2.0x1.2mm SMD CHIP LED LAMP KP-2012SYCK SUPER BRIGHT YELLOW Features Description !2.0mmx1.2mm SMT LED,1.1mm THICKNESS. The Super Bright Yellow source color devices are made !LOW POWER CONSUMPTION. with DH InGaAlP on GaAs substrate Light Emitting !WIDE VIEWING ANGLE. Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: KDA0089 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/07/2001 DRAWN: S. H. CHEN PAGE: 1 OF 4 Selection Guide Par t No . Dic e KP-2012SYCK Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW ( InGaAlP ) WATER CLEAR V i ew i n g An g l e Min . Ty p . 21/2 30 50 120 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l Par am et er D ev i c e peak Peak Wavelength Super Bright Yellow D Dominate Wavelength 1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm IF=20mA Super Bright Yellow 590 nm IF=20mA Spectral Line Halfwidth Super Bright Yellow 20 nm IF=20mA C Capacitance Super Bright Yellow 20 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF=20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at T)=25C P ar am e t e r Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 175 mA Reverse Voltage 5 V Operating Temperature -40C To +85C Storage Temperature -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: KDA0089 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/07/2001 DRAWN: S. H. CHEN PAGE: 2 OF 4 Super Bright Yellow KP-2012SYCK SPEC NO: KDA0089 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/07/2001 DRAWN: S. H. CHEN PAGE: 3 OF 4 KP-2012SYCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: KDA0089 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/07/2001 DRAWN: S. H. CHEN PAGE: 4 OF 4