SCALE™-2 2SC0108T2A0-17
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2SC0108T2A0-17 Preliminary Data Sheet
Dual Channel Ultra-compact Low-cost SCALE™-2 Driver Core
Short De scription
The low-cost SCALE™-2 dual-driver core 2SC0108T2A0-17 combines unrivalled compactness with broad
applicability. The driver is designed for universal applications requiring high reliability. The 2SC0108T2A0-17
drives all usual IGBT modules up to 600A/1200V or 450A/1700V. The embedded paralleling capability allows
easy inverter design covering higher power ratings. Multi-level t opologies are also supported.
The 2SC0108T2A0-17 is the most compact driver core available for industrial applications, with a footprint of
only 45 x 34.3mm and an insertion height of max. 16mm. It allows even the most restricted insertion spaces
to be e fficient ly used . Com pare d with co nventi onal dri vers , the hig hly int egra ted SCA LE-2 chipset allow s about
85% of components to be dispensed with. This advantage is impressively reflected in increased reliability at
simultaneously minimized cost.
The 2SC0108T2A0-17 combines a complete two-channel driver core with all components required for driving,
such as a n isolat ed DC/ DC con verte r, short -circuit prot ection as well as supply voltage monitoring. Each of th e
two output channels is electrically isolate d from the primary side and the other secondar y channel.
An output current of 8A and 1W drive power is available per channel, making the 2SC0108T2A0-17 an ideal
driver platform for universa l usa g e in small and medium power applications. The driver provides a gate voltage
swing of +1 5V/–8V. The turn-o n voltage is regulate d to maintain a sta ble 15V rega rdless of the output pow er
level.
Its outstanding EMC allows safe and re liable operation in even hard industrial applications.
Product Highlights Applications
General purpose drives
Uninterruptible power supplies (UPS)
Solar and wind power converters
Auxiliary converters for traction
Electro/hybrid drive vehicles
Driving parallel-connected IGBTs
Switched mode power supplies (SMPS)
Medical (MRT, CT, X-Ray)
Laser technology
Ultra-compa c t dual cha nnel d river
Highly integrated SCALE-2 chipset
Gate current ±8A , 1W output power per channel
+15V/-8V gate driving
Blocking voltages up to 1700V
Safe isolation to EN 5 0178
Short del ay and low jitter
Inter face for 3.3V...15V logic level
UL recognition E32 17 57 for UL5 08 C (NM MS 2/ 8)
UL recognition E34 64 91 for UL6 09 50 -1 (NWGQ2/8)
SCALE™-2 2SC0108T2A0-17
Prelim i nary Dat a Shee t
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Safety Notice!
The data contained in this data sheet is intended exclusively for technically trained staff. Handling all high-
voltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory!
Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive
devices according to inte rn ational sta ndard IE C 60747-1, Chapter IX or European standard EN 1000 15 (i. e. the
workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged .
Important Product Docume ntation
This data sheet contains o nly product-speci fic dat a. For a detailed description, must-read application notes and
important informa tion that apply to this produ ct, please refer to “2SC0108T Descr iption & Application Ma nual”
on www.power.com/igbt-driver/go/2SC0108T
Absolut e Maxi mum Rat i ng s
Parameter Remarks Min Max Unit
Supply voltage VCC
VCC to GND 0 16 V
Logic inp ut and o utput volta ges Primary side , t o GND -0.5 VCC+0.5 V
SOx current Failure condition, total current 20 mA
Gate peak current Iout Note 1 -8 +8 A
External gate resistance Turn-on and turn-off 2 Ω
IGBT gate charge 6.3 µC
Average supply current ICC Notes 2, 3 260 mA
Output power Ambient temperature <70°C (Notes 4, 5) 1.2 W
Ambient temperature <85°C (Note 4) 1 W
Test voltage (50Hz/1min.) Primary to secondary (Note 14) 5000 VAC(eff)
Secondary to seco ndary (Note 14) 4000 VAC(eff)
Switching frequency f 50 kHz
|dV/dt| Rate of change of input to output voltage (Note 10) 75 kV/μs
Operating voltage Primary/s econdary, secondary/secondary 1700 Vpeak
Operating temperature Notes 5, 18 -20 +85 °C
Storage temperature -40 +90 °C
Recommended Operating Conditions
Power Supply Remarks Min Typ Max Unit
Supply voltage
VCC
VCC to GND 14.5 15 15.5 V
SCALE™-2 2SC0108T2A0-17
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Electrical Characteristics
All data refer to +25°C and VCC = 15V unless otherwise specified.
Power supply Remarks Min Typ Max Unit
Supply current ICC Without load 31 mA
Coupling capacitance Cio Primary side to secondary side, per channel 19 pF
Power Supply Monitoring Remarks Min Typ Max Unit
Supply thres ho ld VCC Primary side, clear fault 11.9 12.6 13.3 V
Primary side, set fault (Note 11) 11.3 12.0 12.7 V
Monitoring hysteresis Primary side, set/clear fault 0.35 V
Supply thres ho ld VISOx-VEx Secon d ary side, clear fault 12.1 12.6 13.1 V
Secondary side, set fault (Note 12) 11.5 12.0 12.5 V
Monitoring hysteresis Secon dary side, se t/clear fault 0.35 V
Supply thres ho ld VEx-VCOMx Secondary side, clear fault 5 5.15 5.3 V
Secon dary side, s e t fault (Note 12) 4.7 4.85 5 V
Monitoring hysteresis Secon dary side, se t/clear fault 0.15 V
Logic Inputs and Outputs Remarks Min Typ Max Unit
Input bias current V(INx) > 3V 190 µA
Turn-on threshold V(INx) 2.6 V
Turn-off threshold V(INx) 1.3 V
SOx output voltage Failure condition, I(SOx)<20mA 0.7 V
Short-Circuit Protection Remarks Min Typ Max Unit
Current through pin REFx R(REFx, VEx)<70kΩ 150 µA
Minimum response time Note 8 1.2 µs
Minimum blocking time Note 9 9 µs
Timing Charact eristics Remarks Min Typ Max Unit
Turn-on del ay td(on) Note 6 90 ns
Turn-off delay td(off) Note 6 75 ns
Jitter of turn-on delay Note 17 ±2 ns
Jitter of turn-off delay Note 17 ±2 ns
Output rise time tr(out) Note 7 17 ns
Output fall time tf(out) Note 7 15 ns
Transmission delay of fault stat e Note 13 360 ns
SCALE™-2 2SC0108T2A0-17
Prelim i nary Dat a Shee t
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Electrical Isolation Remarks Min Typ Max Unit
Test voltage (50Hz/1s) Primary to secondary side (Note 14) 5000 5050 5100 Veff
Secon dary to secondary side (Note 14) 4000 4050 4100 Veff
Partial discharge extinction volt. Primary to secondary side (Note 16) 1768 Vpeak
Secon dary to secondary side (Note 16) 1700 Vpeak
Creepage distance Primary to secondary side 12.9 mm
Secon dary to secondary side 8.5 mm
Clearance distance Primary to secondary side 12.9 mm
Secon dary to secondary side 6.5 mm
Outputs Remarks Min Typ Max Unit
Blocking capacit ance VISOx to VEx 9.4 µF
VEx to COMx 9.4 µF
Typical internal gate resistance Turn-on and t urn-o ff (Note 15) 0.5 Ω
Output voltage swing
The output voltage swing consists of two distinct se gments. First, there is the tu rn-on voltag e VGHx between
pins GHx and VEx. VGHx is regulated and maintained at a constant level for all output power values and
frequencies.
The seco nd segm ent o f the output voltag e swing i s the turn-off vo ltag e VGLx. VGLx is measured between pins
GLx and VEx. It is a negative voltage. It changes with the output power to accommodate the inevitable
voltage drop across the internal DC/DC converter.
Output Voltage Remarks Min Typ Max Unit
Turn-on voltage, VGHx Any load condition 15.0 V
Turn-off volt ag e , VGLx No load -9.4 V
Turn-off volt ag e , VGLx 1W output power -7.6 V
Turn-off volt ag e , VGLx 1.2W output power -7.2 V
Footnot es to the K ey D a ta
1 )
The maximum peak gate current refers to the highest current level occurring during the product
lifetime. It is an absolute value and does a lso apply for short pulses.
2 )
The average supply input current is limited for thermal reasons. Higher values than specified by the
absolute maximum rat ing are permissible (e.g. during p ower supply start up) if the average rem ains
below the given value, provided the
average is taken over a time period which is shorter than the
thermal time constants of the driver in the application.
3 )
There is no means of actively controlling or limiting the input current in the driver. In the case of
start-up wi th very high bl ockin
g capaci tor value s, or i n case of s hort cir cuit at th e output, t he supp ly
input current has to be limi ted externall y.
4 )
The maximum output power must not be exceeded at any time during operation. The absolute
maximum rating must also be observed for time
periods shorter than the thermal time constants of
the driver in the application.
5 )
An extended output power range is specified in the output power section for maximum ambient
temperatures of 70°C. In that case, the absolute maximum rating for the operating temperature
SCALE™-2 2SC0108T2A0-17
Prelim i nary Dat a Shee t
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changes to (–20°C - 70°C) and the absolute maximum output power rating changes to 1.2W .
6 )
The delay time is measured between 50% of the input signal and 10% voltage swing of the
corresp onding output. The delay time is independent of the output loading.
7 )
Output rise and fall times are measured between 10% and 90% of the nominal output swing. The
values are given for the driver side of the gate resistors without load. The time constant of the
output load in conjunction wit h the pr esent gate resistors leads to a n a d d itional delay at the load side
of the gate resistors.
8 )
The minimum response time given is valid for the circuit given in the description and application
manual (Fig. 6) with the values of table 1 ( Cax=0pF, Rthx=43kΩ).
9 )
The blocking time sets a minimum time span between the end of any fault state and the start of
normal operation (remove fault from pin SOx). The value of the blocking time can be adjusted at pin
TB. The specified blocking time is valid if TB is connected to GND.
10 )
This specification guarante e s that the dr ive information will be tr ansferred re liably even at a high DC-
link voltage and with ultra-fast sw itching operations.
11 )
Undervoltage monitoring of the primary-side supply voltage (VCC to GND). If the voltage drops
below this limit, a fault is transmitted to both SOx outputs and the IGBTs are switched off.
12 )
Undervo ltage monitoring of the se condary-side supply voltage (VISOx to VEx and VEx to COMx which
correspond with the approximate turn-on and turn-off gate-
emitter voltages). If the corresponding
voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the
corresp onding SOx output.
13 )
Transmission delay of fault state from the secondary side to the corresponding primary status
output.
14 )
HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate
driver is suited for HiP ot te st ing. Nevert heles s, it is str ongly re comme nded t o limit the testing time to
1s slots as stipulated by EN 50178. Excessive HiPot testing a t voltages much higher than 1200VAC(eff)
may lead to insulation degradation. No degradation has been observed over 1min. testing at
5000VAC(eff). Every production sample s
hipped to customers has undergone 100% testing at the
given value for 1s.
15 )
The resulting gate resistance is the sum of the external and the internal gate resistance.
16 )
17 )
18 )
Partial discharge m easurement is performe d in accorda nce with IEC 60270 and iso lation coordination
specified in EN 50178. The p artial discharge extinction volta g e between primary and either secondary
side is coordinated for safe isolat ion to EN 50178.
Jitter measurements are performed with input signals INx switching between 0V an
d 5V referred to
GND, with a corresponding rise time and fall time of 15ns.
A version with extended operating temperature range of –40°C…85°C (2SC0108T2B0-
17) can also
be supplied.
Legal Disclaimer
The statements, technical information and recommendations contained herein are believed to be accurate as
of the date hereof. All parameters, numbers, values and other technical data included in the technical
information were calculated and determined to our best knowledge in accordance with the relevant technical
norms (if any). They may base on assumptions or operational conditions that do not necessarily apply in
general. We exclude any representation or warranty, express or implied, in relation to the accuracy or
completeness of the statements, technical information and recommendations contained herein. No
responsibility is accepted for the accuracy or sufficiency of any of the statements, technical information,
recommendations or opinions communicated and any liability for any direct, indirect or consequential loss or
damage suffered by any person arisi ng ther efrom is ex p ressly disclaimed.
SCALE™-2 2SC0108T2A0-17
Prelim i nary Dat a Shee t
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Ordering Information
The general terms and conditions of delivery of Powe r Integrations Switzerland G mbH apply.
Type Designation Description
2SC0108T2A0-17 Dual-channel SCALE-2 driver core
Product home page: www.power.com/igbt-driver/go/2SC0108T
Refer to www.power.com/igbt-driver/go/nomenclature for information on driver nomenclature
Information about Other Products
For other drivers, product documentation, and application support
Please click: www.power.com
Manufacturer
Power Integrations Switzerland GmbH
Johann-Renfer-Strasse 15
2504 Biel-Bie nne, Sw it ze rla nd
Phone +41 32 344 47 47
Fax +41 32 344 47 40
Email igbt-driver.sales@power.com
Website www.power.com/igbt-driver
© 2009…2015 Power Integrations Switzerland GmbH. All rights reserved.
We reserve the right to make any technical modifications without prior notice. Versio n 2.1 fr om 2016-05-20
SCALE™-2 2SC0108T2A0-17
Prelim i nary Dat a Shee t
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