40 9 8 7 6 5 4 3 | 2 | 6/687 11.70 Sy 7.30 Lx 0,65 0.05 Co a g ee x i ~~ 1955 Gy; 254 TYP(4) 7.62 L |_ | q 4,80 +0.05 | =} 506] + 55] + Vy | | 200REF { -r aaan VISIBLE AREA | qT rT . __ TF tl. . } Lt] Li] 254 oH 4 H. 2.05 00.05 be 10,15 20.05 bo 1.45 T 475 bh 4.46{ See Detailt MATERIAL: 1.60 7 HOUSING: HIGH TEMPERATURE PLASTIC, GLASS FILLED,UL94V-0 : TERMINAL:COPPER ALLOY 2,PLATING: SIM CARD CONTACT AREA PLATING: 30u MIN GOLD OVER 50uMIN NICKEL PLATING PCB SOLDERING AREA PLATING:120u MIN TIN-LEAD OVER 50uMIN NICKEL PLATING : 710.10} VISIBLE AREA PLATING: GOLD FLASH OVER 50u MIN NICKEL PLATING Detail1 0,05 10.05 3.PACKAGING:TAPE REEL 4,PRODUCT SPECIFICATION:PS-67687-001 5 5 GENERAL TOLERANCES] SCALE | DESIGN UNITS THIRD ANGLE S 3) Jouauty UNLESS SPECIFIED) 51] METRIC |C) projection | REVISE ON CAD ONLY m | SYMBOLS mm INCH DIMENSION STYLE TITLE oO Co Se Sz Z PLACES|t#---_|+--- MM ONLY SIM CARD CONNECTOR mh E 3 PLACES|--- [--7 DRAWN BY DATE SALES DRAWING S olt|W-o Frracesizaz ===> JSSUN 2002/07/30 Ss gly NS i T PLACE 140.25 |+-- [CHECKED BY DATE aN OR Fly ANGULARE 3 (-ZHAO =. 2002/07/30] Wolsx MOLEX INCORPORATED A Ss og \/- Q DRART WHERE APPLICABLE OVED BY DATE MATERIAL NO. DOCUMENT NO. SHEET NO. eee R HER SAMHUANG 2002/07/30] 676872001 SD-67687-201 | 14 oF 1 wow => W TN D ENGIONS THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX B A a ITHI | | INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION rev. B 000/06/12 9 8 ? | 6 | 5 4 3 | 2 | 1