Welcome to TE.com, you are viewing information for visitors in TE CONNECTIVITY (TE) CHOOSE ANOTHER SITE STAY ON THIS SITE Need Help? +1 800 522 6752 o r Live Chat Track Your Order Search by part # or keyword Products Industries & Solutions Shop TE Resources Sign In US-EN Purchase items directly from TE.com Connectors Sockets Memory Sockets SO DIMMs 2309407-1 DDR4 DIMM, SO DIMM Sockets, Small Outline (SO), Stack Height .157 in [4 mm], Right Angle Module Orientation, Surface Mount, Cable-to-Board We are here to help! DDR4 DIMM TE Internal #: 2309407-1 TE Internal Description: DDR4 SODIMM 260P 4.0H STD Get in touch with our product experts. CHAT WITH US EMAIL US CALL US DRAM Type: Small Outline (SO) Stack Height: 4mm[.157in] Module Orientation: Right Angle PCB Mounting Style: Surface Mount Connector System: Cable-to-Board Digital Datasheet ORDER SAMPLES Compatible Parts & Tooling Documents Product Drawings Features Product Compliance DDR4 SODIMM 260P 4.0H STD DDR4 SODIMM 260P 4.0H STD English CAD Files PCB Design Download symbol & footprint (SnapEDA) 3D PDF 3D_CVM_CVM_2309407-1_1.pdf 3D Customer View Model ENG_CVM_CVM_2309407-1_1.2d_dxf.zip English ENG_CVM_CVM_2309407-1_1.3d_igs.zip English ENG_CVM_CVM_2309407-1_1.3d_stp.zip English Product Specifications Application Specification ENG_SS_114-115015_A.pdf English Product Specification ENG_SS_108-115122_A1.pdf English Qualification Test Report ENG_SS_501-115133_A.pdf English Product Environmental Compliance Product Compliance ENG_PC_MD_2309407-1_A(770383).xlsx English Product Compliance ENG_PC_MD_2309407-1_A(695386).xml English Please review product documents or contact us for the latest agency approval information. Please Note: Use the Product Drawing for all design activity. Product Type Features DRAM Type: Small Outline (SO) Connector System: Cable-to-Board Sealable: No Connector & Contact Terminates To: Printed Circuit Board Center Post: Without Product Type: Socket Configuration Features Module Orientation: Right Angle Number of Positions: 260 Number of Rows: 2 Keying: Standard Number of Keys: 1 Center Key: Offset Left Electrical Characteristics DRAM Voltage(V): 1.2 Signal Characteristics SGRAM Voltage(V): 1.2 Body Features Ejector Type: Locking Connector Profile: Low Module Key Type: Offset Left Retention Post Location: Both Ends Latch Material: High Temperature Thermoplastic Ejector Location: Both Ends Retention Post Material: Stainless Steel Contact Features Contact Base Material: Copper Alloy PCB Contact Termination Area Plating Material: Gold Flash Contact Mating Area Plating Material: Gold Flash Contact Current Rating (Max)(A): .5 Socket Type: Memory Card Socket Style: SO DIMM Termination Features Insertion Style: Cam-In Mechanical Attachment PCB Mount Retention Type: Solder Peg PCB Mount Retention: With PCB Mounting Style: Surface Mount Connector Mounting Type: Board Mount Housing Features Centerline (Pitch)(mm): .5, 2.1 Centerline (Pitch)(in): .0197, .082 Housing Material: High Temperature Thermoplastic Housing Color: Black Dimensions Stack Height: 4mm[.157in] Row-to-Row Spacing: 8.2mm[.322in] Usage Conditions Operating Temperature Range: -55 - 85C[-67 - 185F] Operation/Application Circuit Application: Power Industry Standards UL Flammability Rating: UL 94V-0 Packaging Features Packaging Method: Tape & Reel Statement of Compliance Statement of Compliance pdf Also in the Series DIMM Sockets (69) Packaging Quantity: 900 DDR4 DIMM SO DIMM Sockets (39) ABOUT TE CONNECTIVITY FOR PARTNERS SUPPORT CALL US LIVE CHAT UNITED STATES (EN)