SCDS161A − MAY 2004 – REVISED OCTOBER 2004
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DWide Bandwidth (BW = 350 MHz Min)
DLow Differential Crosstalk
(XTALK = −68 dB Typ)
DLow Power Consumption (ICC = 10 mA Max)
DBidirectional Data Flow, With Near-Zero
Propagation Delay
DLow ON-State Resistance (ron = 5 W Typ)
DRail-to-Rail Switching on Data I/O Ports
(0 to VCC)
DVCC Operating Range From 3 V to 3.6 V
DIoff Supports Partial-Power-Down Mode
Operation
DData and Control Inputs Have Undershoot
Clamp Diodes
DLatch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
DSuitable for Both 10 Base-T/100 Base-T
Signaling
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
S
IA0
IA1
YA
IB0
IB1
YB
GND
VCC
E
ID0
ID1
YD
IC0
IC1
YC
RGY PACKAGE
(TOP VIEW)
116
89
2
3
4
5
6
7
15
14
13
12
11
10
E
ID0
ID1
YD
IC0
IC1
IA0
IA1
YA
IB0
IB1
YB
S
YC V
GND
CC
description/ordering information
The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input.
When E is low, the switch is enabled and the I port is connected to the Y port. When E is high, the switch is
disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data
path of the multiplexer/demultiplexer.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
QFN − RGY Tape and reel TS3L100RGYR TK100
SOIC − D
Tube TS3L100D
TS3L100
SOIC − D Tape and reel TS3L100DR TS3L100
0°C to 70°CSSOP (QSOP) − DBQ Tape and reel TS3L100DBQR TK100
0C to 70 C
TSSOP − PW
Tube TS3L100PW
TK100
TSSOP − PW Tape and reel TS3L100PWR TK100
TVSOP − DGV Tape and reel TS3L100DGVR TK100
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!" #!$% &"'
&! #" #" (" " ") !"
&& *+' &! #", &" ""%+ %!&"
", %% #""'
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide
bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN
applications.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
INPUTS
INPUT/OUTPUT
FUNCTION
E S
INPUT/OUTPUT
YX
FUNCTION
L L IX0YX = IX0
LHIX
1YX = IX1
H X Z Disconnect
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
IAn−IDn Data I/Os
SSelect input
EEnable input
YA−YD Data I/Os
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
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logic diagram (positive logic)
YA IA0
IA1
IB0
IB1
IC0
IC1
ID0
ID1
E
S
YC
YB
YD
4
7
9
12
2
3
5
6
11
10
14
13
15
1
Control
Logic
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input voltage range, VIN (see Notes 1 and 2) −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input clamp current, IIK (VIN < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O port clamp current, II/OK (VI/O < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ON-state switch current, II/O (see Note 4) ±128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND terminals ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 5): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DBQ package 90°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground, unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
MIN MAX UNIT
VCC Supply voltage 3 3.6 V
VIH High-level control input voltage (E, S) 2 VCC V
VIL Low-level control input voltage (E, S) 0 0.8 V
TAOperating free-air temperature 0 70 °C
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
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electrical characteristics over recommended operating free-air temperature range,
VCC = 3.3 V + 0.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIK E, S VCC = 3 V, IIN = −18 mA −1.8 V
Vhys E, S 150 mV
IIH E, S VCC = 3.6 V, VIN = VCC ±1µA
IIL E, S VCC = 3.6 V, VIN = GND ±1µA
IOZ‡VCC = 3.6 V, VO = 0 to 3.6 V,
VI = 0, Switch OFF ±1µA
IOS§VCC = 3.6 V, VO = 0 to 0.5 VCC,
VI = 0, Switch ON 50 mA
Ioff VCC = 0, VO = 0 to 3.6 V, VI = 0 15 µA
ICC VCC = 3.6 V, II/O = 0, Switch ON or OFF 0.1 10 µA
∆ICC E, S VCC = 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND 750 µA
ICCD VCC = 3.6 V, I and Y ports open, VIN input switching 50% duty cycle 0.45 mA/
MHz
CIN E, S f = 1 MHz 3 pF
COFF
I port
VI = 0,
f = 1 MHz,
Outputs open,
Switch OFF
5
pF
C
OFF Y port
V
I
= 0,
f = 1 MHz,
Outputs open,
Switch OFF
10
pF
CON VI = 0, f = 1 MHz,
Outputs open, Switch ON 17 pF
ron
VCC = 3 V
VI = 0 V, IO = 48 mA 5 7
Ω
r
on
V
CC
= 3 V
VI = 2 V, IO = 15 mA 10 15 Ω
∆ron VI = 3 V, Switch ON, IO = 15 mA 1Ω
VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
†All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡For I/O ports, the parameter IOZ includes the input leakage current.
§The IOS test is applicable to only one ON channel at a time. The duration of this test is less than one second.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V + 0.3 V, RL = 100 Ω, CL = 35 pF (unless otherwise noted) (see Figure 4)
PARAMETER FROM
(INPUT) TO
(OUTPUT) MIN MAX UNIT
tON SY 1 7.5 ns
tOFF SY 1 3.5 ns
†All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
dynamic characteristics over recommended operating free-air temperature range,
VCC = 3.3 V + 0.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP†UNIT
XTALK(Diff) RL = 100 Ω,f = 10 MHz, see Figure 8, tr = tf = 2 ns −55 dB
XTALK RL = 100 Ω,f = 30 MHz, see Figure 6 −68 dB
OIRR RL = 100 Ω,f = 30 MHz, see Figure 7 −42 dB
BW RL = 100 Ω, see Figure 5 350 MHz
†All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OPERATING CHARACTERISTICS
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
1 10 100 600
Frequency − MHz
Gain − dB
−80
−70
−60
−50
−40
−30
−20
−10
0
Phase − Deg
−90
Y Gain 3 dB at 450 MHz
JPhase at 3-dB Frequency, −43 Degrees
J
Y
Phase
Gain
Figure 1. Gain/Phase vs Frequency
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OPERATING CHARACTERISTICS
−80
−70
−60
−50
−40
−30
−20
−10
0
1 10 100 600
Frequency − MHz
Off Isolation − dB
0
20
40
60
80
100
120
140
160
Phase − Deg
Y Off Isolation at 30 MHz, −44.6 dB
JPhase at 30 MHz, 84.41 Degrees
J
Y
Phase
Off Isolation
Figure 2. Off Isolation vs Frequency
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OPERATING CHARACTERISTICS
1 10 100 600
Frequency − MHz
Crosstalk − dB
−250
−150
−50
50
150
250
Phase − Deg
−200
−180
−160
−140
−120
−100
−80
−60
−40
−20
0
Y Crosstalk at 30 MHz, −67.3 dB
JPhase at 30 MHz, −118.4 Degrees
J
Y
200
0
100
−100
−200
Crosstalk
Phase
Figure 3. Crosstalk vs Frequency
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
CL
(see Note A)
TEST CIRCUIT
RL
Analog Output
Waveform
(VO)
tON
0 V
3 V
VOLTAGE WAVEFORMS
tON AND tOFF TIMES
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns.
C. The outputs are measured one at a time, with one transition per measurement.
50% 50%
50 Ω
VG1
VCC
DUT
50 Ω
VS
VX1
TEST CL
RLVX1
3.3 V + 0.3 V
3.3 V + 0.3 V
VCC VX0
tOFF
tON
3.3 V + 0.3 V
3.3 V + 0.3 V
100 Ω
100 Ω
100 Ω
100 Ω
35 pF
35 pF
35 pF
35 pF
GND
3 V
GND
3 V
3 V
GND
3 V
GND
Output
Control
(VS)
Input Generator
VO
VX0
S
IX0
IX1E
YX
0 V
VOH
tOFF
90%90%
Figure 4. Test Circuit and Voltage Waveforms
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Network Analyzer
(HP8753ES)
RL = 100 Ω
EXT TRIGGER
BIAS
P1 P2
DUT
YA
S
E
IA0
VE
VS
VCC
VBIAS
Figure 5. Test Circuit for Frequency Response (BW)
Frequency response is measured at the output of the ON channel. For example, when VS = 0, VE = 0, and YA is the
input, the output is measured at IA0. All unused analog I/O ports are left open.
HP8753ES setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Network Analyzer
(HP8753ES)
RL = 100 Ω
EXT TRIGGER
BIAS
P1 P2
DUT
YA
S
E
IA0
VE
VS
VCC
VBIAS
YB
RL = 100 Ω
IB0
50 Ω†
†A 50-Ω termination resistor is needed for the network analyzer.
Figure 6. Test Circuit for Crosstalk (XTALK)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VS = 0,
VE = 0, and YA is the input, the output is measured at IB0. All unused analog input (Y) ports are connected to GND
and output (I) ports are connected to GND through 50-Ω pulldown resistors.
HP8753ES setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Network Analyzer
(HP8753ES)
RL = 100 Ω
EXT TRIGGER
BIAS
P1 P2
DUT
YA
S
E
IA0
VE
VS
VCC
VBIAS
RL = 100 Ω
IA1
50 Ω†
†A 50-Ω termination resistor is needed for the network analyzer.
Figure 7. Test Circuit for Off Isolation (OIRR)
OFF isolation is measured at the output of the OFF channel. For example, when VS = VCC, VE = 0, and YA is the input,
the output is measured at IA0. All unused analog input (Y) ports are left open and output (I) ports are connected to
GND through 50-Ω pulldown resistors.
HP8753ES setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
100 Ω
VCC
TS3L100
S
IA0
IA1
YA
IB0
IB1
YB
GND
VCC = 3.3 V
E
ID0
ID1
YD
IC0
IC1
YC
0.1 µF
100 Ω
100 Ω 100 Ω
Oscilloscope
Pulse
Generator
VI+
VI−
VO+
VO−
Figure 8. Differential Crosstalk Measurement
Differential crosstalk is a measure of coupling noise between a transmit and receive pair in the LAN application.
Differential crosstalk depends on the edge rate, frequency, and load. This is calculated from the equation,
XTALK(Diff) d b = 2 0 log V O(Diff)/VI(Diff), where VO(Dif f ) i s the dif ferential output voltage and VI(Diff ) i s the dif ferential
input voltage.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TS3L100DBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TS3L100DBQRE4 ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TS3L100DBQRG4 ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TS3L100DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3L100RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TS3L100RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TS3L100DGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
TS3L100DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TS3L100PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TS3L100RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS3L100DGVR TVSOP DGV 16 2000 367.0 367.0 35.0
TS3L100DR SOIC D 16 2500 333.2 345.9 28.6
TS3L100PWR TSSOP PW 16 2000 367.0 367.0 35.0
TS3L100RGYR VQFN RGY 16 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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