Memory Module Specifications KVR1333D3S8N9H/2G 2GB 1Rx8 256M x 64-Bit PC3-10600 CL9 240-Pin DIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM's 256M x 64-bit (2GB) CL(IDD) 9 cycles DDR3-1333 CL9 SDRAM (Synchronous DRAM), 1Rx8 memory Row Cycle Time (tRCmin) 49.5ns (min.) module, based on eight 256M x 8-bit DDR3-1333 FBGA compo- Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) nents. The SPD is programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. This 240-pin DIMM uses Row Active Time (tRASmin) 36ns (min.) gold contact fingers. The electrical and mechanical specifica- Maximum Operating Power 2.160 W* tions are as follows: UL Rating 94 V - 0 Operating Temperature 0o C to 85o C FEATURES Storage Temperature -55o C to +100o C * JEDEC standard 1.5V (1.425V ~1.575V) Power Supply *Power will vary depending on the SDRAM used. * VDDQ = 1.5V (1.425V ~ 1.575V) * 667MHz fCK for 1333Mb/sec/pin * 8 independent internal bank * Programmable CAS Latency: 9, 8, 7, 6 * Programmable Additive Latency: 0, CL - 2, or CL - 1 clock * Programmable CAS Write Latency(CWL) = 7 (DDR3-1333) * 8-bit pre-fetch * Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] * Bi-directional Differential Data Strobe * Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) * On Die Termination using ODT pin * Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C * Asynchronous Reset * PCB Height: 1.18" (30mm), single sided component Continued >> Document No. VALUERAM1020-001.B00 05/18/12 Page 1 MODULE DIMENSIONS: T E C H N O L O G Y 133.35 Units: millimeters 30.00 18.80 15.80 11.00 8.00 54.70 0.00 0.00 Document No. VALUERAM1020-001.B00 Page 2