$.,.,# ~... The values for the equafim+~~& found in the maximum ratings table on the data ~~et. Sfibsfituting these values into the equation for an am~~~$aperature TA of 25C, one can calculate the pow~,')tipafion of the device which in this $:P~= 150C - 25C 1.5 Watts Ta~loo a= `Mountedonthe DPAKfootprint 0.2 0.4 0.6 0.8 1.0 A, Area (squareinches) the use of tha$~dommended footprint on a glass epoxy printed circuif `board to achieve a power dissipation of 1.5 wafts. There are other alternatives to achieving higher power dissipation from the SOT-223 package. One is to increase the area of the collector pad. By increasing the area of the collector pad, the power dissipation can be increased. 4 \ , SE +< 80 0.0 = , s Watis ~:\>:.\\\, \,`\,\,*\t\: 83.3CN . ..'7 ,,~,~,wt~ Ntf,A,, for the SOT-223 package assumes Th~~,:~CN i.8 W& s 3s # 2120 %E E: .- Figure 3. Thermal Resistance versus Collector Pad Area for the SOT-223 Packge ~ypical) Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM.Using a board material such as Thermal Clad, an aluminum core board, the power dssipafion can be doubled using the same footprint. Motorola Small-Signal Transistors, FETs and Diodes Device Data PZT2222AT1 SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is rquired to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SOT-223 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. Always preheat the device. . The delta temperature between the preheat and soldering should be 100"C or less.' . When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. o The soldering temperature and time shall n~t, exceed ,,,,,,:< >,st,:.,, 260C for more than 10 seconds. .,'>.,.,> . When shifting from preheating to solderin&$:&maximum temperature gradient shall be 5C or l~;;$x:,$ . After soldering has been compieted.~~~~vice should be allowed to cool naturally for ,@,:~@@three minutes. Gradual cooling should be qS:~;~ the use of forced cooling will increase the te~e~ure gradient and result in latent failure due to m~afi~l stress. e Mechanical stress or S*@hould not be applied during ,;$+ *:*~~i$ cooling >,,.., ~i:$i. ~>t::.> ..:,. -.,, i:. * Soldering a de@i~X~out preheating can cause excessive thermal shocb@nd''&ess which can r=sult in damage to the ~{~ ,.. t~~ ~ device. >*,:*,..<,$s ,*...~:~q.} ,i> WPICAL SOLDER HEATl~$;kdFiLE .~,\\,,< For any given circuit board, there will be a group of control .wual~Perature that might be experienced on the surface settings that will give the desired heat pattern. The operator ..$,l~~%~testboard at or near a central solder ioint. The two must set temperatures for several heating zones, and a { ~~ofiles are based on a high density and a low density board. figure for belt speed. Taken together, these control setiin~S~5~~he Wtronics SMD31 o convectionfinfrared reflow soldering make up a heating "profile" for that particular circuit boards,;''"" system was used to generate this profile. The type of solder On machines controlled by a computer, the compu~er ` used was 62/36/2 Tin Lead Silver with a melting point remembers these profiles from one operating ses$@ to the between 1~-l 89C. When this type of furnace is used for next. figure 4 shows a typical heating profile fq.Vd~?~when solder reflow work, the circuit boards and solder ioints tend to soldering a surface mount device to a pfintq&q@ board. heat first. The components on the board are then heated by This profile will vary among soldering syste~$,~u~%is a good conduction. The circuit board, because it has a large surface starting point. Factors that can affect th&~Ywinclude the area, absorbs the thermal energy more efficiently, then type of soldering system in use,,$w$~~ and types of distributes this energy to the components. Because of this components on the board, type of ~l~hsed, and the type of board or substrate material h@q,%ed. This profile shows effect, the main body of a component may be up to 30 temperature versus time. T@,,~@r@nthe graph shows the degrees cooler than the adiacent solder ioints. . Y;,,:: 1500c t 1Oooc 1400c DESIREDCURVE FOR LOW MASS ASSEMBLIES I JUINT H $ I I I ` TIME (3 TO 7 MINUTES TOTAL) I `k SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) I - 1 1 I I TM~ Figure 4. Typical Solder Heating Profile Motorola Small-gnal Transistors, F~s and Diodes Device Data 5 Iefi blank. intentionally Iefi blank. CASE 318E44 ,,:,,. ..', `$' >$$ ~\,* "f+,, .`s:.,:~ ,.r}.' ,,} .~.?,t,., ~:+ +:~,1, \ ~.,, .\ J,>:! i ~t?t$$t ,~y:, \$i\, ~\th ... . .. ,.*,:J.:,. , he rightto make changestithomfutiher no~ceto any Pmu~sherein. Motorola m*es now~nv, repr=enta~on or9uara~ee re9ar~n9 ~of its products for any particular purpose, nor does Motorola assume any titi~~ arising out of the apphcation or use of any product or circuit, Iaims any and all tisbitity,including without Mmitationconsequential or incidental damages. `TypiW parameters can and do vary indifferent rating pe~meters, including `Typicals" must be validated for each customer application by customer's technical experts. Motorola does under rts patent rights nor the rights of others. Motorola pducts are not designed, intended, or authorized for use as components in ,~>, ~temsintendedforsurgiwl implatiintothe bdy, orotierqpfi@tions intended tosu~otiorsuSain hfe, or foranyotherappti@ion inwMchthefailureof Should Buyer purchase oruse Motorola produtisfor any such `"./ ~.~~WeMotorola produti muldcreate asituation where personal injuyor death maymur. ,:,. unintended orunatihorizd @pfimtion, Buyer shdlindemniVmd hold Motorola andtisofiwrs, employe=, subsidwi*, atitiat=, anddWributorshaml=s against all claims, costs, damages, and expenses, and r=sonable attorney fess arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was neg~gentregarding the design or manufacture of the part. Motorola and @are register~ trademarks of Motorola, lnC.Motorola, Inc. is an Equal Opportuni~/Affirmative Action Employer. I Literature Dlatrtbution Centeffi USA Motorola Literature Distibutiow P.O.Box 2091% Phoenix, Atizona 85036. EUROPE Motorola Ltd; European Lite@Ufe Osntr% 88 Tanners Drive, Blskelands, Milton Keynes, MK14 5BP, England. JAPAN: Nippon Motorola Ltd: W2-1, Nishi=otenda, Shinagawa-ku, Tokyo 141, Japan. ASIA PACIFIC: Motorola Semicondu@ors H.K. Ltd.; SihCOnHarbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. `. M~R-A @ 2PHXSM57F-1 PRINWD IN USA 1= MmoD .' SMALLSIGNAL YSASM' Pm2222AT1/D lllllllllllllllllllllllllllllllllllllllllllllllll 1111111111111111