Rev. 1.2 4/13 Copyright © 2013 by Silico n Laboratories Si595
VOLTAGE-CONTROLLED CRYSTAL OSCILLATOR (VCXO)
10 TO 810 MHZ
Features
Applications
Description
The Si595 VCXO utilizes Silicon Laboratories’ advanced DSPLL
®
circuitry to
provide a low-jitter clock at high frequencies. The Si595 is available with
any-rate output frequency from 10 to 810 MHz. Unlike traditional VCXOs,
where a different crystal is required for each output frequency, the Si595
uses one fixed crystal to provide a wide range of output frequencies. This IC-
based approach allows the crystal resonator to provide exceptional
frequency stability and reliability. In addition, DSPLL clock synthesis
provides supply noise rejection, simplifying the task of generating low-jitter
clocks in noisy environments. The Si595 IC-based VCXO is factory-
configurable for a wide variety of user specifications including frequency,
supply voltage, output format, tuning slope, and absolute pull range (APR).
Specific config uratio ns a re fa ctor y programmed at time of shipmen t, thereby
eliminating the long lead times associated with custom oscillators.
Functional Block Diagram
Available with any-rate output
frequencies from 10 to 810 MHz
3rd generation DSPLL® with
superior jitter performance
Internal fixed fundamental mode
crystal frequency ensures high
reliability and low aging
Available CMOS, LVPECL,
LVDS, and CML outputs
3.3, 2.5, and 1.8 V supply options
Industry-standard 5 x 7 mm
package and pinout
Pb-free/RoHS-compliant
–40 to +85 ºC operating range
SONET/SDH (OC-3/12/48)
Networking
SD/HD SDI/3G SDI video
FTTx
Clock recovery and jitter cleanup PLLs
FPGA/ASIC clock generation
Fixed
Frequency
XO
An y -ra te
10–810 MHz
DSPLL®
Clock Synthesis
ADC
VDD CLK+CLK–
Vc OE GND
Ordering Information:
See page 7.
Pin Assignments:
See page 6.
(Top View)
Si5602
1
2
3
6
5
4
VC
GND
OE
VDD
CLK+
CLK–
Si595
REVISION D
Si595
2 Rev. 1.2
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter Symbol Test Condition Min Typ Max Units
Supply Voltage1VDD 3.3 V option 2.97 3.3 3.63
V2.5 V option 2.25 2.5 2.75
1.8 V option 1.71 1.8 1.89
Supply Current IDD Output enabled
LVPECL
CML
LVDS
CMOS
120
110
100
90
135
120
110
100
mA
Tristate mode 60 75
Output Enable (OE)2VIH 0.75 x VDD ——
V
VIL ——0.5
Operating Temperature Range TA–40 85 °C
Notes:
1. Selectable parameter specified by part number. See 3. "Ordering Information" on page 7 for further details.
2. OE pin includes an internal 17 k pullup resistor to VDD for output enable active high or a 17 k pull-down resistor to
GND for output enable active low. See 3. "Ordering Informa tion" on page 7.
Table 2. VC Control Voltage Input
Parameter Symbol Test Conditio n Min Typ Max Units
Control Voltage Tuning Slope1,2,3 KV10 to 90% of VDD —45
95
125
185
380
ppm/V
Control Voltage Linearity4LVC BSL –5 ±1 +5 %
Incremental –10 ±5 +10
Modulation Bandwidth BW 9.3 10.0 10.7 kHz
VC Input Impedance ZVC 500 k
VC Input Capacitance CVC —50pF
Nominal Control Voltage VCNOM @ fO—V
DD/2 V
Control Voltage Tuning Range VC0V
DD V
Notes:
1. Positive slope; selectable option by part number. See 3. "Ordering Information" on page 7.
2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR
requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absol ute Pull Range (APR)” for more inform ation.
3. KV variation is ±10% of typical values.
4. BSL determined from deviation from best straight line fit with VC ranging from 10 to 90% of VDD. Incremental slope
determined with VC ranging from 10 to 90% of VDD.
Si595
Rev. 1.2 3
Table 3. CLK± Output Frequency Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Nominal Frequency 1,2,3 fOLVDS/CML/LVPECL 10 810 MHz
CMOS 10 160
Temperature Stability1,4 TA= –40 to +85 ºC –20
–50
+20
+50 ppm
Absolute Pull Range1,4 APR ±10 ±370 ppm
Power up Time5tOSC ——10ms
Notes:
1. See Section 3. "Ordering Information" on page 7 for further details.
2. Specified at time of order by part number.
3. Nominal output frequency set by VCNOM =V
DD/2.
4. Selectable parameter specified by part number.
5. Time from power up or tristate mode to fO.
Table 4. CLK± Output Levels and Symmetry
Parameter Symbol Test Condition Min Typ Max Units
LVPECL Output Option1VOmid-level VDD – 1.42 VDD – 1.25 V
VOD swing (diff) 1.1 1.9 VPP
VSE swing (single-ended) 0.55 0.95 VPP
LVDS Output Option2VOmid-level 1.125 1.20 1.275 V
VOD swing (diff) 0.5 0.7 0.9 VPP
CML Output Option2
VO2.5/3.3 V option mid-level VDD – 1.30 V
1.8 V option mid-level VDD – 0.36
VOD 2.5/3.3 V option swing (diff) 1.10 1.50 1.90 VPP
1.8 V option swing (diff) 0.35 0.425 0.50
CMOS Output Option3VOH 0.8 x VDD VDD V
VOL ——0.4
Rise/Fall time (20/80%) tR, tFLVPECL/LVDS/CML 350 ps
CMOS with CL=15pF 2 ns
Symmetry (duty cycle) SYM LVPECL: VDD – 1.3 V (diff)
LVDS: 1.25 V (diff)
CMOS: VDD/2 45 55 %
Notes:
1. 50 to VDD – 2.0 V.
2. Rterm = 100 (differential).
3. CL = 15 pF. Sinking or sourcing 12 mA for VDD = 3.3V, 6mA for V
DD = 2.5V, 3mA for V
DD = 1.8 V.
Si595
4 Rev. 1.2
Table 5. CLK± Output Phase Jitter
Parameter Symbol Test Condition Min Typ Max Units
Phase Jitter (RMS)1,2
for FOUT of 50 MHz < FOUT
810 MHz
JKv = 45 ppm/V
12 kHz to 20 MHz 0.5 ps
Kv = 95 ppm/V
12 kHz to 20 MHz 0.5
Kv = 125 ppm/V
12 kHz to 20 MHz 0.5
Kv = 185 ppm/V
12 kHz to 20 MHz 0.5
Kv = 380 ppm/V
12 kHz to 20 MHz 0.7
Notes:
1. Refer to AN256 for further information.
2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR
requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absol ute Pull Range (APR)” for more inform ation.
Table 6. CLK± Output Period Jitter
Parameter Symbol Test Condition Min Typ Max Units
Period Jitter* JPER RMS 3 ps
Peak-to-Peak 35
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.
Table 7. CLK± Output Phase Noise (Typical)
Offset Frequency 74.25 MHz
185 ppm/V
LVPECL
148.5 MHz
185 ppm/V
LVPECL
155.52 MHz
95 ppm/V
LVPECL
Units
100 Hz
1kHz
10 kHz
100 kHz
1MHz
10 MHz
20 MHz
–77
–101
–121
–134
–149
–151
–150
–68
–95
–116
–128
–144
–147
–148
–77
–101
–119
–127
–144
–147
–148
dBc/Hz
Si595
Rev. 1.2 5
Table 8. Environmental Compliance and Package Information
Parameter Conditions/Test Method
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 2003
Gross and Fine Leak MIL-STD-883, Method 1014
Resistance to Solder Heat MIL-STD-883, Method 2036
Moisture Sensitivity Level J-STD-020, MSL1
Contact Pads Gold over Nickel
Table 9. Thermal Characteristics
(Typical values TA = 25 ºC, VDD =3.3V)
Parameter Symbol Test Condition Min Typ Max Unit
Thermal Resistance Junction to Ambient JA Still Air 84.6 °C/W
Thermal Resistance Junction to Case JC Still Air 38.8 °C/W
Ambient Temperature TA–40 85 °C
Junction Tem p er a tur e TJ——125°C
Table 10. Absolute Maximum Ratings1
Parameter Symbol Rating Units
Maximum Op er at ing Temperature TAMAX 85 ºC
Supply Voltage VDD –0.5 to +3.8 V
Input Voltage VI–0.5 to VDD + 0.3
Storage Temperature TS–55 to +125 ºC
ESD Sensitivity (HBM, per JESD22-A114) ESD 2500 V
Soldering Temperature (Pb -f re e pr of ile)2TPEAK 260 ºC
Soldering Temperature Time @ TPEAK (Pb-free pr ofile)2tP20–40 seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Fu nctional
operation or specification compliance is not implied at th ese conditions. Exposure to maximum rating conditio ns for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging F AQ available for download from
www.silabs.com/VCXO for further information, including soldering profiles.
Si595
6 Rev. 1.2
2. Pin Descriptions
Table 11. Si595 Pin Descriptions
Pin Name Type Function
1 VCAnalog Input Control Voltage
2OE* Input Output Enable
3GND Ground Electrical and Case Gr ou n d
4CLK+ Output Oscillator Output
5CLK–
(N/C for CMOS) Output Complementary Output
(N/C for CMOS, do not make external connection)
6 VDD Power Power Supply Voltage
*Note: OE pin includes a 17 k resistor to VDD for OE active high option or 17 k to GND for OE active low option.
See 3. "Ordering Information" on page 7.
1
2
3
6
5
4
VC
GND
OE
VDD
CLK+
CLK–
(Top View)
Si595
Rev. 1.2 7
3. Ordering Information
The Si595 supports a variety of options including frequency, temperature stability, tuning slope, output format, and
VDD. Specific device configurations are programmed into the Si595 at time of shipment. Configurations are
specified using the Part Number Configu ration chart show n below. Silicon Labs provides a web browser-based part
number configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this tool
and for further ordering instructions. The Si595 VCXO series is supplied in an industr y-standard, RoHS compliant,
lead-free, 6-pad, 5 x 7 mm package. Tape and reel packaging is an ordering option.
Figure 1. Part Number Convention
R = Tape & Reel
Blank = Trays
Operating Temp Range (°C)
G –40 to +85 °C
Device Revision Letter
595 VCXO
Product Family
595 X X XXXMXXX D G R
1st Option Code
VDD Output Format Output Enable Polarity
A 3.3 LVPECL High
B 3.3 LVDS High
C 3.3 CMOS High
D3.3CML High
E 2.5 LVPECL High
F 2.5 LVDS High
G 2.5 CMOS High
H2.5CML High
J 1.8 CMOS High
K1.8CML High
M 3.3 LVPECL Low
N 3.3 LVDS Low
P 3.3 CMOS Low
Q 3.3 CML Low
R 2.5 LVPECL Low
S 2.5 LVDS Low
T 2.5 CMOS Low
U 2.5 CML Low
V 1.8 CMOS Low
W 1.8 CML Low
Note:
CMOS available to 160 MHz.
2nd Optio n Code
Temperature Tuning Slope Minimum APR
Stability Kv (±ppm) for VDD @
Code ± ppm (max) ppm/V (typ) 3.3 V 2.5 V 1.8 V
A 20 380 370 275 200
B 20 185 160 110 80
C 50 185 130 80 50
D 20 125 100 75 40
E20 95 655025
F 50 125 70 45 10
G 50 95 35 20 N/A
H 20 45 15 N/A N/A
Notes:
1. For best jitter and phase noise performance, always choose the smallest Kv that meets
the application’s minimum APR requirements. Lower Kv options minimize noise
coupling and jitter in real-world PLL designs. See AN266 for more information.
2. APR is the ability of a VCXO to track a signal over the product lifetime. A VCXO with an
APR of ±100 ppm is able to lock to a clock with a ±100 ppm stability over 15 years over
all operating conditions.
3. Nominal Pull range (±) = 0.5 x VDD x tuning slope.
4. Minimum APR values noted above include worst case values for all parameters.
Example Part Number: 595AE148M500DGR is a 5 x 7 m m VC X O in a 6 pa d package. The nominal frequen cy is 148.5 MHz, with a 3.3 V supply,
LVPECL output, and Output Enable active high polarity. Temperature stability is specified as ±20 ppm and the tuning slope is 95 ppm/V. The part is
specified for a –40 to +85 C° ambient temperature range operation and is shipped in tape and reel format.
Frequency (e.g., 148M500 is 148.5 MHz)
Available frequency range is 10 to 810 MHz. The position of “M” shifts
to denote higher or lower frequencies. If the frequency of interest
requires greater than 6 digit resolution, a six digit code will be
assigned for the specific frequency.
Si595
8 Rev. 1.2
4. Outline Diagram and Suggested Pad Layout
Figure 2 illustrates the package details for the Si595. Table 12 lists the values for the dimensions shown in the
illustration.
Figure 2. Si595 Outline Diagram
Table 12. Package Diagram Dimensions (mm)
Dimension Min Nom Max
A 1.50 1.65 1.80
b 1.30 1.40 1.50
c 0.50 0.60 0.70
D 5.00 BSC
D1 4.30 4.40 4.50
e 2.54 BSC.
E 7.00 BSC.
E1 6.10 6.20 6.30
H 0.55 0.65 0.75
L 1.17 1.27 1.37
p 1.80 2.60
R 0.70 REF
aaa 0.15
bbb 0.15
ccc 0.10
ddd 0.10
eee 0.50
Si595
Rev. 1.2 9
5. Si5xx Mark Specification
Figure 3 illustrates the mark specification for the Si595. Table 13 lists the line information.
Figure 3. Mark Specification
Table 13. Si595 Top Mark Description
Line Position Description
1 1–10 “SiLabs”+ Part Family Number, 595 (First 3 characters in part number)
2 1–10 Si595: Option1+Option2+Freq(7)+Temp
Si595 w/ 8-digit reso lut ion : Op tion 1 +O pt ion 2+ConfigNum(6)+Temp
3 Trace Code
Position 1 Pin 1 orientation mark (dot)
Position 2 Product Revision (D)
Position 3–6 Tiny Trace Code (4 alphanumeric characters per assembly release instructions)
Position 7 Year (least significant year digit), to be assigned by assembly site (ex: 2009 = 9)
Position 8–9 Calendar Work Week number (1–53), to be assigned by assembly site
Position 10 “+” to indicate Pb-Free and RoHS-compliant
Si595
10 Rev. 1.2
6. 6-Pin PCB Land Pattern
Figure 4 illustrates the 6-pin PCB land pattern for the Si595. Table 14 lists the values for the dimensions show n in
the illustration.
Figure 4. Si595 PCB Land Pattern
Table 14. PCB Land Pattern Dimensions (mm)
Dimension Min Max
D2 5.08 REF
e 2.54 BSC
E2 4.15 REF
GD 0.84
GE 2.00
VD 8.20 REF
VE 7.30 REF
X1.70 TYP
Y2.15 REF
ZD 6.78
ZE 6.30
Notes:
1. Dimensioning and tolerancing per th e ANSI Y14.5M-1994 specification.
2. Land pattern design based on IPC-7351 guidelines.
3. All dimensions shown are at maximum material condition (MMC).
4. Controlling dimension is in millime ters (mm).
Si595
Rev. 1.2 11
DOCUMENT CHANGE LIST:
Revision 0.1 to Revision 0.2
Updated Ta ble 5, “CLK± Outp ut Phase Jitter,” on
page 4.
Updated typical phase jitter from 0.6 to 0.7 ps for
kV = 380 ppm/V.
Revision 0.2 to Revision 1.0
Updated 2.5 V/3.3 V and 1.8 V CML output level
specifications in Table 4 on page 3.
Updated Si595 device to support frequencies up to
810 MHz for LVPECL, LVDS, and CML outputs.
Separated 1.8 V, 2.5 V/3.3 V supply voltage.
specifications for CML output in Table 3 on page 5.
Updated Note 1 of Table 5 on page 4 to refer to
AN256.
Updated Table 8 on page 5 to include the "Moisture
Sensitivity Level" and "Contact Pads" rows.
Updated Figure 3 and Table 13 on page 9 to reflect
specific marking information.
Revision 1.0 to Revision 1.1
Swapped D and E values in Table 12 on page 8.
Revision 1.1 to Revision 1.2
Added Table 9, “Thermal Characteristics,” on
page 5.
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