USB Type-C Demo Kit V2 Board User Guide
EB99 Version 1.2, December 2015
2
USB Type-C Demo Kit V2 Board
Introduction
The USB Type-C Demo Kit V2 has been developed to support a variety of demos, encompassing different levels of
the USB Type-C functionality which includes Power Delivery and negotiation, power and data role swap, control chan-
nel negotiation, super speed signaling, DP alternate mode support and a low speed signal aggregation function.
There are two versions of this board, as identified by the Ordering Part Numbers (iCE40LP8K-USBC-EVN and
iCE5LP4K-USBC-EVN). This document is applicable to either version, with the notes as applicable.
The main circuits on the development kit board:
• Programming Circuit
— Mini-USB Type B connector to FTDI
— FTDI to MachXO2™ Programming Mux
• MachXO2-4000ZE
— Programming Multiplexing
— Signal Generator and Receiver for aggregation
— General Purpose I/O
— LED Display Control
• iCE40LP-8K (iCE40LP8K-USBC-EVN only)
— Super-speed signaling control
— CD-PD physical layer and power delivery manager
— Billboard support
— DP alternate mode support and control
— Aggregator support
— AP interface
— Data logging
• iCE5LP-4K (iCE5LP4K-USBC-EVN only)
— Super-Speed signaling Control
— CD-PD physical layer and power delivery manager
— AP interface
— Data logging
Note: The iCE40LP8K-USBC-EVN board from Lattice is hardwired to behave as a UFP_D (DisplayPort UFP)
device. If you need to test DFP_D (DisplayPort DFP) functionality, apply the following changes on the board:
• R199,R201,R203,R205,R207,R209,R211,R213,R215,R217 - Do Not Populate
• R198,R200,R202,R204,R206,R208,R210,R212,R214,R216 - Populate
3
USB Type-C Demo Kit V2 Board
Key Components
Figure 1 is the top view of the USB Type-C Demo Kit V2 Board showing the key components present on the board.
Figure 1. Top View of USB Type-C Demo Kit V2 Board with Key Components
Power Jacket (J8)
Header Pool
10-Bit Switch (SW3)
USB 2.0 Mini-B (J2)
FTDI Chip (U1)
iCE5LP4K (U5)1
USB Type-C Receptacle (CN2)
USB Type-A Receptacle (J6)
Power Switch (SW2)
LEDs (D1-D8) LEDs (D17-D25)
LEDs (D26-D33)
LCMXO2-4000ZE (U4)
DP Connector UFP (CN1)2
DP Connector DFP (CN2)2
iCE40LP8K (U22)2
HD3SS460 (U11)
P13D6S3224 (U19)
SN8F22511BX (U13)2
Boost
Regulator
(U18)2
Notes:
1. iCE5LP4K-USBC EVN Only
2. iCE40LP8K-USBC EVN Only
4
USB Type-C Demo Kit V2 Board
Headers and Test Connectors
Figure 2 shows the top view of the demo board. The numbers of headers and test connectors which provide
access to USB Type-C Demo Kit V2 Board circuits are indicated.
Figure 2. Top View of the USB Type-C Demo Kit V2 Board with Headers and Test Connectors
Table 1 provides the detailed definition of the headers and test connectors.
Table 1. Headers and Test Connectors
Part Description Setting Options Default Setting
J1 External JTAG I/F
J3 JTAG/SPI Selection 1-2 (SPI), 2-3 (JTAG) JTAG
J16 JTAG/I2C Selection 1-2 (JTAG), 2-3 (I2C) JTAG
SW1 MachXO2 Reset Switch
J17 Jumper for DP Power Open-Off, Short-On Open
J5 BB Device Programmer I/F
SW2 Board Power Switch Left-On, Right-Off Right
J7 VBUS Sink Connector Open-Off, Short-On Open
SW3 General Purpose Input Switch
J9 USB Role Selection 1-2 (UFP), 2-3 (DFP) Open
J10 MachXO2 I/O HIZ Enable 1-2 (Enable), 2-3 (Disable) Open
J15 For Testing/Probing
J12 MachXO2 I/O Direction Input 1-2 (Input), 2-3 (Output) Open
J20 For Testing/Probing
J18 External I2C I/F
J19 External AGG Inputs
(SW3)
J18 J16
SW2
J20 J12
J10
J17
J5
J9 J19 J15
SW1
J7J3
J1
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USB Type-C Demo Kit V2 Board
Programming Circuit
The Mini-USB Type B connector is used for programming the board, using the standard Diamond Programmer soft-
ware. Figure 3 shows the programming block of the USB Type-C Demo Kit V2.
The Mini-USB Type B connector interfaces with the FTDI FT2232H IC. The FTDI IC works with Diamond program-
mer to provide interfaces for JTAG (for programming MachXO2-4000ZE) and SPI (for programming both the
iCE40™ LP and iCE40 Ultra™ devices and their SPI Flash Memories). The SPI programming works in conjunction
with a mux design that must be programmed into the MachXO2-4000ZE. The mux design operation and required
switch settings are described in detail in the next section. When the MachXO2 device contains the mux design and
the proper switch settings are chosen, the Diamond Programmer interfaces directly with the iCE40 devices or SPI
Flashes.
Figure 3. Programming Block
Programming Mux and Switch Settings
The board allows for programming the various devices contained on the USB Type-C Demo Kit V2:
• MachXO2 (LCMXO2-4000ZE-1MG132C) – U4
• iCE40 LP (iCE40LP8K-CM81) – U22
— Configuration or Programming
— iCE40 Ultra External SPI Flash – U10
— Micron Technology Inc. (N25Q032A13ESC40F)
— CDONE LED (Red) – D11
• iCE40 Ultra (iCE5LP4K-SG48) – U7
— Configuration or Programming
— iCE40 Ultra External SPI Flash - U6
— Micron Technology Inc (N25Q032A13ESC40F)
— CDONE LED (Green) – D9
• iCE40 Device CRESETB can be asserted by pushing SW1
— Routed through MachXO2 device
USB MINI-B FTDI
FT2232H
LCMX02-
4000ZE
ICE40LP8K-
CM81 or
ICE5LP4K-48
Switch FLASH
J2 U1 U4 U5/U22
SW3 U10
6
USB Type-C Demo Kit V2 Board
Figure 4 shows the DIP switch numbering and settings.
Figure 4. DIP Switch Numbering
Two positions of the DIP switch SW3 and the header J3 are used to control which devices and which mode the
FTDI Bridge utilizes. Table 2 provides the detailed definitions of the DIP switch settings required to program each
device.
Table 2. DIP Switch Settings to Program the Device
Note: The MachXO2 must be programmed with an image containing the SPI programming multiplexing and CRESET
level-shifting driver (for example, the default image asdf.jed) prior to programming or configuring the iCE40 devices or
their subtended SPI Flash devices.
Device Operation Mode Jumper Position DIPSW (SW3) Position
J16 J3 SW3.1 SW3.2
MachXO2 Program/Configure JTAG 1-2 3-2 Up Down
iCE40 CRAM Program/Configure SPI 1-2 1-2 Down Down
iCE40 Flash Program/Configure SPI 1-2 1-2 Down Up
(All) Boot — 3-2 — Up Up
J16
J3
SW3.1
SW3.2
SW3.3
SW3.4
SW3.5
SW3.6
SW3.7
SW3.8
SW3.9
SW3.10
(SW3)
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USB Type-C Demo Kit V2 Board
Status Indicators
The board provides the number of LED status indicators, shows power, configuration, and an application status.
Table 3 provides the detailed definition of the Status LED I/O Map.
Table 3. Status LED I/O Map
Device I/O Balls LED Schematic NET Bank Color
LCMX02-4000ZE B1 D1 AGG_LED1 3 Green
LCMX02-4000ZE B2 D2 AGG_LED2 3 Green
LCMX02-4000ZE C1 D3 AGG_LED3 3 Green
LCMX02-4000ZE C2 D4 AGG_LED4 3 Green
LCMX02-4000ZE C3 D5 AGG_LED5 3 Green
LCMX02-4000ZE D1 D6 AGG_LED6 3 Green
LCMX02-4000ZE E1 D7 AGG_LED7 3 Green
LCMX02-4000ZE E2 D8 AGG_LED8 3 Green
LCMX02-4000ZE J3 D17 STATUS_LED1 3 Blue
LCMX02-4000ZE K1 D20 STATUS_LED2 3 Blue
LCMX02-4000ZE K2 D22 STATUS_LED3 3 Green
LCMX02-4000ZE K3 D23 STATUS_LED4 3 Green
LCMX02-4000ZE L3 D26 STATUS_LED5 3 Red
LCMX02-4000ZE M1 D27 STATUS_LED6 3 Red
LCMX02-4000ZE M2 D30 STATUS_LED7 3 Yellow
LCMX02-4000ZE N9 D31 STATUS_LED8 2 Yellow
LCMX02-4000ZE N10 D33 STATUS_LED9 2 Yellow
LCMX02-4000ZE P2 D18 STATUS_LED10 2 Blue
LCMX02-4000ZE P4 D19 STATUS_LED11 2 Blue
LCMX02-4000ZE P6 D21 STATUS_LED12 2 Green
LCMX02-4000ZE P7 D23 STATUS_LED13 2 Green
LCMX02-4000ZE P8 D25 STATUS_LED14 2 Green
LCMX02-4000ZE P9 D28 STATUS_LED15 2 Blue
LCMX02-4000ZE P11 D29 STATUS_LED16 2 Blue
LCMX02-4000ZE P12 D32 STATUS_LED17 2 Blue
ICE5LP4K 7 D9 4KDONE 2 Red
ICE40LP8K E6 D11 CDONE 2 Red
8
USB Type-C Demo Kit V2 Board
MachXO2-4000ZE Circuit Overview
LCMXO2-4000ZE-1MG132C
The MachXO2 device (LCMXO2-4000ZE-1MG132C) on the board performs a variety of functions:
• Programming Multiplexing
— Interface from PC/FTDI to iCE5LP, iCE40LP, and SPI Flash memories
• Signal Aggregator Demo Function
— Includes interface to iCE40LP8K
• General Purpose I/O from DIP switches and LEDs
The USB demo design includes bitstreams for the MachXO2.
Note: Refer to the documents accompanying each demo for details on the specific design function of the
MachXO2.
Tables provide the detailed definition of the different functions:
• LED Indication (Table 3)
• Switches (Table 4)
— DIP Switches
— Push Button
— 3-pin Headers
• iCE40LP8K/iCE5LP4K Interface (Table 5)
• External Application Processor Interface (Table 6)
Table 4 provides the detailed definition of the I/O Map for the device MachXO2 general purpose functions.
Table 4. Switches / I/O Map for MachXO2
Device I/O Ball Schematic Net Bank Designator
LCMX02-4000ZE B9/B12 CONFIG_SW1 0 SW3
LCMX02-4000ZE B14 CONFIG_SW2 1 SW3
LCMX02-4000ZE C13 CONFIG_SW3 1 SW3
LCMX02-4000ZE C14 SW4 1 SW3
LCMX02-4000ZE D12 SW5 1 SW3
LCMX02-4000ZE E12 SW6 1 SW3
LCMX02-4000ZE E13 SW7 1 SW3
LCMX02-4000ZE E14 SW8 1 SW3
LCMX02-4000ZE F12 SW9 1 SW3
LCMX02-4000ZE F13 SW10 1 SW3
LCMX02-4000ZE A2 XO2_RESET 0 SW1
POWER — 5V — SW2
9
USB Type-C Demo Kit V2 Board
Table 5. Aggregator I/O Map for MachX02
The MachXO2-4000ZE and an iCE40LP8k/iCE5LP4K provides connections to the header J18 (Embedded control-
ler connector). Table 6 provides the detailed definition of the signals.
Table 6. AP Interface for MachXO2, iCE40LP/iCE5LP and J18
MACHX02(U4) ICE40LP8K(U22) HD3SS460(U11)
Pin Number Schematic Net
I/O Ball Bank I/O Ball Bank
F13B60 —AGG_GPIO1
F23A60 —AGG_GPIO2
F33B50 —AGG_GPIO3
G33A40 —AGG_GPIO4
H13B40 —AGG_GPIO5
H23D50 —AGG_GPIO6
H33E50 —AGG_GPIO7
J13A30 —AGG_GPIO8
B80A80 —SDA1
C80B80 —SCL1
A90B70 —SDA2
A70A70 —SCL2
A2 0 13 AUX_CHP
A1 0 14 AUX_CHN
iCE40LP8K(U22) iCE5LP4K(U5) XO2(U4) J18 Schematic Net
Name
IO Ball Bank IO Ball Bank IO Ball Bank
G7 SPI 15 2 M7 2 1 SPI_SCK
G42182N42 3EC_CS
G6 SPI 14 2 M9 2 5 SPI_MISO
H7 SPI 17 2 M8 2 8 SPI_MOSI
10
USB Type-C Demo Kit V2 Board
iCE40LP8K
The iCE40LP8K (U5/U22) is one of the devices on the board used to demonstrate the Lattice Type-C Power Deliv-
ery (PD) management and Cable Detect (CD) solution. In order to support the variety of demos, the iCE device
provides multiple parallel and serial connections to the MachXO2 device on the board. Table 5 and Table 6 provide
the detailed definition of the connections. Both the devices are connected to the J18 (Embedded Controller
header).
The iCE configuration may be stored in external SPI Flash (Refer the section Programming Mux and Switch Set-
tings for more information. The external SPI Flash (U10) is connected to the configuration SPI port of the iCE
device. These signals, along with the CDONE and CRESET signals from the iCE are connected to the MachXO2-
4000ZE device to facilitate connection from the PC (for programming) to both the iCE and SPI Flash.
The 25 MHz oscillator X2 is used to provide an external clock signal to the iCE40LP device. This clock signal is
also passed to the iCE5LP device. Table 7 provides the detailed definition of the clock connections.
Table 7. Clock Connections for iCE40LP
Power Supply
Power supply to the development kit is by the MINI-USB Type-B connector or from an external adaptor. This con-
nector provides 5 V source for the voltage regulators on the board which supply the power to MachXO2 and iCE
devices on the board. Each IO and core voltage rail on the board is accessible by a test point on the board. The
current flowing to each rail can also be measured using a 1Ω resistor placed in the path of each voltage rail.
Figure 5 shows the device power rails. There are three voltage regulators on the board used to supply the 3.3 V,
1.8 V, and 1.2 V rails. The input to these regulators is the 5 V rail on the board, which is supplied from either the
MINI-USB Type-B connector or external power adaptor via switch SW2.
Figure 5. Device Power Rails
Several of the voltage rails also connect to indicator LEDs on the board to display the power status to the user.
These LEDs are listed in Table 8.
ICE40LP8K(U22) ICE5LP4K(U5) Schematic Net
IO Ball Bank IO Ball Bank Name
D8 1 20 2 CLK IN
EXT
ADAPTER
USB MINI
LD0
LD0
LD0
J8
J2 5V
VCC3V3
VCC1V2
DP3V3
U14
U15
U21
SW2
11
USB Type-C Demo Kit V2 Board
Table 8. Voltage Rail Indicator LEDs
The board voltage rails are summarized in Table 9, including the rail source voltage, test point #, and current sense
resistor number.
Table 9. Device Power Rail Summary and Test Points
Voltage Rail Indicator LED Color
INT_5V D12 Blue
VCC3V3 D14 Yellow
5V D14 Yellow
Voltage Rail Source Rail Sense Resistor Test Point #
VCC_SPI VCC3V3 — TP18
VCONN_5V 5V R106 —
XO2_VCCIO0 VCC3V3 R107 TP6
XO2_VCCIO1 VCC3V3 R109 TP8
XO2_VCCIO2 VCC3V3 R111 TP10
XO2_VCCIO3 VCC3V3 R113 TP12
ICEVCCIO0 VCC3V3 R108 TP7
ICEVCCIO1 VCC3V3 R110 TP9
ICEVCCIO2 VCC3V3 R112 TP11
ICEVCCIO3 VCC3V3 R114 TP13
XO2_CORE VCC3V3 R102 TP4
ICE4K_CORE VCC3V3 R104 TP5
ICE8K_CORE VCC3V3 R105 TP16
DP3V3 INT_5V — —
5V USB5V/EXT_5V — TP17
VBUS EXT_5V — —
12
USB Type-C Demo Kit V2 Board
USB Super-Speed Switch/Alternate Mode Function
The development kit includes a super-speed switch IC (U11 - HD3SS460) along with a high-speed USB switch
(U19 – PI3DBS3224). The super-speed switch IC is used to demonstrate the orientation-agnostic capability of the
USB Type-C connector. The switches connect various USB sockets. Figure 6 shows the switch functions and the
data flow diagram.
Figure 6. Super Speed Block
U11 is connected on one side to the standard-USB 9-pin connector (J6), the Mini DP connectors (CN1 and CN3)
and the other side connected to the USB Type-C connector (CN1). J6 provides a bi-directional Super-Speed chan-
nel as well as a bi-directional High-Speed channel, with CN1, CN2 providing a unidirectional display source data.
The U11 switch connection is managed by the iCE40 device on the board, using the SS_EN, SS_AMSEL, and
SS_POL signal inputs to U11. For more information refer the documentation on the super-speed switch demo.
Table 10 provides the detailed definition of the mode supported by the super speed switch.
USB
Type B
(J4)
DP
Type C
Connector
(CN1)
T1
HD3SS460
(U12)
SSRX+/-
SSTX+/-
LNA
LNB
LNC
LNQ
POL
AMSEL
EN
SSRX
SSTX
CRX1
CTX1
RX1
TX1
CRX2
CTX2
RX2
TX2
SS
HS
SBU1
SBU2
RFU1
RFU2
13
USB Type-C Demo Kit V2 Board
Table 10. Modes Supported by Super Speed Switch
POL AMSEL EN Configurations High Speed Signal Flow SBU Signal Flow
L L H
2CH USB SS
+ 2CH AM
(Normal)
SSRX SSTX
CRX 1
CTX 1
CTX 2
CRX 2
LnD
LnC
LnB
LnA
SBU 1
SBU 2
CSBU 1
CSBU 2
H L H
2CH USBSS
+ 2CH AM
(Flipped)
SBU 1
SBU 2
CSBU 1
CSBU 2
L H H
4CH AM
(Normal)
SSRX SSTX
CRX 1
CTX 1
CTX 2
CRX 2
LnD
LnC
LnB
LnA
SBU 1
SBU 2
CSBU 1
CSBU 2
H H H 4CH AM
(Flipped)
SSRX SSTX
CRX 1
CTX 1
CTX 2
CRX 2
LnD
LnC
LnB
LnA
SBU 1
SBU 2
CSBU 1
CSBU 2
14
USB Type-C Demo Kit V2 Board
USB High Speed Function
High speed switch function done by the device (U19) which receives inputs from the standard-USB 3.0 type A con-
nector J6 and the Billboard device (U13) data using USB2.0 protocol and switches either of one to the Type-C con-
nector (CN2). The switching behavior of U13 is controlled by the iCE device using the HS_SAI and HS_EN signals.
Figure 7 shows the High Speed Switch.
Figure 7. High Speed Switch
Table 11 provides the detailed definition of the MUX selection.
Table 11. MUX Selection
ENA/B SAI OUTA0
0 X Hi-Z
11INA
10INB
USB CONN
BB DEVICE
HS Switch
Type-
C
CONN
ICE5LP4K/ICE40LP8K
J6 U19 CN2
U13
15
USB Type-C Demo Kit V2 Board
Billboard Interface
Billboard interface is the feature supported by USB Type-C protocol and which functioned by U13 and based on the
iCE control for the HS switch it will be terminated to the Type-C connector (CN2). Table 12 provides the detailed
definition of the Billboard Interface I/O map and associated net names.
Table 12. Billboard Interface
Data Logging Interface
Data logging interface can use a terminal screen such as HyperTerminal or Putty to display PD transactions of the
USB Type-C Demo Kit V2. Figure 8 shows the data flow and the block diagram of the data logging interface.
Figure 8. Data Logging Interface
Ordering Information
ICE40LP8K(U22) SNF225111BX(U13) J5 PI3DBS3224(U19) Schematic Net
I/O Ball Bank Pin Name Pin Number Pin Number
C4 0 P5.0/SCK — — BB_SCK
H5 2 P5.0/SDO — — BB_SDO
G5 2 P5.1/SDI — — BB_SDI
C5 0 P0.1/INT1 — — BB_INT
— — P1.0 2 — BB_PGM
— — P1.1 3 — BB_ALSB/PDB
— — P2.0 5 — BB_CLK
— — P2.1 4 — BB_OE
— — DN — 4 BB_DN
— — DP — 3 BB_DP
Description Ordering Part Number
China RoHS Environment-
Friendly Use Period
iCE40LP8K USB Type-C Demo Kit V2 iCE40LP8K-USBC-EVN
iCE40 Ultra USB Type-C Demo Kit V2 iCE5LP4K-USBC-EVN
USB MINI-B FTDI
FT2232HL
MXU ICE40LP8K-
CM81
ICE5LP4K-48
LCMX02-
4000ZE
J2
U1
U3 L22
U5
U4
JTAG/I2C
UART
16
USB Type-C Demo Kit V2 Board
Technical Support Assistance
Submit a technical support case via www.latticesemi.com/techsupport.
Revision History
© 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as
listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of
their respective holders. The specifications and information herein are subject to change without notice.
Date Version Change Summary
December 2015 1.2 Updated the SW3 switch settings according to the USB Type-C Demo
Kit V2-Rev B.
Updated the schematic diagrams according to the USB Type-C Demo
Kit V2-Rev B.
October 2015 1.1 Updated Introduction section. Added note on modifying board popula-
tion.
Updated USB Super-Speed Switch/Alternate Mode Function section.
Removed note on modifying board population.
June 2015 1.0 Initial release.
17
USB Type-C Demo Kit V2 Board
Appendix A. Schematic Diagrams (USB Type--C Demo Kit V2-REV B)
Figure 9. Block Diagram
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Type-C Connector
ICE40LP8K-CM81
ICE5LP4K-SG48
USB
SS/AM
SWITCH
Source Mini DP
Connector
USB3.1 Data(Tx,Rx)
SS CNTRL
USB3.1-A-Female
Connector
X4 DP Data Pairs
Aggregator Data
Comparator
SPDT Switch
CC Rx,Tx
CC Tx
CC Rx
SPI Flash
SPI
SPI
USB-Mini-B
Connector
FTDI LCMXO2-1200ZE
Power-Reg
ISL97656
CNTRL
X4 DP/USBSS Data Pairs
DP AUX/Aggregator Data(SBU)
CC
USB2.0 D+/D-
Status LED's
Aardvark
Connector
I2C
I2C
I2C
JTAG/SPI
2*I2C, 8GPIO
Aggregator
LED's
VBUS(20V or 5V)
Headers
Note:
1)Either ICE5LP4K or ICE40LP8K will be poplated not both
External
Power
Connector
5V
BB-USB PHY
HD3SS460
SN8F22511BX
FT2232HL
N25Q032A13ESC40F
TS5A23159RSER
HS Switch
PI3DBS3224
HS CNTRL
5V
20V
Voltage
Selector
MOSFET's
VCONN
CC/VCONN SEL SWITCH
Sink Mini DP
Connector
Date:
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Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
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B1.3
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BLOCK Diagram
Lattice USB3.1 Type-C Evalution board B
Date:
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Title
Lattice Semiconductor Applications
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BLOCK Diagram
Lattice USB3.1 Type-C Evalution board B
Date:
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BLOCK Diagram
Lattice USB3.1 Type-C Evalution board B
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USB Type-C Demo Kit V2 Board
Figure 10. FTDI I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
1-2 For SPI
3-2 For JTAG
MINI USB FOR PROGRAMMING AND POWER
SPI signals used as I2C for USB logging
1-2 For JTAG
3-2 For I2C
Manual selection for I2C/JTAG
DM
FT_EECS
DP
FT_EECLK
FT_EEDATA
TDO
TMS
TDI
TCK
TCK
TDI
TDO
TMS
USB5V
VCC1V8FTVCC3V3
VCC3V3
VCC3V3
VCC3V3
VCC3V3
VCC1V8FT
VCC3V3
VCC3V3VCC1V8FT
VCC3V3
VCC3V3
VCC3V3
TCK 3
TDI 3
TDO 3
TMS 3
FTDI_SPICS 3
FTDI_INT3
FTDI_CRESETB 3
SPI_SCK 3,4,5,9
EC_CS 3,4,5,9
UART_TX 3
UART_RX 3
Date:
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Email: techsupport@Latticesemi.com
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FTDI I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
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Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
102
FTDI I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
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Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
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FTDI I/F
Lattice USB3.1 Type-C Evalution board B
J3
HEADER 3
1
2
3
C6
0.1uF
R16
10K
R194
4.7k
R2330
R60
R1812k
C12
18pF
C3
0.1uF
C18
0.1uF
J2
SKT_MINIUSB_B_RA
VCC 1
D- 2
D+ 3
ID 4
GND5
R15
10K
R13 2k2
C1
0.1uF
R1412k
R50
L3
600ohm 500mA
12
C19
0.1uF
R171
4.7k
C5
0.1uF
C7
10uF
C9
0.1uF
C16
0.1uF
C11
18pF
R100
C20
0.1uF
FTDI High-Speed USB
FT2232H
FT2232HL
U1
VREGIN
50
VREGOUT
49
DM
7
DP
8
REF
6
RESET#
14
EECS
63
EECLK
62
EEDATA
61
OSCI
2
OSCO
3
TEST
13
ADBUS0 16
ADBUS1 17
ADBUS2 18
ADBUS3 19
VPHY 4
VPLL 9
VCORE 12
VCORE 37
VCORE 64
VCCIO 20
VCCIO 31
VCCIO 42
VCCIO 56
AGND
10
GND
1
GND
5
GND
11
GND
15
GND
25
GND
35
GND
47
GND
51
PWREN#60
SUSPEND# 36
ADBUS4 21
ADBUS5 22
ADBUS6 23
ADBUS7 24
ACBUS0 26
ACBUS1 27
ACBUS2 28
ACBUS3 29
ACBUS4 30
ACBUS5 32
ACBUS6 33
ACBUS7 34
BDBUS0 38
BDBUS1 39
BDBUS2 40
BDBUS3 41
BDBUS4 43
BDBUS5 44
BDBUS6 45
BDBUS7 46
BCBUS0 48
BCBUS1 52
BCBUS2 53
BCBUS3 54
BCBUS4 55
BCBUS5 57
BCBUS6 58
BCBUS7 59
X1
12MHZ
1
133
G1
2G2 4
R17
10K
J16
HEADER 3
1
2
3
C13
0.1uF
R1
4.7k
93LC56-SO8
U2
CS 1
CLK 2
DI 3
DO 4
VSS
5ORG
6NU
7VCC
8
C8
0.1uF
C2
4u7
12
C10
0.1uF
R90
C14
0.1uF
L1
600ohm 500mA
12
R120
R80
R30
J1
header_1x8
DNI
11
22
33
44
55
66
77
88
C15
0.1uF
L2
600ohm 500mA
12
C17
0.1uF
R2320
R70
R2
4.7k
C4
4u7
12
R40
U3
STG3693QTR
VCC
2
123SEL
3
GND
11
4SEL
10
D1
16
D2
5
D3
8
D4
13
1S1 15
1S2 1
2S1 4
2S2 6
3S1 7
3S2 9
4S1 12
4S2 14
19
USB Type-C Demo Kit V2 Board
Figure 11. MachXO2 I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
AGGREGATOR LED'S
PLACE IT TOP SIDE
PLACE IT TOP SIDE
PLACE DE-CAPS CLOSE TO THEIR POWER PINS
FTDI_SPICS
FTDI_SPICLK
XO2_SYSRST
TDI
TCK
JTAG
TDO
FTDI_SPISI
AGG_LED1
AGG_LED2
FTDI_SPISO
AGG_LED3
AGG_LED4
AGG_LED5
AGG_LED6
AGG_LED7
AGG_LED8
FTDI_SPICLK
FTDI_SPISI
FTDI_SPISO
SPI
XO2_SYSRST
CRESET_B
FTDI_SPICS
AGG_LED1
AGG_LED2
AGG_LED3
AGG_LED4
AGG_LED5
AGG_LED6
AGG_LED7
AGG_LED8
CRESET_B
XO2_VCCIO2
XO2_CORE
XO2_VCCIO0
XO2_VCCIO1
XO2_VCCIO3
XO2_VCCIO0
XO2_VCCIO2
XO2_CORE
XO2_VCCIO0
XO2_VCCIO1
FTDI_CRESETB 2
TCK 2
TDO 2
TDI 2
CONFIG_SW19
AGG_GPIO15,9
AGG_GPIO25,9
AGG_GPIO35,9
AGG_GPIO45,9
AGG_GPIO85,9
AGG_GPIO75,9
AGG_GPIO65,9
AGG_GPIO55,9
CONFIG_SW29
CONFIG_SW39
SW49
SW59
SW69
SW79
SW89
TMS 2
SCL2 5,9
SDA2 5,9
SDA1 5,9
SCL1 5,9
SPI_SCK 2,4,5,9
SPI_MOSI 4,5,9
SPI_MISO 4,5,9
ICE_SPI_SS_B 4,5
STATUS_LED11 10
HIZ_CNTRL 9
IO_DIRECTION_EN9
STATUS_LED10 10
STATUS_LED12 10
STATUS_LED13 10
STATUS_LED14 10
STATUS_LED15 10
STATUS_LED16 10
STATUS_LED17 10
FTDI_SPICS 2
FL_SPI_SS_B 5
STATUS_LED810
STATUS_LED9 10
CRESET_B 4,5
STATUS_LED610
STATUS_LED510
STATUS_LED410
STATUS_LED310
STATUS_LED710
EC_INT4,5
EC_CS 2,4,5,9
FTDI_INT2
PD_CONTRACT 9
SW99
SW109
STATUS_LED210
STATUS_LED110
GPIO15,8
GPIO25
HEAD19
HEAD29
HEAD39
HEAD49
HEAD59
HEAD69
HEAD79
HEAD89
UART_RX2
UART_TX2
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
103
XO2 I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
103
XO2 I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
103
XO2 I/F
Lattice USB3.1 Type-C Evalution board B
C23
100nF
10V
C28
100nF
10V
C35
100nF
10V
C36
100nF
10V
D1 Green
1 2
C42
100nF
10V
R22 680R
C21
10uF
10V
R221
10K
DNI
C33
100nF
10V
Bank 3 Bank 2
(PRI. || SEC.)
LCMXO2-4000ZE-1MG132I
U4-3
PL2A || L_GPLLT_FB
B1
PL2B || L_GPLLC_FB
B2
PL2C || L_GPLLT_IN
C1
PL3A || PCLKT3_2
C2
PL2D || L_GPLLC_IN
C3
PL3B || PCLKC3_2
D1
VCCIO3
D3
PL3C
E1
PL3D
E2
PL4A
E3
PL4C
F1
PL4B
F2
PL4D
F3
VCCIO3
G1
PL5A || PCLKT3_1
G3
PL5C
H1
PL5B || PCLKC3_1
H2
PL5D
H3
PL8A
J1
PL8B
J2
PL8C
J3
PL9A || PCLKT3_0
K1
PL8D
K2
PL9B || PCLKC3_0
K3
VCCIO3
L1
PL10B
L3
PL10C
M1
PL10D
M2
PB4D M3
PB6C || MCLK/CCLK M4
PB9D M5
VCCIO2 M6
PB11A || PCLKT2_1 M7
PB15B M8
PB18AM9
PB18CM10
PB20A M11
PB4B N2
PB6A N3
PB6D || SO/SPISO N4
PB9C N5
PB9A || PCLKT2_0 N6
PB11D N7
PB11B || PCLKC2_1 N8
PB15D N9
PB18BN10
VCCIO2 N11
PB20C || SNN12
VCCIO2 P1
PB4A P2
PB4C || CSSPINP3
PB6B P4
PB9B || PCLKC2_0 P6
PB11C P7
PB15A P8
PB15C P9
PB18DP11
PB20B P12
PB20D || SI/SISPI P13
C24
100nF
10V
R280
R23 680R
SW1
SYS_RST
R192
4.7k
C38
10uF
10V
D2 Green
1 2
R31
4.7k
C25
10uF
10V
D6 Green
1 2
R36
4.7k
C26
100nF
10V
R24 680R
R27
4.7k
D5 Green
1 2
TP1
1
C43
100nF
10V
D7 Green
1 2
C32
100nF
10V
R32
4.7k
R19 680R
R25 680R
C30
10uF
10V
C27
100nF
10V
R340
D8Green
1 2
D3 Green
1 2
C41
100nF
10V
R20 680R
C22
100nF
10V
Bank 1 Bank 0
(PRI. || SEC.)
LCMXO2-4000ZE-1MG132I
U4-2
PR2A
B14
PR2B
C13
PR2C
C14
PR2D
D12
PR3A
E12
PR4A
E13
PR3B
E14
PR4B
F12
PR4C
F13
PR4D
F14
PR5A
G12
PR5C || PCLKT1_0
G13
PR5B
G14
PR5D || PCLKC1_0
H12
VCCIO1
H14
PR8A
J12
PR8C
J13
PR8B
J14
PR8D
K12
PR9A
K13
PR9B
K14
VCCIO1
L12
PR9C
L14
PR10A
M12
PR9D
M13
PR10B
M14
PR10C
N13
PR10D
N14
PT9A A2
PT10A A3
PT10C || TDO A4
PT11D || TMS A6
PT12A || PCLKT0_1 A7
VCCIO0 A8
PT15B A9
PT16A A10
PT16C A11
PT17B A12
PT17D || DONEA13
PT9B B3
PT10D || TDI B4
PT11A B5
PT11C || TCK B6
PT12B || PCLKC0_1 B7
PT12D || SDA/PCLKC0_0 B8
PT15C || JTAGENBB9
VCCIO0 B10
PT16D B12
PT17C || INITNB13
PT10B C4
VCCIO0 C5
PT11B C6
PT12C || SCL/PCLKT0_0 C8
PT15A C9
PT15D || PROGRAMNC10
PT16B C11
PT17A C12
VCCIO1
D14
C39
1uF
10V
R26 680R
R290
R330
TP2
1
C31
100nF
10V
C37
100nF
10V
C40
100nF
10V
D4 Green
1 2
C34
10uF
10V
LCMXO2-4000ZE-1MG132I
U4-1
VCC
A1
VCC
A14
NC
C7
VCC
N1
VCC
P14
GNDA5
GNDB11
GNDD2
GNDD13
GNDG2
GNDH13
GNDL2
GNDL13
GNDP5
GNDP10
C29
0.1uF
R21 680R
R300
20
USB Type-C Demo Kit V2 Board
Figure 12. iCE5LP4K I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Enabling SLT
For Cable drop testing
CC/VCONN SEL SWITCH
PLACE DE-CAPS CLOSE TO THEIR POWER PINS
VBUS_REF
VBUS_DET_PWM
4K_CC_RX_REF
CC1_DET_PWM
CC1_DET_REF
CC1_VCONN_EN
VBUS_DET
CC2_DET_REF
CC2_DET_PWM
CC1_RP
CC1_TX
CC1_TX_EN
CC1_DET
CC1_RX
CC1_RD
CRESET_B
CC2_RP
CC2_TX
CC2_TX_EN
CC2_DET
CC2_RX
CC2_RD
CC2_VCONN_EN
4K_CC_RX_REF CC2_RD
VBUS_DET
CC1_DET
CC2_DET
CC1_RP
CC1_RD
CC2_RP
CC2_RD
CC1_TX
CC1_TX_EN
CC2_TX
CC2_TX_EN
CC1_VCONN_EN
CC2_VCONN_EN
DB_DISABLE
4KCDONE
CRESET_B
4KCDONEDB_DISABLE
DB_DISABLE
VCC1V2
VCONN_5V
VCONN_5V
VCONN_5V
VCONN_5V
VCC3V3
ICE_VCCIO2 ICE4K_CORE
ICE_VCCIO0ICE4K_CORE
VBUS
VCC3V3
VCC3V3
ICE_VCCIO2 ICE_VCCIO1
VCC3V3
VCC3V3
VCC3V3
VCC3V3
ICE_VCCIO1 ICE_VCCIO0
VBUS_DET 5
CC1_DET 5
CC2_DET 5,8
SPI_MISO3,5,9
SPI_MOSI3,5,9
SPI_SCK2,3,5,9
ICE_SPI_SS_B3,5
EC_INT3,5
EC_CS2,3,5,9
SS_EN5,6
SS_POL5,6
SS_AMSEL5,6
VBUS_SINK_EN5,8
VBUS_5V_EN5,8
CC2 6,9
CC1 6,9
CC1_RP 5
CC1_RD 5
CC2_RP 5
CC2_RD 5
CC1_TX 5
CC1_TX_EN5
CC2_TX 5
CC2_TX_EN5
CC1_VCONN_EN5
CC2_VCONN_EN5
DB_DISABLE 5
UFP/DFP5,9
CRESET_B 3,5
VBUS_DISCHARGE_EN5,8
HS_SAI5,6
CLK_IN5,7
4K_CC_RX_REF
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
104
ICE5LP4K I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
104
ICE5LP4K I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
104
ICE5LP4K I/F
Lattice USB3.1 Type-C Evalution board B
510K
R53
5K1R52
0.047uF
10V
C52
0.047uFC44
P-Channel
Q3
5K1R44
36KR46
100nF
10V
C47
10uF
10V
C127
100RR47
42.2R
R42
5K1
R167
R620
DNI
R16810m
510KR56
10uF
10V
C128
D9
Red
12
42.2R
R48
10uF
10V
C48
5K1
R60
4.7k
R54
3.3nF
10V
C49
3.3nF
10V
C46
5K1
R49
R61
649
D34CDBU0520
1 2
0.047uF
10V
C51
100nF
10V
C58
TS5A23159RSER
U6
NC1
9NO1
2
NC2
7
V+8
COM1 10
NO2
4
GND
3
COM2 6
IN2
5
IN1
1
100nF
10V
C54
iCE5LP4K _QFN48
U5
U5
VCCIO2
1
IOB_6a 2
IOB_9b3
IOB_8a4
VCC
5
IOB_13b6
CDONE7
CRESET_B
8
IOB_16a 9
IOB_18a10
IOB_20a 11
IOB_22a 12
IOT_45a_G1 37
IOT_50b38
RGB2
39
RGB1
40
RGB0
41
IOT_51a 42
IOT_49a 43
IOB_3b_G6 44
IOB_5b45
IOB_0a
46 IOB_2a
47
IOB_4a 48
IOB_24a
13
IOB_32a_SO
14
IOB_34a_SCK
15
IOB_35b_CSN
16
IOB_33b_SI
17
IOB_31b
18IOB_29b
19
IOB_25b_G3
20
IOB_23b21
SPI_VCCIO1
22
IOT_37a 23
VPP2V5_Top
24
IOT_36b25
IOT_39a 26
IOT_38b 27
IOT_41a 28
VCCPLL
29
VCC
30
IOT_42b31
IOT_43a 32
VCCIO0
33
IOT_44b
34
IOT_46b_G0 35
IOT_48b 36
TH_PAD
49
510KR57
330pF
16V
C109
510K
R51
10uF
10V
C115
Q1
BSH103,235
510K
R41
Q2
BSH103,235
1K
R58
4.7k
R45
100nF
10V
C114
5K1
R55
330pF
16V
C108
36KR38
R169 10m
R1800
DNI
P-Channel
Q4
R1790
R170
75K
1KR37
1K
R59 SN74LV1T34DCKR
U7
NC
1
A
2
G
3V5
Y4
100RR40
100nF
10V
C112
5K1
R50
100nF
10V
C59
10uF
10V
C126
100RR39
21
USB Type-C Demo Kit V2 Board
Figure 13. iCE5LP8K I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
BMC RX Comparators
SPI FLASH
PLACE DE-CAPS CLOSE TO THEIR POWER PINS
CC2_EXT_DET
CC1_DET
CC2_DET
8K_CC2_DET_PWM
8K_CC1_DET_PWM
SPI_MISO
SPI_MOSI
SPI_SCK
ICE_SPI_SS_B
CDONE
8K_VBUS_IN
8K_VBUS_DET_PWN
8K_CC1_DET_REF
CC1_EXT_DET
CC2_RX_REF
CC1_RX_REF
VBUS_DET
4K_CC_RX_REF
SPI_MISO SPI_MOSI
SPI_SCK
FL_SPI_SS_B
VBUS_DET
CC1_DET
CC2_DET
SPI_MOSI
SPI_MISO
SPI_SCK
ICE_SPI_SS_B
FL_SPI_SS_B
CDONE
ISENSE
VBUS_8K_REF
ISENSE
VPP_2V5
8K_CC2_DET_REF
CC2_EXT_DET
CC1_EXT_DET
8K_CC2_DET_REF
8K_CC1_DET_REF
ICE_VCCIO3
VCC3V3
ICE8K_CORE
ICE_VCCIO2
VCC_SPI
ICE8K_CORE VCC3V3ICE8K_CORE
ICE_VCCIO1
ICE_VCCIO0
VCC3V3
VCC_SPI
ICE_VCCIO0
ICE_VCCIO2
VCC3V3
VCC3V3
VCC3V3
VCC3V3
VCC_SPI
SCL1 3,9
SDA1 3,9
SCL2 3,9
SDA2 3,9
AGG_GPIO1 3,9
AGG_GPIO2 3,9
AGG_GPIO3 3,9
AGG_GPIO4 3,9
AGG_GPIO5 3,9
AGG_GPIO6 3,9
AGG_GPIO7 3,9
AGG_GPIO83,9
CLK_IN4,7
VBUS_DET 4
CC1_DET 4
CC2_DET 4,8
CC2_RP 4
CC2_RD 4
CC1_RP 4
CC1_RD 4
SS_EN4,6
SS_POL 4,6
SS_AMSEL 4,6
SPI_MOSI 3,4,9
SPI_MISO 3,4,9
SPI_SCK 2,3,4,9
ICE_SPI_SS_B 3,4
FL_SPI_SS_B 3
EC_CS2,3,4,9
CRESET_B3,4
EC_INT3,4
CC1_TX 4
CC1_TX_EN4
CC2_TX 4
CC2_TX_EN4
VBUS_5V_EN4,8
VBUS_SINK_EN4,8
VBUS_DISCHARGE_EN4,8
VBUS_20V_EN8
HPD 6
UFP/DFP 4,9
AUX_CHP 6
AUX_CHN6
DB_DISABLE4
ISENSE 8
BB_SCK 6
BB_INT6
BB_SDO6
BB_SDI6
CC1_VCONN_EN4
CC2_VCONN_EN4
GPIO1 3,8
HS_SAI 4,6
DP_POWER_EN7
GPIO2 3
4K_CC_RX_REF
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
105
ICE40LP8K I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
105
ICE40LP8K I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
105
ICE40LP8K I/F
Lattice USB3.1 Type-C Evalution board B
D10
CDBU0520
12
C73
10uF
R910
C118
10uF
10V
U10
N25Q032A13ESC40F
CS
1
SDI
5
SCK
6
WP
3
HOLD 7
VCC 8
GND
4
SDO 2
R810
C62
10uF
10V
R1840
DNI
510KR71
C74
1uF
U20
TLV3492AIDCNR
DNI
2
3
1
4
6
5
7
8
C120
10uF
10V
C67
100nF
R72
2K
R820
TP3
1
R88
10K
R75
2K
C70
100nF
R89
10K
R74
2K
1nF
C69
510K R181C119
10uF
10V
R90
10K
R76
2K
510KR85
BANK2
iCE40LP8K-CM81
U22C
IOB_81_GBIN5
G4 IOB_82_GBIN4
H4
IOB_103_CBSEL0
G5
IOB_104_CBSEL1
H5
CDONE
E6
CRESET_B
H6
VCCIO_2
J5 IOB_54 H1
IOB_55 J1
IOB_56 J2
IOB_57 J3
IOB_70 J4
POWER
iCE40LP8K-CM81
U22F
GND
F4
GND
F5
GND
F6
GND
F9 GNDPLL0
J6
VCCPLL0
J7 VCC F2
VCC D4
VCC E9
VPP_2V5C8
VPP_FAST C7
D11
Red
12
1nF
C63
C117
10uF
10V
R11
2k2
C121
100nF
DNI
510K R69
510KR86
510KR80
510K R182
U9
TLV3202AIDGKR
2
3
1
4
6
5
7
8
R222
10K
BANK0
iCE40LP8K-CM81
U22A
IOT_197_GBIN1
C5 IOT_198_GBIN0
C4
VCCIO_0
A5
IOT_170 B8
IOT_174 A8
IOT_177 A7
IOT_180B7
IOT_183B6
IOT_185A6
IOT_188 B5
IOT_208A4
IOT_211 B4
IOT_212 D5
IOT_214 E5
IOT_217 A3
IOT_218B3
IOT_221 A2
IOT_224 A1
1nF
C64
510K R185
DNI
510K R83
C75
100nF
510KR68
510KR79
1nF
C68
510K R84
SPI
iCE40LP8K-CM81
U22E
VCC_SPI
H8IOB_105_SDO G6
IOB_106_SDI H7
IOB_107_SCK G7
IOB_108_SS F7
C116
10uF
10V
C76
100nF
C71
100nF
C66
100nF
510K R173
DNI
BANK3
iCE40LP8K-CM81
U22D
IOL_13B_GBIN7
D3
IOL_14A_GBIN6
E3
VCCIO_3
H3 IOL_2A C2
IOL_2B B2
IOL_3A B1
IOL_3B C1
IOL_7A D2
IOL_7B C3
IOL_10A D1
IOL_10B E1
IOL_13A E2
IOL_14B E4
IOL_22A F1
IOL_22B F3
IOL_24A G3
IOL_24B G1
IOL_26A G2
IOL_26B H2
510KR67
R1830
DNI
C77
100nF
R172
649
R66 100R
510KR73
C72
100nF
10V
C61
100nF
C65
100nF
C60
100nF
10V
BANK1
iCE40LP8K-CM81
U22B
IOR_140_GBIN3
E8IOR_141_GBIN2
D8
VCCIO_1
C6
IOR_109 J8
IOR_110 J9
IOR_111 H9
IOR_112 G9
IOR_113 F8
IOR_114 G8
IOR_115 D6
IOR_116 A9
IOR_117 D7
IOR_118E7
IOR_119 D9
IOR_120 B9
IOR_148C9
510K R70
22
USB Type-C Demo Kit V2 Board
Figure 14. SS/DP/BB I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
1) ALL THE USB SIGNALS SHOULD MAINTAIN 90 OHMS DIFFERNTIAL IMPEDANCE AND
45 OHMS AS A SINGLE ENDED TRACE
2)ROUTE DIFFERENTIAL PAIR SIGNALS SHORT AS POSSIBLE
LAYOUT NOTE:
3)MATCH LENTH WITHIN PAIRS(+/- 50 mils) AS WELL AS TX & RX FOR USB SS SIGNALS
SS SWITCH
4)ALL THE DISPLAY PORT(DP) SIGNALS SHOULD
MAINTAIN 100 OHMS DIFFERNTIAL IMPEDANCE
'D*_LANE_a' PAD
'DFP_D*_LANEn' PAD
'UFP_D*_LANEn' PAD
LAYOUT NOTE :RESISTORS
PLACE TOP SIDE
PLACE TOP SIDE
PLACE X2 CLOSE TO U13
UFP
DFP
DN_LANE_A
DP_LANE_A
DN_LANE_B
DP_LANE_B
USB3_TX_DN
USB3_TX_DP
USB3_RX_DN
USB3_RX_DP
AUX_CHP
AUX_CHN
USBC_RX2_DN
USBC_RX2_DP
USBC_TX2_DN
USBC_TX2_DP
USBC_TX1_DN
USBC_TX1_DP
USBC_RX1_DN
USBC_RX1_DP
SS_EN
SS_AMSEL
SS_POL
USBC_RFU1
USBC_RFU2
USBC_TX1_DP
USBC_TX1_DN
USBC1_DP
USBC1_DN
USBC_RX2_DN
USBC_RX2_DP
USBC_RFU1 USBC_RFU2
USBC_RX1_DP
USBC_RX1_DN
USBC_TX2_DN
USBC_TX2_DP
USBC1_DN
USBC1_DP
DN_LANE_C
DP_LANE_C
DN_LANE_D
DP_LANE_D
UFP_DN_LANE3
UFP_DP_LANE3
UFP_DN_LANE2
UFP_DP_LANE2
UFP_DN_LANE1
UFP_DP_LANE1
UFP_DN_LANE0
UFP_DP_LANE0
USB3_TX_DP
USB3_TX_DN
USB3_RX_DN
USB3_RX_DP
USBC_RFU1
USBC_RFU2
BB_DP
BB_DN
BB_OE
BB_CLK
BB_PGM
BB_ALSB/PDB
BB_PGM
BB_ALSB/PDB
BB_OE
BB_CLK
USB2_DP
USB2_DN
BB_DP
BB_DN
USBC1_DP
USBC1_DN
USB2_DN
USB2_DP
UFP_DN_LANE0
DFP_DN_LANE1
UFP_DP_LANE0
DFP_DP_LANE1
UFP_AUX_CHP
DFP_AUX_CHN
UFP_AUX_CHN
DFP_AUX_CHP
UFP_AUX_CHP
UFP_AUX_CHN
DFP_AUX_CHN
DFP_AUX_CHP
DFP_DP_LANE0
DFP_DN_LANE0
DFP_DP_LANE1
DFP_DN_LANE1
DFP_DP_LANE2
DFP_DN_LANE2
DFP_DP_LANE3
DFP_DN_LANE3
UFP_DN_LANE1
DFP_DN_LANE0
UFP_DP_LANE1
DFP_DP_LANE0
UFP_DN_LANE2
DFP_DN_LANE3
UFP_DP_LANE2
DFP_DP_LANE3
UFP_DN_LANE3
DFP_DN_LANE2
UFP_DP_LANE3
DFP_DP_LANE2
AUX_CHP
AUX_CHN
USBC_RFU1
USBC_RFU2
VCC3V3
VBUS
DPPOWER
USB5V
5V
5V
5VVCC3V3 5V
VCC3V3VCC3V3
5V
DP3V3
DPPOWER
CC14,9 CC2 4,9
HPD 5,6
BB_SCK5
BB_SDO5
BB_SDI5
BB_INT5
SS_EN4,5
SS_AMSEL4,5
SS_POL4,5
HS_SAI4,5
HPD 5,6
AUX_CHP 5
AUX_CHN5
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
106
SS/DP/BB I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
106
SS/DP/BB I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
106
SS/DP/BB I/F
Lattice USB3.1 Type-C Evalution board B
L4
600ohm 500mA
1 2
R2300
DNI
C79
100nF
10V
J17
HEADER 2
1
2
R2020
L5
600ohm 500mA
12
R2100
U13
SN8F22511BX
P5.0/SCK
1
P5.2/SDO
2
P5.1/SDI
3
P1.0
4
P1.1
5
P0.1/INT1
6
XIN
7
XOUT
8
P2.1 16
P2.0 15
VDD 14
VREG33 13
DN12
DP 11
VSS 10
VREG25 9
R2030
R166
4.7k
R2110
U11
HD3SS460
LnAn
15
LnAp
16
LnBn
18
LnBp
19
LnCn
20
LnCp
21
LnDn
23
LnDp
24
SSTXn
25
SSTXp
26
SSRXn
27
SSRXp
28
CRX2n 10
CRX2p 9
CTX2n 7
CTX2p 6
CTX1n 5
CTX1p 4
CRX1n 2
CRX1p 1
CRFU1 11
CRFU2 12
RFU2 14
EN
17
AMSEL
8
POL
3
RFU1 13
THERMAL PAD - GND
29 VCC 22
R2040
R2120
C82
0.1uF
R92 2M2
R2050
R95
4.7k
C87
1uF
C107
100nF
10V
R2130
510K
R193
C80
100nF
10V
R178
4.7k
R93 2M2
C81
100nF
10V
R1980
C86
1uF
U12
TXB0104PWR
VCCA
1VCCB 14
A1
2
A2
3
A3
4
A4
5
NC1
6
GND7
B1 13
B2 12
B3 11
B4 10
NC2 9
OE
8
R1990
R2060
C89
18pF
U19
PI3DBS3224
INA+
1
INA-
2
INB+
3
INB-
4
SAI
14
SA0
15
SBI
12
SBO
11
ENA
16
ENB
10
OUTA0+ 18
OUTA0- 17
OUTA1+ 20
OUTA1- 19
OUTB0+ 8
OUTB0- 9
OUTB1+ 6
OUTB1- 7
VCC 13
GND5
CN1
Mini-DP
DPPOWER 20
GND3 19
AUX_CHN18
ML_LANE1P 17
AUX_CHP 16
ML_LANE1N15
GND2 14
GND1 13
ML_LANE0P 12
ML_LANE2P 11
ML_LANE0N10
ML_LANE2N9
GND5 8
GND4 7
CONFIG2 6
ML_LANE3P 5
CONFIG1 4
ML_LANE3N3
HPD 2
GND6 1
R2070
C83
100nF
10V
CN2
USB TypeC Connector
MFG = BIZ LINK
MFG P/N = 115H0-015369-R1
VBUS
A4
VBUS
A9
TX1P
A2
TX1N
A3
DP1
A6
DN1
A7
RX2N
A10
RX2P
A11
RFU1
A8
CC1
A5
GND
A1
GND
A12
VBUS B4
VBUS B9
RX1P B11
RX1NB10
DN2B7
DP2 B6
TX2NB3
TX2P B2
RFU2 B8
CC2 B5
GNDB1
GNDB12
R2140
R2000
CN3
Mini-DP
DPPOWER 20
GND3 19
AUX_CHN18
ML_LANE2N17
AUX_CHP 16
ML_LANE2P 15
GND2 14
GND1 13
ML_LANE3N12
ML_LANE1N11
ML_LANE3P 10
ML_LANE1P 9
GND5 8
GND4 7
CONFIG2 6
ML_LANE0N5
CONFIG1 4
ML_LANE0P 3
HPD 2
GND6 1
R94
4.7k
C88
18pF
R2080
J5
HEADER 6
1
2
3
4
5
6
R2150
R2010
R2090
J6
Type-A USB 3.0 10 Pin FEMALE
VBUS 1
USB D- 2
USB D+ 3
GND4
SSRX- 5
SSRX+ 6
SSTX- 8
SSTX+ 9
GND_DRAIN7
L7
600ohm 500mA
DNI
12
R2160
C85
0.1uF
R2290
DNI
R2170
X2
12MHZ
1
133
G1
2G2 4
C129
0.1uF
C84
100nF
10V
510K
R197
23
USB Type-C Demo Kit V2 Board
Figure 15. Power Regulator I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
FLASH VOLTAGE CORE VOLTAGE
XO2 I/O VOLTAGE ICE I/O VOLTAGE SEL
VCONN VOLTAGE
500mA traces
700mA traces
XO2 CORE&I/O TP ICE CORE&I/O TP
POWER SWITCH - PLACE IT TOP
PWR ON LED'S
POWER AND GND TP SILK SCREEN SHOULD BE IN
THE NAME OF RESPECTIVE PLANE NAME
LDO REGULATORS
500mA traces
500mA traces
PLACE GND TEST POINTS TWO DIFFERENT CORNER
PLACE POWER TEST POINTS NEAR LDO
Place Near FPGA Pin [50 Ohms]
High Speed Signal
OSCILLATOR
500mA traces
700mA traces
700mA traces
Mounting Holes
Place mounting holes in each corner
POWERE AND GND TEST POINT SILK SCREEN
SHOULD BE IN THE NAME OF RESPECTIVE
POWER RAIL INSTEAD OF "TP"
ICE_VCCIO2
5VVCC3V3
VCC1V2
XO2_CORE
XO2_VCCIO0
XO2_VCCIO1
XO2_VCCIO2
XO2_VCCIO3
VCC3V3
ICE4K_CORE
5V
ICE_VCCIO0
ICE_VCCIO1
ICE_VCCIO2
ICE_VCCIO3
VCC3V3VCC_SPI
INT_5V
VCC3V3
XO2_CORE
ICE4K_CORE
ICE8K_CORE
5V
VCC1V2
VCC1V2
5V
5V
INT_5V
VCONN_5V5V
VCC3V3XO2_VCCIO0
XO2_VCCIO1
XO2_VCCIO2
XO2_VCCIO3
ICE_VCCIO0VCC3V3
ICE_VCCIO1
ICE_VCCIO3
VCC3V3
VSINK 5V
ICE8K_CORE
DP3V3
INT_5V
USB5V
CLK_IN4,5
DP_POWER_EN5
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
107
POWER REGULATOR I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
107
POWER REGULATOR I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
107
POWER REGULATOR I/F
Lattice USB3.1 Type-C Evalution board B
MH4
ThruHole
TP16
1
R99
1k
TP12
1
C94
10u
R105 1
MH2
ThruHole
D12
BLUE
R98
1k
R1030
D14
YELLOW
C96
10u
TP13
1
SW2
PWR
C97
0.1u
TP18
1
U21
XC6222B331MR-G
Vin
1
Vss
2
CE
3NC4
Vout5
R107 1
D36
SL44-E3/57T
1 2
C90
10u
TP7
1
TP14
1
AP2120N-1.2TRG1
U15
GND
1
OUT 2
IN
3
R109 1
D35
SL44-E3/57T
1 2
J7
HEADER 2
1
2
U14
XC6222B331MR-G
Vin
1
Vss
2
CE
3NC4
Vout5
TP5
1
TP15
1
C99
0.1u
R96
4.7k
C122
10u
C92
10u
TP6
1
R111 1
MH3
ThruHole
C123
0.1u
D13
YELLOW
C91
0.1u
C98
100nF
10V
TP4
1
R113 1
C124
10u
TP19
1
TP9
1
R101 1
C93
0.1u
ASFLMB-25MHZ
X3
GND
2
VDD
4STDBY# 1
OUT 3
TP8
1
C125
0.1u
R102 1
R1081
MH1
ThruHole
TP17
1
R100
100K
R177
4.7k
R106 0
R110 1
TP10
1
R97
680R
R112 1
C95
0.1u
TP11
1
R114 1
R104 1
24
USB Type-C Demo Kit V2 Board
Figure 16. Power Source/Sink I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Note : Boost regulator loads upto 0.8A current
J8 supplies 5V at 5A should be in plane
VBUS 5V at 3A should be in plane
VSINK 5V at 3A should be in plane
20V at 3A should be in plane
VCC3V3
VBUSVBUS_SOURCEINT_5V
VBUS_SOURCE
VCC3V3VBUS_SOURCE VBUS_SOURCE VSINK
INT_5V
20V
20V
VBUS_SOURCE
VBUS_5V_EN4,5
VBUS_SINK_EN4,5
VBUS_20V_EN5
VBUS_DISCHARGE_EN4,5
CC2_DET4,5
ISENSE5
GPIO13,5
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
108
POWER SOURCE/SINK I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
108
POWER SOURCE/SINK I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
108
POWER SOURCE/SINK I/F
Lattice USB3.1 Type-C Evalution board B
510K
R126
N-Channel
Q11
C103
0.1u
P-Channel
Q14
5K1
R132
R1860
DNI
R225
75K
C100
1uF
P-Channel
Q8
R118
10R
N-Channel
Q15
P-Channel
Q5
C106
22uF
R227
75K
-
+
U17
INA199A1DCKT
5
4
6
13
2
U16
FUSE
1
122
C104
22uF
R124
10K
N-Channel
Q12
R120
1K
P-Channel
Q16
100E
R231
DNI
100R
1W
R125
FB1
3A
12
R219
10K
R191 75K
N-Channel
Q7
N-Channel
Q17
P-Channel
Q9
R115 10m
C102
27nF
N-Channel
Q10
100K
R223
D16
SL44-E3/57T
1 2
P-Channel
Q13
R130
5K
P-Channel
Q6
R127
10K
R129
3.9K
R117
10R
J8
RASM712X
1
2
3
5K1
R224
100E
R218
DNI
R228
75K
C101
0.1u
R2200
DNI
C105
4.7nF
R226
75K
L6
10uH
12
U18
ISL97656
COMP
1
FB
2
EN
3
GND
4
GND
5
VIN8
LX 6
LX 7
FREQ
9
SS 10
EPAD
11
5K1
R119
25
USB Type-C Demo Kit V2 Board
Figure 17. Headers and Switch I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
UFP/DFP Selection Jumper
Place all the resistors in the top side
General purpose input Switch
Aggregator GPIO for driving externally when HIZ Mode External AardVark I/F
I/O Direction Enable - XO2
HIZ Enable for I/O - XO2
NOTE : ALL THE HEADERS AND SWITCH SHOULD BE PLACED IN TOP
DIP No
Function
0
1
CONFIG_SW1
PROG PORT
CONFIG_SW2
PROG
CONFIG_SW3
FLASH PROG
SPI
JTAG
ICE
FLASH
PROG
BOOT
SW2 & SW3 Switch Functions:
---------------------------
00 - ICE CRAM PROGRAM
01 - No function
10 - Flash program
11 - BOOT
Note : R188,R189 For External Aardvark SPI
Signals for Probing
XO2_VCCIO3
XO2_VCCIO1
XO2_VCCIO2
XO2_VCCIO2
ICE_VCCIO3
VBUS
VCC3V3
XO2_VCCIO1
AGG_GPIO13,5
AGG_GPIO23,5
AGG_GPIO33,5
AGG_GPIO43,5
AGG_GPIO5 3,5
AGG_GPIO6 3,5
AGG_GPIO7 3,5
AGG_GPIO83,5
CONFIG_SW13
CONFIG_SW23
CONFIG_SW33
SW43
SW53
SW63
SW73
SW83
UFP/DFP4,5 HIZ_CNTRL3
IO_DIRECTION_EN3
PD_CONTRACT3
CC14,6
CC24,6
SW93
SW103
SPI_SCK2,3,4,5
EC_CS2,3,4,5
SPI_MISO3,4,5
SPI_MOSI 3,4,5SCL13,5
SDA13,5
SCL2 3,5
SDA2 3,5
HEAD13
HEAD23
HEAD33
HEAD43
HEAD5 3
HEAD6 3
HEAD7 3
HEAD83
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
109
HEDERS & SWITCH I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
109
HEDERS & SWITCH I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
109
HEDERS & SWITCH I/F
Lattice USB3.1 Type-C Evalution board B
R137
4.7k
J19
HEADER 7X2
2
4
6
8
10
12
14
1
3
5
7
9
11
13
R188 0
DNI
R138
4.7k
SW3
SW DIP-10
R139
4.7k
J20
HEADER 5X2
2
4
6
8
10
1
3
5
7
9
R187
0
DNI
R1890
DNI
J18
HEADER 5X2
2
4
6
8
10
1
3
5
7
9
R140
4.7k
R141
4.7k
R135
4.7k
R142
4.7k
J15
4 HEADER
1
2
3
4
R136
4.7k
R195
2k2
R143
4.7k
J10
HEADER 3
1
2
3
R144
4.7k
R133
4.7k
J12
HEADER 3
1
2
3
R134
4.7k
R145
4.7k
J9
HEADER 3
1
2
3
26
USB Type-C Demo Kit V2 Board
Figure 18. Status LED I/F
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
STATUS LED'S - SHOULD BE PLACED IN THE TOP SIDE
VCC3V3
STATUS_LED63
STATUS_LED143
STATUS_LED133
STATUS_LED123
STATUS_LED113
STATUS_LED13
STATUS_LED23
STATUS_LED33
STATUS_LED43
STATUS_LED73
STATUS_LED83
STATUS_LED93
STATUS_LED17 3
STATUS_LED103
STATUS_LED53
STATUS_LED153
STATUS_LED163
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
1010
STATUS LED I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
1010
STATUS LED I/F
Lattice USB3.1 Type-C Evalution board B
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupport@Latticesemi.com
Board Rev
Project
24-FEB-2015
B1.3
1010
STATUS LED I/F
Lattice USB3.1 Type-C Evalution board B
R150 680R
D31
yellow
1 2
D17 blue
1 2
R151 680R
R153 680R
D18blue
1 2
D22 Green
1 2
R155 680R
D28blue
1 2
D24 Green
1 2
R157 680R
R165 680R
D27
Red
1 2
R159 680R
R163 680R
R161 680R
R162 680R
D33
yellow
1 2
R149 680R
D20 blue
1 2
D21 Green
1 2
R152 680R
D30
yellow
1 2
D23 Green
1 2
R154 680R
D25 Green
1 2
D19 blue
1 2
R156 680R
D32 blue
1 2
D29 blue
1 2
R158680R D26
Red
1 2
R164 680R
R160 680R
27
USB Type-C Demo Kit V2 Board
Appendix B. Bill of Materials
Item Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description
4k BOM 8kdfp BOM
1 CN1 1 Mini-DP 2129320-3 DNI — 2129320-3 TE Connectivity Mini Display Port Reverse Offset
2CN2 1USB Type-C
Connector usb_type_c Customer
Supplied — 115H0-015369-
R1 BIZ LINK CONN, USB Type-C, 24P, R/A Recep-
tacle
3 CN3 1 Mini-DP 2129320-3 DNI — 2129320-3 TE Connectivity Mini Display Port Reverse Offset
4 C1,C3,C5,C6,C8,
C9,C10,C13,C14,
C15,C16,C17,C1
8,C19,C20,C29,
C82
17 0.1 uF C0402 — — C0402C104K4R
ACTU KEMET
Corporation CAP Ceramic 0.1 uF 16 V X7R 0402
5 C2,C4 2 4u7 C0603 — — ECJ-1VB0J475K Panasonic CAP Ceramic 4.7 uF 6.3V 10% X5R
0603
6 C7 1 10 uF C0603 — — LMK107BJ106M
ALTD Taiyo Yuden CAP CECAP CER 10 uF 10 V X5R
20% 0603
7 C11,C12,C88,
C89 4 18 pF C0402 — — C0402C180K3G
ACTU KEMET
Corporation CAP Ceramic 18 pF 25 V C0G 0402
8 C21,C25,C30,
C34,C38 5 10 uF C0805 — — GRM21BR61A1
06KE19L Murata CAP Ceramic 10 uF 10 V 10% X5R
0805
9 C22,C23,C24,
C26,C27,C28,
C31,C32,C33,
C35,C36,C37,
C40,C41,C42,
C43,C72,C80,
C81,C98,C107
21 100 nF C0402 — — GRM155R61A1
04KA01D Murata CAP Ceramic 100 nF 10 V 10% X5R
0402
10 C39 1 1 uF C0402 — — GRM155R61A1
05KE15D Murata CAP Ceramic 1 uF 10 V 10% X5R
0402
11 C44,C51,C52 3 0.047 uF C0402 — DNI GRM155R61A4
73KA01D Murata CAP Ceramic 0.047 uF 10 V 10% X5R
0402
12 C46,C49 2 3.3 nF C0402 — — 04025C332JAT2
AAVX Corporation CAP Ceramic 3300 pF 50 V 5% X7R
0402
13 C47,C54,C58,
C59,C112,C114 6 100 nF C0402 — DNI GRM155R61A1
04KA01D Murata CAP Ceramic 100 nF 10 V 10% X5R
0402
14 C48,C115,C126,
C127,C128 5 10 uF C0805 — DNI GRM21BR61A1
06KE19L Murata CAP Ceramic 10 uF 10 V 10% X5R
0805
15 C60,C61,C65,C6
6,C67,C70,C71,
C75,C76,C77,
C83,C84
12 100 nF C0402 DNI — GRM155R61A1
04KA01D Murata CAP Ceramic 100 nF 10 V 10% X5R
0402
16 C62,C73,C116,
C117,C118,
C119,C120
7 10 uF C0805 DNI — GRM21BR61A1
06KE19L Murata CAP Ceramic 10 uF 10 V 10% X5R
0805
17 C63,C64,C68,
C69 4 1 nF C0402 DNI — GRM155R61A1
02KA01D Murata CAP Ceramic 1000 pF 10 V 10% X5R
0402
18 C74,C86,C87 3 1 uF C0402 DNI — GRM155R61A1
05KE15D Murata CAP Ceramic 1 uF 10 V 10% X5R
0402
19 C79 1 100 nF C0402 DNI — GRM155R61A1
04KA01D Murata CAP Ceramic 100 nF 10 V 10% X5R
0402
20 C85 1 0.1 uF C0402 DNI — C0402C104K4R
ACTU KEMET
Corporation CAP Ceramic 0.1 uF 16 V X7R 0402
21 C90,C92,C94,
C96 4 10 u C0603 — — CL10X106MP8N
RNC Samsung CAP Ceramic 10 uF 10 V 20% X6S
0603
22 C91,C93,C95,
C97,C99,C101 6 0.1 u C0402 — — CL05A104MP5N
NNC Samsung Cap Ceramic 0.1 uF 10 V X5R 20%
SMD 0402 85C Paper T/R
23 C100 1 1 uF C0805 — — GRM21BR71H1
05KA12L. Murata Manufac-
turing Co Ltd Multilayer Ceramic Capacitors MLCC -
SMD/SMT 1.0 uF 50 V 10% 0805
24 C102 1 27 nF C0402 DNI — C0402C273K3R
AC7867 KEMET
Corporation Multilayer Ceramic Capacitors MLCC -
SMD/SMT 25 V 0.027 uF 10% X7R
25 C103 1 0.1 u C0805 DNI — VJ0805Y104KX
ATW1 B C Vishay Intertech-
nologies Multilayer Ceramic Capacitors MLCC -
SMD/SMT 0805 0.1 uF 50 V X7R 10%
26 C104,C106 2 22 uF 7343 DNI — T491X226K035
AT KEMET
Corporation Tantalum Capacitors - Solid SMD 35 V
22 uF 10% "X"
27 C105 1 4.7 nF C0402 DNI — 04025C472KAT2
AAVX Corporation Multilayer Ceramic Capacitors MLCC -
SMD/SMT 0402 4700 pF 50 V X7R
10%
28 C108,C109 2 330 pF C0402 DNI DNI C0402C331K4R
ACTU KEMET
Corporation CAP Ceramic 330 pF 16 V 10% X7R
0402
29 C121 1 100 nF C0402 DNI DNI GRM155R61A1
04KA01D Murata CAP Ceramic 100 nF 10 V 10% X5R
0402
30 C122,C124 2 10 u C0603 DNI — CL10X106MP8N
RNC Samsung CAP Ceramic 10 uF 10 V 20% X6S
0603
31 C123,C125 2 0.1 u C0402 DNI — CL05A104MP5N
NNC Samsung Cap Ceramic 0.1 uF 10 V X5R 20%
SMD 0402 85C Paper T/R
32 C129 1 0.1 uF C0402 DNI DNI C0402C104K4R
ACTU KEMET
Corporation CAP Ceramic 0.1 uF 16 V X7R 0402
28
USB Type-C Demo Kit V2 Board
33 D1,D2,D3,D4,D5,
D6,D7,D8 8 Green led_0603 DNI — LTST-
C194KGKT Lite ON INC Standard LEDs - SMD Green 571nm
12mcd 20mA
34 D9 1 Red led_0603 — DNI LTST-
C193KRKT-5A Lite ON INC Standard LEDs - SMD Red 631nm
14mcd 5mA
35 D10 1 CDBU0520 D0603 DNI — CDBU0520 Comchip DIODE SCHOTTKY 20 V 500 mA 0603
36 D11 1 Red led_0603 DNI — LTST-
C193KRKT-5A Lite ON INC Standard LEDs - SMD Red 631 nm 14
mcd 5m A
37 D12 1 Blue led0603 — — LB Q39G-L2N2-
35-1 Osram Opto Standard LEDs - SMD Blue, 470nm
45mcd, 5mA
38 D13,D14 2 Yellow led0603 — — LY Q976-P1S2-
36 Osram Opto LED Uni-Color Yellow 591nm 2-Pin
Chip LED T/R
39 D15,D35,D36 3 SL44-E3/57T SL44E357T — — SL44-E3/57T VISHAY SEMI-
CONDUCTOR Schottky Diodes & Rectifiers 4.0 Amp
40 V
40 D16 1 SL44-E3/57T SL44E357T DNI — SL44-E3/57T VISHAY SEMI-
CONDUCTOR Schottky Diodes & Rectifiers 4.0 Amp
40 V
41 D17,D18,D19,
D20,D28,D29,D3
2
7 Blue led_0603 — — LTST-
C193TBKT-5A Lite ON INC Standard LEDs - SMD Blue 470 nm 28
mcd 5 mA
42 D21,D22,D23,
D24,D25 5 Green led_0603 — — LTST-
C194KGKT Lite ON INC Standard LEDs - SMD Green 571 nm
12 mcd 20 mA
43 D26,D27 2 Red led_0603 — — LTST-
C193KRKT-5A Lite ON INC Standard LEDs - SMD Red 631nm
14mcd 5mA
44 D30,D31,D33 3 Yellow led_0603 — — LTST-
C193KSKT-5A Lite ON INC Standard LEDs - SMD Yellow 589nm
22mcd 5mA
45 D34 1 CDBU0520 D0603 — DNI CDBU0520 Comchip DIODE SCHOTTKY 20 V 500 mA 0603
46 J1 1 header_1x8 hdr_amp_87220_
8_1x8_100 DNI DNI 22-28-4081 Molex General 100 mils Header 1x8
47 J2 1 SKT_MINIUSB_
B_RA skt_miniusb_b_ra — — 5075BMR-05-
SM-CR Neltron CONN MINI USB RCPT RA TYPE B
SMD
48 J3,J9,J12,J16 4 Header 3 header1X3 — — - - General 100 mils Header 1x3
49 J5 1 Header 6 HEADER1x6 DNI — - - General 100 mils Header
50 J6 1 Type-A USB 3.0
10 Pin FEMALE micro_usb3_0A — — GSB311131HR Amphenol USB Connectors USB 3.0 R/A REC TH
TYPE A BLUE 30 GOLD
51 J7 1 Header 2 HEADER2 — — - - General 100 mils Header 1x2
52 J8 1 RASM712X RASM712X — — RASM712X Switchcraft DC Power Connectors RA PWR JK
SM.100 DIA
53 J10 1 Header 3 header1X3 DNI — - - General 100 mils Header 1x3
54 J15 1 4 Header HEADER1X4 — — - - General 100 mils header
55 J17 1 Header 2 HEADER2 DNI — - - General 100 mils Header 1x2
56 J18 1 Header 5X2 header2X5 — — - - General 100 Mils 2*5 header
57 J19 1 Header 7X2 Header7x2 — — - - General 100 mils header
58 J20 1 Header 5X2 header5X2 — — - - General 100 Mils 2*5 header
59 L1,L2,L3,L5 4 600 Ohm
500 mA FB0603 — — BLM18AG601S
N1D Murata Ferrite Bead 600ohm@100MHz
500mA 0603
60 L4 1 600 Ohm
500 mA FB0603 DNI — BLM18AG601S
N1D Murata Ferrite Bead 600ohm@100MHz
500mA 0603
61 L6 1 10 uH 1240 DNI — SRR1240-100M. Bourns Fixed Inductors 10 UH 4A
62 L7 1 600 Ohm
500 mA FB0603 DNI — BLM18AG601S
N1D Murata Ferrite Bead 600ohm@100MHz
500mA 0603
63 MH1,MH2,MH3,
MH4 4 ThruHole MTG125 — — — — —
64 Q1,Q2 2 BSH103,235 BSH103_235 — — BSH103,235 NXP Semicon-
ductors MOSFET N-CH 30 V 0.85 A SOT23
65 Q3,Q4,Q9 3 P-Channel NTA4151PT1G_S
OT416 — — NTA4151PT1G ON Semiconduc-
tor MOSFET P-CH 20 V 760 mA SOT-416
66 Q5,Q6 2 P-Channel IRLML5203TRPB
F— DNI IRLML5203TRP
BF International
Rectifier MOSFET MOSFT P-Ch -30 V -3A
98 mOhm
67 Q8,Q16 2 P-Channel IRLML5203TRPB
F— — IRLML5203TRP
BF International
Rectifier MOSFET MOSFT P-Ch -30 V -3A
98 mOhm
68 Q7,Q10,Q11,
Q12,Q17 5 N-Channel BSH103_235 — — BSH103,235 NXP Semicon-
ductors MOSFET N-CH 30 V 0.85 A SOT23
69 Q13,Q14 2 P-Channel IRLML5203TRPB
FDNI — IRLML5203TRP
BF International
Rectifier MOSFET MOSFT P-Ch -30 V -3 A
98 mOhm
70 Q15 1 N-Channel BSH103_235 DNI — BSH103,235 NXP Semicon-
ductors MOSFET N-CH 30 V 0.85 A SOT23
Item Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description
29
USB Type-C Demo Kit V2 Board
71 R1,R2,R27,R31,
R32,R96,R133,
R134,R135,
R136,R137,R138
,R139,R140,
R141,R142,
R143,R144,
R145,R166,
R171,R194
22 4.7k R0603 — — CRCW06034K7
0FKEA VISHAY Thick Film Resistors - SMD 1/10watt
4.7 kOhm 1%
72 R3,R4,R5,R6,R7,
R8,R9,R10,R28,
R29,R30,R33,
R34,R91,R103,
R106,R180,
R187,R188,
R189,R232,
R233
22 0 R0402 — — RC0402JR-
070RL Yageo RES 1/10W 0.0 Ohm 5% 0402
73 R11,R13,R195 3 2k2 R0603 — — CRCW06032K2
0FKEA Vishay RES Thick Film 0603 2.2 kOhm 1%
1/10W ±100ppm/C Molded SMD Paper
T/R
74 R14,R18 2 12k R0603 — — RC0603FR-
0712KL Yageo SMT Thick Film Chip Resistor 0603 0.1
W 12 kOhms 1% ?100 ppm
75 R15,R16,R17 3 10K R0603 — — RMCF0603JT10
K0 Stackpole
Electronics Inc RES Thick Film 0603 10 kOhm 5%
1/10W ±100ppm/C Molded SMD SMD
Paper T/R
76 R19,R20,R21,
R22,R23,R24,
R25,R26
8 680R R0402 DNI — RMCF0402JT68
0R Stackpole
Electronics Inc RES 680 Ohm 1/16W 5% 0402
77 R36,R94,R95,
R178,R192 5 4.7k R0603 DNI — CRCW06034K7
0FKEA VISHAY Thick Film Resistors - SMD 1/10watt
4.7Kohms 1%
78 R37,R58,R59 3 1K R0402 — DNI RMCF0402JT1K
00 Stackpole
Electronics Inc RES 1 kOhm 1/16 W 5% 0402
79 R38,R46 2 36K R0402 — — RMCF0402JT36
K0 Stackpole
Electronics Inc RES 36 kOhm 1/16 W 5% 0402
80 R39,R47 2 100R R0603 — — ERJ-
3EKF1000V Panasonic RES SMD 100 kOhm 1% 1/10 W 0603
81 R40 1 100R R0402 — DNI RMCF0402JT10
0R Stackpole
Electronics Inc RES 100 Ohm 1/16 W 5% 0402
82 R41,R126 2 510K R0402 — — RMCF0402JT51
0K Stackpole
Electronics Inc RES 510 kOhm 1/16W 5% 0402
83 R45,R54 2 4.7k R0402 — — ERJ-
2RKF4701X Panasonic RES SMD 4.7 kOhm 1% 1/10W 0402
84 R42,R48 2 42.2R R0603 — — ERJ-
3EKF42R2V Panasonic RES SMD 42.2 kOkm 1% 1/10W 0603
85 R44,R49,R50,
R52,R60,R119,
R224
7 5K1 R0402 — — RMCF0402JT5K
10 Stackpole
Electronics Inc RES 5.1 kOhm 1/16W 5% 0402
86 R51,R53 2 510K R0603 — — ERJ-
3GEYJ514V Panasonic RES SMD 510 kOhm 5% 1/10W 0603
87 R55,R167 2 5K1 R0402 — DNI RMCF0402JT5K
10 Stackpole
Electronics Inc RES 5.1 kOhm 1/16W 5% 0402
88 R56,R57 2 510K R0402 — Refer to
Rework
instructions
RMCF0402JT51
0K Stackpole
Electronics Inc RES 510 kOhm 1/16W 5% 0402
89 R61 1 649 R0603 — DNI RC0603FR-
07649RL Yageo RES SMD 649 Ohm 1% 1/10W 0603
90 R12,R62,R183,
R184,R186,
R229,R230
6 0 R0402 DNI DNI RC0402JR-
070RL Yageo RES 1/10W 0.0 Ohm 5% 0402
91 R66 1 100R R0402 DNI — RMCF0402JT10
0R Stackpole
Electronics Inc RES 100 Ohm 1/16W 5% 0402
92 R67,R68,R69,R7
0,R71,R73,R79,R
80,R83,R84,R85,
R86,R181,R182
14 510K R0603 DNI — ERJ-
3GEYJ514V Panasonic RES SMD 510 kOhm 5% 1/10W 0603
93 R72,R74,R75,
R76 4 2K R0603 DNI — RMCF0603JT2K
00 Stackpole
Electronics Inc RES SMD 2 kOhm 5% 1/10W 0603
94 R81,R82 2 0 R0402 DNI — RC0402JR-
070RL Yageo RES 1/10W 0.0 Ohm 5% 0402
95 R220 1 0 R0402 DNI — RC0402JR-
070RL Yageo RES 1/10W 0.0 Ohm 5% 0402
96 R88,R89,R90,
R124,R127,R222 6 10K R0402 — — RMCF0402JT10
K0 Stackpole
Electronics Inc RES 10 kOhm 1/16W 5% 0402
97 R92,R93 2 2M2 R0402 — — RK73H1ETTP22
04F KOA Speer Thick Film Resistors - SMD 2.2 mOhm
1%
Item Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description
30
USB Type-C Demo Kit V2 Board
98 R97,R149,R150,
R151,R152,
R153,R154,
R155,R156,
R157,R158,
R159,R160,
R161,R162,
R163,R164,
R165
18 680R R0402 — — RMCF0402JT68
0R Stackpole
Electronics Inc RES 680 Ohm 1/16W 5% 0402
99 R98,R99 2 1k R0603 — — RC1608J102CS Samsung RES Thick Film 0603 1 kOhm 5% 1/10
W }100ppm/? Molded SMD T/R
100 R100 1 100K R0402 — — RMCF0402JT10
0K Stackpole
Electronics Inc RES 100 kOhm 1/16W 5% 0402
101 R101,R102,
R107,R108,
R109,R110,
R111,R113,
R114
9 1 R0603 — — CRCW06031R0
0JNEAHP Vishay RES 1.0 Ohm .25W 5% 0603 SMD
102 R104 1 1 R0603 — — CRCW06031R0
0JNEAHP Vishay RES 1.0 Ohm .25W 5% 0603 SMD
103 R105,R112 2 1 R0603 DNI — CRCW06031R0
0JNEAHP Vishay RES 1.0 Ohm .25W 5% 0603 SMD
104 R115,R168,R169 3 10m R0402 — — CSRF0402FT10
L0 Stackpole
Electronics Inc RES SMD 0.01 Ohm 1% 1/8W 0402
105 R117,R118 2 10R R0402 — — ERJ-
2RKF10R0X Panasonic RES SMD 10 Ohm 1% 1/10W 0402
106 R120 1 1K R0402 — — ERJ-
2RKF1001X Panasonic
Electronic
Components
Thick Film Resistors - SMD 0402
1 kOhms 1%
107 R125 1 100R R0402 — — ERJ-
2RKF1000X Panasonic RES SMD 100 Ohm 1% 1/10 W 0402
108 R219 1 10K R0402 DNI DNI RMCF0402JT10
K0 Stackpole
Electronics Inc RES 10 kOhm 1/16 W 5% 0402
109 R129 1 3.9K R0402 DNI — CRCW04023K9
0FKED Vishay Intertech-
nologies Thick Film Resistors - SMD 1/16 W 3.9
kOhms 1%
110 R130 1 5K R0603 DNI — PNM0603E5001
BST5 Vishay /
Thin Film Thin Film Resistors - SMD 150 mW
5 kOhm 0.1% 25ppm
111 R132 1 5K1 R0402 DNI — RMCF0402JT5K
10 Stackpole
Electronics Inc RES 5.1 kOhm 1/16 W 5% 0402
112 R170,R226,
R227,R228 4 75K R0402 — — RMCF0402JT75
K0 Stackpole
Electronics Inc RES SMD 75 kOhm 5% 1/16W 0402
113 R172 1 649 R0603 DNI — RC0603FR-
07649RL Yageo RES SMD 649 kOhm 1% 1/10W 0603
114 R173,R185 2 510K R0603 DNI DNI ERJ-
3GEYJ514V Panasonic RES SMD 510 kOhm 5% 1/10W 0603
115 R177 1 4.7k R0603 DNI — CRCW06034K7
0FKEA VISHAY Thick Film Resistors - SMD 1/10 W 4.7
kOhm 1%
116 R179 1 0 R0402 — DNI RC0402JR-
070RL Yageo RES 1/10 W 0.0 Ohm 5% 0402
117 R191,R225 2 75K R0402 DNI — RMCF0402JT75
K0 Stackpole
Electronics Inc RES SMD 75 kOhm 5% 1/16W 0402
118 R193 1 510K R0603 DNI DNI ERJ-
3GEYJ514V Panasonic RES SMD 510 kOhm 5% 1/10W 0603
119 R197 1 510K R0603 DNI — ERJ-
3GEYJ514V Panasonic RES SMD 510 kOhm 5% 1/10W 0603
120 R198,R200,
R202,R204,
R206,R208,
R210,R212,
R214,R216
10 0 R0402 DNI DNI RC0402JR-
070RL Yageo RES 1/10 W 0.0 Ohm 5% 0402
121 R199,R201,
R203,R205,
R207,R209,
R211,R213,
R215,R217
10 0 R0402 DNI — RC0402JR-
070RL Yageo RES 1/10 W 0.0 Ohm 5% 0402
122 R218,R231 2 100E R0603 DNI DNI CRCW0603100
RFKEAHP Vishay / Dale Thick Film Resistors - SMD 1/4watt
100 Ohms 1% 100 ppm High Power
123 R221 1 10K R0402 DNI DNI RMCF0402JT10
K0 Stackpole
Electronics Inc RES 10 kOhm 1/16 W 5% 0402
124 R223 1 100K R0402 — — RN731ETTP100
3B25 KOA Speer Thin Film Resistors - SMD 100 kOhm,
0402, 0.1%, 25 ppm, 63 mW, 25 V
125 SW1 1 SYS_RST 2psmd_eswitch — — TL1015AF160Q
GE-Switch Inc Switch Tactile SPST-NO 0.05 A 12 V
126 SW2 1 PWR EG1218O_switch — — EG1218 E-Switch Power Switch
127 SW3 1 SW DIP-10 CTS_195-10 — — 195-10MST CTS Electrocom-
ponents 10 Position DIP Switch (Refer to notes
below)
Item Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description
31
USB Type-C Demo Kit V2 Board
128 TP1,TP2,TP3,
TP4,TP5,TP6,
TP7,TP8,TP9,
TP10,TP11,
TP12,TP13,
TP14,TP15,
TP16,TP17,
TP18,TP19
19 TP_S_40_63 tp_s_40_63 — — — — 40 mil SMD
129 U1 1 FT2232HL tqfp64_0p5_12p2
x12p2_h1p6 Customer
Supplied FT2232HL FTDI USB to UART / FIFO / JTAG/SPI
130 U2 1 93LC56-SO8 so8_50_244 — — 93LC56C-I/SN Microchip IC 93LC56 EEPROM
131 U3 1 STG3693QTR STG3693QTR — — STG3693QTR STMicroelec-
tronics STG3693 Series SPDT 4.3 V 4 Ohm
Low Volt High Bandwidth Switch -
QFN-16 (2.6x1.8)
132 U4 1 LCMXO2-
4000ZE-
1MG132I
LCMXO2-
4000ZE-
1MG132C
Customer
Supplied LCMXO2-
4000ZE-
1MG132I
Lattice
Semiconductor FPGA - Field Programmable Gate
Array 1280 LUTs 105 I/O 1.2 V -1
133 U5 1 iCE5LP4K
_QFN48 ICE5LP48QFN Customer
Supplied DNI ICE5LP4K-
QFN48 Lattice
Semiconductor Lattice FPGA
134 U6 1 TS5A23159RSER TS5A23159_10U
QFN — — TS5A23159RSE
RTexas
Instruments Switch Dual SPDT
135 U7 1 SN74LV1T34DC
KR SC-70-5 — SN74LV1T
04DCKR SN74LV1T34DC
KR Texas
Instruments IC Buffer Gate SGL CMOS SC70-5
136 U9 1 TLV3202AIDGK
RTLV3202AIDGKR DNI — TLV3202AIDGK
RTexas
Instruments Analog Comparators Dual, 40 ns,
microPower RRI Comparator
137 U10 1 N25Q032A13ES
C40F N25Q032A13_8S
OIC — — N25Q032A13ES
C40F Micron IC Flash 32 Mbit 108 MHz SOIC8
138 U11 1 HD3SS460 HD3SS460 Customer
Supplied — HD3SS460 Texas
Instruments HS USB Switch
139 U12 1 TXB0104PWR TXB0104PWR DNI — TXB0104PWR Texas
Instruments 4-Bit Bidirectional Voltage-level Trans-
lator With Automatic Direction Sensing
140 U13 1 SN8F22511BX SN8F22511BX DNI — SN8F22511BX SONIX USB 2.0 Full-Speed 8-Bit Micro-Con-
troller
141 U14 1 XC6222B331MR
-G SOT25 — — XC6222B331MR
-G Tor ex
Semiconductor
LTD
IC REG LDO 3.3 V 0.7 A SOT25
142 U15 1 AP2120N-
1.2TRG1 SOT23 — — AP2120N-
1.2TRG1 Diodes INC IC REG LDO 1.2 V 0.15 A SOT23
143 U16 1 FUSE 0154004DRT — — 0154004.DRT Littlefuse Surface Mount Fuses Fuseblock w/
fuse 4A OMNI BLOK 154T
144 U17 1 INA199A1DCKT INA199A1DCKT — — INA199A1DCKT Texas
Instruments SP Amp Current Shunt Monitor Single
26 V 6-Pin SC-70 T/R
145 U18 1 ISL97656 ISL97656 DNI — ISL97656IRTZ Intersil Step-Up Regulator with 4A Integrated
Switch
146 U19 1 PI3DBS3224 PI3DBS3224 — — PI3DBS3224ZN
AEX PERICOMM HIGH SPEED MUX/SWITCH
147 U20 1 TLV3492AIDCN
RTLV3492AIDCNR DNI DNI TLV3492AIDCN
RTexas
Instruments Analog Comparators Dual Nanopower
Push -Pull Out Comparator
148 U21 1 XC6222B331MR
-G SOT25 DNI — XC6222B331MR
-G Tor ex
Semiconductor
LTD
IC REG LDO 3.3 V 0.7 A SOT25
149 U22 1 iCE40LP8K-
CM81 iCE40LP8K-
CM81 DNI /
Customer
Supplied
— iCE40LP8K-
CM81 Lattice
Semiconductor Lattice FPGA-(CM81) 81-Ball ucBGA
150 X1 1 12 MHz crystal_4p_3p2x2
p5 ——7M-
12.000MAAJ-T TXC 12 MHz Crystal
151 X2 1 12 MHz crystal_4p_3p2x2
p5 DNI — 7M-
12.000MAAJ-T TXC 12 MHz Crystal
152 X3 1 ASFLMB-25
MHz ASFLMB_SMD — — ASFLMB-
25.000MHZ-LY-T Abracon
Corporation OSC MEMS 25.000 MHz CMOS SMD
153 USB TYPE-C
EVALUATION
BOARD PCB
1 — — — — 305-PD-15-0107 Pactron —
Item Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Lattice:
iCE40LP1K-SWG16-EVN ICE5LP4K-USBC-EVN ICE40LP8K-USBC-EVN