ESD5101, ESD5111 ESD Protection Diodes Micro-packaged Diodes for ESD Protection The ESD51x1 Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in smartphone, smart-watch, or many other portable / wearable applications where board space comes at a premium. www.onsemi.com MARKING DIAGRAMS ESD5101 (01005) DSN2 CASE 152AK Features * Low Capacitance (5 pF Max, I/O to GND) * Small Body Outline Dimensions ESD5111P (0201) DSN2 CASE 152AX L, E, P = Device Code MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Symbol Value Unit Operating Junction Temperature Range TJ -55 to +125 C Storage Temperature Range Tstg -55 to +150 C Lead Solder Temperature - Maximum (10 Seconds) TL 260 C ESD ESD 15 15 kV kV IEC 61000-4-2 Contact (ESD) IEC 61000-4-2 Air (ESD) P * * 01005 Size: 0.435 x 0.23 mm 0201 Size: 0.6 x 0.3 mm Protection for the Following IEC Standards: IEC 61000-4-2 (Level 4) Low ESD Clamping Voltage These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant E ESD5111 (0201) WLCSP2 CASE 567AV * L PIN CONFIGURATION AND SCHEMATIC 1 2 = Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. See Application Note AND8308/D for further description of survivability specs. (c) Semiconductor Components Industries, LLC, 2016 June, 2018 - Rev. 6 ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. 1 Publication Order Number: ESD5101/D ESD5101, ESD5111 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise specified) Parameter Reverse Working Voltage Symbol VRWM Breakdown Voltage VBR Conditions Min Typ I/O Pin to GND IT = 1 mA, I/O Pin to GND 3.68 5.0 Reverse Leakage Current IR VRWM = 3.3 V, I/O Pin to GND ESD5101, ESD5111 Clamping Voltage TLP (Note 1) VC IPP = 8 A IEC 61000-4-2 Level 2 equivalent (4 kV Contact, 4 kV Air) 5.5 IPP = 16 A IEC 61000-4-2 Level 2 equivalent (8 kV Contact, 15 kV Air) 6.5 Junction Capacitance CJ VR = 0 V, f = 1 MHz Max Unit 3.3 V 6.5 V 0.1 mA V 5.5 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. ANSI/ESD STM5.5.1 - Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model. TLP conditions: Z0 = 50 W, tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns. ORDERING INFORMATION Package Shipping ESD5101FCT5G DSN2 (Pb-Free) 10,000 / Tape & Reel ESD5111FCT5G WLCSP2 (Pb-Free) 10,000 / Tape & Reel ESD5111PFCT5G DSN2 (Pb-Free) 10,000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2 ESD5101, ESD5111 10 9 9 8 8 7 7 6 6 C (pF) 10 5 4 3 3 2 2 1 0 -3.5 1 0 -3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 VBIAS (V) VBIAS (V) Figure 1. ESD5101 CV Characteristics Figure 2. ESD5111 CV Characteristics 2 2 0 0 -2 -2 -4 3.5 -4 -6 -6 -8 -8 -10 -10 1.E+08 1.E+07 1.E+09 1.E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 3. ESD5101 S21 Insertion Loss Figure 4. ESD5111 S21 Insertion Loss 10 10 9 9 8 8 7 6 5 4 3 7 6 5 4 3 2 2 1 0 1 0 0.5 1.E+08 1.E+07 CAPACITANCE (pF) CAPACITANCE (pF) 5 4 (dB) (dB) C (pF) TYPICAL CHARACTERISTICS 1.0 1.5 2.0 2.5 3.0 0.5 1.0 1.5 2.0 2.5 FREQUENCY (GHz) FREQUENCY (GHz) Figure 5. ESD5101 Capacitance over Frequency Figure 6. ESD5111 Capacitance over Frequency www.onsemi.com 3 3.0 ESD5101, ESD5111 TYPICAL CHARACTERISTICS 20 20 10 18 16 12 TLP CURRENT (A) VIEC, EQUIVALENT (kV) 14 6 10 8 4 6 12 8 4 2 0 0 2 0 4 6 8 10 12 14 16 18 4 6 2 2 6 10 4 0 8 14 2 0 0 20 2 4 6 VC, VOLTAGE (V) 8 10 12 14 16 18 20 VC, VOLTAGE (V) Figure 7. ESD5101 Positive TLP I-V Curve Figure 8. ESD5111 Positive TLP I-V Curve -20 10 -20 10 -18 -18 -12 6 -10 -8 4 -6 -4 -2 0 0 2 4 6 8 10 12 14 16 18 TLP CURRENT (A) -14 -16 -14 -12 6 -10 -8 4 -6 2 -4 0 -2 0 20 8 VIEC, EQUIVALENT (kV) 8 VIEC, EQUIVALENT (kV) -16 TLP CURRENT (A) VIEC, EQUIVALENT (kV) 8 16 TLP CURRENT (A) 10 18 2 0 VC, VOLTAGE (V) 2 4 6 8 10 12 14 16 18 0 20 VC, VOLTAGE (V) Figure 9. ESD5101 Negative TLP I-V Curve Figure 10. ESD5111 Negative TLP I-V Curve Figure 11. ESD5111 Positive 8 kV ESD Contact Discharge Figure 12. ESD5111 Negative 8 kV ESD Contact Discharge www.onsemi.com 4 ESD5101, ESD5111 IEC61000-4-2 Waveform IEC 61000-4-2 Spec. Ipeak Level Test Voltage (kV) First Peak Current (A) Current at 30 ns (A) Current at 60 ns (A) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 100% 90% I @ 30 ns I @ 60 ns 10% tP = 0.7 ns to 1 ns Figure 13. IEC61000-4-2 Spec Transmission Line Pulse (TLP) Measurement L Transmission Line Pulse (TLP) provides current versus voltage (I-V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 14. TLP I-V curves of ESD protection devices accurately demonstrate the product's ESD capability because the 10s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 15 where an 8 kV IEC 61000-4-2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP I-V curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. 50 W Coax Cable S Attenuator / 50 W Coax Cable 10 MW IM VM DUT VC Oscilloscope Figure 14. Simplified Schematic of a Typical TLP System Figure 15. Comparison Between 8 kV IEC 61000-4-2 and 8 A and 16 A TLP Waveforms www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 0.435x0.23, 0.27P, (01005) CASE 152AK ISSUE A DATE 17 FEB 2015 SCALE 16:1 D PIN 1 INDICATOR 0.02 C 2X 2X EE EE 0.02 C 2X 0.05 C 2X 0.02 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. A B MILLIMETERS DIM MIN MAX A 0.165 0.195 A1 --- 0.030 b 0.177 0.193 D 0.435 BSC E 0.230 BSC e 0.270 BSC L 0.112 0.128 E TOP VIEW A A1 C SIDE VIEW GENERIC MARKING DIAGRAM* SEATING PLANE X e 2X 0.05 b M C A B X = Specific Device Code *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G", may or not be present. 1 0.05 M 2X L C A B RECOMMENDED SOLDER FOOTPRINT* BOTTOM VIEW 0.44 2X 1 2X 0.23 0.16 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON82198E Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. DSN2, 0.435X0.23, 0.27P (01005) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS X4DFN2, 0.60x0.30, 0.36P CASE 152AX ISSUE G SCALE 8:1 D PIN 1 INDICATOR EE DATE 12 APR 2019 A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. E DIM A A1 b D E e L TOP VIEW A 0.02 C A1 GENERIC MARKING DIAGRAM* 0.01 C C SIDE VIEW MILLIMETERS MIN NOM MAX 0.175 0.200 0.225 0.018 REF 0.205 0.215 0.225 0.575 0.600 0.625 0.275 0.300 0.325 0.36 BSC 0.145 0.155 0.165 SEATING PLANE X e X b X = Specific Device Code 1 0.05 M 2X L C A B 0.05 M C A B BOTTOM VIEW *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G", may or not be present. Some products may not follow the Generic Marking. RECOMMENDED SOLDER FOOTPRINT* 0.65 2X 1 2X 0.27 0.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON06808G X4DFN2, 0.60x0.30, 0.36P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP2, 0.6x0.3 CASE 567AV ISSUE C DATE 22 SEP 2017 SCALE 12:1 D 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. A B 0.02 C 2X DIM A A1 b D E e L E 0.02 C TOP VIEW 0.02 C A 0.02 C A1 C SIDE VIEW MILLIMETERS MIN NOM MAX 0.250 0.275 0.300 0.000 0.025 0.050 0.140 0.155 0.170 0.570 0.600 0.630 0.270 0.300 0.330 0.36 BSC 0.190 0.215 0.240 GENERIC MARKING DIAGRAM* SEATING PLANE X e 2X L 2X b 0.05 C A B BOTTOM VIEW X = Specific Device Code *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot " G", may or may not be present. Some products may not follow the Generic Marking. RECOMMENDED SOLDER FOOTPRINT* 2X 0.33 2X 0.28 0.81 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON49805E WLCSP2, 0.6X0.3 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 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