NanoAmp Solutions, Inc.
670 North McCarthy Blvd. Suite 220, Milpitas, CA 95035
ph: 408-935-7777, FAX: 408-935-7770
www.nanoamp.com N02L083WC2A
(DOC# 14-02-015 REV E ECN# 01-0998) 1
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
2Mb Ultra-Low Power Asynchronous CMOS SRAM
256K × 8 bit
Overview
The N02L083WC2A is an integrated memory
device containing a 2 Mbit Static Random Access
Memory organized as 262,144 words by 8 bits. The
device is designed and fabricated using
NanoAmp’s advanced CMOS technology to
provide both high-speed performance and ultra-low
power. The device operates with two chip enable
(CE1 and CE2) controls and output enable (OE) to
allow for easy memory expansion. The
N02L083WC2A is optimal for various applications
where low-power is critical such as battery backup
and hand-held devices. The device can operate
over a very wide temperature range of -40oC to
+85oC and is available in JEDEC standard
packages compatible with other standard 256Kb x
8 SRAMs
Features
Single Wide Power Supply Range
2.3 to 3.6 Volts
Very low standby current
2.0µA at 3.0V (Typical)
Very low operating current
2.0mA at 3.0V and 1µs (Typical)
Very low Page Mode operating current
0.8mA at 3.0V and 1µs (Typical)
Simple memory control
Dual Chip Enables (CE1 and CE2)
Output Enable (OE) for memory expansion
Low voltage data retention
Vcc = 1.8V
Very fast output enable access time
30ns OE access time
Automatic power down to standby mode
TTL compatible three-state output driver
Pin Configuration
Product Family
Part Number Package Type Operating
Temperature
Power
Supply (Vcc) Speed
Standby
Current (ISB),
Typical
Operating
Current (Icc),
Typical
N02L083WC2AT 32 - TSOP I
-40oC to +85oC2.3V - 3.6V 55ns @ 2.7V
70ns @ 2.3V 2 µA2 mA @ 1MHz
N02L083WC2AN 32 - STSOP I
N02L083WC2AT2 32 - TSOP I Green
N02L083WC2AN2 32 - STSOP I Green
N02L083WC2A
STSOP-I, TSOP-I
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A11
A9
A8
A13
WE
CE2
A15
VCC
A17
A16
A14
A12
A7
A6
A5
A4
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
A1
A2
A3
Pin Descriptions
Pin Name Pin Function
A0-A17 Address Inputs
WE Write Enable Input
CE1, CE2 Chip Enable Input
OE Output Enable Input
I/O0-I/O7Data Inputs/Outputs
VCC Power
VSS Ground
(DOC# 14-02-015 REV E ECN# 01-0998) 2
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
Functional Block Diagram
Functional Description
CE1 CE2 WE OE I/O0 - I/O7MODE POWER
H X X X High Z Standby1
1. When the device is in standby mode, control inputs (WE and OE), address inputs and data input/outputs are internally isolated
from any external influence and disabled from exerting any influence externally.
Standby
X L X X High Z Standby1Standby
LHL
X2
2. When WE is invoked, the OE input is internally disabled and has no effect on the circuit.
Data In Write2Active
LHHL Data Out Read Active
L H H H High Z Active Active
Capacitance1
1. These parameters are verified in device characterization and are not 100% tested
Item Symbol Test Condition Min Max Unit
Input Capacitance CIN VIN = 0V, f = 1 MHz, TA = 25oC8pF
I/O Capacitance CI/O VIN = 0V, f = 1 MHz, TA = 25oC8pF
Control
Logic
Page
Decode
Logic
Address
Inputs
A4 - A17
Input/
Output
Mux
and
Buffers I/O0 - I/O7
Address
Word
Decode
Logic
Address
Address
Inputs
A0 - A3
16K Page
x 16 word
x 8 bit
RAM Array
Word Mux
CE1
CE2
WE
OE
(DOC# 14-02-015 REV E ECN# 01-0998) 3
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
Absolute Maximum Ratings1
1. Stresses greater than those listed above may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the operating section of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Item Symbol Rating Unit
Voltage on any pin relative to VSS VIN,OUT –0.3 to VCC+0.3 V
Voltage on VCC Supply Relative to VSS VCC –0.3 to 4.5 V
Power Dissipation PD500 mW
Storage Temperature TSTG –40 to 125 oC
Operating Temperature TA-40 to +85 oC
Soldering Temperature and Time TSOLDER 260oC, 10sec oC
Operating Characteristics (Over Specified Temperature Range)
Item Symbol Test Conditions Min. Typ1
1. Typical values are measured at Vcc=Vcc Typ., TA=25°C and not 100% tested.
Max Unit
Supply Voltage VCC 2.3 3.0 3.6 V
Data Retention Voltage VDR Chip Disabled31.8 V
Input High Voltage VIH 1.8 VCC+0.3 V
Input Low Voltage VIL –0.3 0.6 V
Output High Voltage VOH IOH = 0.2mA VCC–0.2 V
Output Low Voltage VOL IOL = -0.2mA 0.2 V
Input Leakage Current ILI VIN = 0 to VCC 0.5 µA
Output Leakage Current ILO OE = VIH or Chip Disabled 0.5 µA
Read/Write Operating Supply Current
@ 1 µs Cycle Time2
2. This parameter is specified with the outputs disabled to avoid external loading effects. The user must add current required to drive
output capacitance expected in the actual system.
ICC1
VCC=3.6 V, VIN=VIH or VIL
Chip Enabled, IOUT = 0 2.0 4.0 mA
Read/Write Operating Supply Current
@ 70 ns Cycle Time2ICC2
VCC=3.6 V, VIN=VIH or VIL
Chip Enabled, IOUT = 0 12.0 16.0 mA
Page Mode Operating Supply Current
@ 70 ns Cycle Time2 (Refer to Power
Savings with Page Mode Operation
diagram)
ICC3
VCC=3.6 V, VIN=VIH or VIL
Chip Enabled, IOUT = 0 4.0 mA
Read/Write Quiescent Operating Sup-
ply Current3
3. This device assumes a standby mode if the chip is disabled (CE1 high or CE2 low). In order to achieve low standby current all
inputs must be within 0.2 volts of either VCC or VSS.
ICC4
VCC=3.6 V, VIN=VIH or VIL
Chip Enabled, IOUT = 0,
f = 0
3.0 mA
Maximum Standby Current3ISB1
VIN = VCC or 0V
Chip Disabled
tA= 85oC, VCC = 3.6 V
2.0 20.0 µA
Maximum Data Retention Current3IDR
VCC = 1.8V, VIN = VCC or 0
Chip Disabled, tA= 85oC10.0 µA
(DOC# 14-02-015 REV E ECN# 01-0998) 4
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
Power Savings with Page Mode Operation (WE = VIH)
Note: Page mode operation is a method of addressing the SRAM to save operating current. The internal
organization of the SRAM is optimized to allow this unique operating mode to be used as a valuable power
saving feature.
The only thing that needs to be done is to address the SRAM in a manner that the internal page is left open
and 8-bit words of data are read from the open page. By treating addresses A0-A3 as the least significant
bits and addressing the 16 words within the open page, power is reduced to the page mode value which is
considerably lower than standard operating currents for low power SRAMs.
Page Address (A4 - A17)
OE
CE1
CE2
Word Address (A0 - A3)
Open page
Word 1 Word 2 Word 16
...
(DOC# 14-02-015 REV E ECN# 01-0998) 5
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
Timing Test Conditions
Item
Input Pulse Level 0.1VCC to 0.9 VCC
Input Rise and Fall Time 5ns
Input and Output Timing Reference Levels 0.5 VCC
Output Load CL = 30pF
Operating Temperature -40 to +85 oC
Timing
Item Symbol
2.3 - 3.6 V 2.7 - 3.6 V
Units
Min. Max. Min. Max.
Read Cycle Time tRC 70 55 ns
Address Access Time tAA 70 55 ns
Chip Enable to Valid Output tCO 70 55 ns
Output Enable to Valid Output tOE 35 30 ns
Chip Enable to Low-Z output tLZ 10 10 ns
Output Enable to Low-Z Output tOLZ 55ns
Chip Disable to High-Z Output tHZ 020015ns
Output Disable to High-Z Output tOHZ 020015ns
Output Hold from Address Change tOH 10 10 ns
Write Cycle Time tWC 70 55 ns
Chip Enable to End of Write tCW 50 45 ns
Address Valid to End of Write tAW 50 45 ns
Write Pulse Width tWP 40 35 ns
Address Setup Time tAS 00ns
Write Recovery Time tWR 00ns
Write to High-Z Output tWHZ 20 15 ns
Data to Write Time Overlap tDW 40 35 ns
Data Hold from Write Time tDH 00
ns
End Write to Low-Z Output tOW 55ns
(DOC# 14-02-015 REV E ECN# 01-0998) 6
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
Timing of Read Cycle (CE1 = OE = VIL, WE = CE2 = VIH)
Timing Waveform of Read Cycle (WE=VIH)
Address
Data Out
tRC
tAA
tOH
Data ValidPrevious Data Valid
Address
OE
Data Valid
tRC
tAA
tCO
tHZ
tOHZ
tOLZ
tOE
tLZ
High-Z
Data Out
CE1
CE2
(DOC# 14-02-015 REV E ECN# 01-0998) 7
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
Timing Waveform of Write Cycle (WE control)
Timing Waveform of Write Cycle (CE1 Control)
Address
Data In
CE1
CE2
Data Valid
tWC
tAW
tCW
tWR
tWHZ
tDH
High-Z
WE
Data Out
High-Z
tOW
tAS tWP
tDW
Address
WE
Data Valid
tWC
tAW
tCW
tWR
tDH
Data In
High-Z
tAS
tWP
tLZ
tDW
Data Out
tWHZ
CE1
(for CE2 Control, use
inverted signal)
(DOC# 14-02-015 REV E ECN# 01-0998) 8
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
32-Lead TSOP-I Package (T32)
Note:
1. All dimensions in millimeters
2. Package dimensions exclude molding flash
20.0±0.20
8.0±0.10
SEE DETAIL B
1.10±0.15
18.40±0.10
0.27
0.17
0.50mm REF
DETAIL B
0.80mm REF
0o-8o
0.20
0.00
(DOC# 14-02-015 REV E ECN# 01-0998) 9
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
32-Lead STSOP-I Package (N32)
Note:
1. All dimensions in millimeters
2. Package dimensions exclude molding flash
13.40±0.20
8.0±0.10
SEE DETAIL B
1.10±0.15
11.80±0.10
0.27
0.17
0.50mm REF
DETAIL B
0.80mm REF
0o-8o
0.20
0.00
(DOC# 14-02-015 REV E ECN# 01-0998) 10
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
NanoAmp Solutions, Inc. N02L083WC2A
Ordering Information
© 2001 - 2002 Nanoamp Solutions, Inc. All rights reserved.
NanoAmp Solutions, Inc. ("NanoAmp") reserves the right to change or modify the information contained in this data sheet and the products described therein, without prior notice.
NanoAmp does not convey any license under its patent rights nor the rights of others. Charts, drawings and schedules contained in this data sheet are provided for illustration pur-
poses only and they vary depending upon specific applications.
NanoAmp makes no warranty or guarantee regarding suitability of these products for any particular purpose, nor does NanoAmp assume any liability arising out of the application
or use of any product or circuit described herein. NanoAmp does not authorize use of its products as critical components in any application in which the failure of the NanoAmp
product may be expected to result in significant injury or death, including life support systems and critical medical instruments.
Revision History
Revision # Date Change Description
A Jan 2001 Initial Advance Release
B Mar 2001
Added Table 3: Capacitance
Revised quiescent operating current, changed pin 31 to CE1, modified
table 1 and figure 2, other minor edits
C Dec. 2001
Part number change from EM256L08, modified Overview and Features, added
Page Mode Operation diagram and Package diagram, revised Operating Char-
acteristics table, Functional Description table, Timing diagrams, and Ordering
Information diagram
D Nov. 2002 Replaced Isb and Icc on Product Family table with typical values
E Oct. 2004 Added Green Package Option
N02L083WC2AX-XX X
I = Industrial, -40°C to 85°C
55 = 55ns
T = 32-pin TSOP I
N = 32-pin STSOP I
T2 = 32-pin TSOP I Green Package
N2 = 32-pin STSOP I Green Package
Temperature
Performance
Package Type