FS6244 Dual PLL Clock Generator IC 1.0 Features 2.0 * Dual phase-locked loop (PLL) device with three output clock frequencies * On-chip crystal oscillator for reference frequency generation * 3.3V or 5V supply voltage available * Small circuit board footprint (16-pin 0.150 SOIC) * Custom frequency selections available - contact your local AMI Sales Representative for more information Description The FS6244 is a monolithic CMOS clock generator IC designed to minimize cost and component count in digital video/audio systems. Two high-resolution phase-locked loops generate three output clocks through an array of post-dividers. All frequencies are ratiometrically derived from the crystal oscillator frequency. The locking of all the output frequencies together can eliminate unpredictable artifacts in video systems and reduce electromagnetic interference (EMI) due to frequency harmonic stacking. Table 1: Version Information Figure 1: Pin Configuration 1 16 n/c XOUT 2 15 n/c XIN 3 14 CLKB VDD 4 13 VDD VSS 5 12 n/c CLKA 6 11 VSS n/c 7 10 CLKC n/c 8 9 n/c FS6244 n/c DEVICE VDD (nom) FXIN (MHz) CLKA (MHz) CLKB (MHz) CLKC (MHz) FS6244-03 5 27.000 11.2896 (+1.1 ppm) 3.6864 27.000 NOTE: Contact AMI for custom versions 16-pin (0.150) SOIC Figure 2: Block Diagram XIN CRYSTAL OSC. CLKA PLL XOUT PLL DIVIDER ARRAY CLKB CLKC FS6244 American Microsystems, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. ISO9001 2.28.02 FS6244 Dual PLL Clock Generator IC Table 2: Pin Descriptions Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input, DO = Digital Output; P = Power/Ground; # = Active Low pin PIN 3.0 3.1 TYPE NAME DESCRIPTION 1 - N/C 2 AO XOUT No Connection 3 AI XIN Crystal Oscillator Feedback 4 P VDD Power Supply (+3.3V or +5V) 5 P VSS Ground 6 DO CLKA Clock Output A 7 - N/C No Connection 8 - N/C No Connection 9 - N/C No Connection 10 DO CLKC Clock Output C 11 P VSS Ground 12 - N/C No Connection Crystal Oscillator Drive 13 P VDD Power Supply (+3.3V or +5V) 14 DO CLKB Clock Output B 15 - N/C No Connection 16 - N/C No Connection 3.2 Functional Block Description Crystal Oscillator The Crystal Oscillator provides a stable, low-jitter frequency reference for the rest of the FS6244 system components. Loading capacitance for the crystal is internal to the FS6244. No external components (other than the resonator itself) are required for operation of the crystal oscillator. Phase-Locked Loop (PLL) The on-chip PLLs are a standard frequency- and phaselocked loop architecture. The PLL multiplies the reference oscillator to the desired frequency by a ratio of integers. The frequency multiplication is exact with a zero synthesis error unless otherwise indicated in the frequency table. 2 ISO9001 2.28.02 FS6244 Dual VCXO Clock Generator IC 4.0 Electrical Specifications Table 3: Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance, functionality, and reliability. PARAMETER SYMBOL MIN. MAX. UNITS VDD VSS-0.5 7 V Input Voltage, dc VI VSS-0.5 VDD+0.5 V Output Voltage, dc VO VSS-0.5 VDD+0.5 V Input Clamp Current, dc (VI < 0 or VI > VDD) IIK -50 50 mA Output Clamp Current, dc (VI < 0 or VI > VDD) IOK -50 50 mA Storage Temperature Range (non-condensing) TS -65 150 C Ambient Temperature Range, Under Bias TA -55 125 C Junction Temperature TJ 125 C 260 C 2 kV Supply Voltage (VSS = ground) Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy electrostatic discharge. Table 4: Operating Conditions PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS V Supply Voltage (3.3 volt system) VDD SEE NOTE 1 3.0 3.3 3.6 Supply Voltage (5.0 volt system) VDD SEE NOTE 1 4.5 5.0 5.5 V Ambient Operating Temperature Range TA SEE NOTE 1 0 70 C Fundamental Mode 5 27 MHz Crystal Resonator Frequency fXTAL NOTE 1: These specifications represent generic FS6244 device capability. Device specifications for a particular version (i.e. FS6244-xx) are guaranteed only with the operating voltage and reference frequency specified in Version Information. 3 ISO9001 2.28.02 FS6244 Dual PLL Clock Generator IC Table 5: DC Electrical Specifications (VDD = 3.3V nominal) Unless otherwise stated, VDD = 3.3V 10%, no load on any output, and ambient temperature range TA = 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are 3 from typical. Negative currents indicate current flows out of the device. PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS Overall Supply Current, Dynamic, with Loaded Outputs IDD fXTAL = 27MHz; CL = 10pF, VDD = 3.3V 15 mA As seen by a crystal connected to XIN and XOUT 17 pF RXTAL=20; 200 uW mV (depends on output frequencies) Crystal Oscillator Crystal Loading Capacitance CL(xtal) Crystal Drive Level Crystal Oscillator Feedback (XIN) Threshold Bias Voltage VTH 860 High-Level Input Current IIH 34 A Low-Level Input Current IIL -21 A -0.5 mA mA Crystal Oscillator Drive (XOUT) High-Level Output Source Current IOH V(XIN) = 0V, VO = 0V Low-Level Output Sink Current IOL V(XIN) = 3.3V, VO = 3.3V 15 High-Level Output Source Current * IOH VO = 2.0V -40 mA Low-Level Output Sink Current * IOL VO = 0.4V 17 mA Short Circuit Source Current * IOSH VO = 0V; shorted for 30s, max. -55 mA Short Circuit Sink Current * IOSL VO = 3.3V; shorted for 30s, max. 55 mA Clock Outputs (CLKx) 4 ISO9001 2.28.02 FS6244 Dual VCXO Clock Generator IC Table 6: DC Electrical Specifications (VDD = 5V nominal) Unless otherwise stated, VDD = 5.0V 10%, no load on any output, and ambient temperature range TA = 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are 3 from typical. Negative currents indicate current flows out of the device. PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS Overall Supply Current, Dynamic, with Loaded Outputs IDD fXTAL = 27MHz; CL = 10pF, VDD = 5.0V 25 mA As seen by a crystal connected to XIN and XOUT 17 pF RXTAL=20; 300 uW mV (-03 version) Crystal Oscillator Crystal Loading Capacitance CL(xtal) Crystal Drive Level Crystal Oscillator Feedback (XIN) Threshold Bias Voltage VTH 950 High-Level Input Current IIH 50 A Low-Level Input Current IIL -21 A Crystal Oscillator Drive (XOUT) High-Level Output Source Current IOH V(XIN) = 0V, VO = 0V -1 mA Low-Level Output Sink Current IOL V(XIN) = 5V, VO = 5V 20 mA High-Level Output Source Current * IOH VO = VDD -0.4V -25 mA Low-Level Output Sink Current * IOL VO = 0.4V 25 mA Short Circuit Source Current * IOSH VO = 0V; shorted for 30s, max. -80 mA Short Circuit Sink Current * IOSL VO = 5V; shorted for 30s, max. 80 mA Clock Outputs (CLKx) 5 ISO9001 2.28.02 FS6244 Dual PLL Clock Generator IC Table 7: AC Timing Specifications (VDD = 3.3V nominal) Unless otherwise stated, VDD = 3.3V 10%, no load on any output, and ambient temperature range TA = 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are 3 from typical. PARAMETER SYMBOL CONDITIONS/DESCRIPTION CLOCK (MHz) MIN. TYP. MAX. UNITS 0 ppm 55 % Overall Synthesis Error (unless otherwise noted in Frequency Table) Clock Output (CLKx) Ratio of high pulse width (as measured from rising edge to next falling edge at VDD/2) to one clock period Duty Cycle * 45 Jitter, Period (peak-peak) * tj(P) From rising edge to next rising edge at VDD/2, CL = 10pF 390 ps Jitter, Long Term (y()) * tj(LT) From 0-500s at VDD/2, CL = 10pF compared to ideal clock source 155 ps Rise Time * tr VDD = 3.3V; VO = 0.3V to 3.0V; CL = 10pF 1.7 ns Fall Time * tf VDD = 3.3V; VO = 3.0V to 0.3V; CL = 10pF 1.7 ns Table 8: AC Timing Specifications (VDD = 5V nominal) Unless otherwise stated, VDD = 3.3V 10%, no load on any output, and ambient temperature range TA = 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are 3 from typical. PARAMETER SYMBOL CONDITIONS/DESCRIPTION CLOCK (MHz) MIN. TYP. MAX. UNITS 0 ppm 55 % Overall Synthesis Error (unless otherwise noted in Frequency Table) Clock Output (CLKx) Ratio of high pulse width (as measured from rising edge to next falling edge at VDD/2) to one clock period Duty Cycle * 45 Jitter, Period (peak-peak) * tj(P) From rising edge to next rising edge at VDD/2, CL = 10pF 390 ps Jitter, Long Term (y()) * tj(LT) From 0-500s at VDD/2, CL = 10pF compared to ideal clock source 155 ps Rise Time * tr VDD = 5V; VO = 0.5V to 4.5V; CL = 10pF 1.0 ns Fall Time * tf VDD = 5V; VO = 4.5V to 0.5V; CL = 10pF 1.0 ns 6 ISO9001 2.28.02 FS6244 Dual VCXO Clock Generator IC 5.0 Package Information Table 9: 16-pin SOIC (0.150") Package Dimensions DIMENSIONS INCHES MIN. MAX. 16 MILLIMETERS MIN. MAX. A 0.061 0.068 1.55 1.73 A1 0.004 0.0098 0.102 0.249 A2 0.055 0.061 1.40 1.55 B 0.013 0.019 0.33 0.49 C 0.0075 0.0098 0.191 0.249 D 0.386 0.393 9.80 9.98 E 0.150 0.157 3.81 3.99 R e 0.050 BSC E 1 ALL RADII: 0.005" TO 0.01" B 0.230 0.244 5.84 6.20 h 0.010 0.016 0.25 0.41 L 0.016 0.035 0.41 0.89 0 8 0 8 h x 45 7 typ. e 1.27 BSC H H AMERICAN MICROSYSTEMS, INC. A2 D A A1 BASE PLANE C L SEATING PLANE Table 10: 16-pin SOIC (0.150") Package Characteristics PARAMETER SYMBOL Thermal Impedance, Junction to Free-Air 16-pin 0.150" SOIC JA Lead Inductance, Self L11 CONDITIONS/DESCRIPTION TYP. UNITS Air flow = 0 m/s 109 C/W Corner lead 4.0 Center lead 3.0 nH Lead Inductance, Mutual L12 Any lead to any adjacent lead 0.4 nH Lead Capacitance, Bulk C11 Any lead to VSS 0.5 pF 7 ISO9001 2.28.02 FS6244 Dual PLL Clock Generator IC 6.0 Ordering Information Table 11: Device Ordering Codes ORDERING CODE DEVICE NUMBER PACKAGE TYPE OPERATING TEMPERATURE RANGE SHIPPING CONFIGURATION 11640-821 FS6244-03 16-pin (0.150") SOIC (Small Outline Package) 0C to 70C (Commercial) Tape and Reel 11640-831 FS6244-03 16-pin (0.150") SOIC (Small Outline Package) 0C to 70C (Commercial) Tubes 7.0 Revision Information DATE PAGE 4/24/00 5, 7 DESCRIPTION Fixed formatting errors Copyright (c) 1999, 2000 American Microsystems, Inc. Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMI for such applications. American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796, WWW Address: http://www.amis.com E-mail: tgp@amis.com 8 ISO9001 2.28.02