CPC2025N 400V Dual Normally-Open Single-Pole 8-Pin SOIC OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Forward Current (to Activate) Rating 400 120 30 2 Units VP mArms / mADC mA Features * * * * * * * Description The CPC2025N is a miniature device with two independent, normally-open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient infrared LED. 1500Vrms Input/Output Isolation Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to Radiated EM Fields Tape & Reel Version Available Small 8-Pin SOIC Package Flammability Rating UL 94 V-0 The CPC2025N uses IXYS Integrated Circuits' state of the art, double-molded vertical construction packaging to produce one of the world's smallest relays. It offers substantial board space savings over the competitor's larger 8-pin SOIC relay. Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Security * Passive Infrared Detectors (PIR) * Data Signaling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls Approvals * UL Recognized Component: File E76270 * CSA Approval Pending * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # CPC2025N CPC2025NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 1 8 + Control Load 7 2 - Control Load 3 6 + Control Load 4 5 - Control Load Switching Characteristics of Normally-Open (Form-A) Devices Form-A IF 90% 10% ILOAD ton DS-CPC2025N-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2025N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage (Peak) Reverse Input Voltage LED Forward Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Ratings 400 5 50 1 70 600 Units VP V mA A mW mW 1500 Vrms 8 -40 to +85 -40 to +125 kV C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics LED Forward Current To Activate 3 To Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units t=10ms IL=120mA VL=400VP IL ILPK RON ILEAK - 20 - 120 350 30 1 mArms / mADC mAP A ton toff COUT - 0.76 0.36 9 2 1 - 0.3 0.9 - 0.6 0.55 1.2 - 2 1.5 10 IF=5mA, VL=10V IF=0mA, VL=50V, f=1MHz IL=120mA IF=5mA VR=5V IF VF IR VIO=0V, f=1MHz CIO 1 Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60C) a minimum LED forward current of 4mA is recomended. www.ixysic.com - ms pF mA V A pF R04 INTEGRATED CIRCUITS DIVISION CPC2025N PERFORMANCE DATA* 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical LED Forward Current to Activate (N=50, IL=120mA) 15 Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mA) 30 25 20 15 10 Device Count (N) 25 Device Count (N) Device Count (N) 30 10 5 0 0 1.21 1.22 1.23 1.24 0.3 Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 0.4 0.5 0.6 0.7 0.8 LED Forward Current (mA) 10 5 0 0.65 0.70 0.75 0.80 0.85 Turn-On Time (ms) 20 15 10 5 0.34 0.85 20 10 0.65 0.60 0.55 0.50 1.2 1.1 1.0 -40 IF=10mA IF=5mA IF=2mA 0 20 40 60 Temperature (C) 80 20 40 60 Temperature (C) 80 100 Typical Load Current vs. Load Voltage (IF=2mA) 50 0 -50 -3 Typical Turn-On Time vs. LED Forward Current (IL=60mA) -2 -1 0 1 Load Voltage (V) 2 3 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 0.37 0.36 2.5 2.0 1.5 1.0 0.35 0.34 0.33 0.32 0.31 0.5 0 431 100 100 0.30 0 -20 419 422 425 428 Blocking Voltage (VP) -150 -20 Turn-Off Time (ms) Turn-On Time (ms) 1.3 5 -100 0.45 3.0 1.4 10 150 0.70 3.5 IF=50mA IF=20mA 1.5 15 416 0.75 Typical LED Forward Voltage Drop vs. Temperature 1.6 20 0.40 0.80 0.40 -40 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) 0.36 0.37 0.38 0.39 Turn-Off Time (ms) Load Current (mA) LED Forward Current (mA) 30 0.35 LED Forward Current to Activate vs. Temperature (IL=60mA) LED Forward Voltage vs. LED Forward Current 40 20.5 0 0.90 50 18.5 19.0 19.5 20.0 On-Resistance (:) 25 0 0.60 18.0 Typical Blocking Voltage Distribution (N=50) Device Count (N) 15 17.5 0.9 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 25 Device Count (N) 20 Device Count (N) 10 0 1.25 LED Forward Voltage Drop (V) LED Forward Current (mA) 15 5 5 LED Forward Voltage Drop (V) 20 0 10 20 30 40 LED Forward Current (mA) 50 0 10 20 30 40 LED Forward Current (mA) 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2025N PERFORMANCE DATA* 32 Typical Turn-On Time vs. Temperature (IL=60mA) 2.5 Turn-On Time (ms) On-Resistance (:) 30 28 26 24 22 2.0 1.5 IF=5mA 1.0 0.5 0.4 IF=5mA 0.3 IF=2mA 0.2 0.1 20 18 0 0.5 -20 0 20 40 60 Temperature (C) 80 100 -40 Maximum Load Current vs. Temperature (IF=4mA) 140 Blocking Voltage (VP) 100 80 60 40 20 0 0 20 40 60 Temperature (C) Output Capacitance (pF) 50 80 100 20 40 60 Temperature (C) -40 0.030 430 420 410 0 20 40 60 Temperature (C) 80 100 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (VL=400V) 0.020 0.015 0.010 0.005 400 390 -40 -20 0.025 -20 0 20 40 60 Temperature (C) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 20 10 10 100 Load Voltage (V) 80 0 -40 100 -20 0 20 40 60 Temperature (C) 80 100 Energy Rating Curve 30 1 100 440 40 0 0.1 80 450 Load Current (A) -20 0 Typical Blocking Voltage vs. Temperature (IF=0mA) 460 120 -40 -20 Leakage (PA) -40 Load Current (mA) Typical Turn-Off Time vs. Temperature (IL=60mA) 0.6 IF=2mA Turn-Off Time (ms) Typical On-Resistance vs. Temperature (IF=20mA, IL=60mA) 1000 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC2025N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC2025N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC2025N 260C 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2025N MECHANICAL DIMENSIONS CPC2025N 1.016 0.025 (0.040 0.001) 9.347 0.203 (0.368 0.008) Pin 1 2.184 MAX (0.086 MAX) 0.432 0.127 (0.017 0.005) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 0.102 (0.033 0.004) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 0.102 (0.240 0.004) 3.810 0.051 (0.150 0.002) 2.540 TYP (0.100 TYP) 0.203 0.025 (0.008 0.001) 2.54 (0.100) 0.55 (0.022) Dimensions mm (inches) 0.381 0.051 (0.015 0.002) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC2025NTR Tape & Reel 1.75 0.10 330.2 DIA. (13.00 DIA.) 4.00 0.10 P1=8.00 0.10 2.00 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 0.10 O1.50 +0.1, -0 6.50 9.65 0.10 16.00 0.30 Embossed Carrier Direction of feed 3.50 Embossment 6.55 0.10 2.35 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance 0.20. 3. Carrier camber is within 1mm in 250mm. O1.50 MIN 2.85 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 0.05mm. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC2025N-R04 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/4/2018