9352 127 40118 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1995 Feb 02

File under Integrated Circuits, IC02

1996 Mar 26

INTEGRATED CIRCUITS

TDA8012M

Low power PLL FM demodulator

for satellite TV receivers

1996 Mar 26 2

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

FEATURES

•High input sensitivity

•Fully balanced two-pin Voltage Controlled Oscillator

(VCO)

•Low input impedance (50 Ω)

•Low impedance video baseband output

•Internal voltage stabilizer

•Keyed AFC or peak-to-peak AFC

•Carrier detector

•AGC output

•Suitable for High Definition TV (HDTV).

APPLICATIONS

•Direct Broadcast Satellite (DBS) receivers.

GENERAL DESCRIPTION

The TDA8012M is a sensitive PLL FM demodulator which

is used for the second IF in satellite receivers. It provides

Automatic Gain Control (AGC) and Automatic Frequency

Control (AFC) outputs that can be used to optimize the

level and frequency of the input signal. During the

searching procedure, the AFC output provides a signal

which is used for carrier detection.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

VCC supply voltage 4.5 5.0 5.5 V

ICC supply current VCC =5V; T

amb =25°C506070mA

iinput signal voltage level 53 57 61 dBµV

Vo(p-p) video output signal voltage

amplitude (peak-to-peak value) ∆fo= 25 MHz (p-p) −1−V

fioperating input frequency −480 −MHz

TYPE

NUMBER PACKAGES

NAME DESCRIPTION VERSION

TDA8012M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

1996 Mar 26 3

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MBE251

STABILIZER

VCO

VIDEO BUFFER

TDA8012M

CDF1

CDF2

PD(pos)

PD(neg)

IFI1

IFI2

GND

AGCO

AGC

VIDEO

LF1

LF2

OSCGND

VCO1

VCO2

KEY

AFCCDO

AFCos

CARRIER

DETECTOR

AFC

AGC

1996 Mar 26 4

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

PINNING

SYMBOL PIN DESCRIPTION

CDF1 1 carrier detector ﬁlter 1 input

CDF2 2 carrier detector ﬁlter 2 input

PD(pos) 3 positive peak detector output

PD(neg) 4 negative peak detector output

IFI1 5 IF input 1

IFI2 6 IF input 2

GND 7 ground

VCC 8 supply voltage

AGCO 9 AGC output

AGCth 10 AGC threshold voltage input

VIDEO 11 baseband signal output

LF1 12 loop ﬁlter 1 input

LF2 13 loop ﬁlter 2 input

OSCGND 14 oscillator ground

VCO1 15 oscillator tank circuit 1 input

VCO2 16 oscillator tank circuit 2 input

NF 17 noise ﬁlter input

KEY 18 key pulse input

AFCCDO 19 AFC and carrier detector output

AFCos 20 AFC offset input Fig.2 Pin configuration.

book, halfpage

TDA8012M

MBE250

CDF1

CDF2

PD(pos)

PD(neg)

IFI1

IFI2

GND

AGCO

AGC

th VIDEO

LF1

LF2

OSCGND

VCO1

VCO2

KEY

AFC

CDO

FUNCTIONAL DESCRIPTION

The TDA8012M is a low power PLL FM demodulator

designed for use in satellite TV reception systems.

The demodulator is based on a Phase-Locked Loop (PLL)

structure including a fully balanced two-pin VCO. A high

gain IF amplifier ensures a high input sensitivity. The video

output voltage is supplied via a highly linear video buffer

which has a low output impedance. The centre frequency

of the VCO and the loop characteristics can be set using

external components.

The circuit provides an AGC signal which is used to drive

a gain-controlled IF amplifier (TDA8011T or TDA8010M)

to ensure a stable PLL demodulation characteristic.

An analog AFC voltage is also made available. This signal

can be suitably applied to the input of the ADC port of the

PLL frequency synthesizer (TSA5055). The AFC function

may be keyed to address D2MAC and MUSE systems.

The TDA8012M includes a Carrier Detector (CD) which is

used for channel detection during search procedures.

1996 Mar 26 5

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe it is

desirable to take normal precautions appropriate to handling MOS devices.

THERMAL CHARACTERISTICS

CHARACTERISTICS

VCC =5V; f

i= 480 MHz; Vi=57dBµV; Tamb =25°C; measured in application circuit of Fig.4;

unless otherwise speciﬁed.

SYMBOL PARAMETER MIN. MAX. UNIT

VCC supply voltage −0.3 6.0 V

Vi(max) maximum input voltage on all pins −0.3 VCC V

Isource(max) maximum output source current −10 mA

tsc maximum short-circuit time on all outputs −10 s

ZLAC load impedance at video output 600 −Ω

stg storage temperature −55 +150 °C

Tjjunction temperature −+150 °C

Tamb operating ambient temperature −10 +80 °C

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air 120 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

VCC supply voltage 4.75 5.0 5.25 V

ICC supply current note 1 50 60 70 mA

Voltage controlled oscillator

KVCO voltage controlled oscillator constant VCC = 4.75 to 5.25 V;

Tamb =−10 το +80 °C22.5 25 27.5 MHz/V

δfo/δT voltage controlled oscillator drift note 2 −−70 ×10−6−°C

−1

∆f

ovoltage controlled oscillator shift VCC = 4.75 to 5.25 V −− ±750 kHz

Frequency demodulator

Viinput signal voltage level note 3 53 57 61 dBµV

Ziinput impedance real part; note 4 −50 −Ω

parallel inductive part;

note 4 −130 −nH

KPD phase detector constant Vi=57dBµV−0.37 −V/rad

Gvphase-lock loop gain drift; note 5 −2−dB

shift; note 5 −2−dB

1996 Mar 26 6

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

Zo(diff) differential output impedance of the

phase detector 1.6 2 2.4 kΩ

CRPLL phase-lock loop capture range note 6 −±17 −MHz

Gdiff differential gain note 7 −±2−%

diff differential phase note 7 −±2−deg

IM3 third-order intermodulation distortion note 8 50 −−dB

Video output

Vo(p-p) baseband output signal amplitude

(peak-to-peak value) ∆fo= 25 MHz 0.9 1.0 1.1 V

VO(DC) DC voltage level of video output 2.1 2.35 2.6 V

Zooutput impedance −10 50 Ω

Automatic gain control (note 9)

AGCth AGC threshold as a function of the

voltage applied to pin 10 IAGC = 0.5 mA; 0.1VCC −− 53 dBµV

IAGC = 0.5 mA; 0.9VCC 61 −−dBµV

LD level detector shift;

VCC = 4.75 to 5.25 V −1−dB

drift;

Tamb =−10 to +80 °C−1−dB

AGC steepness IAGC = 0.5 mA; note 10 −8−mA/dB

Vsat(AGC) low level AGC output saturation

voltage IAGC =1mA −200 500 mV

Keying pulse

tkey input keyed pulse time period −64 −µs

W(key) keyed pulse width 8 −−µs

IL LOW level input keyed pulse voltage key on −− 0.8 V

VIH HIGH level input keyed pulse voltage key off 2.7 −−V

iinput impedance 1 −−kΩ

AFC and carrier detector output (note 11)

δVAFC/δfAFC steepness 4.9 5.5 6.1 V/MHz

AFCshift shift of AFC voltage in relation to

VCO shift with unmodulated

480 MHz input signal

∆VCC =±5% −±180 ±500 kHz

AFCdrift drift of AFC voltage in relation to the

VCO Tamb =80°C; note 12 −−400 −kHz

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Mar 26 7

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

Notes

1. The DC supply current is defined for VCC =5V.

2. This typical value of −70 ppm/°C or −70 ×10−6°C−1 can be found in the reference measuring set-up shown in Fig.3.

The temperature drift may be adjusted by the temperature coefficient of the external capacitor in the tank circuit.

3. The circuit is designed for an input level of 57 dBµV. The maximum allowable input level is 61 dBµV. However, for

levels other than 57 dBµV the optimum loop filter values will be different from those given for the 57 dBµV input level

in the reference measuring set-up.

4. The input impedance is reduced to a resistor with a parallel reactance. The values are given at 480 MHz. In order to

reduce the radiation from the oscillator to the RF input, it is recommended to use a symmetrical drive.

5. The PLL loop gain shift and drift are given without loop filter shift and drift (non-temperature compensated external

components).

6. The capture range or lock-in range is defined as the PLL normal operating range. This value depends strongly on

the loop filter characteristics.

7. Measurements with test signals in accordance with CCIR recommendation 473-3. FM modulated signal with

DBS parameters:

a) 625 lines PAL TV system

b) 25 MHz/V modulator sensitivity

c) 1 V (p-p) video signal

d) No SAW filter is used.

8. No SAW filter is used at the input:

a) 16 MHz/V modulator sensitivity

b) 4.43 MHz sine wave colour signal [660 mV (p-p)]

c) 3.25 MHz sine wave luminance signal [700 mV (p-p)]

d) Two Wegner sound sub-carriers at 7.02 and 7.2 MHz (100 mV)

e) Intermodulation distance is defined as the distance between the luminance signal and the intermodulation

products.

9. The characteristics of the AGC function are measured in the application circuit of Fig.4. The circuit illustrated in Fig.4

has been designed to set the maximum AGC current of 1 mA. The output of the AGC function is capable of handling

up to 5 mA. The maximum AGC current can be increased to 5 mA by decreasing the value of the resistor connected

between pins 8 and 9.

10. In the application circuit (see Fig.4) the voltage at the AGC output decreases when the IF input level increases above

the adjusted AGC threshold.

11. The outputs from the AFC and carrier detector are combined at pin 19 (see Fig.3). During search tuning, when the

input frequency is outside the capture range, the combined output (carrier detector function) is at a LOW level

(any voltage below 0.6VCC). When the PLL becomes locked, the voltage at pin 19 rises to a HIGH level

(V19 = 0.8VCC to VCC). When the input channel is close to the centre frequency, V19 falls to the LOW level. As shown

in Fig.3, the voltage at pin 19 is now a function of the centre frequency (AFC function). This information may be read

by a microcontroller via the ADC of the satellite frequency synthesizer (TSA5055) and the I2C-bus.

12. The drift of the AFC voltage is measured in accordance with the following method:

a) At room temperature (Tamb =25°C) the TDA8012M is driven by a 480 MHz unmodulated signal. The voltage at

pin 20 must be adjusted to obtain a 1.5 V output at the AFC output (pin 19).

b) At Tamb =80°C, due to its temperature drift, the AFC output voltage differs from 1.5 V. The input frequency must,

therefore, be adjusted to obtain 1.5 V at the AFC output. The drift of the AFC voltage will then be equal to the

difference between the new input frequency and 480 MHz.

1996 Mar 26 8

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

Fig.3 AFC and carrier detector output.

MBE253

0.15

0.3

0.45

0.6

0.8

AFC DATA

frequency

V19/VCC

carrier detect on

500 kHz

1996 Mar 26 9

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

APPLICATION INFORMATION

Fig.4 Application circuit.

book, full pagewidth

MBE252

STABILIZER

VCO

VIDEO BUFFER

TDA8012M

AGCO VIDEO

KEY

AFCCDO

CARRIER

DETECTOR

AFC

AGC

82 kΩ

2.7 MΩ

22 µF

1 µF

10 MΩ

330 nF

10 MΩ

330 nF

IF input

10 nF

4.7

kΩ

kΩ1.3

kΩ

10 pF

1.2 pF30 nH

180 pF

kΩ1 µF

2.2 kΩ

36 kΩ

13 kΩ

1996 Mar 26 10

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

PACKAGE OUTLINE

UNIT A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.15

01.4

1.2 0.32

0.20 0.20

0.13 6.6

6.4 4.5

4.3 0.65 1.0 0.2

6.6

6.2 0.65

0.45 0.48

0.18 10

0.13 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

0.75

0.45

SOT266-1 90-04-05

95-02-25

detail X

vMA

(A )

0.25

110

20 11

pin 1 index

0 2.5 5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

max.

1.5

1996 Mar 26 11

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Reﬂow soldering

Reflow soldering techniques are suitable for all SSOP

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

Wave soldering

Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following

conditions must be observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

•The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate

solder thieves at the downstream end.

Even with these conditions, only consider wave

soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or

SSOP20 (SOT266-1).

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1996 Mar 26 12

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1996 Mar 26 13

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

NOTES

1996 Mar 26 14

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

NOTES

1996 Mar 26 15

Philips Semiconductors Product speciﬁcation

Low power PLL FM demodulator

for satellite TV receivers TDA8012M

NOTES

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All rights are reserved. Reproduction in whole or in part is prohibited without the

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other industrial or intellectual property rights.

Printed in The Netherlands

537021/1100/02/pp16 Date of release: 1996 Mar 26

Document order number: 9397 750 00766