www.ti.com
FEATURES APPLICATIONS
DB PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
READY
C1+
V+
C1−
C2+
C2−
V−
RIN
FORCEOFF
VCC
GND
DOUT
FORCEON
DIN
INVALID
ROUT
DESCRIPTION/ORDERING INFORMATION
MAX3227E3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
•Battery-Powered, Hand-Held, and Portable•Meets or Exceeds the Requirements of
EquipmentTIA/EIA-232-F and ITU v.28 Standards
•PDAs and Palmtop PCs•Operates With 3-V to 5.5-V V
CC
Supply
•Notebooks, Sub-Notebooks, and Laptops•Operates at Least 1 Mbit/s
•Digital Cameras•Low Standby Current . . . 1 μA Typ
•Mobile Phones and Wireless Devices•External Capacitors . . . 4 ×0.1 μF•Accepts 5-V Logic Input With 3.3-V Supply•Designed to Be Interchangeable With Maxim™MAX3227E
•Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II•ESD Protection for RS-232 I/O Pins–±15 kV – Human-Body Model–±8 kV – IEC61000-4-2, Contact Discharge–±15 kV – IEC61000-4-2, Air-Gap Discharge•Auto-Powerdown Plus Feature AutomaticallyDisables Drivers for Power Savings•Packaged in Plastic Shrink Small-OutlinePackage
The MAX3227E consists of one line driver, one line receiver, and a dual charge-pump circuit with ±15-kV IECESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements ofTIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and theserial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to5.5-V supply. This device operates at data-signaling rates of 1 Mbit/s in normal operating mode and a maximumof 30-V/ μs driver output slew rate. This device also features a logic-level output (READY) that asserts when thecharge pump is regulating and the device is ready to begin transmitting.
The MAX3227E achieves a 1- μA supply current using the auto-powerdown plus feature. This deviceautomatically enters a low-power powerdown mode when the RS-232 cable is disconnected or the drivers of theconnected peripherals are inactive for more than 30 s. They turn on again when they sense a valid transition atany driver or receiver input. Auto-powerdown saves power without changes to the existing BIOS or operatingsystem.
The MAX3227EC is characterized for operation from 0 °C to 70 °C. The MAX3227EI is characterized foroperation from –40 °C to 85 °C.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Tube of 80 MAX3227ECDB0°C to 70 °C SSOP – DB MP227ECReel of 2000 MAX3227ECDBRTube of 80 MAX3227EIDB–40 °C to 85 °C SSOP – DB MP227EIReel of 2000 MAX3227EIDBR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
MAX3227E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
FUNCTION TABLE
(1)
INPUT CONDITIONS OUTPUT STATES
RECEIVER VALIDOR RS-232
OPERATING MODEDRIVER LEVELFORCEON FORCEOFF DRIVER RECEIVER INVALID READYEDGE PRESENTWITHIN AT30 s RECEIVER
Auto-Powerdown Plus Conditions
Normal operation,H H NO NO Active Active L H
auto-powerdown plus disabledNormal operation,H H NO YES Active Active H H
auto-powerdown plus disabledNormal operation,L H YES NO Active Active L H
auto-powerdown plus enabledNormal operation,L H YES YES Active Active H H
auto-powerdown plus enabledPowerdown,L H NO NO Z Active L L
auto-powerdown plus enabledPowerdown,L H NO YES Z Active H L
auto-powerdown plus enabledX L X NO Z Active L L Manual powerdownX L X YES Z Active H L Manual powerdown
Auto-Powerdown Conditions
Powerdown,INVALID INVALID X NO Z Active L L
auto-powerdown enabledNormal operation,INVALID INVALID X YES Active Active H H
auto-powerdown enabled
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
2
Submit Documentation Feedback
www.ti.com
DIN DOUT
Auto-Powerdown
Plus INVALID
RIN
FORCEOFF
FORCEON
ROUT
11
16
9
13
10
8
1
12 READY
MAX3227E3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTIONNAME NO.
C1+ 2 Positive terminal of voltage-doubler charge-pump capacitorC1– 4 Negative terminal of voltage-doubler charge-pump capacitorC2+ 5 Positive terminal of inverting charge-pump capacitorC2– 6 Negative terminal of inverting charge-pump capacitorDIN 11 CMOS driver inputDOUT 13 RS-232 driver outputForce-off input, active low. Drive low to shut down drivers, receivers, and charge pump. This overrides auto-shutdownFORCEOFF 16
and FORCEON (see Function Table).Force-on input, active high. Drive high to override powerdown, keeping drivers and receivers on ( FORCEOFF mustFORCEON 12
be high) (see Function Table).GND 14 GroundINVALID 10 Valid signal detector output, active low. A logic high indicates that a valid RS-232 level is present on a receiver input.Ready to transmit output, active high. READY is enabled high when V– goes below –3.5 V and the device is ready toREADY 1
transmit.RIN 8 RS-232 receiver inputROUT 9 CMOS receiver outputV+ 3 +2 ×V
CC
generated by the charge pumpV– 7 –2 ×V
CC
generated by the charge pumpV
CC
15 3-V to 5.5-V single-supply voltage
LOGIC DIAGRAM (POSITIVE LOGIC)
3Submit Documentation Feedback
www.ti.com
Absolute Maximum Ratings
(1)
Recommended Operating Conditions
(1)
Electrical Characteristics
(1)
MAX3227E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range
(2)
–0.3 6 VV+ Positive output supply voltage range
(2)
–0.3 7 VV– Negative output supply voltage range
(2)
0.3 –7 VV+ – V– Supply voltage difference
(2)
13 VDriver ( FORCEOFF, FORCEON) –0.3 6V
I
Input voltage range VReceiver –25 25Driver –13.2 13.2V
O
Output voltage range VReceiver ( INVALID, READY) –0.3 V
CC
+ 0.3Short-circuit duration DOUT to GND Unlimited
θ
JA
Package thermal impedance
(3)
82 °C/WLead temperature 1,6 mm (1/16 in) from case for 10 s 260 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to network GND.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
See Figure 5
MIN NOM MAX UNIT
V
CC
= 3.3 V 3 3.3 3.6Supply voltage VV
CC
= 5 V 4.5 5 5.5V
CC
= 3.3 V 2 5.5V
IH
Driver and control high-level input voltage DIN, FORCEOFF, FORCEON VV
CC
= 5 V 2.4 5.5V
IL
Driver and control low-level input voltage DIN, FORCEOFF, FORCEON 0 0.8 VV
I
Receiver input voltage –25 25 VMAX3227EC 0 70T
A
Operating free-air temperature °CMAX3227EI –40 85
(1) Test conditions are C1–C4 = 0.1 μF at V
CC
= 3.3 V ±0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at V
CC
= 5 V ±0.5 V.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
I
I
Input leakage current FORCEOFF, FORCEON ±0.01 ±1μANo load,Auto-powerdown plus disabled 0.3 2 mAFORCEOFF and FORCEON at V
CC
Supply current Powered off No load, FORCEOFF at GND 1 10I
CC
(T
A
= 25 °C)
No load, FORCEOFF at V
CC
,
μAAuto-powerdown plus enabled FORCEON at GND, 1 10All RIN are open or grounded
(1) Test conditions are C1–C4 = 0.1 μF at V
CC
= 3.3 V ±0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at V
CC
= 5 V ±0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 °C.
4
Submit Documentation Feedback
www.ti.com
DRIVER SECTION
Switching Characteristics
(1)
ESD Protection
MAX3227E3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
abc
Electrical Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(see Figure 1 and Figure 2 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage DOUT at R
L
= 3 k Ωto GND, DIN = GND 5 5.4 VV
OL
Low-level output voltage DOUT at R
L
= 3 k Ωto GND, DIN = V
CC
–5 –5.4 VI
IH
High-level input current V
I
= V
CC
±0.01 ±1μAI
IL
Low-level input current V
I
at GND ±0.01 ±1μAV
CC
= 3.6 V, V
O
= 0 V ±35 ±60I
OS
Short-circuit output current
(3)
mAV
CC
= 5.5 V, V
O
= 0 V ±35 ±60r
o
Output resistance V
CC
, V+, and V– = 0 V, V
O
=±2 V 300 10M ΩI
off
Output leakage current FORCEOFF = GND, V
O
=±12 V, V
CC
= 0 to 5.5 V ±25 μA
(1) Test conditions are C1–C4 = 0.1 μF at V
CC
= 3.3 V ±0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at V
CC
= 5 V ±0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 °C.(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than oneoutput should be shorted at a time.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(see Figure 1 and Figure 2 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
C
L
= 1000 pF, R
L
= 3 k Ω,
250One DIN switching, See Figure 1C
L
= 1000 pF, R
L
= 3 k Ω, One DIN switching,Maximum data rate 1000 kbit/sV
CC
= 4.5 V, See Figure 1C
L
= 250 pF, R
L
= 3 k Ω, One DIN switching,
1000V
CC
= 3 V, See Figure 1t
sk(p)
Pulse skew
(3)
C
L
= 150 pF to 2500 pF, R
L
= 3 k Ωto 7 k Ω, See Figure 2 25 nsSlew rate, V
CC
= 3.3 V, R
L
= 3 k Ωto 7 k Ω,SR(tr) 24 150 V/ μstransition region C
L
= 150 pF to 1000 pF, See Figure 1
(1) Test conditions are C1–C4 = 0.1 μF at V
CC
= 3.3 V ±0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at V
CC
= 5 V ±0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 °C.(3) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
TERMINAL
TEST CONDITIONS TYP UNITNAME NO.
Human-Body Model ±15DOUT 13 Contact Discharge (IEC61000-4-2) ±8 kVAir-Gap Discharge (IEC61000-4-2) ±15
5Submit Documentation Feedback
www.ti.com
RECEIVER SECTION
Switching Characteristics
(1)
ESD Protection
MAX3227E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
abc
Electrical Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage I
OH
= –1 mA V
CC
– 0.6 V
CC
– 0.1 VV
OL
Low-level output voltage I
OL
= 1.6 mA 0.4 VV
CC
= 3.3 V 1.5 2.4V
IT+
Positive-going input threshold voltage VV
CC
= 5 V 1.8 2.4V
CC
= 3.3 V 0.6 1.2V
IT–
Negative-going input threshold voltage VV
CC
= 5 V 0.8 1.5V
hys
Input hysteresis (V
IT+
– V
IT–
) 0.5 VI
off
Output leakage current ±0.05 ±10 μAr
i
Input resistance V
I
=±3 V to ±25 V 3 5 7 k Ω
(1) Test conditions are C1–C4 = 0.1 μF at V
CC
= 3.3 V ±0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at V
CC
= 5 V ±0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 °C.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP
(2)
UNIT
t
PLH
Propagation delay time, low- to high-level output C
L
= 150 pF, See Figure 3 150 nst
PHL
Propagation delay time, high- to low-level output C
L
= 150 pF, See Figure 3 150 nst
sk(p)
Pulse skew
(3)
See Figure 3 50 ns
(1) Test conditions are C1–C4 = 0.1 μF at V
CC
= 3.3 V ±0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at V
CC
= 5 V ±0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 °C.(3) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
TERMINAL
TEST CONDITIONS TYP UNITNAME NO.
Human-Body Model ±15RIN 8 Contact Discharge (IEC61000-4-2) ±8 kVAir-Gap Discharge (IEC61000-4-2) ±15
6
Submit Documentation Feedback
www.ti.com
AUTO-POWERDOWN SECTION
Switching Characteristics
MAX3227E3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
xxx
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS MIN MAX UNIT
Receiver input thresholdV
T+(valid)
FORCEON = GND, FORCEOFF = V
CC
2.7 Vfor INVALID high-level output voltageReceiver input thresholdV
T–(valid)
FORCEON = GND, FORCEOFF = V
CC
–2.7 Vfor INVALID high-level output voltageReceiver input thresholdV
T(invalid)
FORCEON = GND, FORCEOFF = V
CC
–0.3 0.3 Vfor INVALID low-level output voltageV
OH
INVALID, READY output voltage high I
OH
= –1 mA, FORCEON = GND, FORCEOFF = V
CC
V
CC
– 0.6 VV
OL
INVALID, READY output voltage low I
OL
= 1.6 mA, FORCEON = GND, FORCEOFF = V
CC
0.4 V
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER MIN TYP
(1)
MAX UNIT
t
INVH
Propagation delay time, low- to high-level output 1 μst
INVL
Propagation delay time, high- to low-level output 30 μst
WU
Supply enable time 100 μst
AUTOPRDN
Driver or receiver edge to driver's shutdown V
CC
= 5 V 15 30 60 s
(1) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 °C.
7Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6 V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50% 50%
1.5 V 1.5 V
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
−3 V
3 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
3 V or 0 V
FORCEON
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
3 V
FORCEOFF
1.5 V 1.5 V
50% 50%
MAX3227E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
Figure 1. Driver Slew Rate
Figure 2. Driver Pulse Skew
Figure 3. Receiver Propagation Delay Times
8
Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
tWU
VCC
0
0
V+
V−
VCC
0
Transmitter
Inputs
Receiver
Inputs }
INVALID
Output
Transmitter
Outputs
VCC
Invalid
Region
Output
tINVH
tWU
tINVL
TEST CIRCUIT
50 Ω
Generator
(see Note B)
ROUT
Auto-Powerdown
Plus INVALID
DOUTDIN
CL = 30 pF
(see Note A)
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.7 V
−2.7 V
0.3 V
−0.3 V
0 V
Valid RS-232 Level, INVALID High
Indeterminate
Indeterminate
If Signal Remains Within This Region
for More Than 30 µs, INVALID Is Low†
Valid RS-232 Level, INVALID High
†Auto-powerdown disables drivers and reduces supply
current to 1 µA.
VOLTAGE WAVEFORMS
MAX3227E3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
Figure 4. INVALID Propagation Delay Times and Driver Enabling Time
9Submit Documentation Feedback
www.ti.com
APPLICATION INFORMATION
MAX3227E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVERWITH ±15-kV IEC ESD PROTECTION
SLLS715A – FEBRUARY 2006 – REVISED JUNE 2007
Figure 5. Typical Operating Circuit and Capacitor Values
10
Submit Documentation Feedback
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3227ECDB ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3227ECDBG4 ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3227ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3227ECDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3227EIDB ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3227EIDBG4 ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3227EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3227EIDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jun-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3227ECDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
MAX3227EIDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3227ECDBR SSOP DB 16 2000 346.0 346.0 33.0
MAX3227EIDBR SSOP DB 16 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated