MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
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Professional Thin Film Chip Resistors
MCS 0402, MCT 0603, MCU 0805, and MCA 1206
professional thin film flat chip resistors are the perfect
choice for most fields of modern professional electronics
where reliability and stability are of major concern. Typical
applications include telecommunication, medical
equipment, high-end computer and audio / video
electronics.
FEATURES
Approved to EN 140401-801
Excellent overall stability: class 0.5
Professional tolerance of resistance: ± 0.5 %
and ± 1 %
Rated dissipation P70 up to 0.4 W for size 1206
Sulfur resistance verified according to ASTM B 809
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
Automotive
Telecommunication
Medical equipment
Industrial equipment
Note
(1) Please refer to APPLICATION INFORMATION below.
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TECHNICAL SPECIFICATIONS
DESCRIPTION MCS 0402 MCT 0603 MCU 0805 MCA 1206
Imperial size 0402 0603 0805 1206
Metric size code RR1005M RR1608M RR2012M RR3216M
Resistance range 10 to 4.99 M; 0 1 to 10 M; 0 1 to 10 M; 0 1 to 2 M; 0
Resistance tolerance ± 1 %; ± 0.5 %
Temperature coefficient ± 50 ppm/K; ± 25 ppm/K
Rated dissipation, P70 (1) 0.100 W 0.125 W 0.200 W 0.400 W
Operating voltage, Umax. ACRMS/DC 50 V 75 V 150 V 200 V
Permissible film temperature,
F max. (1) 155 °C
Operating temperature range -55 °C to 155 °C
Permissible voltage against ambient
(insulation):
1 min; Uins 75 V 100 V 200 V 300 V
Failure rate: FITobserved 0.1 x 10-9/h
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Note
The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to
different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the
circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please
consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for
information on the general nature of thermal resistance.
Note
Resistance ranges printed in bold are preferred TCR / tolerance combinations with optimized availability.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE STANDARD POWER
Rated dissipation, P70
MCS 0402 0.063 W 0.100 W
MCT 0603 0.100 W 0.125 W
MCU 0805 0.125 W 0.200 W
MCA 1206 0.250 W 0.400 W
Operating temperature range -55 °C to 125 °C -55 °C to 155 °C
Permissible film temperature,
F max. 125 °C 155 °C
Max. resistance change at P70 for resistance range,
|R/R| after:
MCS 0402 10 to 4.99 M10 to 4.99 M
MCT 0603 1 to 10 M1 to 10 M
MCU 0805 1 to 10 M1 to 10 M
MCA 1206 1 to 2 M1 to 2 M
1000 h 0.25 % 0.5 %
8000 h 0.5 % 1.0 %
225 000 h 1.5 % -
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES
MCS 0402
± 50 ppm/K ± 1 % 10 to 4.99 ME24; E96
± 0.5 % 10 to 221 kE24; E192
± 25 ppm/K ± 0.5 % 10 to 221 kE24; E192
Jumper, Imax. = 0.63 A 20 m0 -
MCT 0603
± 50 ppm/K ± 1 % 1 to 10 ME24; E96
± 0.5 % 10 to 511 kE24; E192
± 25 ppm/K ± 0.5 % 10 to 511 kE24; E192
Jumper, Imax. = 1 A 20 m0 -
MCU 0805
± 50 ppm/K ± 1 % 1 to 10 ME24; E96
± 0.5 % 10 to 1.5 ME24; E192
± 25 ppm/K ± 0.5 % 10 to 1.5 ME24; E192
Jumper, Imax. = 1.5 A 20 m0 -
MCA 1206
± 50 ppm/K ± 1 % 1 to 2 ME24; E96
± 0.5 % 10 to 2 ME24; E192
± 25 ppm/K ± 0.5 % 10 to 2 ME24; E192
Jumper, Imax. = 2 A 20 m0 -
PACKAGING
TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH PACKAGING
DIMENSIONS
MCS 0402 E5 5000
Paper tape acc.
IEC 60286-3, Type 1a 8 mm
2 mm Ø 180 mm/7"
E0 10 000
MCT 0603 P5 5000
4 mm
Ø 180 mm/7"
PW 20 000 Ø 330 mm/13"
MCU 0805 P5 5000 Ø 180 mm/7"
PW 20 000 Ø 330 mm/13"
MCA 1206 P5 5000 Ø 180 mm/7"
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Note
Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION.
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: MCT06030D4641DPW00
Part Number: MCT06030Z0000ZP500
TYPE / SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING
MCS0402
MCT0603
MCU0805
MCA1206
0 = neutral D = ± 25 ppm/K
C = ± 50 ppm/K
Z = jumper
3 digit value
1 digit
multiplier
Multiplier
8 = *10-2
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
4 = *104
5 = *105
0000 = jumper
D = ± 0.5 %
F = ± 1 %
Z = jumper
E5
E0
P5
PW
Product Description: MCT 0603-25 0.5 % PW 4K64
Product Description: MCT 0603 P5 0R0
MCT 0603 -25 0.5 % PW 4K64
TYPE SIZE TCR TOLERANCE PACKAGING RESISTANCE
MCS
MCT
MCU
MCA
0402
0603
0805
1206
± 25 ppm/K
± 50 ppm/K
± 0.5 %
± 1 %
E5
E0
P5
PW
4K64 = 4.64 k
50R1 = 50.1
0R0 = jumper
CT06030D4M41DPW006
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic substrate (Al2O3) and conditioned to achieve
the desired temperature coefficient. Specially designed
inner contacts are deposited on both sides. A special laser
is used to achieve the target value by smoothly cutting a
meander groove in the resistive layer without damaging the
ceramics. For the high and low ohmic range, optimized
Cermet products provide comparable properties. The
resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with
potential risk of early field failures (feasible for R 10 ).
Only accepted products are laid directly into the paper tape
in accordance with IEC 60286-3 Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, potting compounds and
their processes, if applied, shall be qualified by appropriate
means to ensure the long-term stability of the whole system.
The resistors are RoHS-compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
The Global Automotive Declarable Substance List
(GADSL) (3)
The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series. The detail
specification refers to the climatic category 55/125/56,
which relates to the “standard operation mode” of this
datasheet.
Conformity is attested by the use of the CECC logo ( ) as
the mark of conformity on the package label.
Vishay Beyschlag has achieved “Approval of
Manufacturer” in accordance with IECQ 03-1. The release
certificate for “Technology Approval Schedule” in
accordance with CECC 240001 based on IECQ 03-3-1 is
granted for the Vishay BEYSCHLAG manufacturing
process.
RELATED PRODUCTS
For more information about products with better TCR and
tighter tolerance please refer to the Precision Thin Film Chip
Resistors datasheet (www.vishay.com/doc?28700).
Resistors are available with established reliability in
accordance with EN 140401-801 version E. Please refer to
the special datasheet (www.vishay.com/doc?28744) for
information on failure rate level, available resistance ranges
and order codes.
Precision chip resistor arrays may be used in voltage divider
applications or precision amplifiers where close matching
between multiple resistors is necessary. ACAS 0612 chip
arrays are specified by the following datasheets:
Professional type (www.vishay.com/doc?28754)
Precision type (www.vishay.com/doc?28751)
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org.
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table.
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FUNCTIONAL PERFORMANCE
MCS 0402
MCT 0603
MCU 0805
MCA 1206
0.1
0.2
W
Power Dissipation
°C
100 150-50 50 70
ϑ
Ambient Temperature
amb
0
P
0.3
0
Derating - Standard Operation
0.1
0.2
0.3
0.4
0.5
W
Power Dissipation
P
°C
100 150-50 50 70
ϑ
Ambient Temperature
amb
MCS 0402
MCT 0603
MCU 0805
MCA 1206
0
Derating - Power Operation
1
W
100
10
100 µs 1 ms 10 ms 1 s 10 s10 µs 100 ms
Pulse Duration
i
0.1
MCS 0402
MCT 0603
MCU 0805
MCA 1206
t
Pulse Load max.
P
^
Single Pulse
Maximum pulse load, single pulse; applicable if 0 and n 1000 and Û Ûmax.;
for permissible resistance change equivalent to 8000 h operation in standard operation mode
P
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1
W
10
100
100 µs 1 ms 10 ms 1 s 10 s
10 µs 100 ms
Pulse Duration
0.1
i
MCS 0402
MCT 0603
MCU 0805
MCA 1206
t
Continuous Pulse Load
max.
P
^
Continuous Pulse
Maximum pulse load, continuous pulses; applicable if P (
amb) and Û Ûmax.;
for permissible resistance change equivalent to 8000 h operation in standard operation mode
P
1 kV
100 µs 1 ms 10 ms 1 s 10 s
10 µs 100 ms
100 V
10 V
Pulse Duration
i
t
MCS 0402
MCT 0603
MCU 0805
MCA 1206
Pulse Voltage
max.
Û
Pulse Voltage
Maximum pulse voltage, single and continuous pulses; applicable if max.;
for permissible resistance change equivalent to 8000 h operation in standard operation mode
P
ˆ
P
ˆ
100 V
1 kV
10 V
10 kV
Resistance Value
Test Voltage
100 Ω1 kΩ10 kΩ100 kΩ1 MΩ
10 Ω10 MΩ
MCS 0402
MCT 0603
MCU 0805
MCA 1206
R
1.2/50 Pulse
Pulse load rating in accordance with EN 60115-1 clause 4.27; 1.2 µs/50 µs; 5 pulses at 12 s interval;
for permissible resistance change ± (0.5 % R + 0.05 )
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100 V
1 kV
10 V
10 kV
Resistance Value R
Test Voltage
100
Ω
1 k
Ω
10 k
Ω
100 k
Ω
1 M
Ω
10
Ω
10 M
Ω
MCS 0402
MCT 0603
MCU 0805
MCA 1206
10/700 Pulse
Pulse load rating in accordance with EN 60115-1 clause 4.27; 10 µs/700 µs;
10 pulses at 1 min intervals; for permissible resistance change ± (0.5 % R + 0.05 )
1
µV/V
Current Noise Voltage Ratio
100
Ω
Resistance Value
R
10
0.1
0.01
1 k
Ω
10 k
Ω
100 k
Ω
1 M
Ω
MCS 0402
MCT 0603
MCU 0805
MCA 1206
Current Noise Voltage Ratio
In accordance with IEC 60195
RF-Behavior
Relative impedance for 49.9 chip resistor
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The components are approved under the IECQ-CECC
quality assessment system for electronic components.
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.5 STABILITY CLASS 1
Stability for product types:
MCS 0402 10 to 33.2 k> 33.2 kto 4.99 M
MCT 0603 10 to 100 k1 to < 10 ;
> 100 k to 10 M
MCU 0805 10 to 221 k1 to < 10 ;
> 221 k to 10 M
MCA 1206 10 to 332 k1 to < 10 ;
> 332 k to 2 M
4.5 - Resistance - ± 1 % R; ±0.5 % R
4.8 - Temperature
coefficient
At (20 / -55 / 20) °C and
(20 / 125 / 20) °C ± 50 ppm/K; ± 25 ppm/K
4.25.1 -
Endurance
at 70 °C:
standard
operation mode
U = or U = Umax.;
whichever is the less
severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.25 % R + 0.05 )
70 °C; 8000 h ±(0.5 % R + 0.05 )
Endurance
at 70 °C:
power
operation mode
U = or U = Umax.;
whichever is the less
severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.5 % R + 0.05 )
70 °C; 8000 h ±(1 % R + 0.05 )
4.25.3 -
Endurance at
upper category
temperature
125 °C; 1000 h ±(0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
155 °C; 1000 h ± (0.5 % R + 0.05 (1 % R + 0.05 )
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.5 % R + 0.05 (1 % R + 0.05 )
P70 x R
P70 x R
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4.23
Climatic
sequence:
standard
operation mode:
4.23.2 2 (Bb) dry heat 125 °C; 16 h
± (0.5 % R + 0.05 (1 % R + 0.05 )
4.23.3 30 (Db) damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Ab) cold -55 °C; 2 h
4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db) damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
5 cycles
4.23.7 - DC load U = Umax.;
1 min.
- 1 (Aa) Cold -55 °C; 2 h ± (0.1 % R + 0.01 ) ± (0.25 % R + 0.05 )
4.19 14 (Na) Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = -55 °C;
UCT = 125 °C;
5 cycles
± (0.1 % R + 0.01 )
no visible damage
LCT = -55 °C;
UCT = 125 °C;
1000 cycles
± (0.25 % R + 0.05 )
no visible damage
4.13 -
Short time
overload:
standard
operation mode
U = 2.5 x
or U = 2 x Umax.;
whichever is the less severe;
5 s
±(0.1 % R + 0.01 (0.25 % R + 0.05 )
Short time
overload:
power
operation mode
U = 2.5 x
or U = 2 x Umax.;
whichever is the less severe;
5 s
±(0.25 % R + 0.05 (0.5 % R + 0.05 )
4.27 -
Single pulse high
voltage overload:
standard
operation mode
Severity no. 4:
U = 10 x
or U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs/700 μs
± (0.5 % R + 0.05 )
no visible damage
4.39 -
Periodic electric
overload:
standard
operation mode
U =
or U = 2 x Umax.;
0.1 s on; 2.5 s off;
whichever is the less severe;
1000 cycles
± (0.5 % R + 0.05 )
no visible damage
Periodic electric
overload:
power
operation mode
U =
or U = 2 x Umax.;
0.1 s on; 2.5 s off;
whichever is the less severe;
1000 cycles
± (1 % R + 0.05 )
no visible damage
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.5 STABILITY CLASS 1
Stability for product types:
MCS 0402 10 to 33.2 k> 33.2 kto 4.99 M
MCT 0603 10 to 100 k1 to < 10 ;
> 100 k to 10 M
MCU 0805 10 to 221 k1 to < 10 ;
> 221 k to 10 M
MCA 1206 10 to 332 k1 to < 10 ;
> 332 k to 2 M
P70 x R
P70 x R
P70 x R
P70 x R
15 x P70 x R
15 x P70 x R
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Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
4.38 -
Electro static
discharge
(human body
model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402: 500 V
MCT 0603: 1000 V
MCU 0805: 1500 V
MCA 1206: 2000 V
±(0.5 % R + 0.05 )
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance; amplitude
1.5 mm or 200 m/s2;
7.5 h
± (0.1 % R + 0.01 )
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered);
no visible damage
4.18 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
±(0.1 % R + 0.01 )
no visible damage
±(0.25 % R + 0.05 )
no visible damage
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol +50 °C;
method 2 No visible damage
4.32 21 (Ue3)Shear
(adhesion)
MCS 0402 and MCT 0603:
9 N
No visible damage
MCU 0805 and MCA 1206:
45 N
4.33 21 (Ue1)Substrate
bending Depth 2 mm, 3 times ±(0.1 % R + 0.01 )
no visible damage, no open circuit in bent position
4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5 (1),
needle flame test; 10 s No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.5 STABILITY CLASS 1
Stability for product types:
MCS 0402 10 to 33.2 k> 33.2 kto 4.99 M
MCT 0603 10 to 100 k1 to < 10 ;
> 100 k to 10 M
MCU 0805 10 to 221 k1 to < 10 ;
> 221 k to 10 M
MCA 1206 10 to 332 k1 to < 10 ;
> 332 k to 2 M
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
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Revision: 16-Aug-16 11 Document Number: 28705
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351.
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
DIMENSIONS AND MASS
TYPE / SIZE H
(mm)
L
(mm)
W
(mm)
WT
(mm)
Tt
(mm)
Tb
(mm)
MASS
(mg)
MCS 0402 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1 / - 0.15 0.2 ± 0.1 0.6
MCT 0603 0.45 + 0.1 / - 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15 / - 0.2 0.3 + 0.15 / - 0.2 1.9
MCU 0805 0.45 + 0.1 / - 0.05 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1 / - 0.2 0.4 + 0.1 / - 0.2 4.6
MCA 1206 0.55 ± 0.1 3.2 + 0.1 / - 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 - - - - 0.35 0.55 0.55 1.45
MCT 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MCU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
MCA 1206 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80
Tb
Tt
L
H
W WT
GX
Y
Z
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
www.vishay.com Vishay Beyschlag
Revision: 16-Aug-16 12 Document Number: 28705
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
HISTORICAL 12NC INFORMATION
The resistors had a 12-digit numeric code starting with
2312.
The subsequent 4 digits indicated the resistor type,
specification and packaging; see the 12NC table.
The remaining 4 digits indicated the resistance value:
- The first 3 digits indicated the resistance value.
- The last digit indicated the resistance decade in
accordance with the last digit of 12NC indicating
resistance decade table.
Last Digit of 12NC Indicating Resistance Decade
Historical 12NC example
The 12NC of a MCT 0603 resistor, value 47 k and TCR 50
with ± 1 % tolerance, supplied in cardboard tape of
5000 units per reel was: 2312 215 14703.
RESISTANCE DECADE LAST DIGIT
1 to 9.99 8
10 to 99.9 9
100 to 999 1
1 k to 9.99 k2
10 k to 99.9 k3
100 k to 999 k4
1 M to 9.99 M5
10 M to 99.9 M6
HISTORICAL 12NC - Resistor type and packaging
DESCRIPTION
2312... .....
CARDBOARD TAPE ON REEL
TYPE TCR TOL. P5
(5000 UNITS)
E0
(10 000 UNITS)
PW
(20 000 UNITS)
MCS 0402
± 50 ppm/K
± 1 % - 275 1.... -
± 0.5 % - 275 5.... -
± 25 ppm/K ± 0.5 % - 276 5.... -
Jumper - - 275 90001 -
MCT 0603
± 50 ppm/K
± 1 % 215 1.... - 205 1..
± 0.5 % 215 5.... - 205 5....
± 25 ppm/K ± 0.5 % 216 5.... - 206 5....
Jumper - 215 90001 - 205 90001
MCU 0805
± 50 ppm/K ± 0.5 % 255 5.... - 245 5....
± 25 ppm/K ± 0.5 % 256 5.... - 246 5....
Jumper - 255 90001 - 245 90001
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Revision: 08-Feb-17 1Document Number: 91000
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