August 1984
Revised February 1999
MM74HC4060 14 Stage Binary Counter
© 1999 Fairchild Semicond uctor Corpor ation DS005354.prf www.fairchildsemi .com
MM74HC4060
14 Stage Binary Counter
General Descript ion
The MM74HC4060 is a high speed binary ripple carry
counter. These counters are implemented utilizing
advanced silicon-gate CMOS tec hnology to achieve speed
perform an ce similar to LS- TTL logic while retainin g the low
power and high noise immunity of CMOS.
The MM74HC4060 is a 14-stage counter, which device
increments on the falling edge (negative transition) of the
input clock, and all their outpu ts are reset to a low level by
applying a logical high on their reset input. The
MM74HC4060 also has two additional inputs to enable
easy connection of either an RC or crystal oscillator.
This device is pin equivalent to the CD4060. All inputs are
protected from damage due to static discharge by protec-
tion diodes to VCC and ground.
Features
Typical propagation delay: 16 ns
Wide operating voltage range: 2–6V
Low input current: 1 µA maximum
Low quiescent current: 80 µA maximum (74 Series)
Output drive capability: 10 LS-TTL loads
Ordering Code:
Devices also available in Tape and R eel. Specify by app ending the su ffix let t er “X” to the ordering code.
Connection Diagram
Pin Assignments f or DIP, SOIC, SOP and TSSOP
Top View
Order Number Package Number Package Description
MM74HC4060M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
MM74HC4060SJ M16D 16-Lead Small Outline Packa ge (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC4060MTC MTC16 16-Lead Th in Shrink Small Outline Package (TS SOP) , JEDEC MO-153, 4.4mm Wide
MM74HC4060N N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” W ide
www.fairchildsemi.com 2
MM74HC4060
Logic Diagra m
3 www.fairchildsemi.com
MM74HC4060
Absolute Maximum Ratings(Note 1)
(Note 2) Recommended Operating
Conditions
Note 1: Maximu m Rating s are thos e values beyond which dam age to the
device may occur.
Note 2: Unl es s ot herwise spec if ied all voltages are reference d t o ground.
Note 3: Power Dissipat ion temperature derating: plast ic “N ” package:
12 mW/°C from 65°C to 85°C.
DC Electrical Characteristics (Note 4)
Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occ ur for HC at 4.5V. Thus the 4.5V values sh ould be use d when
designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V. ) T he worst ca s e leakage cur-
rent (IIN, ICC, an d I OZ) occur for CM OS at the highe r voltage and so the 6. 0V values s hould be used .
Supply Voltage (VCC)0.5 to +7.0V
DC Input Voltage (VIN)1.5 to VCC +1.5V
DC Output Voltage (VOUT)0.5 to VCC +0.5V
Clamp Diode Current (ICD)±20 mA
DC Output Current, per pin (IOUT)±25 mA
DC VCC or GND Current, per pin (ICC)±50 mA
Storage Temperature Range (TSTG)65°C to +150°C
Power Dissipation (PD)
(Note 3) 600 mW
S.O. Package only 500 mW
Lead Temperature (TL)
(Soldering 10 seconds) 260°C
Min Max Units
Supply Voltage (VCC)26V
DC Input or Output Voltage
(VIN, VOUT)0V
CC V
Opera ting Te mp erature Range (TA)40 +85 °C
Input Rise or Fall Times
(tr, tf) VCC
= 2.0V 1000 ns
VCC = 4.5V 500 ns
VCC = 6.0V 400 ns
Symbol Parameter Conditions VCC TA = 25°CT
A = 40 to 85°CT
A = 55 to 125°CUnits
Typ Guaranteed Limits
VIH Minimum HIGH 2.0V 1.5 1.5 1.5 V
Level Voltage 4.5V 3.15 3.15 3.15 V
(Not Applicable to Pins 9 & 10) 6.0V 4.2 4.2 4.2 V
VIL Maximum LOW Level 2.0V 0.5 0.5 0.5 V
Input Voltage 4.5V 1.35 1.35 1.35 V
(Not Applicable to Pins 9 & 10) 6.0V 1.8 1.8 1.8 V
VOH Minimum HIGH Level VIN = VIH or VIL
Output Voltage |IOUT| 20 µA 2.0V 2.0 1.9 1.9 1.9 V
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
Except Pins VIN = VIH or VIL
9 & 10 |IOUT| 4.0 mA 4.5V 4.2 3.98 3.84 3.7 V
|IOUT| 5.2 mA 6.0V 5.7 5.48 5.34 5.2 V
Pins VIN = VIH or VIL 3.98 3.84 3.7 V
9 & 10 |IOUT| = 0.4 mA 5.48 5.34 5.2 V
|IOUT| = 0.52 mA
VOL Maximum LOW Level VIN = VIH or VIL
Output Voltage |IOUT| 20 µA 2.0V 0 0.1 0.1 0.1 V
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
Except Pins VIN = VIH or VIL
9 & 10 |IOUT| 4.0 mA 4.5V 0.2 0.26 0.33 0.4 V
|IOUT| 5.2 mA 6.0V 0.2 0.26 0.33 0.4 V
Pins VIN = VIH or VIL 0.26 0.33 0.4 V
9 & 10 |IOUT| = 0.4 mA 0.26 0.33 0.4 V
|IOUT| = 0.52 mA
IIN Maximum Input Current VIN = VCC or GND 6.0V ±0.1 ±1.0 ±1.0 µA
ICC Maximum Quiescent VIN = VCCor GND
Supply Current IOUT = 0 µA6.0V 8.080 160µA
www.fairchildsemi.com 4
MM74HC4060
AC Electrical Characteristics
VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns
AC Electrical Characteristics
VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
Note 5: Typical Propaga tio n delay time to any output c an be calculated using: tP=17+12(N–1) ns; where N is the number of the output, QW, at VCC = 5V.
Note 6: CPD determines the no load dynamic power consumption, PD = C
PD V
CC2 f+ICC V
CC, and the no load dynamic current consumption,
IS=CPD VCC f+ICC.
Symbol Parameter Conditions Typ Guaranteed Units
Limit
fMAX Maximum Clock Frequency 30 MHz
tPHL, tPLH Maximum Propagation (Note 5) 40 20 ns
Delay to Q4
tPHL, tPLH Maximum Propagation 16 40 ns
Delay to any Q
tREM Minimum Reset 10 20 ns
Removal Time
tWMinimum Pulse Width 10 16 ns
Symbol Parameter Conditions VCC TA = 25°CT
A = 40 to 85°CT
A = 55 to 125°CUnits
Typ Guar ant eed Lim its
fMAX Max imum Ope rating 2.0V 6 5 4 MHz
Frequency 4.5V 30 24 20 MHz
6.0V 35 28 24 MHz
tPHL, tPLH Maximum Propagation 2.0V 120 380 475 171 ns
Delay Clock to Q44.5V 42 76 95 114 ns
6.0V 35 65 81 97 ns
tPHL Maximum Propagation 2.0V 72 240 302 358 ns
Delay Reset to any Q 4.5V 24 48 60 72 ns
6.0V 20 41 51 61 ns
tPHL, tPLH Maximum Propagation 2.0V 125 156 188 ns
Delay Between Stages 4.5V 25 31 38 ns
Qn to Qn+16.0V 21 26 31 ns
tREM Minimum Reset 2.0V 100 125 150 ns
Removal Time 4.5V 20 25 30 ns
6.0V 17 21 25 ns
tWMinimum Pulse Width 2.0V 80 100 120 ns
4.5V 16 20 24 ns
6.0V 14 17 20 ns
tr, tfMaximum Input Rise and 2.0V 1000 1000 1000 ns
Fall Time 4.5V 500 500 500 ns
6.0V 400 400 400 ns
tTHL, tTLH Maximum Output Rise 2.0V 30 75 95 110 ns
and Fall Time 4.5V 10 15 19 22 ns
6.0V 9 13 16 19 ns
CPD Power Dissipation (per package) 55 pF
Capacitance (Note 6)
CIN Maximum Input 5 10 10 10 pF
Capacitance
5 www.fairchildsemi.com
MM74HC4060
Timing Diagram
www.fairchildsemi.com 6
MM74HC4060
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
Package Number M16A
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M16D
7 www.fairchildsemi.com
MM74HC4060
Physical Dimensions in ches (millimeters) unless otherwise noted (Continu ed)
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC16
F airchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and F airchild reserves the right at any tim e without notice to change said circuitry and specifications.
MM74HC4060 14 Stage Binary Counter
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or system s ar e devices or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A criti cal comp onent in any comp onent of a l ife suppor t
device or system whose failure to perform can be rea-
sonably expected to cau se the failure of the li fe support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Packag e Num be r N16E