NC7S14 TinyLogic HS Inverter with Schmitt Trigger Input Description The NC7S14 is a single high performance CMOS Inverter with Schmitt Trigger input. The circuit design provides hysteresis between the positive-going and negative going input thresholds thereby improving noise margins. Advanced Silicon Gate CMOS fabrication assures high speed and low power circuit operation over a broad VCC range. ESD protection diodes inherently guard both input and output with respect to the VCC and GND rails. www.onsemi.com MARKING DIAGRAMS SIP6 CASE 127EB Features * * * * * * * * * * Space Saving SC-74A and SC-88A 5-Lead Package Ultra Small MicroPakTM Leadless Package Schmitt Input Hysteresis: >1 V Typ High Speed: tPD = 4.5 ns Typ Low Quiescent Power: ICC < 1 mA Balanced Output Drive: 2 mA IOL, -2 mA IOH Broad VCC Operating Range: 2 V - 6 V Balanced Propagation Delays Specified for 3 V Operation These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant A 1 Pin 1 SC-74A CASE 318BQ SC-88A CASE 419AC-01 UU, 7S14, S14 KK XY Z T IEEE / IEC Y Figure 1. Logic Symbol UUKK XYZ 7S14T S14T = Specific Device Code = 2-Digit Lot Run Traceability Code = 2-Digit Date Code Format = Assembly Plant Code = Die Run Code = Year Coding Scheme = Plant Code Identifier = Eight-Week Datacoding Scheme ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2004 July, 2019 - Rev. 3 1 Publication Order Number: NC7S14/D NC7S14 Pin Configurations NC 1 5 NC 1 VCC A 2 A 2 GND 3 4 Y GND 3 Figure 2. SC-88A and SC-74A (Top View) 6 VCC 5 NC 4 Y Figure 3. MicroPak (Top Through View) PIN DESCRIPTIONS FUNCTION TABLE (Y = A) Pin Name Inputs Output A Input A Y Y Output L H No Connect H L NC Description H = HIGH Logic Level L = LOW Logic Level ABSOLUTE MAXIMUM RATINGS Symbol VCC IIK Parameter Min Max Unit -0.5 6.5 V VIN -0.5 V - -20 mA VIN VCC + 0.5 V - +20 Supply Voltage DC Input Diode Current VIN DC Input Voltage IOK DC Output Diode Current -0.5 VCC + 0.5 V VOUT < -0.5 V - -20 mA VOUT > VCC + 0.5 V - +20 -0.5 VCC + 0.5 V VOUT DC Output Voltage IOUT DC Output Source or Sink Current - 12.5 mA DC VCC or Ground Current per Output Pin - 25 mA ICC or IGND TSTG Storage Temperature -65 +150 C TJ Junction Temperature - +150 C TL Lead Temperature (Soldering, 10 Seconds) - +260 C PD Power Dissipation in Still Air SC-74A - 225 mW SC-88A-5 - 190 MicroPak - 327 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 NC7S14 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 6.0 V Input Voltage 0 VCC V Output Voltage 0 VCC V -40 +85 C SC-74A - 555 C/W SC-88A-5 - 659 MicroPak - 382 VCC Supply Voltage VIN VOUT TA Operating Temperature qJA Thermal Resistance Conditions Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. DC ELECTICAL CHARACTERISTICS TA = +25C TA = -40 to +85C Symbol Parameter VCC (V) Min Typ Max Min Max Unit VP Positive Threshold Voltage 2.0 3.0 4.5 6.0 - - - - 1.29 1.90 2.73 3.56 1.5 2.2 3.15 4.2 - - - - 1.6 2.2 3.15 4.2 V VN Negative Threshold Voltage 2.0 3.0 4.5 6.0 0.3 0.6 1.13 1.5 0.70 1.05 1.66 2.24 - - - - 0.3 0.6 1.13 1.5 VH Hysteresis Voltage 2.0 3.0 4.5 6.0 0.3 0.4 0.6 0.8 0.59 0.85 1.08 1.31 1.0 1.3 1.4 1.7 0.3 0.4 0.6 0.8 1.0 1.3 1.4 1.7 V HIGH Level Output Voltage 2.0 3.0 4.5 6.0 1.90 2.90 4.40 5.90 2.0 3.0 4.5 6.0 - - - - 1.90 2.90 4.40 5.90 - - - - V 2.68 4.18 5.68 2.87 4.37 5.86 - - - 2.63 4.13 5.63 - - - - - - - 0.0 0.0 0.0 0.0 0.10 0.10 0.10 0.10 - - - - 0.10 0.10 0.10 0.10 VOH 3.0 4.5 6.0 VOL LOW Level Output Voltage 2.0 3.0 4.5 6.0 Conditions IOH = -20 mA VIN = VIL VIN = VIL IOH = -1.3 mA IOH = -2.0 mA IOH = -2.6 mA IOL = 20 mA VIN = VIH V 3.0 4.5 6.0 VIN = VIH IOL = 1.3 mA IOL = 2.0 mA IOL = 2.6 mA - - - 0.1 0.1 0.1 0.26 0.26 0.26 - - - 0.33 0.33 0.33 V V V IIN Input Leakage Current 6.0 VIN = VCC, GND - - 0.1 - 1.0 mA ICC Quiescent Supply Current 6.0 VIN = VCC, GND - - 1.0 - 10.0 mA www.onsemi.com 3 NC7S14 AC ELECTRICAL CHARACTERISTICS TA = +25C TA = -40 to +85C Min Typ Max Min Max Unit CL = 15 pF - 4.5 21 - - ns 2.0 3.0 4.5 6.0 CL = 50 pF - - - - 20 12 8.5 7.5 100 27 20 17 - - - - 125 35 25 21 ns 5.0 CL = 15 pF - 3 8 - - ns 2.0 3.0 4.5 6.0 CL = 50 pF - - - - 25 16 11 9 125 35 25 21 - - - - 145 45 30 24 ns - 2 10 - 10 pF - 7 - - - pF Symbol Parameter VCC (V) tPLH tPHL Propagation Delay (Figure 4, 6) 5.0 tTLH tTHL Output Transition Time (Figure 4, 6) CIN Input Capacitance CPD Power Dissipation Capacitance (Figure 5) Conditions Open 5.0 (Note 2) 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). AC Loading and Waveforms VCC INPUT OUTPUT CL CL includes load and stray capacitance Input PRR = 1.0 MHz; tW = 500 ns Figure 6. AC Waveforms Figure 4. AC Test Circuit VCC A INPUT Input = AC Waveforms; PRR = Variable; Duty Cycle = 50%. Figure 5. ICCD Test Circuit www.onsemi.com 4 NC7S14 ORDERING INFORMATION Top Mark Package Description Shipping NC7S14M5X 7S14 SC-74A 3000 / Tape & Reel NC7S14P5X S14 SC-88A 3000 / Tape & Reel NC7S14L6X UU SIP6, MicroPak 5000 / Tape & Reel Part Number For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC-74A CASE 318BQ ISSUE B 5 1 SCALE 2:1 DATE 18 JAN 2018 5X b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 e D A L DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIM A A1 b c D E E1 e L M TOP VIEW A SIDE VIEW DETAIL A C c SEATING PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT* MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ GENERIC MARKING DIAGRAM* 0.95 PITCH XXX MG G XXX M G 2.40 = Specific Device Code = Date Code = Pb-Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot " G", may or may not be present. Some products may not follow the Generic Marking. 5X 1.00 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON66279G ON SEMICONDUCTOR STANDARD NEW STANDARD: (c) Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 - Rev. 0 SC-74A http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON66279G PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ BY I. HYLAND. 27 JUN 2017 A CORRECTED MARKING DIAGRAM FROM 6 TO 5-LEAD. REQ BY I. HYLAND. 20 SEP 2017 B CORRECTED SOLDERING FOOTPRINT PITCH FROM 3.40MM TO 2.40MM. REQ. BY I. HYLAND. 18 JAN 2018 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. (c) Semiconductor Components Industries, LLC, 2018 January, 2018 - Rev. B Case Outline Number: 318BQ MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC-88A (SC-70 5 Lead), 1.25x2 CASE 419AC-01 ISSUE A D e e E1 E DATE 29 JUN 2010 SYMBOL MIN A 0.80 MAX 1.10 A1 0.00 0.10 A2 0.80 1.00 b 0.15 0.30 0.18 c 0.10 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 0.65 BSC e L TOP VIEW NOM 0.26 0.36 L1 0.42 REF L2 0.15 BSC 0.46 0 8 1 4 10 q1 A2 A q b q1 L L1 A1 SIDE VIEW c L2 END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. DOCUMENT NUMBER: DESCRIPTION: 98AON34260E Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. 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