APW7128QAI-TRL - Anpec Electronics Corp.

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and

advise customers to obtain the latest version of relevant information to verify before placing orders.

30V, 1.2MHz, White LED Driver

•Wide Input Voltage Range from 2.7V to 21V

•High Current-Limit up to 3.5A

•0.5V Reference Voltage with ±3%

System Accuracy

•50mΩ Integrated N-FET

•Fixed 1.2MHz Switching Frequency

•High Efficiency up to 95%

•Open-LED Protection

•Under Voltage Lockout Protection

•ALS Control Input Pin

•Over Temperature Protection

•Low Shutdown Current: <1uA

•3mm x 3mm DFN-10 Package

•Lead Free and Green Devices Available

(RoHS Compliant)

FeaturesGeneral Description

Applications

•Display Backlighting

- Automotive

- LCD Monitors

- Notebook Displays

•Portable Displays

Ordering and Marking Information

The APW7128 is the high power and high efficiency

boost converter with an integrated 30V FET ideal for LCD

panel backlighting applications. 30V output voltage al-

lows for 8 high-power LEDs in series, and 3.5A inductor

current limit allows for more LED strings connected in

parallel. The low 0.5V feedback voltage offers higher

efficiency in WLED driver applications. The wide input

range from 2.7V to 21V made APW7128 a perfect solu-

tion for various applications such as LCD monitor and

portable devices. The OVP pin monitors the output volt-

age to protect IC during open load and FB pin short cir-

cuit operations. The APW7128 provides the ALS pin to

simplify the interface to an ambient light sensor for auto-

matic dimming. The APW7128 is available in the ther-

mally enhanced DFN-10 lead 3mm x 3mm package.

Pin Configuration

8 BP

COMP 2

OVP 3

EN 4

FB 1

PGND 5 6 LX

9 GND

7 VIN

10 ALS

Metal

LX Pad

(Bottom)

APW7128

DFN3x3-10 Top View

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

APW7128 Package Code

QA: DFN3x3-10

Operating Ambient Temperature Range

I : -40 to 85 C

Handling Code

TR : Tape & Reel

Assembly Material

L : Lead Free Device G : Halogen and Lead Free Device

Handling Code

Temperature Range

Package Code

APW7128 QA: APW

7128

XXXXX XXXXX - Date Code

Assembly Material

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw2

Absolute Maximum Ratings (Note 1)

Symbol Parameter Rating Unit

VIN VIN pin to GND -0.3 to 30 V

VLX LX pin to PGND -0.3 to 30 V

VOVP OVP pin to GND -0.3 to 30 V

VBP BP pin to GND -0.3 to 6 V

VEN EN pin to GND -0.3 to 30 V

VALS ALS pin to GND -0.3 to 6 V

PGND to GND -0.3 to 0.3 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -65 to 150 °C

TL Maximum Lead Soldering Temperature, 10 Seconds 260 °C

Recommended Operating Conditions

Symbol Parameter Rating Unit

VIN Supply Voltage, (VIN=BP) 2.7 to 5.5 V

VIN VIN Supply Voltage, (BP is open) 3.7 to 21V V

VOUT Output Voltage up to 30 V

TJ Operating Ambient Temperature -40 to 85 °C

TA Operating Junction Temperature -40 to 125 °C

Electrical Characteristics

VIN=6V, TA = -40 to 85°C, unless otherwise specified. Typical values refer to TA =25°C.

Symbol Parameter Test Conditions Min Typ Max Unit

INPUT SUPPLY CURRENT AND UVLO

BP Under Voltage Lockout

Threshold VIN rising 2.4 2.5 2.6 V

UVLO Hysteresis - 100 - mV

EN=5V, switching - 9 15 mA

IVIN VIN Supply Current EN=0V - - 1 uA

ERROR AMPLIFIER

gm Error Amplifier Transconductance - 350 - uA/V

ICOMP COMP Output Current sourcing and sinking, VCOMP=1.5V

- 50 - uA

VFB FB Voltage 485 500 515 mV

Symbol Parameter Package Typical Value Unit

θJA Junction to Ambient Thermal Resistance

in Free Air DFN3x3-10 80 °C/W

Thermal Characteristics (Note 2)

Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad

is soldered directly on the PCB.

Note 1: Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw3

Electrical Characteristics (Cont.)

VIN=6V, TA = -40 to 85°C, unless otherwise specified. Typical values refer to TA =25°C.

Symbol Parameter Test Conditions Min Typ Max Unit

Minimum FB Voltage VALS=0.3V 188 200 212 mV

IFB FB Input Bias Current - - 1 µA

FB Line Regulation VIN=2.7V to 21V - 0.02 0.04 %/V

INTERNAL POWER SWITCH

Power Switch Current-Limit 2.5 3.5 4.5 A

RDS(ON) Power Switch On Resistance - 50 100 mΩ

LX Leakage Current VLX=30V - - 1 µA

FSW Switching Frequency 0.9 1.2 1.5 MHz

DMAX LX Maximum Duty Cycle 92 95 98 %

ALS

ALS Ratio VALS=1V, VALS/VFB 2.9 3 3.1 V/V

ALS Pin Leakage VALS=5V - - 1 µA

OUTPUT OVERVOLTAGE PROTECTION

Over Voltage Threshold 30 32 34 V

OVP Hysteresis 2 3 4 V

OVP Leakage Current - - 30 µA

CONTROL LOGIC PIN

EN High-Level Input Voltage 2.4 - - V

EN Low-Level Input Voltage - - 0.4 V

EN Leakage Current VEN=21V - - 1 µA

THERMAL SHUTDOWN

Thermal Shutdown Threshold - 150 - °C

Thermal Shutdown Hysteresis - 50 - °C

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw4

Typical Operating Characteristics

2.5

3.5

4.5

5.5

6.5

7.5

0 5 10 15 20 25

VIN Supply Voltage (V)

VIN Supply Current (mA)

8.5

9.0

switching

VIN Supply Current vs. VIN Supply Voltage

400

500

600

700

800

0 5 10 15 20 25

VIN Supply Voltage (V)

VIN Supply Current (uA)

no switching

VIN Supply Current vs. VIN Supply Voltage

100

00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

VIN=19V

VIN=12V

VIN=6V

Load Current (A)

Efficiency (%)

8LEDs in

series

Efficiency vs. Load Current

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0.55

ALS Input Voltage (V)

FB Voltage (V)

00.5 11.5 2

FB Voltage vs. ALS Input Voltage

0.490

0.495

0.500

0.505

0.510

0 5 10 15 20 25

VIN Supply Voltage (V)

FB Voltage (V)

FB Voltage vs. VIN Supply Voltage

2.0

1.0

1.2

1.4

1.6

1.8

VIN Supply Voltage (V)

EN Threshold Voltage (V)

2 6 10 14 18 22

EN High Threshold

EN Low Threshold

EN Threshold Voltage vs. VIN Supply Voltage

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw5

Typical Operating Characteristics (Cont.)

VIN Supply Voltage (V)

2 6 10 14 18 22

Power Switch On Resistance (mΩ)

Power Switching On Resistance

vs. VIN Supply Voltage

1.20

1.25

1.30

1.35

1.40

VIN Supply Voltage (V)

Switching Frequency (MHz)

0 5 10 15 20 25

Switching Frequency vs. VIN Supply Voltage

Switching Frequency (MHz)

1.00

1.05

1.10

1.15

1.20

1.25

1.30

1.35

1.40

1.45

1.50

-40 -20 0 20 40 60 80 100 120 140 160

Junction Temperature (oC)

Switching Frequency

vs. Junction Temperature

200

250

300

350

400

450

500

550

600

650

700

750

800

Junction Temperature (oC)

VIN Supply Current (uA)

-20 020 40 60 80 100 120 140 160

-40

no switching

VIN Supply Current

vs. Junction Temperature

FB Voltage (V)

0.490

0.492

0.494

0.496

0.498

0.500

0.502

0.504

0.506

0.508

0.510

-40 -20 0 20 40 60 80 100 120 140 160

Junction Temperature (oC)

FB Voltage vs. Junction

Temperature

100

Junction Temperature (℃)

Power Switch On Resistance (mΩ)

-40 -20 0 20 40 60 80 100 120 140 160

Power Switching On Resistance

vs. Junction Temperature

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw6

Operating Waveforms

Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.

Start-up

CH1: VEN, 10V/div, DC

CH2: VOUT, 10V/div, DC

CH4: IIN, 500mA/div, DC

TIME: 1ms/div

VIN=12V, L=10uH, CCOMP=0.22uF

VOUT

VEN

IIN

CH1: VEN, 10V/div, DC

CH2: VOUT, 10V/div, DC

CH4: IIN, 500mA/div, DC

TIME: 10ms/div

VIN=12V, L=10uH, CCOMP=0.22uF

Shutdown

VOUT

VEN

IIN

Overvoltage Protection

CH1: VCOMP, 0.5V/div, DC

CH2: VOUT, 10V/div, DC

CH4: IIN, 100mA/div, DC

TIME: 10ms/div

Output is open

VOUT

VCOMP

IIN

Switching Waveforms

CH1: VIN, 50mV/div, AC

CH2: VOUT, 200mV/div, AC

CH3: VLX, 20V/div, DC

TIME: 0.5us/div

VIN=12V, L=10uF, IOUT=160mA

CH4: IL, 200mA/div, DC

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw7

Pin Description

NO. NAME FUNCTION

1 FB Regulator Feedback Pin. Connect a current sense resistor to GND to set the LED current.

2 COMP Error Amplifier Output. Connect a 0.22µF capacitor for compensation and soft-

start. When EN is

pulled low, an internal switch will discharge the COMP voltage to 0V.

3 OVP Output Over Voltage Monitor Pin. Tie to VOUT for OVP function.

4 EN

Enable Input Pin. Pull EN above 2.4V to enable the device; pull EN below 0.4V to disable the

device. The EN pin cannot be left floating.

5 PGND Power Ground. Source of the internal N-channel power MOSFET.

6 LX Internal Power MOSFET Drain.

7 VIN Supply Voltage Input.

8 BP Output of The Internal 5V Regulator. Connect a 1µ

F bypass capacitor to GND. Do not apply an

external load to BP.

9 GND Signal Ground.

10 ALS

Ambient Light Sensor Input. Allow the light sensor to control the FB voltage for LED dimming. If the

ALS function is not used, tie the ALS pin to BP pin.

Block Diagram

UVLO

Oscillator

Control Logic

LDO

0.9V

0.5V

VIN

GND

OVP

COMP

Thermal

Shutdown

ALS

PGND

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw8

Typical Application Circuit

Figure1. Analog Dimming with PWM Voltage

Figure2. Analog Dimming with External ALS Voltage

Designation

Supplier Part Number Specification Wedsite

L1 GOTREND

GTSD53 10uH, 1.33A www.gotrend.com.tw

C1 Murata GRM31CR61E106K X5R, 25V, 10uF www.murata.com

C2 Murata GRM155R61A105K X5R, 10V, 1uF www.murata.com

C3 Murata GRM155R60J224KE01 X5R, 6.3V. 0.22uF www.murata.com

C5 Murata GRM21BR71H105KA12

X7R, 50V, 1uF www.murata.com

D1 Zowie MSCD104 1.0A, 40V www.zowie.com.tw

VIN

ALS

GND

OVP

COMP

PGND

APW7128

Up to 8

LEDs per

String

OFF

10uF 1uF

1uF

10uH

ALS

L1 D1

0.22uF

Up to 8 Strings

3.125

6V to 21VVDD

VIN

ALS

GND

OVP

COMP

PGND

APW7128

Up to 8

LEDs per

String

OFF

10uF 1uF

1uF

10uH

L1 D1

0.22uF

Up to 8 Strings

PWM

brightness

control

R4 C4

3.75

VADJ 24k120k

0.1uF

10k

ILED(max)=20mA

ILED(min)=0mA

6V to 21V

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw9

Function Description

Output Overvoltage Protection

If the FB pin is shorted to ground or an LED fails open

circuit, output voltage in BOOST mode can increase to

potentially damaging voltages. An optional overvoltage

protection circuit can be enabled by connection of the

OVP pin to the output voltage. The device will stop

switching if the output voltage exceeds OVP high

threshold and re-start when the output voltage falls

below OVP low threshold. During sustained OVP fault

conditions, VOUT will saw-tooth between the upper and

lower threshold voltages at a frequency determined by

the magnitude of current available to discharge the

output capacitor. Note that the OVP pin must be con-

nected to output voltage for OVP function.

Ambient Light Sensor Interface

The APW7128 provides the ALS pin to simplify the in-

terface to an ambient light sensor. The ambient light sen-

sor detects the ambient light and yields a current which

is related to the illuminance. Connect a load resistor

from the current output of ambient light sensor to ground

to provide an output voltage to ALS pin. The ALS voltage

will be divided by an internal divider circuit, and the di-

vided ALS voltage will replace the internal reference

voltage. The LED current can be calculated by the follow-

ing equation:

IALS

LED V

1×=

Note that the maximum FB voltage is set to 0.5V, and

minimum FB voltage is set to 0.2V. If the divided ALS

voltage is over 0.5V or less 0.2V, the LED current is lim-

ited at:

where R2 is the resistor from FB to GND.

Enable/Disable

Pull the EN above 2V to enable the device and pull EN

pin below 0.4V to disable the device. In shutdown mode,

the internal control circuits are turned off,

the quiescent

current is below 1uA.

Thermal Shutdown

When the junction temperature exceeds 150°C, the

2RV5.0

I)MAX(LED =2RV2.0

I)MIN(LED =

internal thermal sensor circuit will disable the device

and allow the device to cool down. When the device’s

junction temperature cools by 50°C, the internal thermal

sense circuit will enable the device, resulting in a pulsed

output during continuous thermal protection. Thermal

protection is designed to protect the IC in the event of

over temperature conditions. For normal operation, the

junction temperature cannot exceed TJ=+125 °C.

Internal 5V LDO

The APW7128 provides an internal 5V LDO for the con-

trol circuitry, and the output of the internal LDO is BP pin.

In normal operation, connect a 1µF or greater capaci-

tor to GND is recommended. The internal LDO cannot

supply any more current than is required to operate the

APW7128. Therefore, do not apply any external load to

BP pin. In applications, where the VIN is less than 5.5V,

BP should be tied to VIN through a 10Ω resistor.

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw10

Application Information

Connecting more LED strings

The APW7128 can drive 8 LED strings in parallel and up

to 8 LEDs per string (VF<3.5V). Each string must have the

same number of LEDs. In the applications that have the

same total number of LEDs, more strings and less LEDs

in series are more efficiency than less strings and more

LEDs in series.

Brightness Control

Inductor Selection

A larger value of inductor will reduce the peak inductor

current, resulting in smaller input ripple current, higher

efficiency and reducing stress on the internal MOSFET.

However, the larger value of inductor has a large

dimension, lower saturation current, and higher series

resistance.

A good rule for determining the inductance is to allow the

peak-to-peak ripple current to be approximately 30% to

50% of the maximum input current. Calculate the required

inductance value by the equation:

The method for dimming the LEDs is to apply a PWM

voltage through an RC filter into the FB pin.

The RC filter is used to convert the PWM voltage into an

analog voltage. The values of the R and C depend upon

the frequency of the PWM voltage and the amount of al-

lowable ripple voltage on FB pin. The LED current is pro-

portional to the PWM duty cycle. 0 % duty delivers maxi-

mum LED current and 100% duty delivers minimum LED

current. The values of R1 and R2 are calculated by the

following equations:

(max)LEDFB(min)LED)low(ADJ(min)LEDFB(max)LED)high(ADJ

)high(ADJ(min)LED)low(ADJ(max)LEDFB

IVIVIVIV)V3RIV3RI(V

2R×−×−×+× −×−+××

(max)LED

low(ADJFB

I)V

3R2R

)

3R2R

1(V

1R×−+×

where:

ILED(max) is the maximum LED current

ILED(min) is the minimum LED current

VADJ(high) is the maximum PWM voltage level

VADJ(min) is the minimum PWM voltage level

VFB is the FB pin Voltage

FB 1APW7128

PWM

Voltage

R4 C4

VADJ(max)

VADJ(min)

OUTSWL

ININOUT VFIV)VV(

L××∆

−

INLI)(I%50%30

∆

−

η×

=IN

LOADOUT

VIV

IIN

Figure 3. Dimming with the PWM Voltage

It is necessary to choose an inductor that ensures the

inductor saturation current rating to exceed the peak

inductor current for the application.

To make sure that the peak inductor current is below the

current-limit 2.5A. Calculating the peak inductor current

by the following equation:

LINPEAK I5.0II ∆×+=

OUTSW

ININOUT

LOADOUT

PEAK VFL2 V)VV(

VIV

I××× ×−

η×

where

η is the efficiency

Schottky Diode Selection

A fast recovery time and low forward voltage Schottky di-

ode is necessary for optimum efficiency. Ensure that the

diode’s average and peak current rating exceed the aver-

age output current and peak inductor current. In addition,

the diode’s reverse voltage must exceed output voltage.

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw11

Application Information (Cont.)

Layout Consideration

The correct PCB layout is important for all switching

converters. If the layout is not carefully done, the regulator

could show stability problems as well as EMI problems.

Figure. 4 illustrates the layout guidelines; the bold lines

indicate these traces that must be short and wide. The

capacitors, the diode, and the inductor should be as close

to the IC as possible. Keep traces short, direct, and wide.

Keep the LX node away from FB and COMP pins. The

trace from diode to the LEDs may be longer. The ground

return of input capacitor and output capacitor should be

tied close to PGND. Use the different ground planes for

signal ground and power ground to minimize the effects

of ground noise. Connect these ground nodes at any place

close to one of the ground pins of the IC. The resistor

from FB to GND should be close to the FB pin as possible.

The metal plate of the bottom must be soldered to the

PCB and connected to LX node and the LX plane on the

backside through several thermal vias to improve heat

dissipation.

Capacitor Selection

An input capacitor is required to supply the ripple current

to the inductor and stabilize the input voltage. Larger

input capacitor values and lower ESR provide smaller

input voltage ripple and noise. The typical value for input

capacitor is 2.2µF to 10µF.

The output capacitor with typical value 1µF to 10µF is re-

quired to maintain the output voltage. The COMP capaci-

tor with typical value 0.22µF to 1µF stabilizes the con-

verter and controls the soft-start.

To ensure the voltage rating of input and output capaci-

tors is greater than the maximum input and output voltage.

It is recommended using the ceramic capacitors with X5R,

X7R, or better dielectrics for stable operation over the

entire operating temperature range.

VIN

COMP

PGN

L1 D1

VIN

BOTTOM

SIDE PAD

Short wires

Via connection to LX plane

Short and wide wires

Via connection to GND plane

Via connection to PGND plane

Figure 4. Layouy Guidelines

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw12

Package Information

DFN3x3-10

Pin 1

Corner

E2L

LMIN. MAX.

1.00

0.00

0.18 0.30

2.20 2.70

0.05

1.40

MILLIMETERS

A3 0.20 REF

DFN3*3-10

0.30 0.50

1.75

0.008 REF

MIN. MAX.

INCHES

0.039

0.000

0.007 0.012

0.087 0.106

0.055

0.012 0.020

0.80

0.069

0.031

0.002

3.00 BSC 0.118 BSC

0.50 BSC 0.016 BSC

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw13

Carrier Tape & Reel Dimensions

Application

A H T1 C d D W E1 F

178.0±

2.00

50 MIN.

12.4+2.00

-0.00

13.0+0.50

-0.20

1.5 MIN.

20.2 MIN.

12.0±

0.30

1.75±

0.10

5.5±

0.05

P0 P1 P2 D0 D1 T A0 B0 K0

DFN3x3-10

4.0±0.10

8.0±0.10

2.0±0.10

1.5+0.10

-0.00

1.5 MIN.

0.6+0.00

-0.40

3.35±0.20

1.30±0.20

(mm)

OD0

BA0

SECTION B-B

SECTION A-A

OD1

Package Type Unit Quantity

DFN3X3-10 Tape & Reel 3000

Devices Per Unit

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw14

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow Profiles

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate

(TL to TP) 3°C/second max. 3°C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

100°C

150°C

60-120 seconds

150°C

200°C

60-180 seconds

Time maintained above:

- Temperature (TL)

- Time (tL) 183°C

60-150 seconds 217°C

60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2

Time within 5°C of actual

Peak Temperature (tp) 10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.

Notes: All temperatures refer to topside of the package. Measured on the body surface.

t 25 C to Peak

Ramp-up

Ramp-down

Preheat

Tsmax

Tsmin

Temperature

Time

Critical Zone

TL to TP

Rev. A.1 - Apr., 2008

APW7128

www.anpec.com.tw15

Customer Service

Test item Method Description

SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC

HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C

PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C

TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V

Latch-Up JESD 78 10ms, 1tr > 100mA

Reliability Test Program

Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350

<2.5 mm 240 +0/-5°C 225 +0/-5°C

≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated

classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL

level.

Classification Reflow Profiles (Cont.)

Anpec Electronics Corp.

Head Office :

No.6, Dusing 1st Road, SBIP,

Hsin-Chu, Taiwan, R.O.C.

Tel : 886-3-5642000

Fax : 886-3-5642050

Taipei Branch :

2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,

Sindian City, Taipei County 23146, Taiwan

Tel : 886-2-2910-3838

Fax : 886-2-2917-3838