THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 601885
DRWN:
NVENKATESHSH
2018/06/01
CHK'D:
JPRUNEAU
2018/08/09
APPR:
TOMSMITH
2018/08/13
INITIAL REVISION:
DRWN:
KFERGUSON
2011/10/04
APPR:
BMOSER
2011/11/01
THIRD ANGLE PROJECTION
DRAWING SERIES
C-SIZE
33468
MX64 ISO
RECEPTACLE TERMINAL
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-33468-002
PSD
001
B1
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 1 OF 1
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3
4 PLACES
±
3 PLACES
±
2 PLACES
±
0.10
1 PLACE
±
0.3
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
FORMAT: master-tb-prod-C
REVISION: H
DATE: 2018/01/18
SYMBOLS
=
0
=
0
=
0
=
0
=
0
=
0
=
0
=
0
=
0
DOCUMENT STATUS P1 RELEASE DATE 2018/08/13 12:08:32
C
B
B
SECTION B-B
DD
SECTION D-D
C
SECTION C-C
C
16.01
7.04
5.97
2.87S
WIRE
SIZE
GRIP
CODE
PART
NUMBER
REEL
PAYOFF
DIRECTION
DIM
A
DIM
B
DIM
S
DIM
T
DIM
AF
DIM
AG
BASE
MATERIAL
PLATING
ID
0.35 mm² A
33468-0021 D2.3 2.8 7.15
0.10
0.26
0.07 (2.1) (2.5) COPPER
ALLOY
Sn
Lead Free
33468-0022 B
33467-0021 D
2.3 2.8 6.97-
7.27
0.26
0.07 (2.1) (2.5) COPPER
ALLOY
Au
Lead Free
33467-0022 B
34736-0025 DAg
Lead Free
34736-0026 B
0.5-0.75
mm² B
33468-0023 D2.7 3.1 7.15
0.10
0.26
0.07 (2.5) (2.7) COPPER
ALLOY
Sn
Lead Free
33468-0024 B
33467-0023 D
2.7 3.1 6.97-
7.27
0.26
0.07 (2.5) (2.7) COPPER
ALLOY
Au
Lead Free
33467-0024 B
34736-0027 DAg
Lead Free
34736-0028 B
PLATING ID
SEE TABLE
TRADEMARK,
DATE CODE,
GRIP CODE
NOTES: (UNLESS OTHERWISE SPECIFIED)
1. MATERIALS: SEE TABLE
2. PACKAGING SPECIFICATION: PK-31300-516
AND PK-30907-759
3. CRIMPING PER APPLICATION SPECIFICATION AS-33468-002
4. CRIMPED LEAD MEETS THE FOLLOWING:
4.1. SAE/USCAR-21, MAY 2002
4.2. SAE/USCAR-2, REV. 3, APRIL 2001
4.3. SAE/USCAR-12, REV. 2
4.4. GMW #3191 AUGUST 22, 2000 (DRAFT)
TEMPERATURE CLASS 3, APPLIES ONLY TO Au PARTS
5. PLATING NOTES:
5.1 TIN PLATING (ENTIRE TERMINAL)
5.1.1 ELECTRO REFLOW 1.90 - 3.30 MICROMETERS TIN OVER 0.25 - 0.76
MICROMETERS NICKEL
5.2 GOLD PLATING
5.2.1 UNDERPLATE OVERALL 1.25-2.25 MICROMETERS DUCTILE
SULPHAMATE NICKEL
5.2.2 ELECTRODEPOSITED GOLD 0.76 - 1.5 MICROMETERS IN
CONTACT AREAS
5.2.3 ELECTRODEPOSITED TIN MATTE FINISH 2.5 - 4.0 MICROMETERS
IN CRIMP AREA
5.3 SILVER PLATING
5.3.1 UNDERPLATE OVERALL 1.25-2.25 MICROMETERS DUCTILE
SULPHAMATE NICKEL
5.3.2 ELECTRODEPOSITED PURE SILVER 99.5% PURITY SEMI-BRIGHT
FINISH WITH NO BRIGHTENERS OR CHROMATES 1.9 - 3.3
MICROMETERS IN CONTACT AREAS
5.3.3 ANTI-TARNISH TREATMENT FOR SILVER PLATED AREA:
SYNTHETIC HYDROCARBON CONTACT SURFACE FINISH OR
EQUIVALENT
5.3.4 ELECTRODEPOSITED TIN MATTE FINISH 2.5 - 4.0 MICROMETERS
IN CRIMP AREA
CUTOFF
1.88
0.07
E
2.26
0.05
B
(AG)
A
(AF)
T
54
86
54A
74
80
3.65
59
ISO VIEWS
SCALE 3:1
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
12
A A
B B
C C
D D
E E
F F
G G
H H
PROGRESSION
8.89
