LDBL20 200 mA very low quiescent current linear regulator IC in (0.47x0.47) mm STSTAMPTM package Datasheet - production data Applications Mobile phones Tablet Digital still cameras (DSC) Wearable devices Portable media players Description The LDBL20 high accuracy voltage regulator provides 200 mA of maximum current from an input voltage ranging from 1.5 V to 5.5 V, with a typical dropout voltage of 200 mV. It is available in the new STSTAMPTM package, allowing the maximum space saving. Features Input voltage from 1.5 to 5.5 V Ultra low dropout voltage (200 mV typ. at 200 mA load) Very low quiescent current (20 A typ. at no-load, 0.03 A typ. in off mode) Output voltage tolerance: 1.5% @ 25 C 200 mA guaranteed output current High PSRR (80 dB@1 kHz, 50 db@ 100 kHz) Wide range of output voltages available on request: from 0.8 V up to 5.0 V in 50 mV step Logic-controlled electronic shutdown Internal soft-start Optional output voltage discharge feature Compatible with ceramic capacitor COUT = 0.47 F Internal constant current and thermal protections Available in STSTAMPTM (0.47x0.47) mm package Operating temperature range: -40 C to 125 C August 2017 The device is stabilized with a ceramic capacitor on the output. The ultra low drop voltage, low quiescent current and low noise features, together with the internal soft-start circuit, make the LDBL20 suitable for low power batteryoperated applications. An enable logic control function puts the LDBL20 in shutdown mode with a total current consumption lower than 0.2 A. Constant current and thermal protection are provided. DocID028296 Rev 2 This is information on a product in full production. 1/21 www.st.com Contents LDBL20 Contents 1 Diagram ............................................................................................ 3 2 Pin configuration ............................................................................. 4 3 Typical application .......................................................................... 5 4 5 Maximum ratings ............................................................................ 6 Electrical characteristics ................................................................ 7 6 Application information .................................................................. 9 6.1 Soft-start function .............................................................................. 9 6.2 Output discharge function ................................................................. 9 6.3 Input output capacitors ...................................................................... 9 7 Typical characteristics .................................................................. 10 8 Recommendation on PCB assembly ........................................... 14 9 8.1 PCB design recommendations ........................................................ 14 8.2 Stencil ............................................................................................. 14 8.3 Solder paste .................................................................................... 14 8.4 Placement ....................................................................................... 14 8.5 Reflow profile .................................................................................. 15 Package information ..................................................................... 16 9.1 10 Ordering information..................................................................... 19 10.1 11 2/21 STSTAMPTM (0.47x0.47) mm package information ....................... 17 Marking information ......................................................................... 19 Revision history ............................................................................ 20 DocID028296 Rev 2 LDBL20 1 Diagram Diagram Figure 1: Block diagram The output discharge MOSFET is optional. DocID028296 Rev 2 3/21 Pin configuration 2 LDBL20 Pin configuration Figure 2: Pin connection "#" indicates the marking digit. Refer to Table 7: "Order code". The top horizontal bar identifies pin 1 on top right corner. Table 1: Pin description 4/21 Pin Symbol Function 3 OUT Output voltage 4 GND Common ground 1 EN Enable pin logic input: low = shutdown, high = active 2 IN Input voltage DocID028296 Rev 2 LDBL20 3 Typical application Typical application Figure 3: Typical application circuits VIN VI VOUT VO ON OF F EN L DB L 20 CIn COut G ND GIPD310820151119MT DocID028296 Rev 2 5/21 Maximum ratings 4 LDBL20 Maximum ratings Table 2: Absolute maximum ratings Symbol VIN Parameter Input voltage Value Unit - 0.3 to 7 V - 0.3 to VIN + 0.3 V - 0.3 to 7 V Output current Internally limited Power dissipation Internally limited mA mW VOUT Output voltage VEN Enable input voltage IOUT PD TSTG Storage temperature range - 40 to 150 C TOP Operating junction temperature range - 40 to 125 C Absolute maximum ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. All values are referred to GND. Table 3: ESD performance Symbol ESD Parameter Test conditions Value Unit HBM 4 kV MM 400 V CDM 500 V Value Unit 230 C/W ESD protection voltage Table 4: Thermal performance Symbol RthJA 6/21 Parameter Thermal resistance junction-ambient DocID028296 Rev 2 LDBL20 5 Electrical characteristics Electrical characteristics TJ = 25 C, VIN = VOUT(NOM) + 1 V or 1.5 V, whichever is greater, CIN = COUT = 1 F, IOUT = 1 mA, VEN = VIN, unless otherwise specified. Table 5: LDBL20 electrical characteristics Symbol Parameter VIN Operating input voltage VOUT VOUT VOUT VOUT accuracy Static line regulation(1) Static load regulation Test conditions IOUT = 1 mA, TJ = 25 C IOUT = 1 mA, -40 C 4.5 V (2)Turn-on time is time measured between the enable input just exceeding VEN high value and the output voltage just reaching 95 % of its nominal value 8/21 DocID028296 Rev 2 LDBL20 Application information 6 Application information 6.1 Soft-start function The LDBL20 has an internal soft-start circuit. By increasing the startup time up to 100 s, without the need of any external soft-start capacitor, this feature keeps the regulator inrush current at startup under control. 6.2 Output discharge function The LDBL20 integrates a MOSFET connected between VOUT and GND. This transistor is activated when the EN pin goes to low logic level and has the function to quickly discharge the output capacitor when the device is disabled by the user. The device is available with or without the auto-discharge feature. See Table 7: "Order code". 6.3 Input output capacitors The LDBL20 requires external capacitors to assure the regulator control loop stability. Any good quality ceramic capacitor can be used but, the X5R and the X7R are suggested since they guarantee a very stable combination of capacitance and ESR overtemperature. Locating the input/output capacitors as closer as possible to the relative pins is recommended. The LDBL20 requires an input capacitor with a minimum value of 1 F. This capacitor must be located as closer as possible to the input pin of the device and returned to a clean analog ground. The control loop of the LDBL20 is designed to work with an output ceramic capacitor. This capacitor must meet the requirements of minimum capacitance and equivalent series resistance (ESR), as shown in Figure 17: "Stability area vs (COUT, ESR)". To assure stability, the output capacitor must maintain its ESR and capacitance in the stable region, over the full operating temperature range. The LDBL20 shows stability with a minimum effective output capacitance of 220 nF. However, to keep stability in all operating conditions (temperature, input voltage and load variations), a minimum output capacitor of 0.47 F is recommended. The suggested combination of 1 F input and output capacitors offers a good compromise among the stability of the regulator, optimum transient response and total PCB area occupation. DocID028296 Rev 2 9/21 Typical characteristics 7 LDBL20 Typical characteristics (CIN = COUT = 1 F, VEN to VIN, TJ = 25 C unless otherwise specified) Figure 5: Output voltage vs temperature (IOUT = 200 mA) Figure 6: Line regulation vs temperature Figure 7: Load regulation vs temperature Figure 8: Quiescent current vs temperature (IOUT = 0 mA) Figure 9: Quiescent current vs temperature (IOUT = 200 mA) Load regulation Figure 4: Output voltage vs temperature (IOUT = 1 mA) 10/21 DocID028296 Rev 2 LDBL20 Typical characteristics Figure 10: Shutdown current vs temperature Figure 11: Quiescent current vs load current Figure 12: Quiescent current vs input voltage Figure 13: Dropout voltage vs temperature Figure 14: Supply voltage rejection vs frequency Figure 15: Supply voltage rejection vs input voltage DocID028296 Rev 2 11/21 Typical characteristics 12/21 LDBL20 Figure 16: Output noise spectral density Figure 17: Stability area vs (COUT, ESR) Figure 18: Enable startup (VOUT = 1 V) Figure 19: Enable startup (VOUT = 5 V) Figure 20: Turn-on time (VOUT = 1 V) Figure 21: Turn-off time (VOUT = 1 V) DocID028296 Rev 2 LDBL20 Typical characteristics Figure 22: Turn-on time (VOUT = 5 V) Figure 23: Turn-off time (VOUT = 5 V) Figure 24: Line transient (VOUT = 1 V) Figure 25: Line transient (VOUT = 5 V) Figure 26: Load transient (VOUT = 1 V) Figure 27: Load transient (VOUT = 5 V) DocID028296 Rev 2 13/21 Recommendation on PCB assembly LDBL20 8 Recommendation on PCB assembly 8.1 PCB design recommendations 8.2 Stencil 8.3 95.8% Sn, 3.5% Ag, 0.7% Cu solder paste Halide-free flux qualification ROL0 according to ANSI/J-STD-004 "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m.* type 4 Placement 14/21 Stencil aperture: see drawing in Figure 31: "STSTAMPTM (0.47x0.47) mm recommended solder stencil" Stencil thickness: 75 m Solder paste 8.4 PCB PAD design: non solder mask defined PCB pad size: see drawing in Figure 30: "STSTAMPTM (0.47x0.47) mm recommended footprint" Solder mask opening: 50 m between the edge of the pad and the edge of the solder mask To keep under control the solder paste amount, closed vias are recommended instead of open vias The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to reduce the effect of tilt phenomena caused by asymmetrical solder paste amount due to the solder flowing away Manual positioning is not recommended It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools DocID028296 Rev 2 LDBL20 8.5 Recommendation on PCB assembly Reflow profile Figure 28: ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID028296 Rev 2 15/21 Package information 9 LDBL20 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK (R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 16/21 DocID028296 Rev 2 LDBL20 9.1 Package information STSTAMPTM (0.47x0.47) mm package information Figure 29: STSTAMPTM (0.47x0.47) mm package outline DocID028296 Rev 2 17/21 Package information LDBL20 Table 6: STSTAMPTM (0.47x0.47) mm mechanical data mm Dim. Min. Typ. Max. A 0.18 0.200 0.220 b 0.060 0.065 0.070 b1 0.109 0.114 0.119 E 0.450 0.480 0.510 E1 0.208 0.213 0.218 E2 0.019 0.024 0.029 E3 0.034 0.039 0.044 D 0.450 0.480 0.510 D1 0.252 0.257 0.262 D2 0.255 0.260 0.265 fE 0.095 0.101 0.106 fD 0.106 0.111 0.116 Figure 30: STSTAMPTM (0.47x0.47) mm recommended footprint 0.1 0.25 0.25 0.1 0.25 0.25 Figure 31: STSTAMPTM (0.47x0.47) mm recommended solder stencil 120 m 180 m 180 m 120 m 180 m 180 m 18/21 DocID028296 Rev 2 LDBL20 10 Ordering information Ordering information Table 7: Order code 10.1 Order code Output voltage (V) LDBL20D-18R 1.8 LDBL20D-25R 2.5 LDBL20D-33R 3.3 Auto-discharge Marking Packing A Yes B Tape and reel C Marking information Figure 32: Marking composition (marking view) The symbol "#" indicates the marking digit, as per Table 7: "Order code". DocID028296 Rev 2 19/21 Revision history 11 LDBL20 Revision history Table 8: Document revision history Date Revision 10-Nov-2015 1 Initial release 2 Updated Section 2: "Pin configuration", Table 5: "LDBL20 electrical characteristics ". Added Section 8: "Recommendation on PCB assembly". Updated Section 10: "Ordering information". Minor text changes. 02-Aug-2017 20/21 Changes DocID028296 Rev 2 LDBL20 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2017 STMicroelectronics - All rights reserved DocID028296 Rev 2 21/21