ASM3P2869A-08SR - Alliance Semiconductor

August 2004 ASM3P2869A

rev 2.0

Alliance Semiconductor

2575, Augustine Drive Santa Clara, CA Tel: 408.855.4900 Fax: 408.855.4999 www.alsc.com

Notice: The information in th

is document is subject to change without notice.

Low Power Peak EMI Reducing Solution

Features

Generates an EMI optimized clocking signal at the

output.

Integrated loop filter components.

Operates with a 3.3V ±10% supply.

Operating current less than 6mA.

Low power CMOS design.

Input frequency range: 6MHz to 12MHz.

Generates a 1X low EMI spread spectrum clock of

the input frequency.

Frequency deviation: ±1%.

Available in 6-pin TSOT-23, 8-pin SOIC and 8-pin

TSSOP packages.

Product Description

The ASM3P2869A is a versatile spread spectrum

frequency modulator designed specifically for a wide

range of clock frequencies. The ASM3P2869A reduces

electromagnetic interference (EMI) at the clock source,

allowing system wide reduction of EMI of all clock

dependent signals. The ASM3P2869A allows significant

system cost savings by reducing the number of circuit

board layers ferrite beads, shielding that are traditionally

required to pass EMI regulations.

The ASM3P2869A uses the most efficient and optimized

modulation profile approved by the FCC and is

implemented by using a proprietary all digital method.

The ASM3P2869A modulates the output of a single PLL

in order to “spread” the bandwidth of a synthesized clock,

and more importantly, decreases the peak amplitudes of

its harmonics. This results in significantly lower system

EMI compared to the typical narrow band signal produced

by oscillators and most frequency generators. Lowering

EMI by increasing a signal’s bandwidth is called ‘spread

spectrum clock generation’.

Applications

The ASM3P2869A is targeted towards all portable

devices with very low power requirements like MP3

players, Notebooks and digital still cameras.

Key Specifications

Description Specification

Supply voltages VDD = 3.3V ±10%

Frequency Range 6MHz < CLKIN < 12MHz

Cycle-to-Cycle Jitter 300 ps (maximum)

Output Duty Cycle 40/60% (worst case)

Output Rise and Fall Time 1.1 ns (maximum)

Modulation Rate Equation FIN/256

Frequency Deviation ±1%

Block Diagram

XIN

VSS

ModOUT

Frequency

Divider

Feedback

Divider

Modulation

Phase

Detector

Loop

Filter

VCO Output

Divider

PLL

VDD

Crystal

Oscillator

XOUT

REFOUT

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XOUT

ASM3P2869A

REFOUT

XIN/CLKIN VDD

ModOUT

VSS

Pin Configuration (6-pin TSOT-23)

Pin# Pin Name Type Description

1REFOUT OBuffered output of the input frequency.

2XOUT OCrystal connection. If using an external reference, this pin must be left unconnected.

3XIN/CLKIN ICrystal connection or external reference frequency input. This pin has dual functions. It

can be connected either to an external crystal or an external reference clock.

4VDD PPower supply for the entire chip (3.3V)

5ModOUT OSpread spectrum clock output.

6VSS PGround connection.

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XIN/CLKIN

VSS

ModOUT

XOUT

ASM3P2869A

REFOUT

VDD

Pin Configuration (8-pin SOIC and TSSOP)

Pin Description

Pin# Pin Name Type Description

1XIN/CLKIN ICrystal connection or external reference frequency input. This pin has dual functions. It

can be connected either to an external crystal or an external reference clock.

2XOUT OCrystal connection. If using an external reference, this pin must be left unconnected.

3REFOUT OBuffered output of the input frequency.

4 NC - No connect.

5VSS PGround connection.

6ModOUT OSpread spectrum clock output.

7 NC - No connect.

8VDD PPower supply for the entire chip (3.3V)

Modulation Profile

Specification

Description Specification

Frequency Range 6MHz < CLKIN < 12MHz

Modulation Equation FIN/256

Frequency Deviation ±1%

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Absolute Maximum Ratings

Symbol Parameter Rating Unit

VDD, VIN Voltage on any pin with respect to Ground 0.5 to +7.0 V

TSTG Storage temperature -65 to +125 °C

TAOperating temperature 0 to 70 °C

Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings

for prolonged periods of time may affect device reliability.

DC Electrical Characteristics

(Test condition: All parameters are measured at room temperature (25°C) unless otherwise stated).

Symbol Parameter Min Typ Max Unit

VIL Input low voltage GND -0.3 –0.8 V

VIH Input high voltage 2.0 – VDD + 0.3 V

IIL Input low current – – -35 µA

IIH Input high current – – 35 µA

IXOL XOUT output low current (@4.0V, VDD=3.3V) - 3 - mA

IXOH XOUT output high current (@2.5V, VDD=3.3V) - 3 - mA

VOL Output low voltage (VDD = 3.3 V, IOL = 20 mA) – – 0.4 V

VOH Output high voltage (VDD = 3.3 V, IOH = 20 mA) 2.5 – – V

IDD Static supply current* – – 1.5 mA

ICC Dynamic supply current (3.3V, 12MHz and 15pF

loading) – – 6 mA

VDD Operating voltage 3.0 3.3 3.6 V

tON Power-up time (first locked cycle after power-up)** – – 10 mS

ZOUT Clock output impedance – 50 – ù

*XIN/CLKIN pin is pulled low

**VDD and XIN/CLKIN input are stable, PD pin is made high from low.

AC Electrical Characteristics

Symbol Parameter Min Typ Max Unit

CLKIN Input frequency 6 - 12 MHz

ModOUT Output frequency 6 - 12 MHz

tLH* Output rise time (measured at 0.8V to 2.0V) 0.5 0.7 1.1 ns

tHL*Output fall time (measured at 2.0V to 0.8V) 0.5 0.7 1.0 ns

tJC Jitter (cycle to cycle) - - 360 ps

tDOutput duty cycle 45 50 55 %

*tLH and tHL are measured into a capacitive load of 15pF

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Package Information

6-pin TSOT-23

A2 A



Dimensions in millimeters Dimensions in inches

Symbol

Min Max Min Max

A-1.00 -0.040

A1 0 0.10 00.004

A2 0.87 REF 0.034 REF

B1.40 1.80 0.055 0.071

b0.30 0.50 0.012 0.019

C2.50 3.00 0.098 0.118

D2.70 3.10 0.106 0.122

e0.95 BSC 0.037 BSC

H0.10 0.35 0.004 0.014

LMIN 0.20 MIN 0.008

 0° 8° 0° 8°

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A2 A



8-Pin SOIC

Symbol Dimensions in inches Dimensions in millimeters

Min Max Min Max

A0.057 0.071 1.45 1.80

A1 0.004 0.010 0.10 0.25

A2 0.053 0.069 1.35 1.75

B0.012 0.020 0.31 0.51

C0.004 0.01 0.10 0.25

D0.186 0.202 4.72 5.12

E0.148 0.164 3.75 4.15

e0.050 BSC 1.27 BSC

H0.224 0.248 5.70 6.30

L0.012 0.028 0.30 0.70

θ0° 8° 0° 8°

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

8-Pin TSSOP

Dimensions in inches Dimensions in millimeters

Symbol Min Max Min Max

A0.047 1.10

A1 0.002 0.006 0.05 0.15

A2 0.031 0.041 0.80 1.05

B0.007 0.012 0.19 0.30

C0.004 0.008 0.09 0.20

D0.114 0.122 2.90 3.10

E0.169 0.177 4.30 4.50

e0.026 BSC 0.65 BSC

H0.244 0.260 6.20 6.60

L0.018 0.030 0.45 0.75

θ0° 8° 0° 8°

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Ordering Information

Part Number Marking Package Type Temperature

ASM3P2869AF-06OR K4LL 6-Pin TSOT-23, TAPE & REEL 0°C –70øC

ASM3P2869AF-08TT ASM3P2869AFT 8-Pin TSSOP, TUBE 0øC –70øC

ASM3P2869AF-08TR ASM3P2869AFT 8-Pin TSSOP, TAPE & REEL 0øC –70øC

ASM3P2869AF-08ST ASM3P2869AFS 8-Pin SOIC, TUBE 0øC –70øC

ASM3P2869AF-08SR ASM3P2869AFS 8-Pin SOIC, TAPE & REEL 0øC –70øC

ASM3P2869A-06OR K1LL 6-Pin TSOT-23, TAPE & REEL 0øC –70øC

ASM3P2869A-08TT ASM3P2869AT 8-Pin TSSOP, TUBE 0øC –70øC

ASM3P2869A-08TR ASM3P2869AT 8-Pin TSSOP, TAPE & REEL 0øC –70øC

ASM3P2869A-08ST ASM3P2869AS 8-Pin SOIC, TUBE 0øC –70øC

ASM3P2869A-08SR ASM3P2869AS 8-Pin SOIC, TAPE & REEL 0øC –70øC

Device Ordering Information

A S M 3 P 2 8 6 9 A F - 0 8 T R

Licensed under U.S Patent Nos 5,488,627 and 5,631,921

OR - SOT23/T/R SR - SOIC, T/R

TT –TSSOP, TUBE QR – QFN, T/R

TR - TSSOP, T/R QT - QFN, TUBE

VT – TVSOP, TUBE BT - BGA, TUBE

VR – TVSOP, T/R BR – BGA, T/R

ST – SOIC, TUBE

PIN COUNT

X = Automotive I = Industrial P or n/c = Commercial

1 – reserved 6 – power management

2 - Non PLL based 7 – power management

3 – EMI Reduction 8 – power management

4 – DDR support products 9 – Hi performance

–

STD Zero Delay Buffer

reserved

Alliance Semiconductor Mixed Signal Product

PART NUMBER

LEAD FREE PART

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Notice: The information in this document is subject to change without notice.

Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003

trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective

companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance

assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's

best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time,

without notice. If the product described herein is under development, significant changes to these specifications are possible.

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Alliance Semiconductor Corporation

2575, Augustine Drive,

Santa Clara, CA 95054

Tel# 408-855-4900

Fax: 408-855-4999

www.alsc.com

Preliminary Information

Part Number: ASM3P2869A

Document Version: v 2.0 8_30_2004