SURFACE MOUNT
®
220 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
• EIA SIZES A (1210), B (1812) AND C (1008)
• EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS
• BOTH FLOW AND REFLOW SOLDERING APPLICABLE
• HIGH INDUCTANCE AVAILABLE IN SMALL SIZE
• EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
Molded Chip Wirewound Inductors NIN Series
AVAILABLE TYPE AND RANGE
SPECIFICATIONS
ENVIRONMENTAL CHARACTERISTICS
snoitacificepS eziSesaC
8001 0121 2181
egnaRecnatcudnI 001~Hn01 µH 072~Hn74 µH 01.0 µ0001~H µH
ecnareloTecnatcudnI )J(%5±,)K(%01±,)M(%02± )J(%5±,)K(%01±
egnaRerutarepmeTgnitarepO )egatlovdetarfo%001ta(C°58+~C°52-
ecnatsiseRnoitalusnI )esaCotnoitanimreT,cdV001@(.niMmhOgeM000,1
egatloVgnidnatshtiW )esaCotnoitanimreT(etunim1rofcdV052
ycneuqerFtnanoseRfleS,rotcaF-Q tnerruCCDdetaR,ecnatsiseRCD ecnareloTecnatcudnIdna sgnitsiLtcudorPlaudividnIeeS
eziSAIE edoCeziS )mmHxWxL(eziS epyTCIN egnaRecnatcudnI elytS egaP
8001 C 6.1x0.2x5.2 CF-NIN 001~22.0 µH dradnatS 422
CN-NIN 28.0~Hn01 µH ycneuqerFhgiH 522
CP-NIN 33~0.1 µH tnerruChgiH 622
0121 A 2.2x5.2x2.3 AF-NIN 022~22.0 µH dradnatS 722
AN-NIN 2.8~Hn74 µH ycneuqerFhgiH 822
AP-NIN 033~0.1 µH tnerruChgiH 922
2181 B 2.3x2.3x5.4 BF-NIN 0001~01.0 µH dradnatS 322-222
FEATURES
tseT noitacificepS noitidnoC&dohteMtseT
ytilibaredloSegarevoC.niM%09032+nipiD.ceS3retfA
o
)xulFtsoP(toPredloSC
ytidimuH
egamaDfoecnedivEoN)1(
eBllahSecnatcudnI)2(
nihtiW+ laitinifo%5
eulaV eBllahSrotcaFQ)3( nihtiW+ laitinifo01
eulaV
06tasrH005retfA
o
HR%59~09dnaC
tceffEgniredloS 062-tasdnoceS5retfA
o
021.niM5(C
o
)taeH-erPC
noitarbiVycneuqerFwoL lpmAmm5.1,zH55~01,sixArepsrH2retfA
kcohSlamrehT 04-(selcyc001retfA
o
58+ot
o
hcaE.niM03)C
egarotSerutarepmeTwoL 04-tasrH005retfA
o
C
daoLerutarepmeThgiH efiL
egamaDfoecnedivEoN)1( eBllahSecnatcudnI)2(
Wnihti± laitinIfo%01
eulaV
58+tasrH005retfA
o
tnerruCCDdetarhtiwC
efiLdaoLytidimuH eBllahSrotcaFQ)3( nihtiW± laitinIfo%01
eulaV
06tasrH005retfA
o
HR%59~09htiwC tnerruCCDdetaRhtiw
SURFACE MOUNT
®
221
NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Ser ies
DIMENSIONS (mm)
SIZE B
Applicable Guidelines:
1.Recommended soldering conditions : Flow (wave): 250oC for 5 seconds max. following a preheating of 120oC for 5 minutes.
Reflow: 230oC for 10 seconds max. (preheating is also recommended)
2.Avoid placing inductor over any metal pattern on the PCB, which may create mutual inductance problems.
3.For mounting, it is suggested to secure chip inductor by means of epoxy adhesive curable by ultraviolet.
4.Ultrasonic cleaning is not recommended. If it is necessary, the cleaning conditions must be examined so as not to create mechanical
damage by unexpected resonant vibration. Please contact our engineering department.
5.An excessive mechanical force may effect the electrical and magnetic properties of chip inductors. Make sure not to use any stress
greater than 2Kg when component is placed.
SIZE A and C
PART MARKING (1) 3 digits system in µH
(2) R indicates decimal point in µH Ex:2R7 = 2.7µH
Ex:R18 = .18µH = 180nH
(3) N indicates nanohenries (0.001 µH), Ex: 10N = 0.01 µH = 10nH
MARKING
L
W
A
B
H
B
H
MARKING
L
W
A
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
eziSAIE edoCeziS L.miD W.miD H.miD A.miD B.miD
8001 C 3.0+
5.2 2.0- 0.2±2.0 6.1±2.0 2.1±1.0 4.0±2.0
0121 A 2.3±3.0 5.2±2.0 2.2±2.0 9.1±1.0 6.0±2.0
2181 B 5.4±3.0 2.3±2.0 2.3±2.0 9.1±3.0 8.0±3.0
ecnatcudnI ecnareloT rofgnikraM ecnareloT elpmaxE
±%02 M M2R2
±%01 noitacifitnedIoN 074
±%5 J J072
Inductance Tolerance Code:
M = ±20%, K = ±10%, J = ±5%
Packaging: TR = Tape & Reel
MTR
PART NUMBERING SYSTEM R47
Rated inductance in µH (3 digits, first 2 numbers are significant, R stands for decimal point)
NIN-FA
Series-Type
F
Lead Free
(Optional 99.3% Sn, 0.7% Cu)
SURFACE MOUNT
®
222 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Series
NIN-FB B-SIZE (1812) STANDARD VALUES
CIN N/P 'L' ecnatcudnI )Hu(
ecnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
RTx01RBF-NIN 01.0 )M(%02± )K(%01± 82 zhM2.52 007 44.0 054
RTx21RBF-NIN 21.0 )M(%02± )K(%01± 03 zhM2.52 005 22.0 054
RTx51RBF-NIN 51.0 )M(%02± )K(%01± 03 zhM2.52 054 52.0 054
RTx81RBF-NIN 81.0 )M(%02± )K(%01± 03 zhM2.52 004 82.0 054
RTx22RBF-NIN 22.0 )M(%02± )K(%01± 03 zhM2.52 053 23.0 054
RTx72RBF-NIN 72.0 )M(%02± )K(%01± 03 zhM2.52 023 63.0 054
RTx33RBF-NIN 33.0 )M(%02± )K(%01± 03 zhM2.52 003 04.0 054
RTx93RBF-NIN 93.0 )M(%02± )K(%01± 03 zhM2.52 052 54.0 054
RTx74RBF-NIN 74.0 )M(%02± )K(%01± 03 zhM2.52 022 05.0 054
RTx65RBF-NIN 65.0 )M(%02± )K(%01± 03 zhM2.52 081 55.0 054
RTx86RBF-NIN 86.0 )M(%02± )K(%01± 03 zhM2.52 061 06.0 054
RTx28RBF-NIN 28.0 )M(%02± )K(%01± 03 zhM2.52 041 76.0 054
RTx0R1BF-NIN 0.1 )M(%02± )K(%01± 05 zhM69.7 001 05.0 054
RTx2R1BF-NIN 2.1 )M(%02± )K(%01± 05 zhM69.7 08 55.0 034
RTx5R1BF-NIN 5.1 )M(%02± )K(%01± 05 zhM69.7 07 06.0 014
RTx8R1BF-NIN 8.1 )M(%02± )K(%01± 05 zhM69.7 06 56.0 093
RTx2R2BF-NIN 2.2 )M(%02± )K(%01± 05 zhM69.7 55 07.0 083
RTx7R2BF-NIN 7.2 )M(%02± )K(%01± 05 zhM69.7 05 57.0 073
RTx3R3BF-NIN 3.3 )M(%02± )K(%01± 05 zhM69.7 54 08.0 553
RTx9R3BF-NIN 9.3 )M(%02± )K(%01± 05 zhM69.7 04 09.0 033
RTx7R4BF-NIN 7.4 )M(%02± )K(%01± 05 zhM69.7 53 0.1 513
RTx6R5BF-NIN 6.5 )M(%02± )K(%01± 05 zhM69.7 33 1.1 003
RTx8R6BF-NIN 8.6 )K(%01± )J(%5± 05 zhM69.7 72 2.1 582
RTx2R8BF-NIN 2.8 )K(%01± )J(%5± 05 zhM69.7 52 4.1 072
For Quality Factor (Q) and Inductance (L)
ov er Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
223
NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Series
CIN N/P 'L' ecnatcudnI (µ)H
eccnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
RTx001BF-NIN 01 )K(%01± )J(%5± 05 zhM25.2 02 6.1 052
RTx021BF-NIN 21 )K(%01± )J(%5± 05 zhM25.2 81 0.2 522
RTx051BF-NIN 51 )K(%01± )J(%5± 05 zhM25.2 71 5.2 002
RTx081BF-NIN 81 )K(%01± )J(%5± 05 zhM25.2 51 8.2 091
RTx022BF-NIN 22 )K(%01± )J(%5± 05 zhM25.2 31 2.3 081
RTx072BF-NIN 72 )K(%01± )J(%5± 05 zhM25.2 21 6.3 071
RTx033BF-NIN 33 )K(%01± )J(%5± 05 zhM25.2 11 0.4 061
RTx093BF-NIN 93 )K(%01± )J(%5± 05 zhM25.2 01 5.4 051
RTx074BF-NIN 74 )K(%01± )J(%5± 05 zhM25.2 01 0.5 041
RTx065BF-NIN 65 )K(%01± )J(%5± 05 zhM25.2 3.9 5.5 531
RTx086BF-NIN 86 )K(%01± )J(%5± 05 zhM25.2 0.9 0.6 031
RTx028BF-NIN 28 )K(%01± )J(%5± 05 zhM25.2 2.8 0.7 021
RTx101BF-NIN 001 )K(%01± )J(%5± 04 zhM25.2 7.6 8.8 501
RTx121BF-NIN 021 )K(%01± )J(%5± 04 zhM5.1 1.6 01 001
RTx151BF-NIN 051 )K(%01± )J(%5± 04 zhM5.1 5.5 11 59
RTx181BF-NIN 081 )K(%01± )J(%5± 04 zhM5.1 1.5 31 58
RTx122BF-NIN 022 )K(%01± )J(%5± 04 zhM697.0 5.4 31 58
RTx172BF-NIN 072 )K(%01± )J(%5± 04 zhM697.0 1.4 41 08
RTx133BF-NIN 033 )K(%01± )J(%5± 04 zhM697.0 7.3 61 57
RTx193BF-NIN 093 )K(%01± )J(%5± 04 zhM697.0 3.3 91 07
RTx174BF-NIN 074 )K(%01± )J(%5± 03 zhM697.0 3.3 13 55
RTx165BF-NIN 065 )K(%01± )J(%5± 03 zhM697.0 7.2 53 05
RTx186BF-NIN 086 )K(%01± )J(%5± 03 zhM697.0 5.2 93 05
RTx128BF-NIN 028 )K(%01± )J(%5± 03 zhM697.0 4.2 54 54
RTx201BF-NIN 0001 )K(%01± )J(%5± 03 zhM697.0 1.2 35 04
NIN-FB B-SIZE (1812) STANDARD VALUES
For Quality Factor (Q) and Inductance (L)
over Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
224 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Series
NIN-FC SERIES C SIZE (1008) STANDARD TYPE
CIN N/P 'L' ecnatcudnI (µ)H
ecnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
RTx22RCF-NIN 22.0 ±)M(%02 )K(%01± 52 zhM52 032 07.0 091
RTx72RCF-NIN 72.0 ±)M(%02 )K(%01± 52 zhM52 012 57.0 081
RTx33RCF-NIN 33.0 ±)M(%02 )K(%01± 52 zhM52 091 58.0 071
RTx93RCF-NIN 93.0 ±)M(%02 )K(%01± 52 zhM52 571 59.0 061
RTx74RCF-NIN 74.0 ±)M(%02 )K(%01± 52 zhM52 061 00.1 551
RTx65RCF-NIN 65.0 ±)M(%02 )K(%01± 52 zhM52 051 01.1 051
RTx86RCF-NIN 86.0 ±)M(%02 )K(%01± 52 zhM52 531 52.1 041
RTx28RCF-NIN 28.0 ±)M(%02 )K(%01± 52 zhM52 521 4.1 031
RTx0R1CF-NIN 0.1 )K(%01± )J(%5± 52 zhM69.7 511 56.0 591
RTx2R1CF-NIN 2.1 )K(%01± )J(%5± 52 zhM69.7 001 57.0 081
RTx5R1CF-NIN 5.1 )K(%01± )J(%5± 52 zhM69.7 09 58.0 071
RTx8R1CF-NIN 8.1 )K(%01± )J(%5± 52 zhM69.7 58 59.0 061
RTx2R2CF-NIN 2.2 )K(%01± )J(%5± 52 zhM69.7 08 50.1 551
RTx7R2CF-NIN 7.2 )K(%01± )J(%5± 52 zhM69.7 57 02.1 541
RTx3R3CF-NIN 3.3 )K(%01± )J(%5± 52 zhM69.7 56 03.1 531
RTx9R3CF-NIN 9.3 )K(%01± )J(%5± 52 zhM69.7 06 04.1 031
RTx7R4CF-NIN 7.4 )K(%01± )J(%5± 52 zhM69.7 55 55.1 521
RTx6R5CF-NIN 6.5 )K(%01± )J(%5± 52 zhM69.7 05 57.1 021
RTx8R6CF-NIN 8.6 )K(%01± )J(%5± 52 zhM69.7 54 59.1 511
RTx2R8CF-NIN 2.8 )K(%01± )J(%5± 52 zhM69.7 04 2.2 501
RTx001CF-NIN 01 )K(%01± )J(%5± 52 zhM25.2 23 7.3 08
RTx021CF-NIN 21 )K(%01± )J(%5± 52 zhM25.2 03 1.4 57
RTx051CF-NIN 51 )K(%01± )J(%5± 52 zhM25.2 82 0.5 07
RTx081CF-NIN 81 )K(%01± )J(%5± 52 zhM25.2 52 4.5 56
RTx022CF-NIN 22 )K(%01± )J(%5± 52 zhM25.2 22 0.6 06
RTx072CF-NIN 72 )K(%01± )J(%5± 02 zhM25.2 12 3.6 511
RTx033CF-NIN 33 )K(%01± )J(%5± 02 zhM25.2 02 1.7 011
RTx093CF-NIN 93 )K(%01± )J(%5± 02 zhM25.2 81 5.9 09
RTx074CF-NIN 74 )K(%01± )J(%5± 02 zhM25.2 71 0.11 08
RTx065CF-NIN 65 )K(%01± )J(%5± 02 zhM25.2 61 1.21 57
RTx086CF-NIN 86 )K(%01± )J(%5± 02 zhM25.2 51 6.61 07
RTx028CF-NIN 28 )K(%01± )J(%5± 02 zhM25.2 31 0.91 56
RTx101CF-NIN 001 )K(%01± )J(%5± 02 zhM697.0 21 0.12 06
For Quality Factor (Q) and Inductance (L)
ov er Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
225
NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Series
NIN-NC SERIES C SIZE (1008) HIGH FREQUENCY TYPE
CIN N/P 'L' ecnatcudnI )Hn(
ecnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
RTKN01CN-NIN 01 )K(%01± --- 01 zhM001 0052 23.0 082
RTKN21CN-NIN 21 )K(%01± --- 01 zhM001 0022 43.0 072
RTKN51CN-NIN 51 )K(%01± --- 01 zhM001 0081 83.0 552
RTKN81CN-NIN 81 )K(%01± --- 01 zhM001 0551 04.0 052
RTKN22CN-NIN 22 )K(%01± --- 51 zhM001 0531 34.0 042
RTKN72CN-NIN 72 )K(%01± --- 51 zhM001 0511 74.0 032
RTxN33CN-NIN 33 )K(%01± )J(%5± 51 zhM001 0001 15.0 022
RTxN93CN-NIN 93 )K(%01± )J(%5± 51 zhM001 098 55.0 512
RTxN74CN-NIN 74 )K(%01± )J(%5± 51 zhM001 077 95.0 502
RTxN65CN-NIN 65 )K(%01± )J(%5± 51 zhM001 076 36.0 002
RTxN86CN-NIN 86 )K(%01± )J(%5± 51 zhM001 095 86.0 091
RTxN28CN-NIN 28 )K(%01± )J(%5± 51 zhM001 025 37.0 581
RTx01RCN-NIN 001 )K(%01± )J(%5± 01 zhM2.52 064 08.0 571
RTx21RCN-NIN 021 )K(%01± )J(%5± 01 zhM2.52 004 78.0 071
RTx51RCN-NIN 051 )K(%01± )J(%5± 01 zhM2.52 043 89.0 061
RTx81RCN-NIN 081 )K(%01± )J(%5± 01 zhM2.52 003 50.1 551
RTx22RCN-NIN 022 )K(%01± )J(%5± 01 zhM2.52 062 51.1 541
RTx72RCN-NIN 072 )K(%01± )J(%5± 01 zhM2.52 032 52.1 041
RTx33RCN-NIN 033 )K(%01± )J(%5± 01 zhM2.52 002 73.1 531
RTx93RCN-NIN 093 )K(%01± )J(%5± 01 zhM2.52 081 74.1 031
RTx74RCN-NIN 074 )K(%01± )J(%5± 01 zhM2.52 061 85.1 521
RTx65RCN-NIN 065 )K(%01± )J(%5± 01 zhM2.52 541 07.1 021
RTx86RCN-NIN 086 )K(%01± )J(%5± 01 zhM2.52 031 58.1 011
RTx28RCN-NIN 028 )K(%01± )J(%5± 01 zhM2.52 09 01.2 001
For Quality Factor (Q) and Inductance (L)
over Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
226 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Ser ies
NIN-PC SERIES C SIZE (1008) HIGH CURRENT TYPE
CIN N/P 'L' ecnatcudnI (µ)H
ecnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
RTM0R1CP-NIN 0.1 %02± --- 01 zhM69.7 59 54.0 574
RTM5R1CP-NIN 5.1 %02± --- 01 zhM69.7 58 55.0 534
RTM2R2CP-NIN 2.2 %02± --- 01 zhM69.7 56 56.0 093
RTM3R3CP-NIN 3.3 %02± --- 8 zhM69.7 55 58.0 043
RTM7R4CP-NIN 7.4 %02± --- 8 zhM69.7 34 2.1 582
RTK8R6CP-NIN 8.6 %01± --- 8 zhM69.7 93 3.1 572
RTK001CP-NIN 01 %01± --- 02 zhM25.2 23 2.2 012
RTK021CP-NIN 21 %01± --- 02 zhM25.2 52 7.2 591
RTK051CP-NIN 51 %01± --- 02 zhM25.2 12 2.3 571
RTK022CP-NIN 22 %01± --- 02 zhM25.2 81 0.4 061
RTK033CP-NIN 33 %01± --- 02 zhM25.2 61 5.6 021
For Quality Factor (Q) and Inductance (L)
ov er Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
227
NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Ser ies
NIN-FA SERIES A SIZE (1210) STANDARD TYPE
CIN N/P 'L' ecnatcudnI (µ)H
ecnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
-NINRTx22RAF 22.0 )M(%02± )K(%01± 52 zhM2.52 032 92.0 063
-NINRTx72RAF 72.0 )M(%02± )K(%01± 52 zhM2.52 012 23.0 543
-NINRTx33RAF 33.0 )M(%02± )K(%01± 52 zhM2.52 091 53.0 033
-NINRTx93RAF 93.0 )M(%02± )K(%01± 52 zhM2.52 571 93.0 503
-NINRTx74RAF 74.0 )M(%02± )K(%01± 52 zhM2.52 061 44.0 092
-NINRTx65RAF 65.0 )M(%02± )K(%01± 52 zhM2.52 051 94.0 572
-NINRTx86RAF 86.0 )M(%02± )K(%01± 52 zhM2.52 531 55.0 062
-NINRTx28RAF 28.0 )M(%02± )K(%01± 52 zhM2.52 521 16.0 542
-NINRTx0R1AF 0.1 )K(%01± )J(%5± 03 zhM69.7 511 96.0 032
-NINRTx2R1AF 2.1 )K(%01± )J(%5± 03 zhM69.7 001 57.0 512
-NINRTx5R1AF 5.1 )K(%01± )J(%5± 03 zhM69.7 09 57.0 012
-NINRTx8R1AF 8.1 )K(%01± )J(%5± 03 zhM69.7 58 28.0 002
-NINRTx2R2AF 2.2 )K(%01± )J(%5± 03 zhM69.7 08 59.0 091
-NINRTx7R2AF 7.2 )K(%01± )J(%5± 03 zhM69.7 57 1.1 081
-NINRTx3R3AF 3.3 )K(%01± )J(%5± 03 zhM69.7 56 2.1 081
-NINRTx9R3AF 9.3 )K(%01± )J(%5± 03 zhM69.7 06 3.1 571
-NINRTx7R4AF 7.4 )K(%01± )J(%5± 03 zhM69.7 55 5.1 561
-NINRTx6R5AF 6.5 )K(%01± )J(%5± 03 zhM69.7 05 6.1 061
-NINRTx8R6AF 8.6 )K(%01± )J(%5± 03 zhM69.7 54 8.1 051
-NINRTx2R8AF 2.8 )K(%01± )J(%5± 03 zhM69.7 04 0.2 041
-NINRTx001AF 01 )K(%01± )J(%5± 03 zhM25.2 63 1.2 041
-NINRTx021AF 21 )K(%01± )J(%5± 03 zhM25.2 33 5.2 521
-NINRTx051AF 51 )K(%01± )J(%5± 03 zhM25.2 03 8.2 021
-NINRTx081AF 81 )K(%01± )J(%5± 03 zhM25.2 72 3.3 011
-NINRTx022AF 22 )K(%01± )J(%5± 03 zhM25.2 52 7.3 501
-NINRTx072AF 72 )K(%01± )J(%5± 03 zhM25.2 22 0.5 09
-NINRTx033AF 33 )K(%01± )J(%5± 03 zhM25.2 02 6.5 58
-NINRTx093AF 93 )K(%01± )J(%5± 03 zhM25.2 02 4.6 08
-NINRTx074AF 74 )K(%01± )J(%5± 03 zhM25.2 51 0.7 57
-NINRTx065AF 65 )K(%01± )J(%5± 03 zhM25.2 51 0.8 07
-NINRTx086AF 86 )K(%01± )J(%5± 03 zhM25.2 51 0.9 56
-NINRTx028AF 28 )K(%01± )J(%5± 03 zhM25.2 11 01 06
-NINRTx101AF 001 )K(%01± )J(%5± 02 zhM97.0 01 01 06
-NINRTx121AF 021 )K(%01± )J(%5± 02 zhM97.0 01 11 55
-NINRTx151AF 051 )K(%01± )J(%5± 02 zhM97.0 8 51 05
-NINRTx181AF 081 )K(%01± )J(%5± 02 zhM97.0 7 71 05
-NINRTx122AF 022 )K(%01± )J(%5± 02 zhM97.0 7 12 54
For Quality Factor (Q) and Inductance (L)
over Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
228 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Ser ies
NIN-NA SERIES A SIZE (1210) HIGH FREQUENCY
CIN N/P 'L' ecnatcudnI (µ)H
ecnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
-NINRTxN74AN 740.0 )M(%02± )K(%01± 01 zhM001 086 02.0 054
-NINRTxN65AN 650.0 )M(%02± )K(%01± 01 zhM001 006 22.0 024
-NINRTxN86AN 860.0 )M(%02± )K(%01± 01 zhM001 045 52.0 004
-NINRTxN28AN 280.0 )M(%02± )K(%01± 01 zhM001 005 72.0 083
-NINRTx01RAN 01.0 )M(%02± )K(%01± 01 zhM001 054 03.0 063
-NINRTx21RAN 21.0 )M(%02± )K(%01± 01 zhM2.52 004 76.0 042
-NINRTx51RAN 51.0 )M(%02± )K(%01± 01 zhM2.52 053 27.0 032
-NINRTx81RAN 81.0 )M(%02± )K(%01± 01 zhM2.52 023 18.0 022
-NINRTx22RAN 22.0 )M(%02± )J(%5± 01 zhM2.52 082 09.0 012
-NINRTx72RAN 72.0 )K(%01± )J(%5± 01 zhM2.52 052 0.1 002
-NINRTx33RAN 33.0 )K(%01± )J(%5± 01 zhM2.52 022 1.1 091
-NINRTx93RAN 93.0 )K(%01± )J(%5± 01 zhM2.52 002 2.1 081
-NINRTx74RAN 74.0 )K(%01± )J(%5± 01 zhM2.52 081 4.1 571
-NINRTx65RAN 65.0 )K(%01± )J(%5± 01 zhM2.52 061 5.1 071
-NINRTx86RAN 86.0 )K(%01± )J(%5± 01 zhM2.52 051 7.1 551
-NINRTx28RAN 28.0 )K(%01± )J(%5± 01 zhM2.52 531 9.1 541
-NINRTJ0R1AN 0.1 )J(%5± ---- 31 zhM69.7 021 1.2 521
-NINRTJ0R1AN 2.1 )J(%5± ---- 31 zhM69.7 011 3.2 021
-NINRTJ5R1AN 5.1 )J(%5± ---- 31 zhM69.7 59 7.2 511
-NINRTJ8R1AN 8.1 )J(%5± ---- 31 zhM69.7 58 0.3 011
-NINRTJ2R2AN 2.2 )J(%5± ---- 31 zhM69.7 08 2.3 011
-NINRTJ7R2AN 7.2 )J(%5± ---- 31 zhM69.7 07 6.3 501
-NINRTJ3R3AN 3.3 )J(%5± ---- 31 zhM69.7 26 2.4 001
-NINRTJ9R3AN 9.3 )J(%5± ---- 31 zhM69.7 75 4.4 59
-NINRTJ7R4AN 7.4 )J(%5± ---- 31 zhM69.7 25 7.7 07
-NINRTJ6R5AN 6.5 )J(%5± ---- 31 zhM69.7 64 7.8 56
-NINRTJ8R6AN 8.6 )J(%5± ---- 31 zhM69.7 24 01 06
-NINRTJ2R8AN 2.8 )J(%5± ---- 31 zhM69.7 83 11 06
For Quality Factor (Q) and Inductance (L)
ov er Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
229
NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Series
NIN-PA SERIES A SIZE (1210) HIGH CURRENT TYPE
CIN N/P 'L' ecnatcudnI (µ)H
ecnareloT 'Q' rotcaF ).nim(
Q&L tseT .qerF
FRS zhM ).nim(
CD ecnatsiseR .xaM)smho(
detaR tnerruCCD .xaM)Am(
)dts( )tpo(
-NINRTM0R1AP 0.1 )M(%02± ---- 7 zhM69.7 051 51.0 006
-NINRTM5R1AP 5.1 )M(%02± ---- 7 zhM69.7 011 81.0 055
-NINRTM2R2AP 2.2 )M(%02± ---- 7 zhM69.7 08 32.0 005
-NINRTM3R3AP 3.3 )M(%02± ---- 7 zhM69.7 85 82.0 004
-NINRTM7R4AP 7.4 )M(%02± ---- 7 zhM69.7 64 43.0 053
-NINRTM8R6AP 8.6 )M(%02± ---- 7 zhM69.7 83 24.0 003
-NINRTK001AP 01 )K(%01± ---- 51 zhM25.2 32 05.0 042
-NINRTK021AP 21 )K(%01± ---- 51 zhM25.2 12 06.0 032
-NINRTK051AP 51 )M(%01± ---- 51 zhM25.2 81 47.0 022
-NINRTK081AP 81 )K(%01± ---- 51 zhM25.2 71 09.0 502
-NINRTK022AP 22 )K(%01± ---- 51 zhM25.2 51 51.1 581
-NINRTK072AP 72 )K(%01± ---- 51 zhM25.2 31 54.1 561
-NINRTK033AP 33 )K(%01± ---- 51 zhM25.2 21 56.1 551
-NINRTK093AP 93 )K(%01± ---- 51 zhM25.2 11 09.1 541
-NINRTK074AP 74 )K(%01± ---- 51 zhM25.2 5.9 52.2 531
-NINRTK065AP 65 )K(%01± ---- 51 zhM25.2 5.8 03.3 011
-NINRTK086AP 86 )K(%01± ---- 51 zhM25.2 5.7 07.3 501
-NINRTK028AP 28 )K(%01± ---- 51 zhM25.2 0.7 02.4 001
-NINRTK101AP 001 )K(%01± ---- 02 zhM697.0 5.6 0.5 09
-NINRTK121AP 021 )K(%01± ---- 02 zhM697.0 0.6 0.7 57
-NINRTK151AP 051 )K(%01± ---- 02 zhM697.0 5.5 0.8 07
-NINRTK181AP 081 )K(%01± ---- 02 zhM697.0 0.5 5.9 56
-NINRTK122AP 022 )K(%01± ---- 02 zhM697.0 0.4 0.11 06
-NINRTK172AP 072 )K(%01± ---- 02 zhM697.0 5.3 5.41 55
-NINRTK133AP 033 )K(%01± ---- 02 zhM697.0 0.3 0.61 05
For Quality Factor (Q) and Inductance (L)
ov er Frequency curves
see www.RFpassives.com
SURFACE MOUNT
®
230 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com
Molded Chip Wirewound Inductors NIN Ser ies
PACKAGING SPECIFICATIONS
CARRIER TAPE DIMENSIONS (mm)
DIMENSIONS (mm)
DIMENSIONS (mm)
RECOMMENDED LAND PATTERNS FOR FLOW AND REFLOW SOLDERING
F
Perforation1.5∅±0.1
P
t1
t2
W
A
B
4.0
±0.1
E
21
± 0.8
2.0
± 0.5
2.0 ± 0.5
W
D∅
50∅
Min.
13∅
±0.5
AB
C
NIN Chip
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
➛➛
➛➛
➛
esaC edoC epyT eziS W± 3.0 A± 2.0 B± 2.0 P± 1.0 E± 1.0 F± 1.0 1t 2t
B CP/CN/CF C 0.8 4.2 9.2 0.4 57.1 5.3 3.0 58.1
C AP/AN/AF A 0.8 8.2 6.3 0.4 57.1 5.3 3.0 3.2
D BF B 0.21 6.3 9.4 0.8 57.1 5.5 3.0 4.3
esaC edoC epyT eziS DÆ ±2 W± 5.1 leeR/ytQ
B CP/CN/CF C 871 0.01 scp0002
C AP/AN/AF A 871 0.01 scp0002
D BF B 871 0.41 scp005
Land P attern
➛➛
➛➛
➛
epyT eziS A B C
B CP/CN/CF C 5.1~4.1 0.4~5.3 6.1~2.1
C AP/AN/AF A 0.2~6.1 6.4~0.4 4.2~9.1
D BF B 6.2~4.2 0.6~5.5 0.3~0.2
