C100XXxx Ze > 1746 | ADD ROHS P/N 6/18/45 | T.S. D6/.12 WDE BLACK STRFE B/W 10x0200%-2xEXP10d (WTH BLACK STRPE) | ~*~ .100 TR. | -210 7B". 08D >| A. ~| |~.100 TYP. +C LL 7 7 | one EDO ee 190 f 3 naseete {315 +C .025 SQ. PIN \ 1 TABLE I PART No. | DIM."C 100XXXX2Xa02 | 1804-020 .D1D XXX +.02D 1OGXXXX2X01 | 120 Vary SEE NOTE #1 SELECTIVE GOLD PLATE = (SEE NOTE 43) TABLE_I No. OF DIM DIM 33 PART No. POS "A B* 1O0X-X022xX0X| 2 | .100+.010 | .200+.015 X03 3___|.200 300 x04 4 | .300 400 c" X06 5 .400 500 X06 6 -500 -600 SELECTIVE TIN PLATE (SEE NOTE #3) X07 7 | 800 -700 030 TP x08 8 |.700 800 . . x09 g__| .B00 .800 x10 10 | .A00 1.000 SECTION C-C xu 14 1.000 1.100 NOTES: x12 12 1.106 1.200 1) PART CAN BE SUPPLIED WITH HOOKS; P/N 100X-1XX2xOXW X13 131 1.200 1.300 AND/OR WITHOUT HOOKS: P/N 100X-OXX-2XOXW. PART NUMBER LEGEND X14 14 1.300 1.400 XXX _ X15 15 _| 1.400 1.500 2) INSULATOR MATERIAL: NYLON 6/6, ULL. 94V-0: TOXX- XXX ZXOX-PXXXW X16 16 1.500 1.800 CONTACT MATERIAL! 1GOXXXXZU0XW: PHOSPHOR BRONZE, ALLOY 510; ROHS CONPONNT ag A LEAD FREE PLATE AND WILL X17 17 11.600 1.700 1GOXXXX-2Z10XW: BRASS, ALLOY 260. AGCUIMMDDATE LEAD FREE WAVE SOLDER PROCESSES X18 1B 1.700 7.800 3) GONTACT FINISH; 1009-XXXZX0X; BRITE TIN PLATE (.0001/.0002) OVER tO ee X19 19 __| 4.800 1.300 10GOXXX2XOXW: .100100/.DG0200 MATTE TIN OVER CUNIACT MATERIAL (SEE NOTE 2) X21 21 2000 2.100 .00030/.000060 NKKEL, ROHS COMPLIANT NUMBER OF POSTIONS (SEE TARE f) X22 D2 3.100 7.200 10D2-XXX-2X0X: GOLD PLATE (.000015) OVER INSULATOR: STYLEs 0 = WITHOUT HOOKS X23 23 | 2.200 2.300 NICKEL UNDERPLATE (.000050); CONTACT PLATING (SEF NOTE 3) = WITH HOOKS X24 24 | 2300 2.400 10DB-XXX-2XOX: SELECT GOLD PLATE (.COd020 MIN.) X25 25 2.400 2500 AND SELECT TIN PLATE (.0002) WITH INSULATOR MATERIAL (SEE NOTE 2) X26 28 12.500 7.6800 NIGKEL UNDERPLATE (.000050) OVERALL; X77 271 2.800 2-700 1GOBXXX2KOXW: ae GOLO wae ee pe (cont /.0002) wm 100X-X28-2x0x| 2B | 2.700.010] 2.600+.015 NICKEL UNDERPLATE. (.000050/.000150) OVERALL; ROHS GOMPUANT : 100EXXX2XOX: Sova0 TIN/LEAD {000150 MIN.) OVER TEM] QTY4 PART NO. _| DESCRIPTION | i NIGKEL UNDERPLATE. (.000050/.0001 50); ETHODE ELECTRONICS, INC. 1ODFXxX2X0X: SELECT GOLD PLATE (.0GOD30 MIN.) SEE NOTE #2 IWIERCONMERT PRODUCTS DIV. AND SELECT TIN PLATE (.0D02) WITH we O sce O OABRERA 3/a/0a NICKEL UNDERPLATE (000050) OVERALL, ee .100 CENTER DIP SOLDER 1O0FxXxX2X0XW: 000030 SELECTIVE GOLD IN CONTACT AREA um | T.SCHEMZ | 3/9/00 VERTICAL MOUNT CONNECTOR O0GOSO0/.000150 NICKEL ALL OVER ifn Ome Rute = | om | PAT NET La 00017-6002 SELECTIVE MATTE TION SOLDER TAIL Tr tims | O-CABRERA | 3/9/00 SEE NOTE #5 C | ish | C1 00xxxx Bas | A ROHS: COMPLIANT " [| T.SCHENZ | 3/8/00 =r 4X T* 1