SCDS161A - MAY 2004 - REVISED OCTOBER 2004 D Wide Bandwidth (BW = 350 MHz Min) D Low Differential Crosstalk D Data and Control Inputs Have Undershoot (XTALK = -68 dB Typ) D Low Power Consumption (ICC = 10 mA Max) D Bidirectional Data Flow, With Near-Zero D 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC E ID0 ID1 YD IC0 IC1 YC IA0 IA1 YA IB0 IB1 YB 1 16 15 E 14 ID0 2 3 13 ID1 12 YD 4 5 6 7 8 9 YC S IA0 IA1 YA IB0 IB1 YB GND VCC RGY PACKAGE (TOP VIEW) D, DBQ, DGV, OR PW PACKAGE (TOP VIEW) S D D D GND D D Propagation Delay Low ON-State Resistance (ron = 5 W Typ) Rail-to-Rail Switching on Data I/O Ports (0 to VCC) VCC Operating Range From 3 V to 3.6 V Ioff Supports Partial-Power-Down Mode Operation D Clamp Diodes Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 - 2000-V Human-Body Model (A114-B, Class II) - 1000-V Charged-Device Model (C101) Suitable for Both 10 Base-T/100 Base-T Signaling 11 IC0 10 IC1 description/ordering information The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled and the I port is connected to the Y port. When E is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer. ORDERING INFORMATION QFN - RGY SOIC - D 0C 0 C to 70 70C C ORDERABLE PART NUMBER PACKAGE TA SSOP (QSOP) - DBQ TSSOP - PW Tape and reel TS3L100RGYR Tube TS3L100D Tape and reel TS3L100DR Tape and reel TS3L100DBQR Tube TS3L100PW Tape and reel TS3L100PWR TOP-SIDE MARKING TK100 TS3L100 TK100 TK100 TVSOP - DGV Tape and reel TS3L100DGVR TK100 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" #!$% &"' &! #" #" (" " ") !" && *+' &! #", &" ""%+ %!&" ", %% #""' POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 description/ordering information (continued) This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS E INPUT/OUTPUT YX S FUNCTION L L H IX0 IX1 YX = IX0 L H X Z Disconnect YX = IX1 PIN DESCRIPTIONS PIN NAME IAn-IDn S Select input E Enable input YA-YD 2 DESCRIPTION Data I/Os Data I/Os POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 logic diagram (positive logic) 2 4 IA0 YA 3 IA1 YB 7 5 IB0 6 IB1 9 11 YC 10 YD 12 14 13 S IC0 IC1 ID0 ID1 1 15 Control Logic E POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 4.6 V Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 4.6 V Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 4.6 V Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Package thermal impedance, JA (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82C/W DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground, unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. VI and VO are used to denote specific conditions for VI/O. 4. II and IO are used to denote specific conditions for II/O. 5. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 6) MIN MAX VCC VIH Supply voltage 3 3.6 UNIT V High-level control input voltage (E, S) 2 Low-level control input voltage (E, S) 0 VCC 0.8 V VIL TA Operating free-air temperature 0 70 C V NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 electrical characteristics over recommended VCC = 3.3 V + 0.3 V (unless otherwise noted) PARAMETER VIK Vhys E, S IIH IIL E, S operating free-air TEST CONDITIONS IIN = -18 mA VCC = 3.6 V, VCC = 3.6 V, VIN = VCC VIN = GND TYP MAX UNIT -1.8 V IOZ VCC = 3.6 V, VO = 0 to 3.6 V, VI = 0, Switch OFF IOS VCC = 3.6 V, VO = 0 to 0.5 VCC, VI = 0, Switch ON Ioff ICC VCC = 0, VCC = 3.6 V, VO = 0 to 3.6 V, II/O = 0, VI = 0 Switch ON or OFF VCC = 3.6 V, One input at VCC - 0.6 V, Other inputs at VCC or GND E, S E, S E, S ICCD CIN range, MIN VCC = 3 V, ICC temperature 150 VCC = 3.6 V, E, S I and Y ports open, A 1 A 1 A 50 mA 0.1 VIN input switching 50% duty cycle f = 1 MHz I port mV 1 15 A 10 A 750 A 0.45 mA/ MHz 3 pF 5 VI = 0, f = 1 MHz, Outputs open, Switch OFF CON VI = 0, f = 1 MHz, Outputs open, Switch ON 17 IO = 48 mA 7 VCC = 3 V VI = 0 V, 5 ron VI = 2 V, IO = 15 mA 10 15 ron VI = 3 V, Switch ON, IO = 15 mA 1 COFF Y port pF 10 pF VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25C. For I/O ports, the parameter IOZ includes the input leakage current. The IOS test is applicable to only one ON channel at a time. The duration of this test is less than one second. switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V + 0.3 V, RL = 100 , CL = 35 pF (unless otherwise noted) (see Figure 4) PARAMETER tON FROM (INPUT) TO (OUTPUT) S tOFF S All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25C. dynamic characteristics over recommended VCC = 3.3 V + 0.3 V (unless otherwise noted) PARAMETER operating MIN MAX Y 1 7.5 ns Y 1 3.5 ns free-air TYP TEST CONDITIONS XTALK(Diff) XTALK RL = 100 , f = 10 MHz, see Figure 8, RL = 100 , OIRR RL = 100 , temperature range, UNIT -55 dB f = 30 MHz, see Figure 6 -68 dB f = 30 MHz, see Figure 7 -42 dB 350 MHz BW RL = 100 , see Figure 5 All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25C. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 tr = tf = 2 ns UNIT 5 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 OPERATING CHARACTERISTICS 0 0 Phase -2 -20 -3 -30 Gain -4 -40 J -5 Y -50 -6 -60 -7 -70 -8 -80 -9 1 Y Gain 3 dB at 450 MHz 10 100 Frequency - MHz J Phase at 3-dB Frequency, -43 Degrees Figure 1. Gain/Phase vs Frequency 6 -10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 -90 600 Phase - Deg Gain - dB -1 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 OPERATING CHARACTERISTICS Off Isolation - dB -10 140 -20 120 -30 100 Phase J -40 80 Y Phase - Deg 160 0 60 -50 Off Isolation -60 40 -70 20 -80 1 10 100 0 600 Frequency - MHz Y Off Isolation at 30 MHz, -44.6 dB J Phase at 30 MHz, 84.41 Degrees Figure 2. Off Isolation vs Frequency POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 OPERATING CHARACTERISTICS 0 250 -20 200 -40 150 Crosstalk 100 Y -80 50 -100 0 -120 -50 Phase -140 -100 J -160 -150 -180 -200 -200 1 10 100 Frequency - MHz Y Crosstalk at 30 MHz, -67.3 dB J Phase at 30 MHz, -118.4 Degrees Figure 3. Crosstalk vs Frequency 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 -250 600 Phase - Deg Crosstalk - dB -60 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VS 50 S 50 VG1 IX0 DUT VX0 VO YX IX1 CL (see Note A) E RL VX1 TEST VCC RL CL VX0 VX1 tON 3.3 V + 0.3 V 3.3 V + 0.3 V 100 100 35 pF 35 pF GND 3V 3V GND tOFF 3.3 V + 0.3 V 3.3 V + 0.3 V 100 100 35 pF 35 pF GND 3V 3V GND TEST CIRCUIT 3V Output Control (VS) 50% 50% 0V tON Analog Output Waveform (VO) tOFF 90% 90% VOH 0V VOLTAGE WAVEFORMS tON AND tOFF TIMES NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. C. The outputs are measured one at a time, with one transition per measurement. Figure 4. Test Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC IA0 YA RL = 100 S DUT VS E VE Figure 5. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VS = 0, VE = 0, and YA is the input, the output is measured at IA0. All unused analog I/O ports are left open. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC YA IA0 RL = 100 S 50 VS E DUT VE YB IB0 RL = 100 A 50- termination resistor is needed for the network analyzer. Figure 6. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VS = 0, VE = 0, and YA is the input, the output is measured at IB0. All unused analog input (Y) ports are connected to GND and output (I) ports are connected to GND through 50- pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC IA0 YA RL = 100 S DUT VS IA1 E RL = 100 50 VE A 50- termination resistor is needed for the network analyzer. Figure 7. Test Circuit for Off Isolation (OIRR) OFF isolation is measured at the output of the OFF channel. For example, when VS = VCC, VE = 0, and YA is the input, the output is measured at IA0. All unused analog input (Y) ports are left open and output (I) ports are connected to GND through 50- pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 12 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCDS161A - MAY 2004 - REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 3.3 V 0.1 F Oscilloscope S VO+ 16 IA0 2 15 IA1 3 14 ID0 4 13 ID1 YA 100 100 VO- VCC 1 TS3L100 E YD IB0 5 12 IB1 6 11 IC0 7 10 IC1 8 9 YB GND VI+ 100 YC 100 Pulse Generator VI- Figure 8. Differential Crosstalk Measurement Differential crosstalk is a measure of coupling noise between a transmit and receive pair in the LAN application. Differential crosstalk depends on the edge rate, frequency, and load. This is calculated from the equation, XTALK(Diff) db = 20 log VO(Diff)/VI(Diff), where VO(Diff) is the differential output voltage and VI(Diff) is the differential input voltage. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 13 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TS3L100DBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L100DBQRE4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L100DBQRG4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L100DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L100RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L100RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3L100DGVR Package Package Pins Type Drawing TVSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 TS3L100DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TS3L100PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TS3L100RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3L100DGVR TVSOP DGV 16 2000 367.0 367.0 35.0 TS3L100DR SOIC D 16 2500 333.2 345.9 28.6 TS3L100PWR TSSOP PW 16 2000 367.0 367.0 35.0 TS3L100RGYR VQFN RGY 16 3000 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated