PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-9203101M2A OBSOLETE LCCC FK 20 TBD Call TI Call TI
5962-9203101MEA OBSOLETE CDIP J 16 TBD Call TI Call TI
5962-9203102MEA OBSOLETE CDIP J 16 TBD Call TI Call TI
5962-9203103Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-9203103QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1861J OBSOLETE CDIP J 16 TBD Call TI Call TI
UC1861J883B OBSOLETE CDIP J 16 TBD Call TI Call TI
UC1863J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1863J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1863L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1863L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1864J OBSOLETE CDIP J 16 TBD Call TI Call TI
UC1864J883B OBSOLETE CDIP J 16 TBD Call TI Call TI
UC1864L OBSOLETE LCCC FK 20 TBD Call TI Call TI
UC1864L883B OBSOLETE LCCC FK 20 TBD Call TI Call TI
UC1865J OBSOLETE CDIP J 16 TBD Call TI Call TI
UC1865J883B OBSOLETE CDIP J 16 TBD Call TI Call TI
UC1867J OBSOLETE CDIP J 16 TBD Call TI Call TI
UC1867L OBSOLETE LCCC FK 20 TBD Call TI Call TI
UC2861DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2861DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2861Q ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2861QG3 ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2863DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2863DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2863N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2863NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2864DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2864DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2865N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2865NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2866N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2866NG4 ACTIVE PDIP N 16 25 Green (RoHS & CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 16-Oct-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
UC3861DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3861DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3861N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3861NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3862N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3862NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3863DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3863DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3863DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3863DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3863N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3863NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3864N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3864NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3865DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3865DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3865DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3865DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3865N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3865NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3865Q ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3865QG3 ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3867DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3867DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3867DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Oct-2009
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UC3867DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3867N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3867NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3868N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3868NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1861, UC1863, UC1864, UC1865, UC1867, UC3861, UC3863, UC3864, UC3865, UC3867 :
Space: UC1863-SP
NOTE: Qualified Version Definitions:
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
PACKAGE OPTION ADDENDUM
www.ti.com 16-Oct-2009
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
UC3863DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1
UC3865DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1
UC3867DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC3863DWTR SOIC DW 16 2000 346.0 346.0 33.0
UC3865DWTR SOIC DW 16 2000 346.0 346.0 33.0
UC3867DWTR SOIC DW 16 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2008
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party pro