Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Stereo 2.6W Audio Power Amplifier (with DC Volume Control)
Features
Low Operating Current about 9mA (typical)
Improved Depop Circuitry to Eliminate Turn-on
and Turn-off Transients in Outputs
32-Step Volume Adjustable by DC Voltage
with Hysteresis
Output Power at 1% THD+N
- 2.4W, at VDD=5V, BTLMode, RL=3
- 2W, at VDD=5V, BTLMode, RL=4
at 10% THD+N
- 3.1W, at VDD=5V, BTLMode, RL=3
- 2.6W, at VDD=5V, BTLMode, RL=4
Two Output Modes: BTL and SE Modes Selected
by SE/BTL Pin
Low Current Consumption in Shutdown Mode
(1µA, typical)
Short Circuit Protection
Thermal Shutdown Protection and Over-Current
Protection Circuitry
The OUTP Signal and the INN Signal are
Outphase
Power Enhanced Package (DIP-16/DIP-16A)
Lead Free and Green Devices Available
(RoHS Compliant) Applications
General Description
The APA2070 is a monolithic integrated circuit, which
provides precise DC volume control, and a stereo
bridged audio power amplifiers capable of producing
2.6W (2W) into 4 with less than 10% (1.0%) THD+N.
The attenuator range of the volume control in APA2070 is
from 18dB (VVOLUME=0V) to -80dB (VVOLUME=3.54V) with 32
steps. The advantage of internal gain setting can be less
components and PCB area. Both the depop circuitry and
the thermal shutdown protection circuitry are integrated
in the APA2070, that reduce pops and clicks noise dur-
ing power up or shutdown mode operation. It also im-
proves the power off pop noise and protects the chip be-
ing destroyed by over temperature and short current
failure. To simplify the audio system design, the APA2070
combines a stereo bridge-tied load (BTL) mode for
speaker drive and a stereo single-end (SE) mode for head-
phone drive into a single chip, where both modes are
easily switched by the SE/BTL input control pin signal.
Notebook PC
LCD Monitor or TV
Simplified Application Circuit
R-CH
Input
L-CH
Input LOUTP
LOUTN
LINN
VOLUME
APA2070
ROUTP
RINN
ROUTN
Stereo
Headphone
Stereo
Speaker
DC Volume
Control
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw2
Symbol Parameter Rating Unit
VDD Supply Voltage (VDD to GND) -0.3 to 6 V
Input Voltage (SE/BTL, SHUTDOWN, VOLUME, RINN, LINN to GND) -0.3 to VDD+ 0.3 V
Output Voltage (LOUTN, LOUTP, ROUTP, ROUTN to GND) -0.3 to VDD+ 0.3 V
TA Operating Ambient Temperature Range -40 to 85 οC
TJ Maximum Junction Temperature 150 οC
TSTG Storage Temperature Range -65 to +150 οC
TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 οC
PD Power Dissipation Internally Limited
W
Pin Configuration
Ordering and Marking Information
Absolute Maximum Ratings (Note 1)
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines Green to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
APA2070
Handling Code
Temperature Range
Package Code
APA2070 J : APA2070
XXXXX XXXXX - Date Code
Assembly Material
Package Code
J : DIP-16 / DIP-16A
Operating Ambient Temperature Range
I : - 40 to 85 oC
Handling Code
TU : Tube
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
GND 5
GND 4 13 GND
SE/BTL 8
15 VDD
LINN 6 12 GND
RINN 3 14 ROUTP
BYPASS 2 16 ROUTN
11 LOUTP
10 VDD
VOLUME 7
SHUTDOWN 1
9 LOUTN
APA2070
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw3
Symbol Parameter Typical Value Unit
θJA Junction-to-Ambient Resistance in Free Air (Note 2) 45 oC/W
θJC Junction-to-Case Resistance in Free Air (Note 3)
8 oC/W
Symbol Parameter Range Unit
VDD Supply Voltage 4.5 ~ 5.5
SHUTDOWN 0.4VDD ~ VDD
VIH High Level Threshold Voltage
SE/BTL 0.8VDD ~ VDD
SHUTDOWN 0 ~ 1.0
VIL Low Level Threshold Voltage
SE/BTL 0 ~ 1.0
VCIM Common Mode Input Voltage ~ VDD-1.0
V
TA Ambient Temperature Range -40 ~ 80
TJ Junction Temperature Range -40 ~ 125 οC
RL Speaker Resistance 3 ~
RL Headphone Resistance 16 ~
Recommended Operating Conditions (Note 4)
Electrical Characteristics
APA2070
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VSE/BTL =0V - 9 20
IDD Supply Current
VSE/BTL=5V - 4 10 mA
ISD Shutdown Current
VSE/BTL=0V
VSHUTDOWN =0V
- 1 - µA
TSTART-UP Start-Up Time from Shutdown CBYPASS=2.2µF - 1.6 - s
BTL MODE. VDD=5V, GAIN=6dB (UNLESS OTHERWISE NOTED)
THD+N=10%, RL=3Ω, fin=1kHz
- 3.1 -
THD+N =10%, RL=4,
fin=1kHz
- 2.6 -
THD+N =10%, RL=8, fin=1kHz
- 1.6 -
THD+N =1%, RL=3, fin=1kHz
- 2.4 -
THD+N =1%, RL=4, fin=1kHz
- 2 -
PO Output Power
THD+N =0.5%, RL=8,
fin=1kHz
1 1.3 -
W
PO=1.2W, RL=4, fin=1kHz - 0.07 -
THD+N Total Harmonic Distortion Pulse
Noise PO=0.9W, RL=8, fin=1kHz - 0.08 - %
Unless otherwise specified, these specifications apply over VDD=5V, VGND=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC.
Note 4 : Refer to the typical application circuit
Thermal Characteristics
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Note 3: The case temperature is measured at the center of the GND pin on the beside of the DIP-16/DIP-16A package.
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw4
Electrical Characteristics (Cont.)
APA2070
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BTL MODE. VDD=5V, GAIN=6dB (UNLESS OTHERWISE NOTED) (CONT.)
PSRR Power Supply Rejection Ratio
VDD Ripple=0.1Vrms, RL=8,
CBYPASS=2.2µF, fin=217Hz
- 60 - dB
Crosstalk Channel Separation
CBYPASS=2.2µF, RL=8,
fin=1kHz
- 90 - dB
VOS Output Offset Voltage RL=4 - 5 - mV
S/N
Signal to Noise Ratio PO=1.1W, RL=8, A_Weighting - 95 - dB
SE MODE. VDD=5V, GAIN=0dB
THD+N=10%, RL=16Ω, fin=1kHz - 220 -
THD+N =10%, RL=32, fin=1kHz - 120 -
THD+N =1%, RL=16, fin=1kHz - 160 -
Po Output Power
THD+N =1%, RL=32, fin=1kHz - 95 -
mW
PO=125mW, RL=16, fin=1kHz - 0.09 -
THD+N
Total Harmonic Distortion
Pulse Noise PO=65mW, RL=32, fin=1kHz - 0.09 - %
PSRR Power Supply Rejection Ratio
VDD Ripple =0.1Vrms, RL=32,
CBYPASS =2.2µF, fin=217Hz
- 60 - dB
Crosstalk Channel Separation CBYPASS=2.2µF, RL=32, fin=1kHz - 60 - dB
VOS Output Offset Voltage RL=32 - 5 - mV
S/N
Signal to Noise Ratio PO=75mW, RL=32, A_Weighting
- 100 - dB
Unless otherwise specified, these specifications apply over VDD=5V, VGND=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC.
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw5
Typical Operating Characteristics
THD+N vs. Output PowerTHD+N vs. Output Power
THD+N (%)
Output Power (W)Output Power (W)
THD+N (%)
THD+N vs. Output PowerTHD+N vs. Output Power
THD+N (%)
Output Power (W)Output Power (W)
THD+N (%)
THD+N vs. Frequency THD+N vs. Frequency
THD+N (%)
THD+N (%)
Frequency (Hz)Frequency (Hz)
0.01
10
0.1
1
03.50.5 11.5 22.5 3
VDD = 5V
AV =18dB
fin = 1kHz
BTL Mode
RL = 8
RL = 4RL = 3
0.01
10
0.1
1
0240m
40m 80m 120m 160m 200m
VDD = 5V
AV =12dB
fin = 1kHz
SE Mode
RL = 32
RL = 16
0.01
10
0.1
1
03.5
0.5 11.5 22.5 3
AV = 18dB
AV = 6dB
VDD = 5V
fin =1kHz
RL =3
BTL Mode
0.05
10
0.1
1
10m
5
100m 1
fin = 20kHz
fin= 20Hz
fin= 1kHz
VDD = 5V
AV =18dB
RL =3
BTL Mode
0.01
10
0.1
1
20 20k100 1k 10k
VDD = 5V
RL =3
PO = 1.8W
BTL Mode
AV = 18dB
AV = 6dB
0.01
10
0.1
1
20 20k100 1k 10k
PO = 0.9W
PO = 1.8W
VDD = 5V
AV = 6dB
RL =3
BTL Mode
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw6
Typical Operating Characteristics (Cont.)
THD+N vs. Output PowerTHD+N vs. Output Power
Output Power (W)Output Power (W)
THD+N (%)
THD+N (%)
THD+N vs. Frequency THD+N vs. Frequency
THD+N (%)
THD+N (%)
Frequency (Hz)Frequency (Hz)
THD+N vs. Output PowerTHD+N vs. Output Power
Output Power (W)Output Power (W)
THD+N (%)
THD+N (%)
0.01
10
0.1
1
10m 5100m 1
fin= 20kHz
fin = 20Hz
fin = 1kHz
VDD = 5V
AV =18dB
RL =4
BTL Mode
0.01
10
0.1
1
20 20k
100 1k 10k
VDD = 5V
RL=4
PO=1.5W
BTL Mode
AV = 18dB
AV = 6dB
0.01
10
0.1
1
20 20k100 1k 10k
VDD = 5V
AV= 6dB
RL=4
BTL Mode
PO = 0.8W
PO = 1.5W
0.01
10
0.1
1
03.50.5 11.5 22.5 3
AV = 18dB
AV = 6dB
VDD = 5V
fin= 1kHz
RL=8
BTL Mode
0.01
10
0.1
1
10m
5
100m 1
fin = 20kHz
fin = 20Hz
fin = 1kHz
VDD = 5V
AV = 18dB
RL=8
BTL Mode
0.01
10
0.1
1
03.5
0.5 11.5 22.5 3
AV = 18dB
AV = 6dB
VDD = 5V
f =1kHz
RL =4
BTL Mode
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw7
Typical Operating Characteristics (Cont.)
THD+N (%)
THD+N (%)
THD+N vs. Frequency THD+N vs. Frequency
THD+N (%)
THD+N (%)
Frequency (Hz)Frequency (Hz)
THD+N vs. Output PowerTHD+N vs. Output Power
Output Power (W)Output Power (W)
THD+N (%)
THD+N (%)
THD+N vs. Frequency THD+N vs. Frequency
Frequency (Hz)Frequency (Hz)
0.01
10
0.1
1
20 20k100 1k 10k
PO = 0.5W
VDD = 5V
AV = 6dB
RL=8
BTL Mode
PO = 0.9W
0.01
10
0.1
1
20 20k
100 1k 10k
AV = 6dB
AV = 18dB
VDD=5V
RL=8
PO=0.9W
BTL Mode
0.01
10
0.1
1
0240m40m 80m 120m 160m 200m
VDD=5V
fin=1kHz
RL=16
SE Mode
AV = 0dB
AV = 12dB
0.01
10
0.1
1
10m 300m50m 100m 200m
VDD=5V
AV=12dB
RL=16
CO=1000µF
SE Mode
fin = 20kHz
fin = 1kHz
fin = 20Hz
0.01
10
0.1
20 20k
100 1k 10k
VDD=5V
RL=16
PO=125mW
CO=1000µF
SE Mode
AV = 0dB
1
AV = 12dB
0.01
10
0.1
1
20 20k
100 1k 10k
VDD=5V
AV=0dB
RL=16
CO=1000µF
SE Mode
PO = 125mW
PO = 60mW
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw8
Typical Operating Characteristics (Cont.)
THD+N (%)
THD+N (%)
Frequency Response Frequency Response
THD+N (%)
THD+N (%)
Frequency (Hz)Frequency (Hz)
THD+N vs. Output PowerTHD+N vs. Output Power
Output Power (W)Output Power (W)
Amplitude(dB)
Amplitude(dB)
THD+N vs. Frequency
Frequency (Hz)
THD+N vs. Frequency
Frequency (Hz)
Phase (Degrees)
Phase (Degrees)
0.01
10
0.1
1
0240m40m 80m 120m 160m 200m
VDD=5V
fin=1kHz
RL=32
SE Mode
AV = 0dB
AV = 12dB
0.01
10
0.1
1
10m 300m
50m 100m 200m
VDD=5V
AV=12dB
RL=32
CO=1000µF
SE Mode
fin = 20Hz
fin = 1kHz
fin = 20kHz
0.01
10
0.1
1
20 20k100 1k 10k
AV = 0dB
AV = 14dB
VDD=5V
RL=32
PO=65mW
CO=1000µF
SE Mode
0.01
10
0.1
1
20 20k100 1k 10k
PO = 65mW
PO = 30mW
VDD=5V
AV=12dB
RL=32
CO=1000µF
SE Mode
+60
+260
+100
+140
+180
+220
+0
+20
+4
+8
+12
+16
10 200k100 1k 10k
Phase( 6dB)
Amplitude( 6dB)
Amplitude( 14dB)
Phase( 14dB)
VDD=5V
RL=4
PO=0.8W
BTL Mode +60
+260
+100
+140
+180
+220
+0
+20
+4
+8
+12
+16
10 200k100 1k 10k
Amplitude( 6dB)
Amplitude( 14dB)
Phase( 14dB)
Phase( 6dB)
VDD=5V
RL=8
PO=0.5W
BTL Mode
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw9
Typical Operating Characteristics (Cont.)
Crosstalk vs. Response Crosstalk vs. Response
Frequency (Hz)Frequency (Hz)
Crosstalk(dB)
Crosstalk(dB)
Crosstalk vs. Frequency
Frequency (Hz)
Crosstalk vs. Frequency
Frequency (Hz)
Frequency Response Frequency Response
Frequency (Hz)Frequency (Hz)
Amplitude(dB)
Amplitude(dB)
Crosstalk(dB)
Crosstalk(dB)
Phase (Degrees)
Phase (Degrees)
+60
+260
+100
+140
+180
+220
10 200k100 1k 10k
Amplitude(0dB)
Phase(0dB)
Amplitude(12dB)
Phase(12dB)
-8
+14
-4
0
+4
+10
VDD=5V
RL=16
CO=1000µF
PO=60mW
SE Mode +60
+260
+100
+140
+180
+220
10 200k100 1k 10k
Amplitude(12dB)
Amplitude(0dB)
Phase(12dB)
Phase(0dB)
-8
+14
-4
0
+4
+10
VDD=5V
RL=32
CO=1000µF
PO=30mW
SE Mode
-120
+0
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 20k100 1k 10k
VDD=5V
RL=8
PO=0.9W
BTL Mode
Right to Left
Left to Right
-120
+0
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 20k100 1k 10k
Right to Left
Left to Right
VDD=5V
RL=4
PO=1.5W
BTL Mode
-100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 20k100 1k 10k
Right to Left
Left to Right
VDD=5V
RL=16
CO=1000µF
PO=125mW
SE Mode
-100
+0
-80
-60
-40
-20
20 20k
100 1k 10k
-10
-30
-50
-70
-90
VDD=5V
RL=32
CO=1000µF
PO=65mW
SE Mode
Right to Left
Left to Right
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
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Typical Operating Characteristics (Cont.)
Mute Attenuation vs. Frequency Shutdown Attenuation vs. Frequency
Frequency (Hz)Frequency (Hz)
Shutdown Attenuation(dB)
Mute Attenuation(dB)
PSRR vs. Frequency
Frequency (Hz)
PSRR vs. Frequency
Frequency (Hz)
Output Noise Voltage vs. Frequency Output Noise Voltage vs. Frequency
Frequency (Hz)Frequency (Hz)
Output Noise Voltage(dB)
Output Noise Voltage(dB)
PSRR(dB)
PSRR(dB)
-100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 20k
100 1k 10k
VDD=5V
RL=4
VIN=200mV
AV=18dB
BTL Mode
-100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 20k
100 1k 10k
VDD=5V
RL=32
VIN=200mV
AV=12dB
SE Mode
1µ
100µ
10µ
20µ
20 20k
100 1k 10k
VDD=5V
AV=6dB
RL=4
BTL Mode
A-weighting
Filter BW<22kHz
1µ
100µ
10µ
20µ
20 20k100 1k 10k
Filter BW<22kHz
A-weighting
VDD=5V
AV=0dB
RL=32
SE Mode
-130
+0
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 20k100 1k 10k
VDD=5V
RL=8
VIN=1Vrms
AV=6dB
BTL Mode
-120
+0
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
20 20k100 1k 10k
VDD=5V
RL=8
VIN=1Vrms
AV=6dB
BTL Mode
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
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Typical Operating Characteristics (Cont.)
Power Dissipation vs.Output PowerPower Dissipation vs. Output Power
Gain vs. Volume VoltageSupply Current vs. Supply Voltage
DC Voltage (V)Supply Voltage(V)
Supply Current (mA)
Gain(dB)
Power Dissipation(W)
Power Dissipation(W)
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
3.0 3.5 4.0 4.5 5.0 5.5
BTL
SE
No Load
Output Power (W)Output Power(mW)
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Up
Down
VDD=5V
No Load
BTL Mode
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
RL=3
RL=4
RL=8
VDD=5V
BTL Mode 0
20
40
60
80
100
120
140
160
180
200
0 50 100 150 200 250
RL=8
RL=32
RL=16
VDD=5V
SE Mode
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.50 4.75 5.00 5.25 5.50
Output Power (W)
Output Power vs. Supply Voltage
RL=8,THD+N=1%
RL=8,THD+N=10%
RL=4,THD+N=1%
RL=4,THD+N=10%
RL=3,THD+N=1%
RL=3,THD+N=10%
Supply Voltage (V)
BTL Mode
AV=6dB
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
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Pin Description
PIN
NO. NAME FUNCTION
1
SHUTDOWN
Shutdown control pin. Pulling low the voltage on this pin shuts off the IC. In
shutdown mode, the IC only draws 1µA (typical) of supply current.
2 BYPASS Bypass capacitor connection pin for the bias voltage generator.
3 RINNN Right channel input terminal
4,5,12,13 GND Ground connection. Connect all of the GND pins to ground plane.
6 LINN Left channel input terminal
7 VOLUME DC voltage input pin for internal volume gain setting (DC Volume control).
8
SE/BTL Output mode control input, high for SE output mode and low for BTL mode.
9 LOUTN Left channel negative output in BTL mode and high impedance in SE mode.
10,15 VDD Supply voltage input pin. Connect all of the VDD pins to supply voltage.
11 LOUTP Left channel positive output in BTL mode and SE mode.
14 ROUTP Right channel positive output in BTL mode and SE mode.
16 ROUTN Right channel negative output in BTL mode and high impedance in SE mode.
Block Diagram
Power and Depop
circuit
LOUTP
LOUTN
LINN
SE/BTL
SHUTDOWN
BYPASS
DC
Volume
Control
VOLUME
ROUTP
RINN Bias Voltage
Generator
ROUTN
GND
VDD
Shutdown
SE/BTL Mode
Selection
circuit
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
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Typical Application Circuit
4
4Ring
Headphone
Jack
Sleeve
Control
Pin
Tip
SE/BTL
Signal
1
220µF
220
1k
R-CH
Input
VDD
100k
Shutdown
Signal
1
L-CH
Input
VDD
VDD GND
100
0.1
100k
Shutdown
LOUTP
LOUTN
LINN
SE/BTL
SHUTDOWN
BYPASS
Volume
Control
VOLUME
ROUTP
RINN
ROUTN
VDD
50k
2.2
µF
µF
µF
µF
µF
µF
Bias Voltage
Generator
SE/BTL Mode
Selection
circuit
DC
CCL
CCR
CiL
CiR
CS
CBYPASS
1k
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
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DC Volume Control Table_BTL Mode
Voltage Range (% of V DD) Voltage Range (V DD=5V)
Gain(dB)
High(%)
Low(%)
Recommended (%) High(V)
Low(V)
Recommended (V)
18 2.40 0.00 0.00 0.12 0.00 0.00
17.5 4.60 3.40 4.00 0.23 0.17 0.20
17 6.80 5.60 6.20 0.34 0.28 0.31
16.5 9.20 7.80 8.60 0.46 0.39 0.43
16 11.40 10.20 10.80 0.57 0.51 0.54
15.5 13.80 12.40 13.00 0.69 0.62 0.65
15 16.00 14.60 15.40 0.80 0.73 0.77
14.5 18.20 16.80 17.60 0.91 0.84 0.88
14 20.60 19.20 19.80 1.03 0.96 0.99
13 22.80 21.40 22.00 1.14 1.07 1.10
12 25.00 23.60 24.40 1.25 1.18 1.22
10 27.40 25.80 26.60 1.37 1.29 1.33
8 29.60 28.20 28.80 1.48 1.41 1.44
6 31.80 30.40 31.20 1.59 1.52 1.56
4 34.20 32.60 33.40 1.71 1.63 1.67
2 36.40 34.80 35.60 1.82 1.74 1.78
0 38.60 37.00 37.80 1.93 1.85 1.89
-2 41.00 39.40 40.20 2.05 1.97 2.01
-4 43.20 41.60 42.40 2.16 2.08 2.12
-7 45.60 43.80 44.60 2.28 2.19 2.23
-10 47.80 46.00 47.00 2.39 2.30 2.35
-13 50.00 48.40 49.20 2.50 2.42 2.46
-16 52.40 50.60 51.40 2.62 2.53 2.57
-19 54.60 52.80 53.80 2.73 2.64 2.69
-22 56.80 55.00 56.00 2.84 2.75 2.80
-25 59.20 57.40 58.20 2.96 2.87 2.91
-28 61.40 59.60 60.40 3.07 2.98 3.02
-31 63.60 61.80 62.80 3.18 3.09 3.14
-34 66.00 64.00 65.00 3.30 3.20 3.25
-37 68.20 66.40 67.20 3.41 3.32 3.36
-40 70.40 68.60 69.60 3.52 3.43 3.48
-80 100.00
70.80 100.00 5.00 3.54 5.00
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw15
Function Description
Figure 1: APA2070 Internal Configuration
(each channel)
Bridge-Tied Load (BTL) Operation
The APA2070s output stage of each channel, which con-
sists of one pair of operational amplifiers, provides op-
tion for BTL operation shown as figure 1.
Single-Ended (SE) Operation
SE/BTL Mode Selection Function
The power amplifiers (OP1) gain is set by internal unity
gain and input audio signal comes from internal volume
control amplifier while the second amplifier (OP2) is in-
ternally fixed in a unity-gain, inverting configuration. Fig-
ure 1 shows that the output of OP1 is connected to the
input to OP2, which results in the output signals of with
both amplifiers with identical in magnitude but out of phase
180°. Consequently, the differential gain for each chan-
nel is 2 x (Gain of SE mode).
By driving the load differentially through outputs OUTP
and OUTN, an amplifier configuration is commonly re-
ferred to bridged mode is established. BTL mode opera-
tion is different from the classical single-ended (SE) am-
plifier configuration where one side of its load is con-
nected to the ground.
A BTL amplifier design has a few distinct advantages over
the SE configuration, as it provides differential drive to the
load, thus, doubles the output swing for a specified sup-
ply voltage.
When placed under the same conditions, a BTL amplifier
has four times the output power of a SE ampifier. A BTL
configuration, such as the one used in APA2070, also
creates a second advantage over SE amplifiers. Since
the differential outputs, ROUTP, ROUTN, LOUTP, and
LOUTN, are biased at half-supply, its not necessary for
DC voltage to be across the load. This eliminates the
need for an output coupling capacitor which is required in
a single supply, SE configuration.
To consider the single-supply SE configuration shown in
Typical Application Circuit, a coupling capacitor is required
to block the DC offset voltage from reaching the load.
These capacitors can be quite large (approximately 33µF
to 1000µF) so they tend to be expensive, occupy valuable
PCB area, and have the additional drawback of limiting
low-frequency performance of the system (refer to the
Output Coupling Capacitor). The rules described still hold
with the addition of the following relationship:
(1)
Figure 2: SE/BTL Input Selection by Phonejack Plug
Ring
Headphone Jack
Sleeve
Control
Pin
Tip
1k
VDD
100k
SE/BTL
The best saving features of APA2070 is that it can be
switched easily between BTL and SE modes. This fea-
ture eliminates the requirement for an additional head-
phone amplifier in applications where internal stereo
speakers are driven in BTL mode but external headphone
or speakers must be accommodated.
Inside of the APA2070, two separated amplifiers drive
OUTP and OUTN (See Figure 1). The SE/BTL input con-
trols the operation of the follower amplifier that drives
LOUTP and ROUTN.
When SE/BTL keeps low, the OP2 turns on and the
APA2070 is in the BTL mode.
When SE/BTL keeps high, the OP2 is in a high output
impedance state, which configures the APA2070 as
SE driver from OUTP. IDD is reduced by approximately
one-half in SE mode.
Control of the SE/BTL input can be a logic-level TTL source
or a resistor divider network or the stereo headphone
jack with switch pin as shown in the Typical Application
Circuit.
Bias Voltage
Generator
OUTP
OUTN
OP1
OP2
Volume Control
amplifier output
signal RL
Cbypass x 150k2RiCi<< 2RLCC
111
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw16
SE/BTL Mode Selection Function (Cont.)
The APA2070 has an internal stereo volume control that
setting is the function of the DC voltage applied to the
VOLUME input pin. The APA2070 volume control consists
of 32 steps that are individually selected by a variable DC
voltage level on the VOLUME control pin. The range of
the steps, controlled by the DC voltage, are from 18dB
to -80dB. Each gain step corresponds to a specific input
voltage range, as shown in table. To minimize the effect of
noise on the volume control pin, which can affect the se-
lected gain level, hysteresis and clock delay are
implemented. The amount of hysteresis corresponds to
half of the step width, as shown in the volume control
graph.
DC Volume Control Function
For the highest accuracy, the voltage shown in the rec-
ommended voltage column of the table is used to select
a desired gain. This recommended voltage is exactly half-
way between the two nearest transitions. The gain levels
are 32 steps from 18dB to -40dB in BTL mode, and the
last step at -80dB as mute mode.
Function Description (Cont.)
By switching the SHUTDOWN pin to low, the amplifier
enters a low-current state, IDD<1µA. APA2070 is in shut-
down mode. On normal operation, SHUTDOWN pin is
pulled to high level to keep the IC out of the shutdown
mode. The SHUTDOWN pin should be tied to a defi-
nite voltage to avoid unwanted state changing.
In order to reduce power consumption while not in use,
the APA2070 contains a shutdown pin to externally turn
off the amplifier bias circuitry. This shutdown feature
turns the amplifier off when a logic low is placed on the
SHUTDOWN pin. The trigger point between a logic high
and logic low level is typically 2.0V. It would be better to
switch between the ground and the supply VDD to provide
maximum device performance.
Shutdown Function
DC Volume (V)
Gain (dB)
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Backward
Forward
APA2070 DC Volume Control Curve (BTL)
Figure 3: Gain setting vs. VOLUME pin voltage
Thermal Protection
The thermal protection circuit limits the junction tempera-
ture of the APA2070. When the junction temperature ex-
ceeds TJ = +150oC, a thermal sensor turns off the
amplifier, allowing the devices to cool. The thermal sen-
sor allows the amplifier to start-up after the junction tem-
perature down about 125oC. The thermal protection is
designed with a 25oC hysteresis to lower the average TJ
during continuous thermal overload conditions, which is
increasing lifetime of the IC.
Over-Current Protection
In Figure 2, input SE/BTL operates as below:
When the phonejack plug is inserted, the 1k resistor is
disconnected and the SE/BTL input is pulled high to en-
able the SE mode. Meanwhile, the OUTN amplifier is shut
down which turns the speaker to be mute. The OUTP
amplifier then drives through the output capacitor into the
headphone jack. When there is no headphone plugged
into the system, the contact pin of the headphone jack is
connected from the signal pin, and the voltage divider is
set up by resistors 100k and 1k. Resistor 1k then is
pulled low the SE/BTL pin, enabling the BTL function.
The APA2070 monitors the output current. When the cur-
rent exceeds the current-limit threshold, the APA2070 turns
off the output to prevent the IC from damages in over-
current or short-circuit condition. When the over-current
occurs in power amplifier, the output buffers current will
be foldbacked to a low setting level, and it will release
when over-current situation is no long existence. On the
contrary, if the over-current period is long enough and the
ICs junction temperature reaches the thermal protection
threshold, the IC will enter thermal protection mode.
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw17
Application Information
(3)
(2)
Input Resistance (Ri)
The gain for each audio input of the APA2070 is set by the
internal resistors (Ri and RF) of volume control amplifier
in inverting configuration.
BTL mode operation brings the factor of 2 in the gain
equation due to the inverting amplifier mirroring the volt-
age swing across the load. For varying gain settings, the
APA2070 generates each input resistance on figure 4.
The input resistance will affect the low frequency perfor-
mance of audio signal. The minmum input resistance is
30k when gain setting is 18dB and the resistance will
ramp up when close loop gain below 18dB. The input
resistance has wide variation (+/-10%) caused by pro-
cess variation.
0
20
40
60
80
100
120
140
160
-40 -30 -20 -10 0 10 20
Gain(BTL)
Ri(K)
Ri vs. Gain(BTL)
Figure 4: Input resistance vs. Gain setting
(4)
(5)
Input Capacitor (Ci)
In the typical application, an input capacitor (Ci) is required
to allow the amplifier to bias the input signal to the proper
DC level for optimum operation. In this case, Ci and the
minimum input impedance Ri (30k) form a high-pass
filter with the corner frequency determined in the follow-
ing equation :
The value of Ci must be considered carefully because it
directly affects the low frequency performance of the circuit.
Consider the example where Ri is 30k and the specifi-
cation calls for a flat bass response down to 50Hz. Equa-
tion is reconfigured below :
When varitation of input resistance (Ri) is considered, the
Ci should is 0.1µF, so a value in the range of 0.047µF to
0.47µF would be chosen. A further consideration for this
capacitor is the leakage path from the input source through
the input network (Ri+RF, Ci) to the load. This leakage
current creates a DC offset voltage at the input to the
amplifier that reduces useful headroom, especially in high
gain applications. For this reason, a low-leakage tanta-
lum or ceramic capacitor is the best choice. When polar-
ized capacitors are used, the positive side of the capacitor
should face the amplifier input in most applications as
the DC level there is held at VDD/2. Please note that it is
important to confirm the capacitor polarity in the
application.
Effective Bypass Capacitor (CBYPASS)
A power amplifier, proper supply bypassing, is critical
for low noise performance and high power supply
rejection.
The capacitor location on the BYPASS pin should be as
close to the device as possible. The effect of a larger
supply bypass capacitor is to improve PSRR due to
increased half-supply stability. Two critical criteria of
bypass capacitor (CBYPASS): 1st, it depends upon de-
sired PSRR requirements and click-and-pop
performance; 2nd, the leakage current of CBYPASS will
induce the voltage drop of VBYPASS (voltage of BYPASS
pin), and if the VBYPASS is less than 0.49VDD, the APA2070
will enter mute condition. The value of VBYPASS can be
calculated as below:
(6)
Where
ILeakage =Leakage current of CBYPASS
Therefore, it is recommended that CBYPASSs leakage cur-
rent should be no more than 0.4µA for properly work of
the APA2070.
i
F
VR
R
A Gain SE ==
i
F
R
R
-2Gain BTL ×= C
Fk3021
i
C××π
=
×= 150k I-0.5VVLeakageDDBYPASS
i
)highpass(CCk302 1
F××π
=
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw18
Application Information (Cont.)
(7)
To avoid the start-up pop noise, the bypass voltage should
rise slower than the input bias voltage and the relation-
ship shown in equation should be maintained.
The capacitor is fed from a 150k resistor inside of
the amplifier and the 150k is the maximum input resis-
tance of (Ri+RF). Bypass capacitor, CBYPASS, values of
2.2µF to 10µF ceramic or tantalum low-ESR capacitors
are recommended for the best THD+N and noise
performance.
The bypass capacitance also affects the start-up time.
It is determined in the following equation:
(8)
(9)
Output Coupling Capacitor (CC)
In the typical single-supply SE configuration, an output
coupling capacitor (CC) is required to block the DC bias at
the output of the amplifier thus preventing DC currents in
the load. As with the input coupling capacitor, the output
coupling capacitor and impedance of the load form a high-
pass filter governed by the equation.
For example, a 330µF capacitor with an 8 speaker would
attenuate low frequencies below 60.6Hz. The main
disadvantage, from a performance standpoint, is the load
impedance is typically small, which drives the low-fre-
quency corner higher degrading the bass response.
Large values of CC are required to pass low frequencies
into the load.
Effective Bypass Capacitor (CBYPASS) (Cont.)
Power Supply Decoupling Capacitor (CS)
The APA2070 is a high-performance CMOS audio ampli-
fier that requires adequate power supply decoupling to
ensure the output total harmonic distortion (THD+N) is
as low as possible. Power supply decoupling also pre-
vents the oscillations caused by long lead length between
the amplifier and the speaker. The optimum decoupling
is achieved by using two different types of capacitors that
target on different types of noise on the power supply
leads.
For higher frequency transients, spikes, or digital hash
on the line, a good low equivalent-series-resistance
(ESR) ceramic capacitor, typically 0.1µF, is placed as close
as possible to the device VDD lead works best. For filtering
lower-frequency noise signals, it is recommended to
place a large aluminum electrolytic capacitor of 10µF or
greater near the audio power amplifier
Optimizing Depop Circuitry
Circuitry has been included in the APA2070 to minimize the
amount of popping noise at power-up and when coming
out of shutdown mode. Popping occurs whenever a volt-
age step is applied to the speaker. In order to eliminate
clicks and pops, all capacitors must be fully discharged
before turn-on. Rapid on/off switching of the device or
the shutdown function will cause the click and pop circuitry.
The value of Ci will also affect turn-on pops (Refer to
Effective Bypass Capacitance). The bypass voltage ramp
up should be slower than input bias voltage. Although the
bypass pin current source cannot be modified, the size of
CBYPASS can be changed to alter the device turn-on time
and the amount of clicks and pops. By increasing the value
of CBYPASS, turn-on pop can be reduced. However, the
tradeoff for using a larger bypass capacitor is to increase
the turn-on time for this device. There is a linear relation-
ship between the size of CBYPASS and the turn-on time. In a
SE configuration, the output coupling capacitor (CC), is of
particular concern.
This capacitor discharges through the internal 10k
resistors. Depending on the size of CC, the time constant
can be relatively large. To reduce transients in SE mode,
an external 1k resistor can be placed in parallel with the
internal 10k resistor. The tradeoff for using this resistor
is an increase in quiescent current. In most cases, choos-
ing a small value of Ci in the range of 0.33µF to 1µF,
CBYPASS being equal to 4.7µF and an external 1k resistor
should be placed in parallel with the internal 10k resis-
tor should produce a virtually clickless and popless turn-
on.
A high gain amplifier intensifies the problem as the small
delta in voltage is multiplied by the gain, so it is advanta-
geous to use low-gain configurations.
<<
X150kC1
)X150k C (1
iBYPASS
)X150k5X(C TBYPASS
up start =
CL
)highpass(CCR21
Fπ
=
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw19
Application Information (Cont.)
(10)
(11)
(12)
BTL Amplifier Efficiency
An easy-to-use equation to calculate efficiency starts out
as being equal to the ratio of power from the power sup-
ply to the power delivered to the load.
The following equations are the basis for calculating
amplifier efficiency.
Where
Efficiency of a BTL configuration :
Table 1 is for calculating efficiencies for four different out-
put power levels.
(13)
Note that the efficiency of the amplifier is quite low for
lower power levels and rises sharply as power to the load
is increased resulting in a nearly flat internal power dissi-
pation over the normal operating range. In addition, the
internal dissipation at full output power is less than in the
half power range. Calculating the efficiency for a specific
system is the key to proper power supply design. For a
stereo 1W audio system with 8 loads and a 5V supply,
the maximum draw on the power supply is almost 3W.
A final point to remember about linear amplifiers (either
SE or BTL) is how to manipulate the terms in the effi-
ciency equation to utmost advantage when possible. Note
that in equation, VDD is in the denominator. This indicates
that as the VDD goes down, efficiency goes up. In other
words, use the efficiency analysis to choose the correct
supply voltage and speaker impedance for the application.
Po (W)
Efficiency (%)
IDD(A)
VPP(V)
PD (W)
0.25 31.25 0.16 2.00
0.55
0.50 47.62 0.21 2.83
0.55
1.00 66.67 0.30 4.00
0.5
1.25 78.13 0.32 4.47
0.35
**High peak voltages cause the THD+N to increase.
Table 1. Efficiency vs. Output Power in 5-V/8 BTL Sys-
tems
Power Dissipation
Whether the power amplifier is operated in BTL or SE
mode, power dissipation is the major concern. Equation
(14) states the maximum power dissipation point for a
SE mode operating at a given supply voltage and driving
a specified load.
(14)
In BTL mode operation, the output voltage swing is
doubled as in SE mode. Thus, the maximum power dis-
sipation point for a BTL mode operating at the same given
conditions is 4 times as in SE mode.
(15)
(16)
Since the APA2070 is a dual channel power amplifier, the
maximum internal power dissipation is 2 times that both
of equations depend on the mode of operation. Even with
this substantial increase in power dissipation, the
APA2070 does not require extra heatsink. The power dis-
sipation from equation (14), assuming a 5V-power sup-
ply and an 8 load, must not be greater than the power
dissipation that results from the equation (16):
Since the maximum junction temperature (TJ,MAX) of the
APA2070 is 150οC and the ambient temperature (TA) is
defined by the power system design, the maximum power
dissipation which the IC package is able to handle can be
obtained from equation16.
For DIP-16/DIP-16A package, the thermal resistance (θJA)
is equal to 45οC/W.
L
2
P
L
2
RMS,O
OR2
V
R
V
P==
SUP
O
P
P
Efficiency =
2
V
VP
RMS,O=
L
P
DDAVG,DDDDSUP R
V2
VIVP π
×=×=
DD
P
L
P
DD
L
2
P
SUP
O4V
V
R
V2
V
R2
V
P
Pπ
=
π
×
=L
2
2
DD
MAXD, R2
V
=P : mode SE π
L
2
2
DD
MAXD, R2
4V
=P : mode BTL π
JA
AMAXJ,
MAXD, T-T
Pθ
=
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw20
Application Information (Cont.)
Power Dissipation (Cont.)
Once the power dissipation is greater than the maximum
limit (PD,MAX), either the supply voltage (VDD) must be
decreased, the load impedance (RL) must be increased
or the ambient temperature should be reduced.
Thermal Consideration
Linear power amplifiers dissipate a significant amount of
heat in the package under normal operating conditions.
The first consideration to calculate maximum ambient
temperatures is the numbers from the Power Dissipa-
tion vs. Output Power graphs are per channel values, so
the dissipation of the IC heat needs to be doubled for
two-channel operation. Given θJA, the maximum allow-
able junction temperature (TJMAX), and the total internal
dissipation (PD), the maximum ambient temperature can
be calculated with the following equation. The maximum
recommended junction temperature for the APA2070 is
150°C. The internal dissipation figures are taken from
the Power Dissipation vs. Output Power graphs.
TAMax = TJMax -θJAPD (16)
150 - 45(0.8*2) = 78°C
The APA2070 is designed with a thermal shutdown pro-
tection that turns the device off when the junction tem-
perature surpasses 150°C to prevent damaging the IC.
Layout Consideration
Figure 5: APA 2070 Land Pattern Recommendation
1. All components should be placed close to the APA2070.
For example, the input capacitor (Ci) should be close
to APA2070s input pins to avoid causing noise cou-
pling to APA2070s high impedance inputs; the
decoupling capacitor (CS) should be placed by the
APA2070s power pin to decouple the power rail noise.
2. The output traces should be short, wide (>50mil), and
symmetric.
3. The input trace should be short and symmetric.
4. The power trace width should be greater than 50mil.
5. The APA2070s GND pin should be soldered on the
ground plane of the PCB.
16mm
20mm
3mm
4mm
Ground plane
for GND pin
Via diameter
=0.3mm x 24
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw21
Package Information
DIP-16
Note : 1. Followed from JEDEC MS-001AB
2. Dimension D, D1 and E1 do not include mold flash or
protrusions. Mold flash or protrusions shall not exceed
10 mil.
S
Y
M
B
O
LMIN. MAX.
5.33
0.38
0.36 0.56
1.14 1.78
0.20 0.35
18.6 20.31
0.13
2.92 3.81
A
A1
b
b2
c
D
D1
E
E1
e
eA
MILLIMETERS
A2 2.92 4.95
2.54 BSC
DIP-16
7.62 8.26
6.10 7.11
eB
L
10.92
7.62 BSC
MIN. MAX.
INCHES
0.210
0.015
0.100 BSC
0.300 BSC
0.115 0.195
0.014 0.022
0.045 0.070
0.008 0.014
0.732 0.800
0.005
0.300 0.325
0.240 0.280
0.430
0.115 0.150
D
E1
0.38
ceA
eB
E
A2
A1
AL
b b2 e
D1
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw22
Package Information
DIP-16A
D1 b2b e
A2
A
A1
L
eB
eA
c
E
0.38
S
Y
M
B
O
LMIN. MAX.
5.33
0.38
0.36 0.56
1.14 1.78
0.20 0.35
18.6 20.31
0.13
2.92 3.81
A
A1
b
b2
c
D
D1
E
E1
e
eA
MILLIMETERS
A2 2.92 4.95
2.54 BSC
DIP-16A
7.62 8.26
6.10 7.11
eB
L10.92
7.62 BSC
MIN. MAX.
INCHES
0.210
0.015
0.100 BSC
0.300 BSC
0.115 0.195
0.014 0.022
0.045 0.070
0.008 0.014
0.732 0.800
0.005
0.300 0.325
0.240 0.280
0.430
0.115 0.150
Note : 1. Followed from JEDEC MS-001AB
2. Dimension D, D1 and E1 do not include mold flash or
protrusions. Mold flash or protrusions shall not exceed
10 mil.
D
E1
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw23
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Average ramp-up rate
(Tsmax to TP) 3 °C/second max. 3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL) 183 °C
60-150 seconds 217 °C
60-150 seconds
Peak package body Temperature
(Tp)* See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc) 20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Classification Profile
Copyright ANPEC Electronics Corp.
Rev. A.4 - Oct., 2010
APA2070
www.anpec.com.tw24
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Table 2. Pb-free Process Classification Temperatures (Tc)
Package
Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 mm 2.5 mm 260 °C 250 °C 245 °C
2.5 mm 250 °C 245 °C 245 °C
Table 1. SnPb Eutectic Process Classification Temperatures (Tc)
Package
Thickness Volume mm3
<350 Volume mm3
350
<2.5 mm 235 °C 220 °C
2.5 mm 220 °C 220 °C
Test item Method Description
SOLDERABILITY JESD-22, B102 5 Sec, 245°C
HOLT JESD-22, A108 1000 Hrs, Bias @ Tj=125°C
PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C
TCT JESD-22, A104 500 Cycles, -65°C~150°C
HBM MIL-STD-883-3015.7 VHBM2KV
MM JESD-22, A115 VMM200V
Latch-Up JESD 78 10ms, 1tr100mA
Reliability Test Program