KVR1333D3S8N9H/2G
2GB 1Rx8 256M x 64-Bit PC3-10600
CL9 240-Pin DIMM
DESCRIPTION
This document describes ValueRAM's 256M x 64-bit (2GB)
DDR3-1333 CL9 SDRAM (Synchronous DRAM), 1Rx8 memory
module, based on eight 256M x 8-bit DDR3-1333 FBGA compo-
nents. The SPD is programmed to JEDEC standard latency
DDR3-1333 timing of 9-9-9 at 1.5V. This 240-pin DIMM uses
gold contact fingers. The electrical and mechanical specifica-
tions are as follows:
FEATURES
•JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
•VDDQ = 1.5V (1.425V ~ 1.575V)
•667MHz fCK for 1333Mb/sec/pin
•8 independent internal bank
•Programmable CAS Latency: 9, 8, 7, 6
•Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
•8-bit pre-fetch
•Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
•Bi-directional Differential Data Strobe
•Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•On Die Termination using ODT pin
•Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
•Asynchronous Reset
•PCB Height: 1.18” (30mm), single sided component
Document No. VALUERAM1020-001.B00 05/18/12 Page 1
Memory Module Specifi cations
*Power will vary depending on the SDRAM used.
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power 2.160 W*
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
Continued >>