Connectors Sockets Memory Sockets SO DIMMs
DRAM Type : Small Outline (SO)
Stack Height : 4 mm [ .157 in ]
Module Orientation : Right Angle
PCB Mounting Style : Surface Mount
Connector System : Cable-to-Board
ORDER SAMPLES
Compatible Parts & Tooling
DDR4 DIMM
TE Internal #: 2309407-1
TE Internal Description: DDR4 SODIMM 260P
4.0H STD
2309407-1
DDR4 DIMM, SO DIMM Sockets, Small Outline (SO), Stack Height .157 in [4 mm], Right Angle
Module Orientation, Surface Mount, Cable-to-Board
Digital Datasheet
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Product Drawings
DDR4 SODIMM 260P 4.0H STD
DDR4 SODIMM 260P 4.0H STD
English
CAD Files
PCB Design
Download symbol & footprint (SnapEDA)
3D PDF
3D_CVM_CVM_2309407-1_1.pdf
3D
Customer View Model
ENG_CVM_CVM_2309407-1_1.2d_dxf.zip
English
ENG_CVM_CVM_2309407-1_1.3d_igs.zip
English
ENG_CVM_CVM_2309407-1_1.3d_stp.zip
English
Product
Specifications
Application Specification
ENG_SS_114-115015_A.pdf
English
Product Specification
ENG_SS_108-115122_A1.pdf
English
Documents
Features
Product Compliance
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Qualification Test Report
ENG_SS_501-115133_A.pdf
English
Product
Environmental
Compliance
Product Compliance
ENG_PC_MD_2309407-1_A(770383).xlsx
English
Product Compliance
ENG_PC_MD_2309407-1_A(695386).xml
English
Please review product documents or contact us for the latest agency approval
information. Please Note: Use the Product Drawing for all design activity.
Product Type
Features
DRAM Type : Small Outline (SO)
Connector System : Cable-to-Board
Sealable : No
Connector & Contact Terminates To : Printed Circuit Board
Center Post : Without
Product Type : Socket
Configuration
Features
Module Orientation : Right Angle
Number of Positions : 260
Number of Rows : 2
Keying : Standard
Number of Keys : 1
Center Key : Offset Left
Electrical
Characteristics DRAM Voltage (V): 1.2
Signal
Characteristics SGRAM Voltage (V): 1.2
Body Features
Ejector Type : Locking
Connector Profile : Low
Module Key Type : Offset Left
Retention Post Location : Both Ends
Latch Material : High Temperature Thermoplastic
Ejector Location : Both Ends
Retention Post Material : Stainless Steel
Contact Features
Contact Base Material : Copper Alloy
PCB Contact Termination Area Plating Material : Gold Flash
Contact Mating Area Plating Material : Gold Flash
Contact Current Rating (Max) (A): .5
Socket Type : Memory Card
Socket Style : SO DIMM
Termination
Features Insertion Style : Cam-In
Mechanical
Attachment
PCB Mount Retention Type : Solder Peg
PCB Mount Retention : With
PCB Mounting Style : Surface Mount
Connector Mounting Type : Board Mount
Housing Features
Centerline (Pitch) (mm): .5, 2.1
Centerline (Pitch) (in): .0197, .082
Housing Material : High Temperature Thermoplastic
Housing Color : Black
Dimensions
Stack Height : 4 mm [ .157 in ]
Row-to-Row Spacing : 8.2 mm [ .322 in ]
Usage Conditions Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]
Operation/Application
Circuit Application : Power
Industry
Standards UL Flammability Rating : UL 94V-0
Packaging
Features
Packaging Method : Tape & Reel
Packaging Quantity : 900
Statement of
Compliance
Statement of Compliance pdf
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