INTEGRATED CIRCUITS DATA SHEET 74LVC16245A; 74LVCH16245A 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) Product specification Supersedes data of 2002 Oct 30 2003 Jan 30 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A FEATURES DESCRIPTION * 5 V tolerant inputs/outputs for interfacing with 5 V logic The 74LVC(H)16245A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. In 3-state operation, outputs can handle 5 Volt. These features allow the use of these devices as a mixed 3.3 and 5 V environment. * Wide supply voltage range from 1.2 to 3.6 V * CMOS low power consumption * MULTIBYTETM flow-through standard pin-out architecture * Low inductance multiple power and ground pins for minimum noise and ground bounce The 74LVC(H)16245A is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The device features two output enable (nOE) inputs for easy cascading and two send/receive (nDIR) inputs for direction control. nOE controls the outputs so that the buses are effectively isolated. This device can be used as two 8-bit transceivers or one 16-bit transceiver. * Direct interface with TTL levels * High-impedance when VCC = 0 V * All data inputs have bushold (74LVCH16245A only) * Complies with JEDEC standard no. 8-1A * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. The 74LVCH16245A bushold data inputs eliminates the need for external pull-up resistors to hold unused inputs. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL PARAMETER tPHL/tPLH propagation delay nAn to nBn; nBn to nAn CI CI/O CPD power dissipation capacitance per gate CONDITIONS CL = 50 pF; VCC = 3.3 V UNIT 3.0 ns input capacitance 5.0 pF input/output capacitance 10 pF 30 pF VI = GND to VCC; note 1 Note 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2003 Jan 30 TYPICAL 2 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE 74LVC16245ADL -40 to +85 C 48 SSOP48 plastic SOT370-1 74LVCH16245ADL -40 to +85 C 48 SSOP48 plastic SOT370-1 74LVC16245ADGG -40 to +85 C 48 TSSOP48 plastic SOT362-1 74LVCH16245ADGG -40 to +85 C 48 TSSOP48 plastic SOT362-1 74LVC16245AEV -40 to +85 C 56 VFBGA56 plastic SOT702-1 74LVCH16245AEV -40 to +85 C 56 VFBGA56 plastic SOT702-1 FUNCTION TABLE See note 1. INPUT OUTPUT nOE nDIR nAn nBn L L A=B inputs L H inputs B=A H X Z Z Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state. 2003 Jan 30 3 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A PINNING SYMBOL PINS BALLS DESCRIPTION 1DIR 1 A1 direction control input 1B0 2 B2 data inputs/output 1B1 3 B1 data inputs/output GND 4, 10, 15, 21, 28, 34, 39, 45 B3, B4, D3, D4, G3, G4, J3, J4 ground (0 V) 1B2 5 C2 data inputs/output 1B3 6 C1 data inputs/output VCC1 7, 18 C3, H3 supply voltage 1B4 8 D2 data inputs/output 1B5 9 D1 data inputs/output 1B6 11 E2 data inputs/output 1B7 12 E1 data inputs/output 2B0 13 F1 data output 2B1 14 F2 data output 2B2 16 G1 data output 2B3 17 G2 data output 2B4 19 H1 data output 2B5 20 H2 data output 2B6 22 J1 data output 2B7 23 J2 data output 2DIR 24 K1 direction control input 2OE 25 K6 output enable input (active LOW) 2A7 26 J5 data inputs/output 2A6 27 J6 data inputs/output 2A5 29 H5 data inputs/output 2A4 30 H6 data inputs/output VCC2 31, 42 H4, C4 supply voltage 2A3 32 G5 data inputs/output 2A2 33 G6 data inputs/output 2A1 35 F5 data inputs/output 2A0 36 F6 data inputs/output 1A7 37 E6 data inputs/output 1A6 38 E5 data inputs/output 1A5 40 D6 data inputs/output 1A4 41 D5 data inputs/output 1A3 43 C6 data inputs/output 1A2 44 C5 data inputs/output 1A1 46 B6 data inputs/output 1A0 47 B5 data inputs/output 1OE 48 A6 output enable input (active LOW) 2003 Jan 30 4 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A handbook, halfpage 1DIR 1 48 1OE 1B0 2 47 1A0 1B1 3 46 1A1 GND 4 45 GND 1B2 5 44 1A2 1B3 6 43 1A3 VCC1 7 42 VCC2 1B4 8 41 1A4 1B5 9 40 1A5 GND 10 39 GND 1B6 11 38 1A6 37 1A7 1B7 12 2B0 13 16245 1DIR B 1B1 1B0 GND GND 1A0 1A1 C 1B3 1B2 VCC1 VCC2 1A2 1A3 D 1B5 1B4 GND GND 1A4 1A5 E 1B7 1B6 1A6 1A7 F 2B0 2B1 2A1 2A0 G 2B2 2B3 GND GND 2A3 2A2 H 2B4 2B5 VCC1 VCC2 2A5 2A4 J 2B6 2B7 GND GND 2A7 2A6 K 2DIR 36 2A0 2B1 14 35 2A1 GND 15 34 GND 2B2 16 33 2A2 2B3 17 32 2A3 31 VCC2 VCC1 18 1OE A 2B4 19 30 2A4 2B5 20 29 2A5 GND 21 28 GND 2B6 22 27 2A6 2B7 23 26 2A7 2DIR 24 25 2OE 1 2OE 2 3 4 5 6 MNA707 MNA710 Fig.1 Pin configuration SSOP48 and TSSOP48. 2003 Jan 30 Fig.2 Pin configuration VFBGA56. 5 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) handbook, full pagewidth 1DIR 1 2DIR 48 1A0 1A1 1A2 19 2A5 20 2A6 22 2A7 12 2B5 27 1B6 37 2B4 29 1B5 38 2B3 30 1B4 40 11 1A7 17 2A4 2B2 32 1B3 41 9 1A6 16 2A3 2B1 33 1B2 43 8 1A5 14 2A2 2B0 35 1B1 44 6 1A4 13 2A1 2OE 36 1B0 46 5 1A3 25 2A0 3 24 1OE 47 2 74LVC16245A; 74LVCH16245A 2B6 26 23 1B7 2B7 MNA708 Fig.3 Logic symbol. 2003 Jan 30 6 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) handbook, halfpage 1OE 1DIR 48 1 25 2OE 24 2DIR 1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7 2A0 47 G3 3EN1 [BA] 3EN2 [AB] G6 6EN4 [BA] 6EN5 [AB] 2 1 2 46 3 44 5 43 6 41 8 40 9 38 11 37 12 36 74LVC16245A; 74LVCH16245A 13 4 1B0 1B1 handbook, halfpage VCC 1B2 1B3 1B4 data input 1B5 to internal circuit 1B6 1B7 2B0 MNA705 5 2A1 2A2 2A3 2A4 2A5 2A6 2A7 35 14 33 16 32 17 30 19 29 20 27 22 26 23 2B1 2B2 2B3 2B4 2B5 2B6 2B7 MNA709 Fig.4 Logic symbol (IEEE/IEC). 2003 Jan 30 Fig.5 Bushold circuit. 7 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER supply voltage VI input voltage VO output voltage Tamb operating ambient temperature tr, tf input rise and fall times CONDITIONS MIN. MAX. UNIT for maximum speed performance 2.7 3.6 V for low voltage applications 1.2 3.6 V 0 5.5 V output HIGH or LOW state 0 VCC V output 3-state 0 5.5 V in free air -40 +85 C VCC = 1.2 to 2.7 V 0 20 ns/V VCC = 2.7 to 3.6 V 0 10 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage -0.5 +6.5 V IIK input diode current VI < 0 - -50 mA VI input voltage note 1 -0.5 +6.5 V IOK output diode current VO > VCC or VO < 0 - 50 mA VO output voltage output HIGH or LOW state; note 1 -0.5 VCC + 0.5 V output 3-state; note 1 -0.5 +6.5 V IO output source or sink current - 50 mA ICC, IGND VCC or GND current - 100 mA Tstg storage temperature -65 +150 C Ptot power dissipation SSOP and TSSOP package temperature range from -40 to +85 C; note 2 - 500 mW VFBGA package - 1000 mW VO = 0 to VCC temperature range from -40 to +85 C; note 3 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 60 C the value of PD derates linearly with 5.5 mW/K. 3. Above 70 C the value of PD derates linearly with 1.8 mW/K. 2003 Jan 30 8 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. OTHER TYP. (1) MAX. UNIT VCC (V) Tamb = -40 to +85 C VIH VIL LOW-level input voltage VOH HIGH-level output voltage VOL 1.2 VCC - - V 2.7 to 3.6 2.0 - - V 1.2 - - GND V 2.7 to 3.6 - - 0.8 V IO = -12 mA 2.7 VCC - 0.5 - - V IO = -100 A 3.0 VCC - 0.2 VCC - V IO = -18 mA 3.0 VCC - 0.6 - - V IO = -24 mA 3.0 VCC - 0.8 - - V IO = 12 mA 2.7 - - 0.40 V IO = 100 A 3.0 - - 0.20 V IO = 24 mA 3.0 - - 0.55 V HIGH-level input voltage VI = VIH or VIL LOW-level output voltage VI = VIH or VIL ILI input leakage current VI = 5.5 V or GND; note 2 3.6 - 0.1 5 A IOZ 3-state output OFF-state current VI = VIH or VIL; VO = 5.5 V or GND 3.6 - 0.1 5 A Ioff power off leakage supply VI or VO = 5.5 V 0.0 - 0.1 10 A ICC quiescent supply current VI = VCC or GND; IO = 0 3.6 - 0.1 20 A ICC additional quiescent supply current per pin VI =VCC - 0.6 V; IO = 0 2.7 to 3.6 - 5 500 A IBHL bushold LOW sustaining current VI = 0.8 V; notes 3, 4 and 5 3.0 75 - - A IBHH bushold HIGH sustaining current VI = 2.0 V; notes 3, 4 and 5 3.0 -75 - - A IBHLO bushold LOW overdrive current notes 3, 4 and 6 3.6 500 - - A IBHHO bushold HIGH overdrive current notes 3, 4 and 6 3.6 -500 - - A Notes 1. All typical values are measured at VCC = 3.3 V and Tamb = 25 C. 2. For bushold parts, the bushold circuit is switched off when VI > VCC allowing 5.5 V on the input terminal. 3. Valid for data inputs of bushold parts (74LVCH16245A) only. 4. For data inputs only, control inputs do not have a bushold circuit. 5. The specified sustaining current at the data input holds the input below the specified VI level. 6. The specified overdrive current at the data input forces the data input to the opposite input state. 2003 Jan 30 9 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns. TEST CONDITIONS SYMBOL PARAMETER MIN. WAVEFORMS TYP. MAX. UNIT VCC (V) Tamb = -40 to +85 C tPHL/tPLH propagation delay nAn to nBn; nBn to nAn tPZH/tPZL see Figs 6 and 8 3-state output enable time nOE to nAn; nOE to nBn tPHZ/tPLZ 3-state output disable time nOE to nAn; nOE to nBn see Figs 7 and 8 see Figs 7 and 8 1.2 - 13.0 2.7 1.5 - 5.5 ns 3.0 to 3.6 1.5 3.0(1) 4.5 ns 1.2 - 15.0 - ns 2.7 1.5 - 7.1 ns 3.0 to 3.6 1.5 4.0(1) 6.1 ns 1.2 - 11.0 - ns 2.7 1.5 - 6.6 ns 3.0 to 3.6 1.5 4.0(1) 5.6 ns Note 1. Typical values are measured at VCC = 3.3 V and Tamb = 25 C. AC WAVEFORMS handbook, halfpage VI nAn, nBn VM input GND t PHL t PLH VOH nBn, nAn VM output VOL MNA477 INPUT VCC VM VI tr = tf 1.2 V 0.5 x VCC VCC 2.5 ns 2.7 V 1.5 V 2.7 V 2.5 ns 3.0 to 3.6 V 1.5 V 2.7 V 2.5 ns VOL and VOH are typical output voltage drop that occur with the output load. Fig.6 The input (nAn, nBn) to output (nBn, nAn) propagation delays. 2003 Jan 30 10 - ns Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A VI handbook, full pagewidth nOE input VM GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ tPZH VOH VY output HIGH-to-OFF OFF-to-HIGH GND VM outputs enabled outputs disabled outputs enabled MNA362 INPUT VCC VM VI tr = tf 1.2 V 0.5 x VCC VCC 2.5 ns 2.7 V 1.5 V 2.7 V 2.5 ns 3.0 to 3.6 V 1.5 V 2.7 V 2.5 ns VX = VOL + 0.3 V at VCC 2.7 V; VX = VOL + 0.1 V at VCC < 2.7 V; VY = VOH - 0.3 V at VCC 2.7 V; VY = VOH - 0.1 V at VCC < 2.7 V. VOL and VOH are typical output voltage drop that occur with the output load. Fig.7 3-state enable and disable times. 2003 Jan 30 11 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A VEXT handbook, full pagewidth VCC PULSE GENERATOR VI RL VO D.U.T. CL RT RL MNA616 VCC VI CL RL VEXT tPLH/tPHL tPZH/tPHZ tPZL/tPLZ 1.2 V VCC 50 pF 500 open GND 2 x VCC 2.7 V 2.7 V 50 pF 500 open GND 2 x VCC 3.0 to 3.6 V 2.7 V 50 pF 500 open GND 2 x VCC Definitions for test circuits: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.8 Load circuitry for switching times. 2003 Jan 30 12 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A PACKAGE OUTLINES SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 D E A X c y HE v M A Z 25 48 Q A2 A1 A (A 3) pin 1 index Lp L 24 1 detail X w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.8 0.4 0.2 2.35 2.20 0.25 0.3 0.2 0.22 0.13 16.00 15.75 7.6 7.4 0.635 10.4 10.1 1.4 1.0 0.6 1.2 1.0 0.25 0.18 0.1 0.85 0.40 8 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 2003 Jan 30 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 99-12-27 MO-118 13 o Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 (A 3) A1 pin 1 index A Lp L 1 detail X 24 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 8.3 7.9 1 0.8 0.4 0.50 0.35 0.25 0.08 0.1 0.8 0.4 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 2003 Jan 30 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-10 99-12-27 MO-153 14 o Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 b e C v M C A B w M C 1/2 e y1 C y K J H e G F e2 E D 1/2 e C X B A ball A1 index area 1 2 3 4 5 6 DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A2 b D E e e1 e2 v w y y1 1 0.3 0.2 0.7 0.6 0.45 0.35 4.6 4.4 7.1 6.9 0.65 3.25 5.85 0.15 0.08 0.08 0.1 OUTLINE VERSION SOT702-1 2003 Jan 30 REFERENCES IEC JEDEC JEITA 0 2.5 5 mm scale EUROPEAN PROJECTION ISSUE DATE 01-06-25 02-08-08 MO-225 15 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) SOLDERING 74LVC16245A; 74LVCH16245A If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. To overcome these problems the double-wave soldering method was specifically developed. 2003 Jan 30 16 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable(3) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(4), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP REFLOW(2) suitable suitable suitable not recommended(4)(5) suitable not recommended(6) suitable Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2003 Jan 30 17 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Jan 30 18 Philips Semiconductors Product specification 16-bit bus transceiver with direction pin; 5 V tolerant (3-state) NOTES 2003 Jan 30 19 74LVC16245A; 74LVCH16245A Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA75 (c) Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613508/06/pp20 Date of release: 2003 Jan 30 Document order number: 9397 750 10749 Philips Semiconductors - PIP - 74LVC16245A; 74LVCH16245A; 16-bit bus transceiver with direction pin; 5 V tolerant (3-State) Submit Query Philips Semiconductors Home ProductBuy MySemiconductors ContactProduct Information catalogonline Products MultiMarket Semiconductors * Product Selector Catalog by * Function Catalog by * System * Cross-reference * Packages End of Life * information Distributors Go * Here! * Models * SoC solutions * Information as of 2003-04-22 74LVC16245A; My.Semiconductors.COM. personal service from Use right mouse button to 74LVCH16245A; 16- Your download datasheet Philips Semiconductors. register now ! Download datasheet bit bus transceiver Please Stay informed with direction pin; 5 V tolerant (3-State) General description Block diagram Products & packages Features Buy online Parametrics Applications Support & tools Similar products Datasheet Email/translate General description top The 74LVC(H)16245A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. In 3-state operation, outputs can handle 5 Volt. These features allow the use of these devices as a mixed 3.3 and 5 V environment. The 74LVC(H)16245A is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The device features two output enable (nOE) inputs for easy cascading and two send/receive (nDIR) inputs for direction control. nOE controls the outputs so that the buses are effectively isolated. This device can be used as two 8-bit transceivers or one 16-bit transceiver. The 74LVCH16245A bushold data inputs eliminates the need for external pull-up resistors to hold unused inputs. file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC16245ADL.html (1 of 5) [May-12-2003 11:42:48 AM] Philips Semiconductors - PIP - 74LVC16245A; 74LVCH16245A; 16-bit bus transceiver with direction pin; 5 V tolerant (3-State) Features top 5 V tolerant inputs/outputs for interfacing with 5 V logic Wide supply voltage range from 1.2 to 3.6 V CMOS low power consumption MULTIBYTE TM flow-through standard pin-out architecture Low inductance multiple power and ground pins for minimum noise and ground bounce Direct interface with TTL levels High-impedance when VCC =0 V All data inputs have bushold (74LVCH16245A only) Complies with JEDEC standard no. 8-1A ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. Applications top AN240: Interfacing 3 Volt and 5 Volt Applications Download PDF File Datasheet top Type number Title Publication release date 74LVC16245A; 74LVCH16245A 16-bit bus 1/30/2003 transceiver with direction pin; 5 V tolerant (3-State) Datasheet status Page count File size (kB) Datasheet Product specification 20 109 Download Download PDF File file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC16245ADL.html (2 of 5) [May-12-2003 11:42:48 AM] Philips Semiconductors - PIP - 74LVC16245A; 74LVCH16245A; 16-bit bus transceiver with direction pin; 5 V tolerant (3-State) Parametrics top Type number Package 74LVC16245ADGG 3.3V 16-Bit Transceiver with SOT362-1 Direction 4~6 (TSSOP48) Pin; NonInverting (3State) 74LVC16245ADL SOT370-1 (SSOP48) Description Propagation Delay(ns) 3.3V 16-Bit Transceiver with Direction 4~6 Pin; NonInverting (3State) Voltage No. Power of Dissipation Pins Considerations Logic Output Switching Drive Levels Capability 48 Low Power or Battery Applications TTL Medium Low 48 Low Power or Battery Applications TTL Medium Low 3.3V 16-Bit Transceiver with Direction SOT362-1 Pin; Non74LVCH16245ADGG (TSSOP48) Inverting with Bus Hold (3State) 4~6 Low 48 Low Power or Battery Applications TTL Medium 3.3V 16-Bit Transceiver with Direction Pin; NonInverting with Bus Hold (3State) 4~6 Low 48 Low Power or Battery Applications TTL Medium 74LVCH16245ADL SOT370-1 (SSOP48) file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC16245ADL.html (3 of 5) [May-12-2003 11:42:48 AM] Philips Semiconductors - PIP - 74LVC16245A; 74LVCH16245A; 16-bit bus transceiver with direction pin; 5 V tolerant (3-State) Products, packages, availability and ordering top Type number North American type number 74LVC16245ADGG 74LVC16245ADG 74LVC16245ADGT 74LVC16245ADL 74LVC16245ADL 74LVC16245ADLT 74LVC16245AEV Ordering code Marking/Packing Package Device Buy online IC packing info (12NC) status Download PDF SOT362-1 Standard Marking 9352 350 90112 File (TSSOP48) Full production order this * Tube product Standard Marking SOT362-1 online 9352 350 90118 * Reel Pack, (TSSOP48) Full production order this SMD, 13" product Standard Marking SOT370-1 Full production online 9352 349 00112 order this (SSOP48) * Tube product Standard Marking SOT370-1 Full production online 9352 349 00118 * Reel Pack, order this (SSOP48) SMD, 13" product Standard Marking SOT702-1 online 9352 707 93118 * Reel Pack, (VFBGA56) Full production SMD, 13" Standard Marking SOT702-1 9352 707 93151 * Tray Pack, (VFBGA56) Full production Bakeable, Single - Standard Marking SOT702-1 * Tray Pack, 9352 707 93157 (VFBGA56) Full production Bakeable, Multiple - - - SOT362-1 Standard Marking (TSSOP48) Full production order this * Tube product Standard Marking SOT362-1 online 74LVCH16245ADG9352 384 70118 * Reel Pack, (TSSOP48) Full production order this T SMD, 13" product Standard Marking SOT370-1 Full production online 74LVCH16245ADL 9352 384 60112 order this (SSOP48) * Tube product Standard Marking SOT370-1 74LVCH16245ADLFull production online 9352 384 60118 * Reel Pack, order this (SSOP48) T SMD, 13" product 74LVCH16245ADGG 74LVCH16245ADG 9352 384 70112 74LVCH16245ADL file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC16245ADL.html (4 of 5) [May-12-2003 11:42:48 AM] - - Philips Semiconductors - PIP - 74LVC16245A; 74LVCH16245A; 16-bit bus transceiver with direction pin; 5 V tolerant (3-State) online Standard Marking SOT702-1 9352 719 44118 * Reel Pack, (VFBGA56) Full production SMD, 13" 74LVCH16245AEV Standard Marking SOT702-1 * Tray Pack, 9352 719 44157 (VFBGA56) Full production Bakeable, Multiple - Similar products top 74LVC16245A; 74LVCH16245A links to the similar products page containing an overview of products that are similar in Products function similar or related to the type number(s) as listed on this page. The similar products page includes products from the same catalog tree(s), relevant selection guides and products from the same functional category. to 74LVC16245A; 74LVCH16245A top Support & tools IC Bus Solutions, Typical IC Bus Arrangement Download PDF File Email/translate this product information top Email this product information. Translate this product information page from English to: French Translate The English language is the official language used at the semiconductors.philips.com website and webpages. All translations on this website are created through the use of Google Language Tools and are provided for convenience purposes only. No rights can be derived from any translation on this website. About this Web Site | Copyright (c) 2003 Koninklijke Philips N.V. All rights reserved. | Privacy Policy | | Koninklijke Philips N.V. | Access to and use of this Web Site is subject to the following Terms of Use. | file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74LVC16245ADL.html (5 of 5) [May-12-2003 11:42:48 AM]