Chip Beads & Inductors Introduction Chip Components Guide SAMWHA's CB, CBA,CM, CD series of chip components consist of compact, high performance beads and inductors. Their innovative components and case structures mean low DC resistance and outstanding highfrequency characteristics. These series are designed for a variety of applications, facilitating component selection for individual circuit requirements. Products Guide Product Name Chip Ferrite Beads Application Material Part Number Impedance/ Inductance range Signal Line (G) General Frequency (A) CBGA 10~4000 CBGK 60~1000 High Power Line Medium Frequency (P) (K) CBGM 5~1000 CBPA 11~600 CBPM 50~600 CBUM 50~120 Ultra High Power Line(U) Chip Ferrite Beads Array Chip Ferrite Signal Line Signal Line Inductors Chip Ceramic Inductors 36 High Frequency (M) CMF Ceramic (C) 3216 30~1000 60~1000 3216 30~1000 0.047~33H (F) Signal Line 1608 2012 General Frequency CBAGA (A) Medium Frequency CBAGK (K) High Frequency CBAGM (M) Ferrite Dimensions 1608 2012 CDC 1.0~470nH 1005 1608 Chip Beads & Inductors Part Numbering CB 1608 G A 102 T CM 1608 F R22 K T CBA 3216 G A 102 N4 E CD 1608 C 22N J T Series Mark CB CBA CM CD Impedance Product Name Chip Ferrite Beads Chip Ferrite Beads Array Chip Ferrite Inductors Chip Ceramic Inductors Dimension Mark 1005 1608 2012 3216 Dimension 1.0mmx0.5mm 1.6mmx0.8mm 2.0mmx1.25mm 3.2mmx1.6mm Applications Mark G P U Applications Signal Line High Power Line Ultra High Power Line Material Mark A K M F C Material General Frequency Medium Frequency High Frequency Ferrite Ceramic 300 = 30 601 = 600 201 = 200 102 = 1000 Inductance 22N = 22nH 2R2 = 2.2H 3N3 = 3.3nH R22 = 0.22H Number of circuits N4 = 4 array Inductance Tolerance Mark G J K M N C S D Tolerance 2% 5% 10% 20% 30% 0.2nH 0.3nH 0.5nH Packaging Code Mark B T E Packaging Bulk Pack Tape & Reel Pack Embossed Tape Pack 37 Chip Ferrite Beads Array Features Applications 1. Good reliability (Monolithic Structure) 2. High impedance characteristics 3. Flow/Reflow solder application 1. Computer and its peripherals 2. CD-ROM, DVD, MD lines 3. I/O lines of notebook PCs, W/Ps 4. Digital TVs and VTRs Product Identifications CBA 3216 G A 102 N4 E Series Code Material Code A : General frequency K : Medium frequency M : High frequency Impedance Value Code CBA : Chip Ferrite Beads Array The first two digits are significant The last digit is the number of zeros following Dimension Code Number of circuits The first two digits : length(mm) The last two digits : width(mm) N4 = 4 array Application Code Packaging Code G : Signal line T : Reed paper packaging E : Reed embossed tape packaging B : Bulk packaging Shape & Dimensions (Unit:mm) 56 Model L W T B D E CBA3216 3.20.2 1.60.2 0.90.2 0.30.2 0.40.15 0.80.1 Chip Ferrite Beads Array Specifications Part No. CB3216GA300N4 CB3216GA600N4 CB3216GA121N4 CB3216GA151N4 CB3216GA201N4 CB3216GA221N4 CB3216GA301N4 CB3216GA331N4 CB3216GA471N4 CB3216GA601N4 CB3216GA102N4 CB3216GK600N4 CB3216GK121N4 CB3216GK151N4 CB3216GK201N4 CB3216GK221N4 CB3216GK301N4 CB3216GK471N4 CB3216GK601N4 CB3216GK102N4 Impedance [] 3025% 6025% 12025% 15025% 20025% 22025% 30025% 33025% 47025% 60025% 100025% 6025% 12025% 15025% 20025% 22025% 30025% 47025% 60025% 100025% DC Resistance []max. 0.10 0.25 0.30 0.35 0.35 0.35 0.40 0.40 0.45 0.50 0.70 0.25 0.30 0.35 0.35 0.35 0.40 0.50 0.60 0.75 Rated Current (mA)max. 200 200 300 300 200 150 100 100 100 100 50 400 350 250 250 250 250 200 200 150 Test Frequency [MHz] 100 57 Chip Ferrite Beads Array Electrical Characteristics 90 45 R 15 X 100 225 X 30 400 10 100 CBA 3216 GA 201 N4 X 60 0 1000 1 400 10 100 1000 CBA 3216 GA 221 N4 300 R 200 X 100 0 1000 CBA 3216 GA 301 N4 Z 200 R 100 X 0 1 600 10 100 1000 CBA 3216 GA 471 N4 Z 1 800 10 100 Z 600 450 R 1 10 100 1000 Impedance X 100 0 58 Impedance Impedance R 200 300 X 150 0 400 10 100 1000 X 200 0 1 1000 CBA 3216 GA 601 N4 Z R 300 100 R 120 Z X 1 10 300 R 75 0 1 400 Z 150 Z R 1000 CBA 3216 GA 151 N4 180 Impedance 10 CBA 3216 GA 121 N4 240 Z 60 0 1 300 Impedance Impedance 30 Impedance Impedance Z 0 CBA 3216 GA 600 N4 120 Impedance CBA 3216 GA 300 N4 60 1 10 100 1000 Chip Ferrite Beads Array Electrical Characteristics CBA 3216 GA 102 N4 1200 CBA 3216 GA 600 N4 200 CBA 3216 GA 121 N4 240 Z 0 1 100 R X 50 0 1000 CBA 3216 GK 151 N4 300 100 Impedance X 10 R Z 600 300 Z 180 150 R Impedance Impedance 900 1 10 100 X 60 0 1000 CBA 3216 GK 221 N4 400 120 1 10 100 CBA 3216 GK 301 N4 500 Z Z R 120 X 60 1 800 10 100 200 X 100 0 1000 CBA 3216 GK 471 N4 1 800 10 Impedance R 400 X 200 10 100 200 X 100 1 10 1000 R X 200 1 10 100 1000 Z 900 400 0 100 CBA 3216 GK 102 N4 1200 Z 600 1 R 300 0 1000 CBA 3216 GK 601 N4 Z 500 Impedance 100 Impedance 0 Impedance R 180 0 Z 400 300 Impedance Impedance 240 1000 1000 R 600 X 300 0 1 10 100 1000 59 Chip Ferrite Beads Array Specifications Part No. CBA3216GM300N4 CBA3216GM600N4 CBA3216GM800N4 CBA3216GM121N4 CBA3216GM201N4 CBA3216GM301N4 CBA3216GM471N4 CBA3216GM601N4 CBA3216GM102N4 60 Impedance [] 3025% 6025% 8025% 12025% 20025% 30025% 47025% 60025% 100025% DC Resistance []max. 0.10 0.12 0.15 0.20 0.30 0.45 0.45 0.50 0.80 Rated Current (mA)max. 200 200 150 100 100 100 100 100 100 Test Frequency [MHz] 100 Chip Ferrite Beads Array Electrical Characteristics 150 60 R X 30 10 100 1000 CBA 3216 GM 121 N4 X 1 10 100 CBA 3216 GM 201 N4 600 R 80 0 1000 Z X 1 10 1000 CBA 3216 GM 301 N4 600 Z 450 450 X 60 1 10 100 CBA 3216 GM 471 N4 R 300 X 150 0 1000 Impedance 120 R Z R 180 300 X 150 0 1 10 100 1000 CBA 3216 GM 601 N4 1200 1000 1 10 250 600 1000 X 300 0 100 R Impedance Impedance X 10 1500 R R 1 1000 Z 900 500 0 100 CBA 3216 GM 102 N4 2000 Z Z 750 Impedance 100 Z 240 0 160 R 50 CBA 3216 GM 800 N4 240 Z 100 0 1 300 Impedance Impedance Z Impedance Impedance 90 0 CBA 3216 GM 600 N4 200 Impedance CBA 3216 GM 300 N4 120 1 10 100 1000 1000 X 500 0 1 10 100 1000 61 Reliability and Test Conditions Chip Ferrite Beads Array Item Requirements Test Conditions Operating temperature range -55 ~ +125 - Storage temperature range 40max., 70%RH max. at packing condition Solderability More than 90% of the terminal electrode shall be covered with new solder Preheat temperature : 100~150 Preheat time : 60 sec. Solder temperature : 23010 Soldering time : 41 sec. Resistance to soldering heat 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 30% Preheat temperature : 100~150 Preheat time : 60 sec. Solder temperature : 27010 Soldering time :100.5 sec. More than 50% of the terminal electrode shall be covered with new solder Reflow soldering Preheat temperature : 150 Preheat time : 60 sec. Solder temperature : 23010 Soldering time :10 sec. max. (Reflow soldering profile) High temperature resistance Temperature : 852 Time : 50012 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance Humidity resistance 1. No mechanical damage 2. Impedance shall not change more than 30% Temperature : 852 Applied current : rated current Time : 100012 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 402 Humidity : 902%RH Time : 50012 hours Measurement at room ambient temperature after placing for 24 hours Chip Beads 76 Chip Inductors Reliability and Test Conditions Chip Ferrite Beads Array Item Requirements Test Conditions Humidity lood resistance Temperature : 402 Humidity : 902% RH Applied current : rated current Time : 50012 hours Measurement at room ambient temperature after placing for 24hours Low temperature resistance Temperature : -405 Time : 100012 hours Measurement at room ambient temperature after placing for 24hours Thermal Shock 1. No mechanical damage 2. Impedance shall not change more than 30% 1. -403 for 30 minutes 2. 853 for 30 minutes 3. repeat 100 cycle Vibration Frequency : 10~55 Hz Amplitude : 1.5 mm Direction : X, T, Z Sweep time : 2 hours for each axis Drop Drop 10 times on a concrete floor from a height of 100 cm No mechanical damage Flexure strength Bending Strength Type A [mm] B [mm] C [mm] D [mm] W [kgf] 4 Array 0.8 0.8 3.0 0.4 5.0 The terminal electrode shall be neither break off nor the chip damage Chip Beads Chip Inductors 77 Packaging Bulk packaging Polybags / Box Pcs / Polybag 5 1,000 Reel packaging (Unit:mm) A 1782 Type 1005 1608 Q'TY(PCS) 10,000 4,000 Leader and Blank portion 78 B C 50min. 130.5 D E W 40.8 20.2 91.5 2012 (T)0.85 (T)1.25 4,000 3,000 3216 Array 3,000 3,000 Packaging Taping Dimension *Embossing Tape Unit : mm Type A 0.1 B 0.1 C D 0.1 0.1 1608 1.80 1.00 0.95 0.23 2012 2.25 1.45 1.00 0.23 3216 3.50 1.85 1.25 0.23 *Paper Tape Unit : mm Type A 0.1 B 0.1 C D T 0.1 0.05 (max) 1005 1.15 0.65 2.0 1.0 0.8 1608 1.80 1.00 4.0 2.0 1.1 2012 2.30 1.55 4.0 2.0 1.1 79 Land Pattern Design Land Patten Design Chip Ferrite Beads, Chip Ceramic/Ferrite Inductors Unit : mm Type A B C 1005 0.7 0.4 0.5 1608 1.0 0.6 0.8 2012 1.0 1.0 1.0 3216 1.1 2.2 1.4 Chip Ferrite Beads Array Unit : mm 80 Type A B C D 3216 0.8 0.8 3.0 0.4 Soldering Profile Typocal Performance Characteristics a Soldering Profile Reflow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min 10 sec. max 60 sec. min Flow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min 3 sec. max 60 sec. min Flow Soldering 300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. To 2 sec. max ! Specifications which provide more details for the proper and safe use described product are available upon request. All specifications are subject to change without notice. 81