6N139, 6N138, HCPL-0701, HCPL-0700, HCNW139, HCNW-138 Low Input Current, High Gain Optocouplers Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in TTL compatible saturation voltages and high speed operation. Where desired the VCC and VO terminals may be tied together to achieve convent ional photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made. * High current transfer ratio - 2000% typical (4500 % typical for HCNW139/138) * Low input current requirements - 0.5 mA * TTL compatible output - 0.1 V VOL typical * Performance guaranteed over temperature 0C to 70C * Base access allows gain bandwidth adjustment * High output current - 60 mA * Safetyapproval UL recognized - 3750 V rms for 1 minute and 5000 V rms* for 1 minute per UL 1577 CSA approved IEC/EN/DIN EN 60747-5-2 approved with VIORM = 1414 Vpeak for HCNW139 and HCNW138 * Available in 8-Pin DIP or SOIC-8 footprint or widebody package * MIL-PRF-38534 hermetic version available (HCPL-5700/1) The 6N139, HCPL-0701, and CNW139 are for use in CMOS, LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to 70C operating range for only 0.5 mA of LED current. The 6N138, HCPL-0700, and HCNW138 are designed for use mainly in TTL applications. Current Transfer Ratio (CTR) is 300% minimum over 0 to 70C for an LED current of 1.6 mA (1 TTL Unit load ). A 300% minimum CTR enables operation with 1 TTL Load using a 2.2 k pull-up resistor. Functional Diagram NC 1 8 VCC ANODE 2 7 VB CATHODE 3 6 VO NC 4 TRUTH TABLE LED VO ON LOW OFF HIGH 5 GND Applications * Ground isolate most logic families - TTL/TTL, CMOS/ TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL * Low input current line receiver * High voltage insulation (HCNW139/138) * EIA RS-232C line receiver * Telephone ring detector * 117 V ac line voltage status indicator - low input power dissipation * Low power systems - ground isolation *5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only. A 0.1 F bypass capacitor connected between pins 8 and 5 is recommended. 6N139 Functional Diagram CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Selection for lower input current down to 250 A is available upon request. lead profile is designed to be compatible with standard surface mount processes. The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint. The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creepage and clearance dimensions suitable for safety approval by regulatory agencies worldwide. The SOIC-8 does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The Selection Guide Widebody 8-Pin DIP Package (300 Mil) Small Outline SO-8 (400 mil) Dual Single Dual Minimum Absolute Single Channel Channel Channel Single Input ON MaxiChannel Package Package Package Channel Current Minimum mum Package HCPLHCPLHCPLPackage (IF) CTR VCC 6N139 2731[1] 6N138 2730 HCPL-4701[1] [1] 4731[1] 0701 0700 070A[1] 0731 HCNW139 0.5 mA 400% 0730 HCNW138 1.6 mA 300% 7V 40 A 800% 18 V 073A[1] 18 V 0.5 mA 300% 20 V Note: 1. Technical data are on separate Avago publications. 2 Hermetic Single and Dual Channel Packages HCPL- 5701[1] 5700[1] 5731[1] 5730[1] Ordering Information 6N138, 6N139, HCPL-0700 and HCPL-0701 are UL Recognized with 3750 Vrms for 1 minute per UL1577 and are approved under CSA Component Acceptance Notice #5, File CA 88324. Option Part RoHS non RoHS Number Compliant Compliant Package Surface Mount Gull Wing Tape & Reel UL 5000 Vrms/ 1 Minute rating IEC/EN/DIN EN 60747-5-2 Quantity -000E no option 300 mil DIP-8 50 per tube -300E #300 300 mil DIP-8 X X 50 per tube -500E #500 300 mil DIP-8 X X 1000 per reel 6N138 -020E #020 300 mil DIP-8 X 50 per tube 6N139 -320E #320 300 mil DIP-8 X X X 50 per tube -520E #520 300 mil DIP-8 X X X -060E #060 300 mil DIP-8 X 50 per tube -360E #360 300 mil DIP-8 X X X 50 per tube -560E #560 300 mil DIP-8 X X X 1000 per reel -000E no option SO-8 100 per tube #500 SO-8 1500 per reel HCPL-0700 -500E X X X X X 1000 per reel X HCPL-0701 -060E #060 SO-8 X 100 per tube -560E #560 SO-8 X 1500 per reel HCNW138 -000E no option 400 mil 42 per tube HCNW139 -300E #300 Widebody X X 42 per tube -500E #500 DIP-8 X X 750 per reel X To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entr y. Example 1: 6N138-560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant. Example 2: HCPL-0700 to order product of 300 mil DIP package in Tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation `#XXX' is used for existing products, while (new) products launched since July 15, 2001 and RoHS compliant will use `-XXXE.' 3 X X X Schematic VCC 8 ICC ANODE 2 IF + VF CATHODE - IO 3 6 5 SHIELD IB VB 6N139 Schematic 7 VO GND Package Outline Drawings 8-Pin DIP Package (6N139/6N138)** 7.62 0.25 (0.300 0.010) 9.65 0.25 (0.380 0.010) 8 TYPE NUMBER 7 6 5 6.35 0.25 (0.250 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5 TYP. 3.56 0.13 (0.140 0.005) 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). 0.65 (0.025) MAX. 1.080 0.320 (0.043 0.013) * MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED. 2.54 0.25 (0.100 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. **JEDEC Registered Data. 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138) LAND PATTERN RECOMMENDATION 9.65 0.25 (0.380 0.010) 8 7 6 1.016 (0.040) 5 6.350 0.25 (0.250 0.010) 1 2 3 10.9 (0.430) 4 1.27 (0.050) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 0.25 (0.380 0.010) 7.62 0.25 (0.300 0.010) 3.56 0.13 (0.140 0.005) 1.080 0.320 (0.043 0.013) 0.635 0.25 (0.025 0.010) 0.635 0.130 2.54 (0.025 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 4 2.0 (0.080) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12 NOM. Small Outline SO-8 Package (HCPL-0701/HCPL-0700) LAND PATTERN RECOMMENDATION 8 7 6 5 XXX YWW 3.937 0.127 (0.155 0.005) 5.994 0.203 (0.236 0.008) TYPE NUMBER (LAST 3 DIGITS) 7.49 (0.295) DATE CODE PIN ONE 1 2 3 4 0.406 0.076 (0.016 0.003) 1.9 (0.075) 1.270 BSC (0.050) 0.64 (0.025) * 5.080 0.127 (0.200 0.005) 3.175 0.127 (0.125 0.005) 7 1.524 (0.060) 45 X 0.432 (0.017) 0 ~ 7 0.228 0.025 (0.009 0.001) 0.203 0.102 (0.008 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 0.254 (0.205 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 8-Pin Widebody DIP Package (HCNW139/HCNW138) 11.00 MAX. (0.433) 11.23 0.15 (0.442 0.006) 8 7 6 5 TYPE NUMBER A HCNWXXXX 9.00 0.15 (0.354 0.006) DATE CODE YYWW 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7 TYP. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. 1.80 0.15 (0.071 0.006) 0.40 (0.016) 0.56 (0.022) DIMENSIONS IN MILLIMETERS (INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 5 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138) 11.23 0.15 (0.442 0.006) 8 7 6 LAND PATTERN RECOMMENDATION 5 9.00 0.15 (0.354 0.006) 1 2 3 13.56 (0.534) 4 2.29 (0.09) 1.3 (0.051) 12.30 0.30 (0.484 0.012) 1.55 (0.061) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.80 0.15 (0.071 0.006) 1.00 0.15 (0.039 0.006) 0.75 0.25 (0.030 0.010) 2.54 (0.100) BSC + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 7 NOM. LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Solder Reflow Temperature Profile 300 PREHEATING RATE 3 C + 1 C/-0.5 C/SEC. REFLOW HEATING RATE 2.5 C 0.5 C/SEC. 200 PEAK TEMP. 245 C PEAK TEMP. 240 C TEMPERATURE (C) 2.5 C 0.5 C/SEC. 30 SEC. 160 C 150 C 140 C PEAK TEMP. 230 C SOLDERING TIME 200 C 30 SEC. 3 C + 1 C/-0.5 C 100 PREHEATING TIME 150 C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 TIME (SECONDS) NOTE: NON-HALIDE FLUX SHOULD BE USED. 6 200 250 Recommended Pb-Free IR Profile tp Tp TEMPERATURE TL Tsmax * 260 +0/-5 C TIME WITHIN 5 C of ACTUAL PEAK TEMPERATURE 15 SEC. 217 C 150 - 200 C RAMP-UP 3 C/SEC. MAX. NOTES: THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 C, Tsmin = 150 C RAMP-DOWN 6 C/SEC. MAX. Tsmin ts PREHEAT 60 to 180 SEC. 25 tL NOTE: NON-HALIDE FLUX SHOULD BE USED. 60 to 150 SEC. * RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 C t 25 C to PEAK TIME Regulatory Information The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations: UL IEC/EN/DIN EN 60747-5-2 Recognized under UL 1577, Component Recognition Program, File E55361. Approved under IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (HCNW139/138 only) CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. Insulation and Safety Related Specifications Parameter Symbol 8-Pin DIP (300 Mil) SO-8 Value Value Widebody (400 Mil) Value Units Minimum External L(101) 7.1 4.9 9.6 mm Air Gap (External Clearance) Measured from input terminals to output terminals, shortest distance through air. Minimum External L(102) 7.4 4.8 10.0 mm Tracking (External Creepage) Measured from input terminals to output terminals, shortest distance path along body. Minimum Internal 0.08 0.08 1.0 mm Plastic Gap (Internal Clearance) Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA 4.0 mm Tracking (Internal Creepage) Measured from input terminals to output terminals, along internal cavity. Tracking Resistance (Comparative Tracking Index) DIN IEC 112/VDE 0303 Part 1 CTI 200 200 200 Volts Isolation Group IIIa IIIa IIIa Option 300 - surface mount classification is Class A in accordance with CECC 00802. 7 Conditions Material Group (DIN VDE 0110, 1/89, Table 1) IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138) Description Symbol Characteristic Units Installation Classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage 600 V rms I-IV for rated mains voltage 1000 V rms I-III Climatic Classification 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage VIORM 1414 Vpeak Input to Output Test Voltage, Method b* VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, Partial Discharge < 5 pC VPR 2652 Vpeak Input to Output Test Voltage, Method a* VPR = 1.5 x VIORM, Type and Sample Test, tP = 60 sec, Partial Discharge < 5 pC VPR 2121 Vpeak VIOTM 8000 Vpeak TS IS,INPUT PS,OUTPUT 175 400 700 C mA mW RS > 109 Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 11, Thermal Derating curve.) Case Temperature Current (Input Current IF, PS = 0) Output Power Insulation Resistance at TS, VIO = 500 V *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 8 Absolute Maximum Ratings* (No Derating Required up to 85C) Parameter Symbol Min. Max. Units Storage Temperature Operating Temperature** TS -55 125 C TA -40 85 C Average Forward Input Current IF(AVG) 20 mA Peak Forward Input Current (50% Duty Cycle, 1 ms Pulse Width) IFPK 40 mA Peak Transient Input Current (<1 s Pulse Width, 300 pps) IF(TRAN) 1.0 A Reverse Input Voltage VR 5 V HCNW139/138 3 V Input Power Dissipation PI 35 mW Output Current (Pin 6) IO 60 mA Emitter Base Reverse Voltage (Pin 5-7) VEB 0.5 V Supply Voltage and Output Voltage (6N139, HCPL-0701, HCNW139) VCC -0.5 18 V Supply Voltage and Output Voltage (6N138, HCPL-0700, HCNW138) VCC -0.5 7 V Output Power Dissipation PO 100 mW PT 135 mW Total Power Dissipation Lead Solder Temperature (for Through Hole Devices) 260C for 10 sec., 1.6 mm below seating plane HCNW139/138 260C for 10 sec., up to seating plane Reflow Temperature Profile See Package Outline Drawings section (for SOIC-8 and Option #300) *JEDEC Registered Data for 6N139 and 6N138. **0C to 70C on JEDEC Registration. Recommended Operating Conditions Parameter 9 Symbol Min. Max. Units Power Supply Voltage VCC 4.5 18 V Forward Input Current (ON) IF(ON) 0.5 12.0 mA Forward Input Voltage (OFF) VF(OFF) 0 0.8 V Operating Temperature TA 0 70 C Electrical Specifications 0C TA 70C, 4.5 V VCC 18 V, 0.5 mA IF(ON) 12 mA, 0 V VF(OFF) 0.8 V, unless otherwise specified. All Typicals at TA = 25C. See Note 7. Parameter Sym. Device Min. Typ.** Max. Units Test ConditionsFig. Note Current Transfer CTR 6N139 400* 2000 5000 % IF = 0.5 mA VCC = 4.5 2, 3 Ratio HCPL-0701 VO = 0.4 V HCNW139 400 4500 6N139 500* 1600 2600 IF = 1.6 mA HCPL-0701 HCNW139 500 3000 300 1600 IF = 5.0 mA 200 850 IF = 12 mA 6N138 300* 1600 2600 IF = 1.6 mA HCPL-0700 HCNW138 1500 Logic Low Output VOL 6N139 0.1 0.4 V IF = 0.5 mA, VCC = 4.5 1 Voltage HCPL-0701 IO = 2 mA HCNW139 IF = 1.6 mA, IO = 8 mA IF = 5.0 mA, IO = 15 mA 0.2 IF = 12 mA, IO = 24 mA 6N138 0.1 IF = 1.6 mA, HCPL-0700 IO = 4.8 mA HCNW138 Logic High IOH 6N139 0.05 100 A VO = VCC = 18 V IF = 0 mA Output Current HCPL-0701 HCNW139 6N138 0.1 250 VO = VCC = 7 V HCPL-0700 HCNW138 Logic Low Supply ICCL 6N138/139 0.4 1.5 mA IF = 1.6 mA, VO = Open, 10 Current HCPL-0701/ VCC = 18 V 0700 HCNW139 0.5 2 HCNW138 Logic High ICCH 6N138/139 0.01 10 A IF = 0 mA, VO = Open, Supply Current HCPL-0701/ VCC = 18 V 0700 HCNW139 1 HCNW138 Input Forward VF 6N138 1.25 1.40 1.7* V TA = 25C IF = 1.6 mA 4, 8 Voltage 6N139 HCPL-0701 1.75 HCPL-0700 HCNW139 1.0 1.45 1.85 TA = 25C HCNW138 0.95 1.95 Input Reverse BVR 5.0* V IR = 10 A, TA = 25C HCNW139 3.0 I R = 100 A, TA = 25C Breakdown Voltage HCNW138 Temperature VF -1.8 mV/C IF = 1.6 mA 8 Coefficient of TA Forward Voltage Input CIN 60 pF f = 1 MHz, VF = 0 V Capacitance HCNW139 90 HCNW138 *JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25C and VCC = 5 V, unless otherwise noted. 10 1, 2, 4 2 2 2 2 Switching Specifications (AC) Over recommended operating conditions (TA = 0 to 70C), VCC = 5 V, unless otherwise specified. Parameter Sym. Device Min. Typ.** Max. Units Test Conditions TA =25C Fig. Note 6N139 5 25* 30 s IF = 0.5 mA, 5, 6, 2, 4 HCPL-0701 Rl = 4.7 k 7, 9, HCNW139 12 6N139 0.2 1* 2 s IF = 12 mA, HCPL-0701 Rl = 270 HCNW139 11 6N138 1.6 10* 15 s IF = 1.6 mA, HCPL-0700 Rl = 2.2 k HCNW138 11 Propagation tPLH 6N139 18 60* 90 s IF = 0.5 mA, 5, 6, 2, 4 Delay Time HCPL-0701 Rl = 4.7 k 7, 9, to Logic High HCNW139 115 12 at Output 6N139 2 7* 10 s IF = 12 mA, HCPL-0701 Rl = 270 HCNW139 11 6N138 10 35* 50 s IF = 1.6 mA, HCPL-0700 Rl = 2.2 k HCNW138 70 Common Mode |CMH| 1000 10000 V/s IF = 0 mA, 13 5, 6 Transient TA = 25C Immunity at Rl = 2.2 k Logic High |VCM| = 10 Output Vp-p Common Mode |CML| 1000 10000 V/s IF = 1.6 mA, 13 5, 6 Transient TA = 25C Immunity at Rl = 2.2 k Logic Low |VCM| = 10 Output Vp-p Propagation tPHL Delay Time to Logic Low at Output *JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25C and VCC = 5 V, unless otherwise noted. 11 Package Characteristics Parameter Sym. Min. Typ.** Max. Units Input-Output Momentary VISO 3750 V rms Withstand Voltage Option 020 HCNW139 HCNW138 Fig. Note 3, 8 5000 3, 9 Resistance (Input-Output) RI-O 1012 Capacitance (Input-Output) Test Conditions RH < 50%, t = 1 min., TA = 25C CI-O 0.6 pF VI-O = 500 Vdc RH < 45% 3 f = 1 MHz 3 **All typicals at TA = 25C, unless otherwise noted. The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage." Notes: 1. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%. 2. Pin 7 Open. 3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values below 47 k. For more information, please contact your local Avago Components representative. 5. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM /dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM /dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 6. In applications where dV/dt may exceed 50,000 V/s (such as static discharge) a series resistor, RCC, should be included to protect the detector IC from destructively high surge currents. The recommended value is RCC = 220 . 7. Use of a 0.1 F bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended. 8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 4500 V rms for 1 second (leakage detection current limit, II-O < 5 A). This test is performed before the 100% production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table, if applicable. 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection current limit, II-O < 5 A). This test is performed before the 100% production test for partial discharge (method b) shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table, if applicable. 12 4.0 mA A 1.5 m 25 1.0 mA 0.5 mA 0 VCC = 5 V TA = 25 C 0 1.0 2.0 2000 85C 70C IO - OUTPUT CURRENT - mA IO - OUTPUT CURRENT - mA A 3.5 m A 3.0 m A 2.5 m A 2.0 m CTR - CURRENT TRANSFER RATIO - % 5.0 mA 50 4.5 mA 25C 1600 70C -40C 1200 800 400 VCC = 5 V VO = 0.4 V 0 0.1 VO - OUTPUT VOLTAGE - V 1.0 Figure 2. Current transfer ratio vs. forward current 6N138/6N139 Figure 1. 6N138/6N139 DC transfer characteristics 10 TA = 85 C 1.0 0.1 0.01 0.01 10 IF - FORWARD CURRENT - mA 100 TA = 70 C TA = 25 C TA = 0 C TA = -40 C 0.1 10 1 IF - INPUT DIODE FORWARD CURRENT - mA Figure 3. 6N138/6N139 output current vs. input diode forward current 6N1390 fig 1 6N139 fig 2 10 1.0 + VF - TA = 85C TA = 70C 0.1 TA = 25C 0.01 0.001 1.1 TA = 0C TA = -40C 1.2 1.3 1.5 1.4 35 30 20 15 10 tPHL 5 VF - FORWARD VOLTAGE - V Figure 4. Input diode forward current vs. forward voltage 40 60 80 100 TA - TEMPERATURE - C Figure 7. Propagation delay vs. temperature 6N139 Figure 7 13 tPLH 15 12 9 6 tPHL 3 0 -60 -40 -20 80 100 0 20 40 60 80 100 TA - TEMPERATURE - C Figure 6. Propagation delay vs. temperature 6N139 Figure 6 100 IF = 1.6 mA TA = 25 C tf 1.5 TIME - s tPLH tPHL 20 IF = 1.6 mA RL = 2.2 k 1/f = 50 s 1.6 1 0 40 60 18 6N139 Figure 5 2 0 -60 -40 -20 20 Figure 5. Propagation delay vs. temperature VF - FORWARD VOLTAGE - V tP - PROPAGATION DELAY - s 3 IF = 12 mA RL = 270 k 1/f = 50 s 0 21 TA - TEMPERATURE - C 6N139 fig 4 4 tPLH 25 0 -60 -40 -20 1.6 24 IF = 0.5 mA RL = 4.7 k 1/f = 50 s tP - PROPAGATION DELAY - s 100 40 IF tP - PROPAGATION DELAY - s IF - FORWARD CURRENT - mA 1000 6N139 fig 3 1.4 tr 10 1.3 IF - ADJUSTED FOR VOL = 2 V 1.2 -60 -40 -20 0 20 40 60 80 100 TA - TEMPERATURE - C Figure 8. Forward voltage vs. temperature 1 0.1 1.0 10 RL - LOAD RESISTANCE - k Figure 9. Nonsaturated rise and fall times vs. load resistance 6N139 Figure 8 6N139 fig 9 OUTPUT POWER - PS, INPUT CURRENT - IS ICCL - LOGIC LOW SUPPLY CURRENT - mA 0.8 0.7 0.6 0.5 VCC = 18 V 0.4 VCC = 5 V 0.3 0.2 0.1 0 0 4 2 8 6 12 10 14 16 WIDEBODY 1000 PS (mW) 900 IS (mA) 800 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 TS - CASE TEMPERATURE - C IF - FORWARD CURRENT Figure 10. Logic low supply current vs. forward current Figure 11. Thermal derating curve, dependence of safety limiting value 6N139 fig 11b with case temperature per IEC/EN/DIN EN 60747-5-2 6N139 Figure 10 IF PULSE GEN. ZO = 50 t r = 5 ns 0 5V VO (SATURATED RESPONSE) 1.5 V 1.5 V VOL t PHL t PLH IF 10% DUTY CYCLE I/f < 100 s 1 8 2 7 3 6 +5 V RL VO 0.1 F I F MONITOR 5 4 CL = 15 pF* RM VO 90% (NON-SATURATED RESPONSE) 10% 90% 5V * INCLUDES PROBE AND FIXTURE CAPACITANCE 10% tf tr Figure 12. Switching test circuit VCM 10 V 0 V 10% 90% 90% tr VO IF tr, tf = 16 ns B 6N139 Figure 12 10% tf A 5V VFF SWITCH AT A: IF = 0 mA VO SWITCH AT B: IF = 1.6 mA 1 8 RCC (SEE NOTE 6) +5 V 2 7 RL 3 6 4 5 VCM + - VOL PULSE GEN. Figure 13. Test circuit for transient immunity and typical waveforms 6N139 Figure 13 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0543EN AV02-1359EN - January 28, 2010 VO