BA6424AFSE2 - ROHM SEMICONDUCTOR

Datasheet

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

1/10

TSZ02201

0H1H0B10024

19.J

ul.2012 Rev.001

www.rohm.com

TSZ22111・14・001

DC Brushless Fan Motor Driver

Standard Single-phase Full wave

Fan Motor Driver

BA6424AFS

●

●●

●General Description

This is the summary of application for BA6424AFS. BA6424AFS incorporates lock protection and automatic restart circuit.

●

●●

●Features

 Lock protection and auto restart

 Rotating speed pulse signal (FG) output

 Lock alarm signal (AL) output

●

●●

●Applications

 General consumer electronics, BD player, DVR, STB

 Office equipment, Copier, FAX Laser Printer etc.

●

●●

●Package(s) W(Typ.) x D(Typ.) x H(Max.)

SSOP-A16 6.60mm x 6.20mm x 1.71m

●Absolute maximum ratings

Parameter Symbol

Ratings Unit

Supply voltage Vcc 30 V

Power dissipation Pd 812.5* mW

Operation temperature Topr -40 to +100 ℃

Storage temperature Tstg -55 to +150 ℃

Output current Iomax 1.0** A

Output voltage Vout 30 V

FG signal output voltage Vfg 30 V

AL signal output voltage Val 30 V

Junction temperature Tjmax 150 ℃

* Reduce by 6.5mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board)

** This value is not to exceed Pd.

●Operating Conditions

Parameter Symbol

Ratings Unit

Operating supply voltage range

Vcc 6.0 to 28.0 V

Hall input voltage range Vh 2.5 to Vcc V

SSOP-A16

Datasheet

2/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

●

●●

●Electrical characteristics (Unless otherwise specified Ta=25℃,Vcc=12V)

Parameter Symbol

Limits Unit Conditions Characteristics

Min. Typ. Max.

Circuit current Icc 2.7 5.4 8.1 mA At output OFF Fig.1

Charge current of capacitor for

lock detection Ildc 1.55

3.10

4.65 μA Vld=1.8V -

Discharge current of capacitor

for lock detection Ildd 0.33

0.66

0.99 μA Vld=1.8V -

Charge-

discharge current ratio of

capacitor for lock detection rcd 3.0 4.7 6.4 - rcd=Ildc/Ildd -

Clamp voltage of capacitor for

lock detection Vldcl 2.00

2.48

3.00 V -

Charge current of capacitor for

lock detection Vldcp 0.70

0.99

1.30

V -

Output L voltage Vol - 0.8 1.2 V Io=200mA Fig.2

Output H voltage Voh - 0.9 1.4 V

Io=-200mA

Voltage between

output and Vcc

Fig.3

FG output L voltage Vfgl - 0.1 0.3 V Ifg=10mA Fig.4

FG output leak current Ifgl - 0 10 μA Vfg=30V -

AL output L voltage Vall - 0.1 0.3 V Ial=10mA Fig.4

AL output leak current Iall - 0 10 μA Val=30V -

Hall input - output offset voltage

Vofs -20 0 20 mV -

Hall input - FG offset voltage Vfgofs

-45 -25 -5 mV -

●

●●

●Reference Data

0.5

1.5

0 0.2 0.4 0.6 0.8 1

Outpu t Cu rrent, Io [ A]

Output L voltage, Vol [V]

0.05

0.1

0.15

0.2

0 2 4 6 8 10

AL current, Ial [mA]

AL low voltage, Vall [V]

Fig.3 Output H voltage

0 6 12 18 24 30

Supply voltage, Vcc [V]

Circuit current, Icc [mA]

Fig.1 Circuit current

Fig.2 Output L voltage

28V

12V

Fig.4 FG/AL output L voltage

28V

100℃

-25℃

25℃

28V

12V

0.1

1.0

10.0

0.1 1.0 10.0 100.0

Collector-emitter voltage, Vce[V]

Collector-emitter current, Ice[A]

0.1

1.0

10.0

0.1 1.0 10.0 100.0

Collector-emitter voltage, Vce[V]

Collector-emitter current, Ice[A]

Operating Voltage Range

Fig.5 Output Tr ASO（upper）

(TON=100msec)

Fig.6 Output Tr ASO（lower）

(TON=100msec)

12V

-2

-1.5

-1

-0.5

0 0.2 0.4 0.6 0.8 1

Output Current, Io [A]

Output H voltage, Voh [V]

Datasheet

3/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

●

●●

●Block diagram, application circuit, and pin assignment (Constant etc are for reference)

PIN No. Terminal name

Function

1 GND GND terminal

2 N.C.

3 OUT2 Motor output terminal2

4 Vcc Power supply terminal

5 FG Rotating speed pulse signal output terminal

6 AL Lock alarm signal output terminal

7 LD Lock detection and auto restart capacitor connecting terminal

8 N.C.

9 H+ Hall input terminal+

10 H- Hall input terminal-

11 N.C.

12 N.C.

13 N.C.

14 OUT1 Motor output terminal1

15 N.C.

16 N.C.

●

●●

●Truth table

AL normal operation

:L(output is ON)

lock detection

: :H(output is OFF)

H+ H- OUT1 OUT2 FG

H L H L H

L H L H L

Take a measure against Vcc

voltage rise generated by

rev ers e connection of current

and counter electromot ive

force.

Set accordin g to the amplit ude

of h all element ou tput and hall

input voltage range.

T hi

s is an open collect or

output. Connect a pull-up

resistor.

Capacitor for setting lock

detecting and auto restart time

LOGIC

TSD

AMP

REG

LO CK

DETECTI ON

AN D

AUTO

RESTART

AMP

HALL

AMP

H+

HALL

Vcc

OUT2

OUT1

GND

REG

F G

0.47

to 4.7μF

to 10kΩ

P.7

P.4

P.6

P.4

Datasheet

4/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

●

●●

●Description of operations

1) Lock protection and automatic restart

Lock detection ON time (Ton) and lock detection OFF time (Toff) is set by charging and discharging of

external capacitor of LD terminal.

Fig.7 Lock protection timing chart

*BA6424AFS returns normal operation by the input of hall signal during Toff.

2) Hall input setting

Hall input voltage range is shown in operating conditions.

Fig.8 Hall input voltage range

Adjust the value of hall element bias resistor R1 in Fig.9 so that the input voltage of a hall amplifier is input in "hall

input voltage range" including signal amplitude.

Hall input voltage range

upper limit

Vcc

GND

Hall input voltage range

lower limit

C : Capacity of capacitor equipped

externally on LD terminal

Vldcl : LD terminal clamping voltage

Vldcp : LD terminal comparator voltage

Ildc : LD terminal charging current

Ildd : LD terminal discharging current

C･(Vldcl-Vldcp)

Ildc

C･(Vldcl-Vldcp)

Ildd

Ton (Lock detection ON time) =

Toff (Lock detection OFF time) =

H-

Motor locking

OUT1

terminal

clamping voltage

LD terminal

comparator voltage

Output

Tr OFF

Ton

HIGH (open collector)

offf

Lock detection Lock release Returns

normal operation

Output

Datasheet

5/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

○Reducing the noise of hall signal

Hall element may be affected by Vcc noise or the like depending on the wiring pattern of board. In this case, place

a capacitor like C1 in Fig.9. In addition, when wiring from the hall element output to IC hall input is long, noise may

be loaded on wiring. In this case, place a capacitor like C2 in Fig.9.

Fig.9 Application near hall signal

＊This IC doesn’t have hall input hysteresis.

Note the hall input so that the FG signal do not chatter by the noise of the hall signal.

●

●●

●Equivalent circuit

1) Hall input terminal 2) Motor output terminal

3) Lock detection and automatic restart capacitor 4) FG/AL signal output terminal

connecting terminal

Vcc

OUT1

OUT2

GND

H+

H-

Vcc

Hall bias current

= Vcc / (RH+R1 )

Hall element

H-

H+

Vcc

GND

Datasheet

6/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

●

●●

●Safety measure

1) Reverse connection protection diode

Reverse connection of power results in IC destruction as shown in Fig.10. When reverse connection is possible, reverse

connection protection diode must be added between power supply and Vcc.

Fig.10 Flow of current when power is connected reversely

2) Measure against Vcc voltage rise by back electromotive force

Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse

connection protection diode is connected, Vcc voltage rises because the diode prevents current flow to power supply.

Fig.11 Vcc voltage rise by back electromotive force

When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place

(A) Capacitor or (B) Zener diode between Vcc and GND. If necessary, add both (C).

Fig.12 Measure against Vcc voltage rise

Vcc

GND

Vcc

GND

Vcc

GND

Internal circuit impedance high

 amperage small

Circuit

block

Each

In normal energization

Large current flows

 Thermal destruction

Each

Circuit

block

Reverse power connection

No destruction

Each

Circuit

block

After reverse connection

destruction prevention

Phase

switching

(A) Capacitor (B) Zener diode

ON ON

Datasheet

7/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

3) Problem of GND line PWM switching

Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.

Fig.13 GND Line PWM switching prohibited

4) FG and AL output

FG and AL output is an open collector and requires pull-up resistor.

The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG or AL output

terminal is directly connected to power supply, could damage the IC.

Fig.14 Protection of FG and AL terminal

●

●●

●Calculation of power consumed by IC

Power consumed by this IC Pc is approximately calculated as follows:

Pc=Pc1+Pc2+Pc3

・Pc1：Power consumption by circuit current

Pc1=Vcc×Icc

・Pc2：Power consumption at output stage

Pc2=VOL×Io+VOH×Io

VOL is L voltage of output terminal 1 and 2.

VOH is H voltage of output terminal 1 and 2.

Io is the current flowing to output terminal 1 and 2.

・Pc3：Power consumption at AL

Pc3=VAL×IAL

VAL is L voltage of AL output.

IAL is the current of AL.

Power consumption by IC greatly changes with use condition of IC such as power supply voltage and output current.

Consider thermal design so that the maximum power dissipation on IC package is not exceeded.

Fig.15 Calculation of power consumed by IC

IAL

Vcc

Icc AL

OUT1

OUT2

PWM input

Prohibited

Vcc

Motor

Driver

GND

Controller

Protection

resistor R1 Connector

of board

FG/AL

Pull-up

resistor

Vcc

Datasheet

8/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

●

●●

●Thermal derating curve

Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is

heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The

temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable

power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)

and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to

the maximum value in the storage temperature range.

Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which

indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θ

ja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.16 shows the model of

heat resistance of the package.

Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the

equation below:

θja ＝ (Tj - Ta) / P [℃/W]

Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can

be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance

θja.

Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,

wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at

a specified condition. Fig.17 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70

[mm] x 1.6 [mm] (copper foil area below 3 [%]))

*Reduce by 6.5 mW/℃ over 25℃.

(On 70.0mm×70.0mm×1.6mm glass epoxy board)

Fig.17 Thermal derating curve

θja = (Tj - Ta) / P [℃/W]

Fig.16 Thermal resistance

Ambi

ent temperature Ta[℃]

Chip surface temperature Tj[℃]

Power consumption P[W]

400

600

800

1000

Pd(mW

)

0 25

100

125

150

Ta(℃)

200

812.5

Datasheet

9/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

●

●●

●Cautions on use

1) Absolute maximum ratings

Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum ratings. Because the

cause of this damage cannot be identified as a short circuit or an open circuit, if any over rated values will expect to exceed the

absolute maximum ratings, consider adding circuit protection devices, such as fuses..

2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power

supply lines. An external direction diode can be added.

3) Power supply line

Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing

a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor

characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,

capacitance characteristic values are reduced at low temperatures)

4) GND potential

It is possible that the motor output terminal may deflect below GND terminal because of influence by back

electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,

except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor

coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including

transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of

individual motor. Please make fully confirmation that no problem is found on operation of IC.

5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating

conditions.

6) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

7) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.

9) Thermal shut down circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a

hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an

open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the

IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment

where the operation of this circuit is assumed.

10) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to

stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before

connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps

as an antistatic measure. Use similar precaution when transporting or storing the IC.

11) GND wiring pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to

change the GND wiring pattern of any external components, either.

12) Capacitor between output and GND

When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is

possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor

between output and GND below 100uF.

13) IC terminal input

When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below

GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic

element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not

use in a manner where parasitic element is actuated.

14) In use

We are sure that the example of application circuit is preferable, but please check the character further more in

application to a part which requires high precision. In using the unit with external circuit constant changed, consider

the variation of externally equipped parts and our IC including not only static character but also transient character

and allow sufficient margin in determining

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a

reference to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority

Datasheet

10/10

BA6424AFS

www.rohm.com

TSZ22111・15・001

19.Jul.2012 Rev.001

TSZ02201-0H1H0B100240-1-

●

●●

●Physical Dimension

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

( )

Direction of feed

Reel 1pin

(Unit : mm)

SSOP-A16

0.8

0.11

4 53

0.3MIN

1216 14

6.6±0.2

0.15±0.1

0.36±0.1

1.5±0.1 6.2±0.3

4.4±0.2

(MAX 6.95 include BURR)

0.1

6 4 2 4

6 4 2 46 4 2 4

6 4 2 4 A F S

A F SA F S

A F S

1PIN MARK

Lot No.

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.